CN110064611B

CN110064611B - Processing device and method for manufacturing product

Info

Publication number: CN110064611B
Application number: CN201910047528.7A
Authority: CN
Inventors: 宇泽秀俊; 东秀和
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2018-01-22
Filing date: 2019-01-18
Publication date: 2022-04-05
Anticipated expiration: 2039-01-18
Also published as: CN110064611A; TWI740094B; JP7018323B2; KR102243615B1; TW201932205A; JP2019126749A; KR20190089740A

Abstract

The present invention is a processing apparatus for preventing adhesion of processing chips to a cleaning roller immersed in a cleaning liquid, the processing apparatus including: a processing mechanism (6A) and a processing mechanism (6B) for processing the processed object (W); and a cleaning mechanism (8) for cleaning the workpiece (W) to be processed, wherein the cleaning mechanism (8) comprises: a liquid storage tank (81) for storing a cleaning liquid; and a cleaning roller (82) which rotates in a state in which a part of the cleaning roller is immersed in the cleaning liquid in the liquid storage tank (81), contacts the workpiece (W) to be processed, which is positioned above the liquid storage tank (81), and is disposed so as to sandwich the cleaning roller (82) between a liquid supply port (83) for supplying the cleaning liquid into the liquid storage tank (81) and a liquid discharge port (84) for discharging the cleaning liquid from the liquid storage tank (81).

Description

Processing device and method for manufacturing product

Technical Field

The present invention relates to a processing apparatus and a method of manufacturing a product.

Background

Conventionally, as shown in patent document 1, a workpiece as a workpiece is cut into individual pieces, and then a cleaning roller such as a rotary brush is brought into contact with the cut workpiece to remove machining chips such as cutting chips adhering to the workpiece, thereby cleaning the workpiece.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2002-28583

Disclosure of Invention

[ problems to be solved by the invention ]

However, there are cases where machining chips adhere to the cleaning roller during cleaning and cannot be removed. In this case, the workpiece is cleaned by the cleaning roller to which the machining chips adhere, and the cleaning capability may be reduced.

The present invention has been made to solve the above-described problems, and a main object of the present invention is to efficiently remove machining chips adhering to a cleaning roller.

[ means for solving problems ]

That is, the processing apparatus of the present invention includes: a processing mechanism for processing the object to be processed; and a cleaning mechanism for cleaning the workpiece on which the machining is performed, the cleaning mechanism including: a liquid storage tank for storing the cleaning liquid; and a cleaning roller that rotates in a state in which a part of the cleaning roller is immersed in the cleaning liquid in the liquid reservoir, contacts the workpiece on which the processing is performed, and is disposed so as to be separated from the cleaning roller, and includes a liquid supply port through which the cleaning liquid is supplied into the liquid reservoir and a liquid discharge port through which the cleaning liquid is discharged from the liquid reservoir.

The method of making the article of the invention comprises: a processing step of processing a workpiece; and a cleaning step of cleaning the workpiece on which the processing is performed, the cleaning step being performed by a cleaning mechanism including: a liquid storage tank for storing the cleaning liquid; and a cleaning roller that rotates in a state in which a part of the cleaning roller is immersed in the cleaning liquid in the reservoir and that is in contact with the workpiece on which the processing is performed, the workpiece being positioned above the reservoir, wherein a liquid supply port through which the cleaning liquid is supplied into the reservoir and a liquid discharge port through which the cleaning liquid is discharged from the reservoir are disposed so as to be spaced apart from the cleaning roller.

[ Effect of the invention ]

According to the present invention thus constituted, machining chips adhering to the cleaning roller can be efficiently removed.

Drawings

Fig. 1 is a plan view schematically showing the structure of a cutting device according to the present embodiment.

Fig. 2 is a plan view schematically showing the structure of the cleaning mechanism according to the embodiment.

Fig. 3 is a sectional view schematically showing the structure of the cleaning mechanism according to the embodiment.

Fig. 4 is a cross-sectional view schematically showing the structure of the cleaning mechanism according to the modified embodiment.

Fig. 5 is a cross-sectional view schematically showing the structure of the cleaning mechanism according to the modified embodiment and a partial plan view of an example of the removing member.

[ description of symbols ]

2: plate-like member feeding mechanism

3: cutting platform

4: moving mechanism

5: rotating mechanism

6A, 6B: main shaft (processing mechanism)

7. 8: cleaning mechanism

8A: liquid supply pipe

8B: liquid discharge pipe

9: conveying mechanism

10: inspection table

11: camera with a camera module

12: indexing platform

13: transfer mechanism

14: tray for good products

15: defective product tray

61A, 61B: rotary knife

71: jet cleaning mechanism

72: drying mechanism

80: support body

81: liquid storage tank

81 a: bottom part

81a 1: inclined part

81 b: side wall part

81H: opening part

82: cleaning roller

82 a: shaft part

82 b: brush hair

82 x: center shaft

83: liquid supply port

84: liquid discharge port

85: supply pipe

86: water removal member

87: partition board

88: cover member

89: removing member

89 a: protrusion

100: cutting device (processing device)

A: plate-like member supply unit

B: plate-like member cutting unit

C: inspection unit

CTL: control unit

D: accommodating unit

P: article of manufacture

W: sealed substrate (sealed plate-shaped member, processed object)

W': cut substrate (cut plate-shaped member)

S1: a first reservoir

S2: second reservoir

X, Y, Z, θ: direction of rotation

Detailed Description

Next, the present invention will be described in more detail by way of examples. The present invention is not limited by the following description.

As described above, the processing apparatus of the present invention includes: a processing mechanism for processing the object to be processed; and a cleaning mechanism for cleaning the workpiece on which the machining is performed, the cleaning mechanism including: a liquid storage tank for storing the cleaning liquid; and a cleaning roller that rotates in a state in which a part of the cleaning roller is immersed in the cleaning liquid in the liquid reservoir, contacts the workpiece on which the processing is performed, and is disposed so as to be separated from the cleaning roller, and includes a liquid supply port through which the cleaning liquid is supplied into the liquid reservoir and a liquid discharge port through which the cleaning liquid is discharged from the liquid reservoir.

In the above-described machining apparatus, the cleaning roller rotates while being partially immersed in the cleaning liquid in the liquid reservoir, and is brought into contact with the workpiece to be machined to clean the workpiece, so that machining chips adhering to the cleaning roller are removed by the cleaning liquid.

Here, the machining chips removed from the cleaning roller in the liquid sump may be retained in the liquid sump and may adhere to the cleaning roller. Since the liquid supply port and the liquid discharge port of the present invention are disposed so as to be separated from the cleaning roller, a flow of the cleaning liquid is formed from the liquid supply port toward the liquid discharge port with respect to the cleaning roller. As a result, the cleaning liquid collides against the cleaning roller from one direction, and then the cleaning liquid is discharged to the outside from the liquid discharge port, so that the processing chips removed from the cleaning roller in the liquid sump are discharged together with the cleaning liquid. This makes it possible to prevent the processing chips present in the liquid sump from adhering to the cleaning roller.

Heavy machining chips tend to sink and settle to the bottom of the sump. The deposited machining chips may be agitated by the rotation of the cleaning roller, move to the water surface side, and adhere to the cleaning roller again.

In order to suitably solve the above problem, it is desirable that the liquid discharge port is formed in the bottom of the liquid sump.

With this configuration, the machining chips that have fallen to the bottom of the liquid sump can be efficiently discharged, and reattachment to the cleaning roller can be reduced.

In order to reduce the installation area of the cleaning mechanism, it is desirable that the liquid supply port is formed in the bottom of the liquid sump. In this case, a liquid supply pipe connected to the liquid supply port is connected to the bottom of the liquid storage tank. In the above configuration, in order to prevent the cleaning liquid from flowing upward from the liquid supply port, it is preferable that the cleaning mechanism further includes a lid member provided so as to cover the liquid supply port.

In the case of a cut substrate obtained by singulating a workpiece, it is preferable that the cleaning roller has a cylindrical shape and rotates around its center axis in order to clean the cut substrate at once.

In the above configuration, it is preferable that the liquid supply port and the liquid discharge port are disposed so as to be separated from each other by a center axis of the cleaning roller.

In order to remove the machining chips adhering to the cleaning roller uniformly by making the cleaning liquid flowing toward the cleaning roller more uniform, it is preferable that the reservoir includes a partition plate which is provided between the cleaning roller and the liquid supply port, which partitions a first reservoir on the side of the liquid supply port and a second reservoir on the side of the cleaning roller, and which allows the cleaning liquid to overflow from the first reservoir to the second reservoir. By making the flow of the cleaning liquid more uniform, the machining chips accumulated in the liquid storage tank can be discharged without being biased.

In order to facilitate the flow of the machining chips sinking to the bottom of the liquid sump toward the liquid discharge port and to facilitate the flow of the machining chips toward the cleaning roller and the liquid discharge port, it is preferable that the bottom of the liquid sump includes an inclined portion which is inclined downward from the liquid supply port side toward the liquid discharge port side.

If only the cleaning liquid is brought into contact with the cleaning roller, the machining chips may not be sufficiently removed. Therefore, it is desirable that the cleaning mechanism further includes a removing member that comes into contact with the cleaning roller above the liquid sump to remove the machining chips attached to the cleaning roller.

In addition, the method of manufacturing the article of the present invention comprises: a processing step of processing a workpiece; and a cleaning step of cleaning the workpiece on which the processing is performed, the cleaning step being performed by a cleaning mechanism including: a liquid storage tank for storing the cleaning liquid; and a cleaning roller that rotates in a state in which a part of the cleaning roller is immersed in the cleaning liquid in the liquid reservoir, contacts the workpiece on which the processing is performed, and is disposed so as to be separated from the cleaning roller, and includes a liquid supply port through which the cleaning liquid is supplied into the liquid reservoir and a liquid discharge port through which the cleaning liquid is discharged from the liquid reservoir.

< one embodiment of the present invention >

Hereinafter, an embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. In any of the drawings described below, the schematic drawings are appropriately omitted or exaggerated for ease of understanding. The same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

< integral constitution of processing apparatus >

As shown in fig. 1, a processing apparatus 100 according to the present embodiment is a cutting apparatus that cuts a sealed plate-like member W as a workpiece to be processed and singulates the sealed plate-like member into a plurality of products P (cut products). The cutting apparatus 100 includes a plate-like member supply unit a, a plate-like member cutting unit B, an inspection unit C, and a storage unit D as respective constituent components. Each of the components (the units a to D) is detachable and replaceable with respect to the other components.

Here, the sealed plate-shaped member W is formed by virtually dividing a plate-shaped member such as a printed circuit board or a lead frame into a plurality of grid-shaped regions, mounting chip-shaped elements (for example, semiconductor chips) in the respective regions, and then sealing a part or the whole of the plate-shaped member with resin. The sealed plate-like member W has a substrate-side surface and a resin-side surface. The sealed substrate is cut by a cutting mechanism (processing mechanism) such as a rotary cutter, and the substrate is singulated into individual regions to be products P. In the following, an example of cutting the sealed substrate as the sealed plate-like member W is described.

The plate-like member supply unit a is provided with a plate-like member supply mechanism 2. The sealed substrate W corresponding to the object to be cut is carried out from the plate member supply mechanism 2 and transferred to the plate member cutting unit B by a transfer mechanism (not shown). The sealed substrate W may be transferred with the substrate side surface facing upward, or may be transferred with the resin side surface facing upward. For example, a sealed substrate W of a Ball Grid Array Package (BGA) system is transferred with the substrate side facing upward. On the other hand, a sealed substrate W, which is sealed with a transparent resin material and resin like a Light Emitting Diode (LED), is often transferred with the resin side surface facing upward. Fig. 1 illustrates a case where the sealed substrate W of the BGA type is cut. Therefore, the sealed substrate W is transferred with the substrate side surface facing upward.

The cutting apparatus 100 shown in fig. 1 is a single-stage cutting apparatus. Therefore, one cutting deck 3 is provided in the plate-like member cutting unit B. The cutting table 3 is movable in the Y direction of fig. 1 by a moving mechanism 4 and is rotatable in the θ direction by a rotating mechanism 5. The sealed substrate W is placed on and sucked onto the cutting stage 3. When a ceramic substrate (ceramic substrate) or a printed wiring board (printed wiring board) in which a plurality of Contact Image sensors (Contact Image sensors) and a plurality of Thermal Print heads (Thermal Print heads) are embedded, each having a shape of an elongated row, is singulated, the rotating mechanism 5 may be omitted.

The plate member cutting unit B is provided with two spindles (spindle)6A and 6B as cutting mechanisms (machining mechanisms). The cutting device 100 is a double-spindle cutting device provided with two

spindles

6A and 6B. The two

main shafts

6A, 6B are independently movable in the X direction. The two

main shafts

6A and 6B are provided with a rotary knife 61A and a rotary knife 61B, respectively. The sealed substrate W is cut by the rotation of the rotary blade 61A and the rotary blade 61B in a plane including the Y direction and the Z direction.

Each of the

spindles

6A and 6B is provided with a cutting water supply nozzle (not shown) for spraying cutting water toward a point to be machined in order to suppress frictional heat generated by the rotating blade 61A and the rotating blade 61B rotating at high speed, for example. The sealed substrate W is cut by moving the cutting table 3 relative to the spindle 6A and the spindle 6B. Fig. 1 shows a case where the sealed substrate W is cut by fixing the

main shafts

6A and 6B and moving the cutting table 3 in the Y direction.

In the plate-like member cutting unit B, a cleaning mechanism 7 and a cleaning mechanism 8 are provided, the cleaning mechanism 7 cleaning one surface (a surface on the substrate side in fig. 1) of a cut substrate (cut plate-like member) W ', which is an aggregate including a plurality of products P obtained by cutting and singulating the sealed substrate W, and the cleaning mechanism 8 cleaning the other surface (a surface on the resin side in fig. 1) of the cut substrate W'.

The spray cleaning mechanism 71 and the drying mechanism 72 are integrally provided in the cleaning mechanism 7. The cutting deck 3 is linearly reciprocated in the Y direction by the moving mechanism 4 below the cleaning mechanism 7. The cutting stage 3 linearly reciprocates below the cleaning mechanism 7, whereby the substrate-side surface of the cut substrate W' is cleaned by the spray cleaning mechanism 71 and dried by the drying mechanism 72. The cleaning mechanism 7 having the spray cleaning mechanism 71 and the drying mechanism 72 may be integrally movable or may be fixed.

The cleaning mechanism 8 is provided with a cleaning roller 82 rotatable about a Y-direction as a rotation axis. The cut substrate W' is disposed above the cleaning mechanism 8 for cleaning the resin side surface. The cut substrate W' is fixed by sucking the substrate side surface thereof by the transfer mechanism 9. In other words, the cut substrate W' is fixed to the conveyance mechanism 9 with the resin side facing downward. The conveyance mechanism 9 is movable in the X direction and the Z direction. The resin-side surface of the cut substrate W' is cleaned by the cleaning roller 82 by the conveyance mechanism 9 moving back and forth in the X direction while being lowered. The drying section for drying the resin-side surface of the cut substrate W' after cleaning may be provided inside the cleaning mechanism 8 or outside the cleaning mechanism. The drying section may be an air blast (air blow) or the like.

The inspection unit C is provided with an inspection stage 10. The cut substrate W' is transferred to the inspection stage 10. The inspection stage 10 is configured to be movable in the X direction and rotatable about the Y direction. The plurality of singulated products P are inspected on the resin side surface and the substrate side surface by the inspection camera 11, and are classified into good products and defective products. The inspected cut substrate W' is transferred to an index table (index table) 12. In the inspection unit C, a plurality of transfer mechanisms 13 are provided to transfer the plurality of products P disposed on the index table 12 to the tray.

The storage unit D is provided with a good-product tray 14 for storing good products and a defective-product tray 15 for storing defective products. The products P sorted into good products and defective products are stored in the trays 14 and 15 by the transfer mechanism 13. In fig. 1, only one tray 14 and tray 15 is shown, but a plurality of trays 14 and 15 are provided in the storage unit D. The storage unit D may be provided with a good-product tray storage unit for storing a good-product tray 14 in which good products are stored, a defective-product tray storage unit for storing a defective-product tray 15 in which defective products are stored, and an empty tray (pre-storage tray) supply unit for supplying an empty tray before storage.

In the present embodiment, a control unit CTL that sets and controls the operation of the cutting apparatus 100, the cutting conditions, the cleaning conditions, and the like is provided in the plate-like member supply unit a. The control unit CTL is not limited to this, and may be provided in other units B to D.

Specific constitution of < washing means 8 >

Next, a specific configuration of the cleaning mechanism 8 will be described.

As shown in particular in fig. 2 and 3, the cleaning means 8 comprise: a liquid storage tank 81 for storing water as a cleaning liquid, and a cleaning roller 82 in contact with the resin side surface of the cut substrate W' positioned above the liquid storage tank 81.

The liquid storage tank 81 has a box shape having an opening 81H on the upper surface, and stores water for cleaning the cleaning roller 82. The liquid sump 81 of the present embodiment has a bottom 81a having a substantially rectangular shape in a flat plate shape, and side walls 81b provided on each side of the bottom 81 a. In the liquid storage tank 81, a part of the cleaning roller 82 is disposed to be immersed in water from an opening 81H on the upper surface.

Further, the liquid storage tank 81 is formed with a liquid supply port 83 for supplying water into the tank 81 and a liquid discharge port 84 for discharging water from the tank. A supply pipe 85 is connected to the liquid supply port 83, and the supply pipe 85 supplies water from the outside to the liquid sump 81. The amount of water supplied from the supply pipe 85 is adjusted by a flow rate adjusting mechanism, not shown, so that the water level in the reservoir 81 is substantially constant. The water discharged from the liquid discharge port 84 is stored in a waste liquid container (not shown) provided below. Further, a discharge pipe may be connected to the liquid discharge port 84.

The cleaning roller 82 has a cylindrical shape and rotates about its center axis 82 x. The cleaning roller 82 is horizontally disposed above the liquid sump 81 so that the center axis 82x thereof is along the Y direction. The cleaning roller 82 of the present embodiment is a cylindrical rotating brush having bristles 82b radially arranged on the outer circumferential surface of a shaft portion 82 a.

The cleaning roller 82 is configured to rotate in a state in which a part thereof (specifically, a part of the brush 82b in the circumferential direction) is immersed in water in the liquid storage tank 81. Specifically, both axial ends of the shaft 82a of the cleaning roller 82 are rotatably supported by the support 80, and are rotationally driven by a motor (not shown) connected to one axial end. The support body 80 is provided separately from the liquid sump 81, but the support body 80 may be configured using the side wall 81b of the liquid sump 81.

In addition, the cleaning mechanism 8 includes a water removal member 86 to remove water contained in the cleaning roller 82. The water removing member 86 is a rod-shaped member provided along the central axis 82x of the cleaning roller 82, and contacts the rotating cleaning roller 82 during cleaning. The water removing member 86 is brought into contact with the brush 82b which is exposed from the water and directed toward the cut substrate W' to remove the water.

In the cleaning mechanism 8 of the present embodiment, the liquid supply port 83 and the liquid discharge port 84 formed in the liquid sump 81 are disposed so as to be separated from the cleaning roller 82. The liquid supply port 83 and the liquid discharge port 84 are formed in the bottom 81a of the liquid sump 81.

The liquid supply port 83 of the present embodiment is formed at 2 positions. The two liquid supply ports 83 are preferably provided at positions substantially equidistant from the central axis 82x of the cleaning roller 82, that is, at positions arranged in the Y direction. The two liquid supply ports 83 are preferably provided at positions substantially symmetrical in the Y direction with respect to the bottom 81a of the liquid sump 81. The number of the liquid supply ports 83 is not limited to two, and may be one, or three or more. When three or more liquid supply ports 83 are formed, it is desirable that they be provided at substantially equal intervals in the Y direction in order to uniformize the flow of water.

On the other hand, the liquid discharge port 84 is formed in a linear slit shape extending in the Y direction. The liquid discharge port 84 is preferably provided so that the direction in which it extends in a linear slit shape is substantially parallel to the central axis 82x of the cleaning roller 82, i.e., along the Y direction. A plurality of liquid discharge ports 84 may be formed similarly to the liquid supply ports 83.

The reservoir 81 has a partition 87, and the partition 87 divides the interior of the reservoir 81 into a first reservoir S1 on the side of the liquid supply port 83 and a second reservoir S2 on the side of the cleaning roller 82.

The partition 87 is provided between the cleaning roller 82 and the liquid supply port 83 so as to be substantially parallel to the central axis 82x of the cleaning roller 82. The height dimension of the spacer 87 is substantially the same in the longitudinal direction in plan view. The height of the partition 87 is set to be lower than the height of the side wall 81b of the liquid sump 81. This prevents water from overflowing from the side wall 81b of the liquid storage tank 81.

In the bottom 81a of the reservoir 81, the liquid supply port 83 is located on the first reservoir S1 side, and the liquid discharge port 84 is located on the second reservoir S2 side. The water stored in the first reservoir S1 from the liquid supply port 83 overflows the partition 87 and flows into the second reservoir S2. Here, by storing the water that has flowed into the first reservoir S1 from the liquid supply port 83 in the first reservoir S1, the flow velocity unevenness in the width direction (Y direction in fig. 2) is alleviated. In addition, since the water flowing from the first reservoir S1 to the second reservoir S2 overflows the partition 87, the flow velocity in the width direction becomes more uniform. Thereby, the flow of the water flowing toward the cleaning roller 82 in the second reservoir S2 is more uniformed in the axial direction of the cleaning roller 82.

In the present embodiment, the rotation direction of the cleaning roller 82 is set to be opposite to the flow direction of the water (see fig. 3). Since the moving direction of the brush 82b of the washing roller 82 in water is opposite to the flowing direction of water, when the immersed portion (brush 82b) of the washing roller 82 comes into contact with water, the force received from the water increases, and the processing chips attached to the washing roller 82 are easily removed.

The cleaning mechanism 8 further includes a cover member 88 provided to cover the liquid supply port 83. Since the liquid supply port 83 of the present embodiment is formed in the bottom 81a of the liquid sump 81, the lid member 88 is also provided in the bottom 81a of the liquid sump 81. In addition, a cover member 88 is provided for each liquid supply port 83.

The cover member 88 is provided above the liquid supply port 83 in the reservoir 81 (specifically, in the first reservoir S1) at a distance therefrom, and in the present embodiment, disperses water flowing in upward direction from the liquid supply port 83 in the lateral direction (Y direction). In fig. 2, the components are dispersed in two directions along the Y direction. The cover member 88 may be configured to cover a part of the liquid supply port 83, in addition to the entire liquid supply port 83 as shown in fig. 2. The cover member 88 is not limited to a shape having a U-shaped cross section, and may cover a part or the whole of the liquid supply port 83.

By providing the cover member 88 so as to cover the liquid supply port 83 in this way, the water flowing in from the liquid supply port 83 can be dispersed by the cover member 88, and the variation in the flow velocity in the first reservoir S1 can be further alleviated.

< Effect of the present embodiment >

According to the cutting apparatus 100 of the present embodiment, since the cleaning roller 82 rotates in a state in which a part thereof is immersed in water in the liquid sump 81 and is cleaned by being brought into contact with the cut substrate W', the processing chips adhering to the cleaning roller 82 are removed by the water.

In particular, in the present embodiment, since the liquid supply port 83 and the liquid discharge port 84 are disposed so as to be spaced apart from the cleaning roller 82, a flow of water is formed from the liquid supply port 83 toward the liquid discharge port 84 with respect to the cleaning roller 82. As a result, the water collides against the cleaning roller 82 from one direction, and then, the water is discharged to the outside from the liquid discharge port 84, so that the processing chips removed from the cleaning roller 82 in the liquid sump 81 are discharged together with the water. This makes it possible to prevent the machining chips present in the liquid sump 81 from adhering to the cleaning roller 82.

In addition, in the present embodiment, since the liquid discharge port 84 is formed in the bottom portion 81a of the liquid sump 81, the machining chips sinking to the bottom portion 81a of the liquid sump 81 can be efficiently discharged, and reattachment to the cleaning roller 82 can be reduced.

Further, in the present embodiment, since the cover member 88 is provided to cover the liquid supply port 83, the water flowing from the liquid supply port 83 can be dispersed while preventing upward spraying of the water from the liquid supply port 83, and the flow rate of the water flowing to the cleaning roller 82 can be further equalized.

In addition, since the inside of the reservoir 81 is divided into the first reservoir S1 and the second reservoir S2 by the partition 87 and water overflows from the first reservoir S1 to the second reservoir S2, the water flowing toward the cleaning roller 82 is more uniformly distributed, and thus the processing chips adhering to the cleaning roller 82 can be uniformly removed.

< other modified embodiment >

The present invention is not limited to the above embodiments.

For example, the positions of the liquid supply port 83 and the liquid discharge port 84 may be the side wall portion 81b of the liquid sump 81. In this case, in order to easily discharge the sinking machining chips, it is desirable that the liquid discharge port 84 is located as close to the bottom 81a as possible.

Further, the liquid supply port 83 and the liquid discharge port 84 may be configured by a liquid supply tube 8A and a liquid discharge tube 8B provided separately from the liquid storage tank 81 as shown in fig. 4, instead of providing the liquid supply port 83 and the liquid discharge port 84 at the bottom or the side wall portion 81B of the liquid storage tank 81. In this case, the opening on the side of the liquid reservoir 81 in the liquid supply tube 8A becomes the liquid supply port 83, and the opening on the side of the liquid reservoir 81 in the liquid discharge tube 8B becomes the liquid discharge port 84. In this case, it is desirable that the liquid discharge port 84 is disposed as close as possible to the bottom 81a of the liquid sump 81. A suction pump (not shown) is provided in the liquid discharge pipe 8B to suck water in the liquid storage tank 81.

The height of the partition 87 may not be substantially the same, but may be different in the longitudinal direction in plan view. For example, the flow of the cleaning liquid in the central portion can be increased by setting the height of the central portion of the partition plate 87 lower than that in the both end portions, or the flow of the cleaning liquid in the both end portions can be increased by setting the configuration to the opposite side. Further, it is conceivable to set the height dimension in accordance with the positional relationship with the liquid supply port 83. For example, it is conceivable to increase the height of the portion close to the liquid supply port 83 and decrease the height of the portion away from the liquid supply port 83 to make the flow uniform.

Alternatively, as shown in fig. 5, the following configuration may be adopted: the bottom 81a of the liquid storage tank 81 has an inclined portion 81a1 descending from the liquid supply port 83 side toward the liquid discharge port 84 side. In fig. 5, the partition 87 is provided, and the inclined portion 81a1 is configured to descend from the partition 87 toward the liquid discharge port 84. The inclined portion 81a1 is not limited to a flat shape (straight shape), and may be curved so as to be depressed at the center in the width direction, as long as the flow of the cleaning liquid toward the liquid discharge port 84 is formed. The inclined portion 81a1 enables machining chips to be efficiently discharged from the liquid discharge port 84.

Further, as shown in fig. 5, the cleaning mechanism 8 may further include a removing member 89, and the removing member 89 is in contact with the cleaning roller 82 above the liquid sump 81 to remove the processing chips attached to the cleaning roller 82. As shown in fig. 5, the removing member 89 has a rod shape provided along the central axis 82x of the cleaning roller 82, and contacts the rotating cleaning roller 82 during cleaning. When the cleaning roller 82 is a rotating brush, a comb-shaped cleaning roller having a plurality of protrusions 89a is considered to be used in order to easily remove machining chips that have entered between brush bristles. The removing member 89 functions to remove the machining chips adhering to the cleaning roller 82 and also functions to remove water contained in the cleaning roller 82. The removing member 89 is provided midway toward the cleaning liquid from the cleaning roller 82 toward the cut substrate W ', but may be provided midway toward the cleaning liquid from the cut substrate W'.

In the above embodiment, when the sealed substrate W sealed with resin is cut, the sealed substrate W is transferred with the resin side surface facing upward. At this time, the cleaning mechanism 7 cleans the resin side surface of the cut substrate W ', and the cleaning mechanism 8 cleans the substrate side surface of the cut substrate W'.

The cleaning roller may be made of a material having water-containing property such as sponge, in addition to the rotating brush.

In the above-described embodiment, the cutting device of the single cutting table system and the double spindle structure has been described, but the present invention is not limited to this, and may be a cutting device of the single cutting table system and the single spindle structure, a cutting device of the double cutting table system and the double spindle structure, and the like.

In addition, the machining device of the present invention may be a device that performs machining other than cutting, for example, a device that performs other machining such as cutting or grinding.

It is to be understood that the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the invention.

Claims

1. A processing device, comprising: a processing mechanism for cutting the workpiece by supplying cutting water to the workpiece so as to singulate the workpiece into a plurality of products; and a cleaning mechanism for cleaning the workpiece subjected to the processing and in a state in which an aggregate including a plurality of products is fixed, and for cleaning the workpiece

The cleaning mechanism includes: a liquid storage tank for storing water as a cleaning liquid; a cleaning roller that rotates in a state in which a part of the cleaning roller is immersed in the water in the liquid sump and that is in contact with the workpiece on which the processing is performed, the workpiece being positioned above the liquid sump; and a removing member which comes into contact with the cleaning roller above the liquid sump to remove processing chips attached to the cleaning roller and remove water contained in the cleaning roller,

the washing roller rotates in a direction opposite to the flow direction of the water,

a plurality of liquid supply ports for supplying the water into the liquid storage tank and a liquid discharge port for discharging the water from the liquid storage tank are arranged with the cleaning roller interposed therebetween,

the liquid supply ports are formed at the bottom of the liquid storage tank and supply the water in an upward direction,

the reservoir includes a partition disposed between the cleaning roller and the liquid supply port, and divided into a first reservoir on the side of the liquid supply port and a second reservoir on the side of the cleaning roller, so that the water overflows from the first reservoir to the second reservoir.

2. The processing apparatus according to claim 1, wherein the liquid discharge port is formed at a bottom of the liquid sump.

3. The processing apparatus according to claim 1, wherein the cleaning mechanism further comprises a cover member provided so as to cover the liquid supply port.

4. The processing apparatus according to claim 1, wherein the cleaning roller has a cylindrical shape and rotates about a center axis thereof,

the liquid supply port and the liquid discharge port are disposed so as to be separated from the central axis.

5. The processing apparatus according to claim 1, wherein a bottom of the liquid sump includes an inclined portion that descends from the liquid supply port side toward the liquid discharge port side.

6. A method of manufacturing an article comprising: a processing step of performing cutting by supplying cutting water so as to singulate the workpiece into a plurality of products; and

a cleaning step of cleaning the workpiece subjected to the processing and in a state in which an aggregate including a plurality of products is fixed, and cleaning the workpiece

The cleaning process is carried out by a cleaning mechanism,

a plurality of liquid supply ports for supplying the water into the liquid storage tank and a liquid discharge port for discharging the water from the liquid storage tank are arranged with the cleaning roller interposed therebetween, the plurality of liquid supply ports are formed in a bottom portion of the liquid storage tank and supply the water in an upward direction,

7. The method of manufacturing an article according to claim 6, wherein the cleaning mechanism further comprises a lid member provided so as to cover the liquid supply port.

8. The method of manufacturing a product according to claim 6, wherein a bottom of the liquid sump includes an inclined portion that descends from the liquid supply port side toward the liquid discharge port side.