JP2019126749A - Processing device and production method of product - Google Patents
Processing device and production method of product Download PDFInfo
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- JP2019126749A JP2019126749A JP2018008101A JP2018008101A JP2019126749A JP 2019126749 A JP2019126749 A JP 2019126749A JP 2018008101 A JP2018008101 A JP 2018008101A JP 2018008101 A JP2018008101 A JP 2018008101A JP 2019126749 A JP2019126749 A JP 2019126749A
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- liquid
- cleaning
- storage tank
- liquid storage
- supply port
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000007788 liquid Substances 0.000 claims abstract description 266
- 238000003860 storage Methods 0.000 claims abstract description 123
- 230000007246 mechanism Effects 0.000 claims abstract description 77
- 239000002699 waste material Substances 0.000 claims abstract description 16
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims description 190
- 238000005192 partition Methods 0.000 claims description 16
- 238000005406 washing Methods 0.000 abstract description 18
- 239000012530 fluid Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 43
- 238000005520 cutting process Methods 0.000 description 42
- 230000002950 deficient Effects 0.000 description 15
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 238000007689 inspection Methods 0.000 description 9
- 238000003754 machining Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Dicing (AREA)
- Cleaning In General (AREA)
- Details Of Cutting Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
本発明は、加工装置、及び製品の製造方法に関するものである。 The present invention relates to a processing apparatus and a product manufacturing method.
従来、特許文献1に示すように、被加工物であるワークを個片に切断した後に、当該切断されたワークに回転ブラシ等の洗浄ローラを接触させることで、前記ワークに付着した切断屑等の加工屑を除去して洗浄することが行われている。 Conventionally, as shown in Patent Document 1, after cutting a workpiece, which is a workpiece, into pieces, a cutting roller attached to the workpiece by bringing a cleaning roller such as a rotating brush into contact with the cut workpiece, etc. The processing waste is removed and cleaned.
しかしながら、洗浄中に洗浄ローラに加工屑が付着してしまい、その加工屑を取り除くことができない場合がある。この場合、加工屑が付いた洗浄ローラでワークを洗浄することになり、洗浄能力が低下する恐れがある。 However, there is a case in which machining debris adheres to the cleaning roller during cleaning, and the machining debris can not be removed. In this case, the work is to be cleaned by the cleaning roller with the swarf, which may reduce the cleaning ability.
そこで本発明は、上記問題点を解決すべくなされたものであり、洗浄ローラに付着した加工屑を効率良く除去することをその主たる課題とするものである。 Accordingly, the present invention has been made to solve the above-mentioned problems, and its main object is to efficiently remove the processing waste adhering to the cleaning roller.
すなわち本発明に係る加工装置は、被加工物に加工を施す加工機構と、前記加工が施された被加工物を洗浄する洗浄機構とを含み、前記洗浄機構は、洗浄液を貯留する貯液槽と、当該貯液槽内の洗浄液に一部が浸漬された状態で回転し、前記貯液槽の上方に位置する前記加工が施された被加工物に接触する洗浄ローラとを含み、前記貯液槽内に洗浄液を供給する液供給口と前記貯液槽内から洗浄液を排出する液排出口とが、前記洗浄ローラを挟んで配置されていることを特徴とする。 That is, a processing apparatus according to the present invention includes a processing mechanism that processes a workpiece, and a cleaning mechanism that cleans the processed workpiece, and the cleaning mechanism stores a cleaning liquid. And a cleaning roller that rotates in a state of being partially immersed in the cleaning liquid in the liquid storage tank and is in contact with the processed workpiece that is positioned above the liquid storage tank. A liquid supply port for supplying a cleaning liquid into the liquid tank and a liquid discharge port for discharging the cleaning liquid from the liquid storage tank are arranged with the cleaning roller interposed therebetween.
このように構成した本発明によれば、洗浄ローラに付着した加工屑を効率良く除去することができる。 According to the present invention configured as described above, machining debris attached to the cleaning roller can be efficiently removed.
次に、本発明について、例を挙げてさらに詳細に説明する。ただし、本発明は、以下の説明により限定されない。 Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.
本発明の加工装置は、前述のとおり、被加工物に加工を施す加工機構と、前記加工が施された被加工物を洗浄する洗浄機構とを含み、前記洗浄機構は、洗浄液を貯留する貯液槽と、当該貯液槽内の洗浄液に一部が浸漬された状態で回転し、前記貯液槽の上方に位置する前記加工が施された被加工物に接触する洗浄ローラとを含み、前記貯液槽内に洗浄液を供給する液供給口と前記貯液槽内から洗浄液を排出する液排出口とが、前記洗浄ローラを挟んで配置されていることを特徴とする。
この加工装置であれば、洗浄ローラが貯液槽内の洗浄液に一部が浸漬された状態で回転し、被加工物に接触して洗浄するので、洗浄ローラに付着した加工屑は洗浄液により除去される。
ここで、貯液槽内で洗浄ローラから除去された加工屑が貯液槽内で滞留し、洗浄ローラに付着してしまう恐れがある。本発明は、液供給口と液排出口とが洗浄ローラを挟んで配置されているので、洗浄ローラに対して液供給口から液排出口に向かって洗浄液の流れが形成される。その結果、洗浄ローラに対して洗浄液が一方向から当たり、その後、当該洗浄液が液排出口から外部に排出されるので、貯液槽内で洗浄ローラから除去された加工屑は、洗浄液とともに排出されることになる。これによって、貯液槽内にある加工屑を洗浄ローラに付着しにくくすることができる。
As described above, the processing apparatus of the present invention includes the processing mechanism for processing the workpiece and the cleaning mechanism for cleaning the workpiece subjected to the processing, and the cleaning mechanism stores the cleaning liquid. A liquid tank, and a cleaning roller which rotates in a state in which a part of the liquid tank is immersed in the cleaning liquid in the liquid storage tank, and which is in contact with the processed object located above the liquid storage tank; A liquid supply port for supplying a cleaning liquid into the liquid storage tank and a liquid discharge port for discharging the cleaning liquid from the liquid storage tank are disposed sandwiching the cleaning roller.
In this processing device, the cleaning roller rotates in a state where the cleaning roller is partially immersed in the cleaning solution in the liquid storage tank, and contacts the workpiece to be cleaned, so that the processing debris attached to the cleaning roller is removed by the cleaning solution Is done.
Here, there is a possibility that the machining debris removed from the cleaning roller in the liquid storage tank may stagnate in the liquid storage tank and adhere to the cleaning roller. In the present invention, since the liquid supply port and the liquid discharge port are disposed to sandwich the cleaning roller, the flow of the cleaning liquid is formed from the liquid supply port to the liquid discharge port with respect to the cleaning roller. As a result, the cleaning liquid strikes the cleaning roller from one direction, and thereafter, the cleaning liquid is discharged from the liquid discharge port to the outside, so that the scrap removed from the cleaning roller in the storage tank is discharged together with the cleaning liquid. Will be. Thereby, it is possible to make it difficult for the processing waste in the liquid storage tank to adhere to the cleaning roller.
重量の重い加工屑は貯液槽の底部に沈下して滞留しやすい。この沈下した加工屑は、洗浄ローラの回転によって攪拌されて水面側に移動して洗浄ローラに再付着する可能性がある。
この問題を好適に解決するためには、前記液排出口は、前記貯液槽の底部に形成されていることが望ましい。
この構成であれば、貯液槽の底部に沈下した加工屑を効率良く排出することができ、洗浄ローラへの再付着を低減することができる。
Heavy processing waste tends to sink and stay at the bottom of the liquid storage tank. There is a possibility that the sunken work pieces are stirred by the rotation of the washing roller, move to the water surface side, and reattach to the washing roller.
In order to solve this problem suitably, it is desirable that the liquid outlet be formed at the bottom of the liquid storage tank.
With this configuration, the processing waste that has sunk to the bottom of the liquid storage tank can be efficiently discharged, and re-adhesion to the cleaning roller can be reduced.
洗浄機構の設置面積を小さくするためには、前記液供給口は、前記貯液槽の底部に形成されていることが望ましい。この場合、液供給口に接続される液供給管は、貯液槽の底部に接続されることになる。この構成において、液供給口からの洗浄液の噴き上がりを防止するためには、前記洗浄機構は、前記液供給口を覆うように設けられたカバー部材をさらに含むことが望ましい。 In order to reduce the installation area of the cleaning mechanism, the liquid supply port is preferably formed at the bottom of the liquid storage tank. In this case, the liquid supply pipe connected to the liquid supply port is connected to the bottom of the storage tank. In this configuration, it is preferable that the cleaning mechanism further includes a cover member provided so as to cover the liquid supply port in order to prevent the cleaning liquid from being spouted from the liquid supply port.
被加工物が個片化された切断済基板などの場合に、切断済基板を一挙に洗浄するためには、前記洗浄ローラは、円筒形状をなし、その中心軸周りに回転するものであることが望ましい。
この構成の場合には、前記液供給口及び前記液排出口は、前記洗浄ローラの中心軸を挟んで配置されていることが望ましい。
When the workpiece is a singulated cut substrate or the like, the washing roller has a cylindrical shape and rotates around its central axis in order to wash the cut substrate at once. Is desirable.
In the case of this configuration, it is desirable that the liquid supply port and the liquid discharge port be disposed sandwiching the central axis of the cleaning roller.
洗浄ローラに流れる洗浄液をより均等にすることで、洗浄ローラに付着した加工屑の除去を満遍なく行うためには、前記貯液槽は、前記洗浄ローラと前記液供給口との間に設けられ、前記液供給口側の第1貯液室と前記洗浄ローラ側の第2貯液室とに区画し、前記洗浄液を前記第1貯液室から前記第2貯液室へオーバーフローさせる仕切り板を含むことが望ましい。洗浄液の流れをより均等することによって貯液槽内に滞留した加工屑を偏りなく排出することもできる。 In order to uniformly remove the processing waste adhering to the cleaning roller by making the cleaning liquid flowing to the cleaning roller more uniform, the liquid storage tank is provided between the cleaning roller and the liquid supply port, A partition plate that divides into a first liquid storage chamber on the liquid supply port side and a second liquid storage chamber on the cleaning roller side, and causes the cleaning liquid to overflow from the first liquid storage chamber to the second liquid storage chamber; Is desirable. By making the flow of the cleaning solution even more uniform, it is possible to evenly discharge the processing debris remaining in the storage tank.
洗浄ローラ及び液排出口への流れを生成しやすくするとともに、貯液槽の底部に沈下した加工屑を液排出口に流れやすくするためには、前記貯液槽の底部は、前記液供給口側から前記液排出口側に向かって下る傾斜部を含むことが望ましい。 In order to make it easy to generate the flow to the cleaning roller and the liquid discharge port, and to make it easier for the processing waste sinking to the bottom of the liquid storage tank to flow to the liquid discharge port, the bottom of the liquid storage tank has the liquid supply port It is desirable to include an inclined portion which descends from the side toward the liquid outlet side.
洗浄液を洗浄ローラに接触させるだけでは加工屑を十分に除去できない可能性がある。このため、前記洗浄機構は、前記貯液槽の上方において前記洗浄ローラに接触して当該洗浄ローラに付着した加工屑を除去する除去部材をさらに含むことが望ましい。 There is a possibility that the cutting waste can not be sufficiently removed only by bringing the cleaning solution into contact with the cleaning roller. For this reason, it is desirable that the cleaning mechanism further includes a removing member that contacts the cleaning roller above the liquid storage tank and removes processing waste adhering to the cleaning roller.
また、本発明に係る製品の製造方法は、被加工物に加工を施す加工工程と、前記加工が施された被加工物を洗浄する洗浄工程とを含み、前記洗浄工程は、洗浄機構を用いて行われ、前記洗浄機構は、洗浄液を貯留する貯液槽と、当該貯液槽内の洗浄液に一部が浸漬された状態で回転し、前記貯液槽の上方に位置する前記加工が施された被加工物に接触する洗浄ローラとを含み、前記貯液槽内に洗浄液を供給する液供給口と前記貯液槽内から洗浄液を排出する液排出口とが、前記洗浄ローラを挟んで配置されていることを特徴とする。 The product manufacturing method according to the present invention includes a processing step of processing a workpiece and a cleaning step of cleaning the workpiece subjected to the processing, and the cleaning step uses a cleaning mechanism. The cleaning mechanism rotates in a state in which the cleaning liquid is stored in the liquid storage tank and the cleaning liquid in the liquid storage tank is partially immersed in the cleaning mechanism, and the processing is performed above the liquid storage tank. A liquid supply port for supplying a cleaning liquid into the liquid storage tank, and a liquid discharge port for discharging the cleaning liquid from the liquid storage tank, with the cleaning roller interposed therebetween. It is characterized by being arranged.
<本発明の一実施形態>
以下に、本発明に係る加工装置の一実施形態について、図面を参照して説明する。なお、以下に示すいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。同一の構成要素については、同一の符号を付して説明を適宜省略する。
<One Embodiment of the Present Invention>
Hereinafter, an embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. In addition, also about any figure shown below, in order to make it intelligible, it abbreviate | omits or exaggerates suitably and is schematically drawn. About the same component, the same numerals are attached and explanation is omitted suitably.
<加工装置の全体構成>
本実施形態の加工装置100は、図1に示すように、被加工物である封止済板状部材Wを切断することによって複数の製品P(切断品)に個片化する切断装置である。切断装置100は、板状部材供給ユニットAと板状部材切断ユニットBと検査ユニットCと収容ユニットDとを、それぞれ構成要素として備える。各構成要素(各ユニットA〜D)は、それぞれ他の構成要素に対して着脱可能かつ交換可能である。
<Overall configuration of processing equipment>
The processing apparatus 100 according to the present embodiment is a cutting apparatus that singulates into a plurality of products P (cut articles) by cutting a sealed plate-like member W, which is a workpiece, as shown in FIG. 1. . The cutting device 100 includes a plate-like member supply unit A, a plate-like member cutting unit B, an inspection unit C, and a receiving unit D as components. Each component (each unit A to D) is detachable and replaceable with respect to other components.
ここで、封止済板状部材Wは、プリント基板やリードフレームなどの板状部材を格子状の複数の領域に仮想的に区画して、それぞれの領域にチップ状の素子(例えば、半導体チップ)を装着した後、板状部材の一部又は全体を樹脂封止したものである。この封止済板状部材Wは、基板側の面と樹脂側の面とを有する。回転刃などを使用した切断機構(加工機構)によって封止済基板を切断し、それぞれの領域単位に個片化したものが製品Pとなる。なお以下では、封止済板状部材Wとして封止済基板を切断する例を示す。 Here, the sealed plate-like member W virtually divides a plate-like member such as a printed board or a lead frame into a plurality of lattice-like regions, and chip-like elements (for example, semiconductor chips) in each region. A part of or the whole of the plate-like member is resin-sealed. The sealed plate member W has a surface on the substrate side and a surface on the resin side. The sealed substrate is cut by a cutting mechanism (machining mechanism) using a rotary blade or the like, and the product P is obtained by singulating each area unit. In addition, below, the example which cut | disconnects a sealed substrate as the sealed plate-shaped member W is shown.
板状部材供給ユニットAには板状部材供給機構2が設けられる。被切断物に相当する封止済基板Wが、板状部材供給機構2から搬出され、移送機構(図示なし)によって板状部材切断ユニットBに移送される。封止済基板Wは、基板側の面を上にして移送される場合と樹脂側の面を上にして移送される場合とがある。例えば、BGA(Ball Grid Array Package)方式の封止済基板Wは、基板側の面を上にして移送される。一方、LEDのように透明な樹脂材料を用いて樹脂封止された封止済基板Wは、樹脂側の面を上にして移送されることが多い。図1においては、BGA方式の封止済基板Wを切断する場合について説明する。したがって、封止済基板Wは基板側の面を上にして移送される。 The plate member supply unit A is provided with a plate member supply mechanism 2. A sealed substrate W corresponding to an object to be cut is carried out from the plate-like member supply mechanism 2 and transferred to the plate-like member cutting unit B by a transfer mechanism (not shown). The sealed substrate W may be transported with the surface on the substrate side up and may be transported with the surface on the resin side up. For example, a sealed substrate W of the BGA (Ball Grid Array Package) method is transferred with the surface on the substrate side up. On the other hand, a sealed substrate W resin-sealed using a transparent resin material such as an LED is often transported with the surface on the resin side up. In FIG. 1, the case of cutting the sealed substrate W of the BGA method will be described. Therefore, the sealed substrate W is transferred with the substrate side surface up.
図1に示される切断装置100は、シングルカットテーブル方式の切断装置である。したがって、板状部材切断ユニットBには、1個の切断用テーブル3が設けられる。切断用テーブル3は、移動機構4によって図1のY方向に移動可能であり、かつ、回転機構5によってθ方向に回動可能である。切断用テーブル3の上には封止済基板Wが載置されて吸着される。なお、それぞれ細長い列状の形状を有する、複数の密着イメージセンサ(Contact Image Sensor)、複数のサーマルプリントヘッド(Thermal Print Head)などが作り込まれたセラミック基板(ceramic substrate)、プリント基板(printed wiring board)などを個片化する場合には、回転機構5を省略してもよい。 A cutting device 100 shown in FIG. 1 is a single-cut table type cutting device. Therefore, the plate-like member cutting unit B is provided with one cutting table 3. The cutting table 3 is movable in the Y direction in FIG. 1 by the moving mechanism 4 and is rotatable in the θ direction by the rotation mechanism 5. The sealed substrate W is placed on the cutting table 3 and adsorbed. In addition, a ceramic substrate (ceramic substrate) and a printed wiring board (printed wiring) each having a plurality of contact image sensors, a plurality of thermal print heads (Thermal Print Head), etc., each having an elongated row shape. In the case of singulating the board or the like, the rotation mechanism 5 may be omitted.
板状部材切断ユニットBには、切断機構(加工機構)として2個のスピンドル6A、6Bが設けられる。切断装置100は、2個のスピンドル6A、6Bが設けられるツインスピンドル構成の切断装置である。2個のスピンドル6A、6Bは、独立してX方向に移動可能である。2個のスピンドル6A、6Bには、それぞれ回転刃61A、61Bが設けられる。これらの回転刃61A、61Bは、それぞれY方向とZ方向とを含む面内において回転することによって封止済基板Wを切断する。 The plate-like member cutting unit B is provided with two spindles 6A and 6B as a cutting mechanism (processing mechanism). The cutting device 100 is a twin-spindle cutting device in which two spindles 6A and 6B are provided. The two spindles 6A, 6B are independently movable in the X direction. Rotary blades 61A and 61B are provided on the two spindles 6A and 6B, respectively. The rotary blades 61A and 61B cut the sealed substrate W by rotating in the plane including the Y direction and the Z direction.
各スピンドル6A、6Bには、例えば、高速回転する回転刃61A、61Bによって発生する摩擦熱を抑えるために被加工点に向かって切削水を噴射する切削水供給用ノズル(図示なし)が設けられる。切断用テーブル3とスピンドル6A、6Bとを相対的に移動させることによって封止済基板Wを切断する。図1においては、スピンドル6A、6Bを固定して、切断用テーブル3をY方向に移動させることによって封止済基板Wを切断する場合を示す。 Each spindle 6A, 6B is provided with a cutting water supply nozzle (not shown) for injecting cutting water toward the workpiece point in order to suppress frictional heat generated by the rotary blades 61A, 61B rotating at high speed, for example. . The sealed substrate W is cut by relatively moving the cutting table 3 and the spindles 6A and 6B. FIG. 1 shows a case where the sealed substrate W is cut by fixing the spindles 6A and 6B and moving the cutting table 3 in the Y direction.
板状部材切断ユニットBには、封止済基板Wを切断して個片化された複数の製品Pからなる集合体、すなわち、切断済基板(切断済板状部材)W’の一方の面(図1においては基板側の面)を洗浄する洗浄機構7と他方の面(図1においては樹脂側の面)を洗浄する洗浄機構8とが設けられる。 The plate-like member cutting unit B has an assembly of a plurality of products P cut into pieces by cutting the sealed substrate W, that is, one surface of a cut substrate (cut plate-like member) W ′. A cleaning mechanism 7 for cleaning (the surface on the substrate side in FIG. 1) and a cleaning mechanism 8 for cleaning the other surface (the surface on the resin side in FIG. 1) are provided.
洗浄機構7には、噴射洗浄機構71と乾燥機構72とが一体的に設けられる。切断用テーブル3は、移動機構4によって洗浄機構7の下方においてY方向に沿って直線的に往復移動する。切断用テーブル3が洗浄機構7の下方において直線的に往復移動することによって、切断済基板W’の基板側の面が、噴射洗浄機構71によって洗浄され、乾燥機構72によって乾燥される。噴射洗浄機構71と乾燥機構72とを有する洗浄機構7は一体的に移動しても良いし、固定されていても良い。 In the cleaning mechanism 7, a jet cleaning mechanism 71 and a drying mechanism 72 are integrally provided. The cutting table 3 linearly reciprocates along the Y direction below the cleaning mechanism 7 by the moving mechanism 4. As the cutting table 3 linearly reciprocates below the cleaning mechanism 7, the substrate-side surface of the cut substrate W ′ is cleaned by the jet cleaning mechanism 71 and dried by the drying mechanism 72. The cleaning mechanism 7 having the jet cleaning mechanism 71 and the drying mechanism 72 may move integrally or may be fixed.
洗浄機構8には、Y方向を回転軸にして回転可能である洗浄ローラ82が設けられる。樹脂側の面を洗浄する洗浄機構8の上方には、切断済基板W’が配置される。切断済基板W’は、基板側の面を搬送機構9によって吸着されて固定される。言い換えれば、切断済基板W’は、樹脂側の面を下にして搬送機構9に固定される。搬送機構9はX方向及びZ方向に移動可能である。搬送機構9が下降してX方向に往復移動することによって、切断済基板W’の樹脂側の面が洗浄ローラ82によって洗浄される。洗浄後に切断済基板W’の樹脂側の面を乾燥させる乾燥部を洗浄機構8内に設けても良いし、洗浄機構外に設けても良い。乾燥部はエアブロー等であっても良い。 The cleaning mechanism 8 is provided with a cleaning roller 82 which is rotatable with the Y direction as a rotation axis. The cut substrate W 'is disposed above the cleaning mechanism 8 that cleans the surface on the resin side. The cut substrate W ′ is fixed by suction by the transport mechanism 9 on the substrate side surface. In other words, the cut substrate W 'is fixed to the transport mechanism 9 with the resin side surface down. The transport mechanism 9 is movable in the X direction and the Z direction. As the transport mechanism 9 descends and reciprocates in the X direction, the cleaning roller 82 cleans the resin-side surface of the cut substrate W ′. A drying unit for drying the resin-side surface of the cut substrate W 'after cleaning may be provided in the cleaning mechanism 8 or may be provided outside the cleaning mechanism. The drying unit may be air blow or the like.
検査ユニットCには検査用ステージ10が設けられる。切断済基板W’は、検査用ステージ10に移載される。検査用ステージ10はX方向に移動可能であり、かつ、Y方向を軸にして回転できるように構成される。個片化された複数の製品Pは、樹脂側の面及び基板側の面を検査用のカメラ11によって検査されて、良品と不良品とに選別される。検査済みの切断済基板W’は、インデックステーブル12に移載される。検査ユニットCには、インデックステーブル12に配置された複数の製品Pをトレイに移送するため複数の移送機構13が設けられる。 The inspection unit C is provided with an inspection stage 10. The cut substrate W ′ is transferred onto the inspection stage 10. The inspection stage 10 is configured to be movable in the X direction and to be rotatable about the Y direction. The plurality of separated products P are inspected by the inspection camera 11 on the resin side surface and the substrate side surface, and are classified into non-defective products and defective products. The inspected cut substrate W ′ is transferred to the index table 12. The inspection unit C is provided with a plurality of transfer mechanisms 13 for transferring a plurality of products P arranged on the index table 12 to the tray.
収容ユニットDには良品を収容する良品用トレイ14と不良品を収容する不良品用トレイ15とが設けられる。移送機構13によって良品と不良品とに選別された製品Pが各トレイ14、15に収容される。図1においては、各トレイ14、15を1個のみ示しているが、各トレイ14、15は複数個収容ユニットD内に設けられる。また、収容ユニットDには、良品を収容済みの良品用トレイ14を収納する良品用トレイ収納部と、不良品を収容済みの不良品用トレイ15を収納する不良品用トレイ収納部と、収容前の空トレイを供給する空トレイ(収容前トレイ)供給部を設けても良い。 The accommodation unit D is provided with a non-defective product tray 14 for containing non-defective products and a defective product tray 15 for containing defective products. The products P sorted into the non-defective product and the non-defective product by the transfer mechanism 13 are accommodated in the respective trays 14 and 15. Although only one each of the trays 14 and 15 is shown in FIG. 1, a plurality of the trays 14 and 15 are provided in the accommodation unit D. Further, the storage unit D includes a non-defective product tray storage unit that stores the non-defective product tray 14 that has stored the non-defective product, a defective product tray storage unit that stores the defective product tray 15 that has already stored the defective product, and the storage unit D. An empty tray (pre-accommodating tray) supply unit may be provided to supply the front empty tray.
なお、本実施形態においては、切断装置100の動作や切断条件、洗浄条件などを設定して制御する制御部CTLを板状部材供給ユニットA内に設けている。これに限らず、制御部CTLを他のユニットB〜D内に設けてもよい。 In the present embodiment, a control unit CTL that sets and controls the operation of the cutting apparatus 100, cutting conditions, cleaning conditions, and the like is provided in the plate-like member supply unit A. Not limited to this, the control unit CTL may be provided in other units B to D.
<洗浄機構8の具体的構成>
次に洗浄機構8の具体的構成について説明する。
<Specific configuration of cleaning mechanism 8>
Next, the specific configuration of the cleaning mechanism 8 will be described.
洗浄機構8は、特に図2及び図3に示すように、洗浄液として水を貯留する貯液槽81と、貯液槽81の上方に位置する切断済基板W’の樹脂側の面に接触する洗浄ローラ82とを備えている。 As shown in FIGS. 2 and 3 in particular, the cleaning mechanism 8 contacts a liquid storage tank 81 that stores water as a cleaning liquid, and a resin-side surface of the cut substrate W ′ that is positioned above the liquid storage tank 81. And a cleaning roller 82.
貯液槽81は、上面に開口部81Hを有する箱形状をなしており、洗浄ローラ82を洗浄するための水を貯留するものである。本実施形態の貯液槽81は、平板状をなす概略矩形状の底部81aと、当該底部81aの各辺に設けられた側壁部81bとを有する。この貯液槽81には、上面の開口部81Hから洗浄ローラ82の一部が水に浸漬されるように設けられる。 The liquid storage tank 81 has a box shape having an opening 81 H on the top surface, and stores water for cleaning the cleaning roller 82. The liquid storage tank 81 of the present embodiment has a substantially rectangular bottom 81a having a flat plate shape, and side walls 81b provided on each side of the bottom 81a. In the liquid storage tank 81, a part of the cleaning roller 82 is provided so as to be immersed in water from the opening 81H on the upper surface.
また、貯液槽81には、槽81内に水を供給する液供給口83と槽内から水を排出する液排出口84とが形成されている。液供給口83には、外部からの水を貯液槽81に供給するための供給管85が接続されている。この供給管85から供給される水量は、図示しない流量調整機構により貯液槽81内の水面レベルが略一定となるように調整されている。また、液排出口84から排出された水は、下方に設けられた廃液容器(図示なし)に収容される。なお、液排出口84に排出管を接続するようにしても良い。 Further, the liquid storage tank 81 is formed with a liquid supply port 83 for supplying water into the tank 81 and a liquid discharge port 84 for discharging water from the tank. To the liquid supply port 83, a supply pipe 85 for supplying water from the outside to the liquid storage tank 81 is connected. The amount of water supplied from the supply pipe 85 is adjusted so that the water level in the liquid storage tank 81 is substantially constant by a flow rate adjusting mechanism (not shown). Further, the water discharged from the liquid discharge port 84 is stored in a waste liquid container (not shown) provided below. Note that a discharge pipe may be connected to the liquid discharge port 84.
洗浄ローラ82は、円筒形状をなし、その中心軸82x周りに回転するものである。この洗浄ローラ82は、貯液槽81の上方において、その中心軸82xがY方向に沿って水平に設けられている。本実施形態の洗浄ローラ82は、軸部82aの外側周面にブラシ毛82bが放射状に設けられた円筒状をなす回転ブラシである。 The cleaning roller 82 has a cylindrical shape and rotates around its central axis 82x. The central axis 82x of the cleaning roller 82 is provided horizontally along the Y direction above the liquid storage tank 81. The cleaning roller 82 of the present embodiment is a cylindrical rotating brush in which brush bristles 82 b are radially provided on the outer peripheral surface of the shaft portion 82 a.
洗浄ローラ82は、貯液槽81内の水に一部(具体的には周方向における一部のブラシ毛82b)が浸漬された状態で回転するように構成されている。具体的には洗浄ローラ82は、軸部82aの軸方向両端部が、支持体80により回転自在に支持されており、軸方向一端部に連結されたモータ(図示なし)によって回転駆動される。なお支持体80は、貯液槽81とは別に設けられているが、貯液槽81の側壁部81bを用いて構成しても良い。 The cleaning roller 82 is configured to rotate in a state where a part of the water in the liquid storage tank 81 (specifically, a part of the bristles 82b in the circumferential direction) is immersed. Specifically, the cleaning roller 82 is rotatably supported at both ends in the axial direction of the shaft portion 82a by the support 80, and is driven to rotate by a motor (not shown) connected to one end portion in the axial direction. In addition, although the support body 80 is provided separately from the liquid storage tank 81, you may comprise using the side wall part 81b of the liquid storage tank 81. As shown in FIG.
また、洗浄機構8は、洗浄ローラ82に含まれる水を切るための水切り部材86を備えている。この水切り部材86は、洗浄ローラ82の中心軸82xに沿って設けられた棒状をなすものであり、洗浄時に回転する洗浄ローラ82に接触するものである。この水切り部材86は、水から出て切断済基板W’に向かうブラシ毛82bに接触して、水を切るものである。 The cleaning mechanism 8 also includes a drainage member 86 for draining the water contained in the cleaning roller 82. The draining member 86 has a rod shape provided along the central axis 82x of the cleaning roller 82, and contacts the cleaning roller 82 that rotates during cleaning. The draining member 86 contacts the brush bristles 82b which go out of the water and go to the cut substrate W 'to drain the water.
そして本実施形態の洗浄機構8において、貯液槽81に形成された液供給口83及び液排出口84は、洗浄ローラ82を挟んで配置されている。液供給口83及び液排出口84はいずれも貯液槽81の底部81aに形成されている。 In the cleaning mechanism 8 of this embodiment, the liquid supply port 83 and the liquid discharge port 84 formed in the liquid storage tank 81 are arranged with the cleaning roller 82 interposed therebetween. The liquid supply port 83 and the liquid discharge port 84 are both formed in the bottom 81 a of the liquid storage tank 81.
本実施形態の液供給口83は、2箇所形成されている。2つの液供給口83は、洗浄ローラ82の中心軸82xから略等距離の位置、つまり、Y方向に並んだ位置に設けることが好ましい。また、2つの液供給口83は、貯液槽の81の底部81aにおいてY方向に略対称な位置に設けられることが好ましい。なお、液供給口83の数は2個に限られず、1つであっても良いし、3個以上であっても良い。3個以上の液供給口83を形成する場合には、水の流れを均一化するためにY方向に略等間隔に設けることが望ましい。 Two liquid supply ports 83 of the present embodiment are formed. The two liquid supply ports 83 are preferably provided at positions substantially equidistant from the central axis 82x of the cleaning roller 82, that is, at positions aligned in the Y direction. Moreover, it is preferable that the two liquid supply ports 83 be provided at substantially symmetrical positions in the Y direction at the bottom 81 a of the liquid storage tank 81. The number of the liquid supply ports 83 is not limited to two, and may be one or three or more. When three or more liquid supply ports 83 are formed, it is desirable to provide them at substantially equal intervals in the Y direction in order to make the flow of water uniform.
一方、液排出口84は、Y方向に延びる直線スリット状をなすものとしてある。液排出口84は、その直線スリット状に延びる方向が洗浄ローラ82の中心軸82xと略平行に、つまりY方向に沿って設けられることが好ましい。なお、液排出口84も液供給口83と同様に、複数個形成しても良い。 On the other hand, the liquid discharge port 84 has a linear slit shape extending in the Y direction. The liquid discharge port 84 is preferably provided so that the direction extending in a straight slit shape is substantially parallel to the central axis 82x of the cleaning roller 82, that is, along the Y direction. A plurality of liquid discharge ports 84 may be formed in the same manner as the liquid supply port 83.
さらに貯液槽81は、槽81内を液供給口83側の第1貯液室S1と洗浄ローラ82側の第2貯液室S2とに区画する仕切り板87を有している。 Further, the liquid storage tank 81 has a partition plate 87 that partitions the inside of the tank 81 into a first liquid storage chamber S1 on the liquid supply port 83 side and a second liquid storage chamber S2 on the cleaning roller 82 side.
この仕切り板87は、洗浄ローラ82と液供給口83との間において、洗浄ローラ82の中心軸82xと略平行となるように設けられている。仕切り板87の高さ寸法は、平面視における長手方向において略同一である。また、仕切り板87の高さ寸法は、貯液槽81の側壁部81bの高さよりも低く設定してある。これにより、貯液槽81の側壁部81bから水がオーバーフローしないように構成されている。 The partition plate 87 is provided between the cleaning roller 82 and the liquid supply port 83 so as to be substantially parallel to the central axis 82 x of the cleaning roller 82. The height dimension of the partition plate 87 is substantially the same in the longitudinal direction in plan view. The height of the partition plate 87 is set lower than the height of the side wall 81 b of the liquid storage tank 81. Thereby, it is comprised so that water may not overflow from the side wall part 81b of the liquid storage tank 81. FIG.
貯液槽81の底部81aにおいて第1貯液室S1側に液供給口83が位置しており、第2貯液室S2側に液排出口84が位置している。そして、液供給口83から第1貯液室S1に貯留された水は、仕切り板87をオーバーフローして第2貯液室S2に流入する。ここで、液供給口83から第1貯液室S1に流入した水は、第1貯液室S1に貯留されることによって幅方向(図2においてY方向)における流速のムラが緩和される。また、第1貯液室S1から第2貯液室S2に流入する水は、仕切り板87をオーバーフローすることによって、幅方向における流速がより均一化される。これにより第2貯液室S2において洗浄ローラ82に向かって流れる水の流れが、洗浄ローラ82の軸方向においてより均一化される。 In the bottom 81a of the liquid storage tank 81, a liquid supply port 83 is positioned on the first liquid storage chamber S1 side, and a liquid discharge port 84 is positioned on the second liquid storage chamber S2 side. Then, the water stored in the first liquid storage chamber S1 from the liquid supply port 83 overflows the partition plate 87 and flows into the second liquid storage chamber S2. Here, the water that has flowed into the first liquid storage chamber S1 from the liquid supply port 83 is stored in the first liquid storage chamber S1, so that unevenness in the flow velocity in the width direction (Y direction in FIG. 2) is alleviated. Further, the water flowing into the second liquid storage chamber S2 from the first liquid storage chamber S1 overflows the partition plate 87, whereby the flow velocity in the width direction is made more uniform. Thus, the flow of water flowing toward the cleaning roller 82 in the second liquid storage chamber S2 is made more uniform in the axial direction of the cleaning roller 82.
本実施形態では、洗浄ローラ82の回転方向は、水の流れ方向とは逆向きとなるようにしてある(図3参照)。これにより、水中における洗浄ローラ82のブラシ毛82bの移動方向と水の流れ方向が逆向きとなるので、洗浄ローラ82の浸漬部位(ブラシ毛82b)が水と接触する際に、水から受ける力が増大し、洗浄ローラ82に付着した加工屑が除去されやすくなる。 In the present embodiment, the rotation direction of the cleaning roller 82 is opposite to the flow direction of water (see FIG. 3). As a result, the movement direction of the brush bristles 82b of the cleaning roller 82 in water and the flow direction of water are reversed, so that the force received from the water when the immersion part (brush bristles 82b) of the cleaning roller 82 comes into contact with water As a result, machining debris attached to the cleaning roller 82 is easily removed.
さらに洗浄機構8は、液供給口83を覆うように設けられたカバー部材88をさらに備えている。本実施形態の液供給口83は貯液槽81の底部81aに形成されていることから、カバー部材88も貯液槽81の底部81aに設けられている。また、液供給口83毎にカバー部材88が設けられている。 Furthermore, the cleaning mechanism 8 further includes a cover member 88 provided to cover the liquid supply port 83. Since the liquid supply port 83 of the present embodiment is formed at the bottom 81 a of the liquid storage tank 81, the cover member 88 is also provided at the bottom 81 a of the liquid storage tank 81. A cover member 88 is provided for each liquid supply port 83.
このカバー部材88は、貯液槽81内(具体的には第1貯液室S1内)において液供給口83から離間してその上方に設けられており、本実施形態では、液供給口83から上方向に向かって流入した水を横方向(Y方向)に分散させるものである。図2においてはY方向に沿った2方向に分散させるように構成されている。なお、カバー部材88は、図2に示すように液供給口83の全体を覆うように構成される他、液供給口83の一部を覆うように構成しても良い。その他、カバー部材88は、断面下向きコの字状をなす形状に限定されず、液供給口83の一部又は全部を覆うものであれば良い。
このように液供給口83を覆うようにカバー部材88を設けることによって、液供給口83から流入した水はカバー部材88により分散し、第1貯液室S1での流速のムラをより一層緩和することができる。
The cover member 88 is spaced apart from the liquid supply port 83 in the liquid storage tank 81 (specifically, in the first liquid storage chamber S1), and is provided above the liquid supply port 83. In the present embodiment, the cover member 88 is a liquid supply port 83. The water that flows in upward from the side is dispersed in the horizontal direction (Y direction). In FIG. 2, it is configured to disperse in two directions along the Y direction. The cover member 88 may be configured to cover a part of the liquid supply port 83 as well as to cover the entire liquid supply port 83 as shown in FIG. In addition, the cover member 88 is not limited to a U-shaped cross section downward as long as it covers part or all of the liquid supply port 83.
Thus, by providing the cover member 88 so as to cover the liquid supply port 83, the water flowing from the liquid supply port 83 is dispersed by the cover member 88, and the unevenness of the flow velocity in the first liquid storage chamber S1 is further alleviated. can do.
<本実施形態の効果>
本実施形態の切断装置100によれば、洗浄ローラ82が貯液槽81内の水に一部が浸漬された状態で回転し、切断済基板W’に接触して洗浄するので、洗浄ローラ82に付着した加工屑は水により除去される。
特に本実施形態では、液供給口83と液排出口84とが洗浄ローラ82を挟んで配置されているので、洗浄ローラ82に対して液供給口83から液排出口84に向かって水の流れが形成される。その結果、洗浄ローラ82に対して水が一方向から当たり、その後、当該水が液排出口84から外部に排出されるので、貯液槽81内で洗浄ローラ82から除去された加工屑は、水とともに排出されることになる。これによって、貯液槽81内にある加工屑を洗浄ローラ82に付着しにくくすることができる。
<Effect of this embodiment>
According to the cutting apparatus 100 of the present embodiment, the cleaning roller 82 rotates in a state in which the cleaning roller 82 is partially immersed in the water in the liquid storage tank 81 and contacts the cut substrate W ′ to clean it. The chips attached to the water are removed by water.
In particular, in the present embodiment, since the liquid supply port 83 and the liquid discharge port 84 are disposed with the cleaning roller 82 interposed therebetween, the flow of water from the liquid supply port 83 to the liquid discharge port 84 with respect to the cleaning roller 82 Is formed. As a result, water strikes the cleaning roller 82 from one direction, and then the water is discharged from the liquid discharge port 84 to the outside, so the scrap removed from the cleaning roller 82 in the liquid storage tank 81 is It will be discharged with the water. By this, it is possible to make it difficult for the processing debris in the liquid storage tank 81 to adhere to the cleaning roller 82.
また本実施形態では、液排出口84が貯液槽81の底部81aに形成されているので、貯液槽81の底部81aに沈下した加工屑を効率良く排出することができ、洗浄ローラ82への再付着を低減することができる。 In the present embodiment, since the liquid discharge port 84 is formed in the bottom 81 a of the liquid storage tank 81, the processing waste that has settled on the bottom 81 a of the liquid storage tank 81 can be efficiently discharged to the cleaning roller 82. Can reduce reattachment of
さらに本実施形態では、液供給口83を覆うカバー部材88を有するので、液供給口83からの水の噴き上がりを防止するともに、液供給口83から流入した水を分散させることができ、洗浄ローラ82に流れる水の流速をより一層均等にすることができる。 Further, in the present embodiment, since the cover member 88 that covers the liquid supply port 83 is provided, it is possible to prevent the water from flowing from the liquid supply port 83 and to disperse the water that has flowed from the liquid supply port 83, and to wash the liquid. The flow rate of the water flowing through the roller 82 can be made even more uniform.
その上、貯液槽81内を仕切り板87により第1貯液室S1及び第2貯液室S2に区画して、水を第1貯液室S1から第2貯液室S2へオーバーフローさせているので、洗浄ローラ82に流れる水をより均等にすることで、洗浄ローラ82に付着した加工屑の除去を満遍なく行うことができる。 In addition, the liquid storage tank 81 is partitioned into a first liquid storage chamber S1 and a second liquid storage chamber S2 by a partition plate 87, and water is allowed to overflow from the first liquid storage chamber S1 to the second liquid storage chamber S2. Therefore, by making the water flowing to the cleaning roller 82 more even, it is possible to uniformly remove the processing debris attached to the cleaning roller 82.
<その他の変形実施形態>
なお、本発明は前記実施形態に限られるものではない。
<Other Modified Embodiments>
The present invention is not limited to the above embodiment.
例えば、液供給口83及び液排出口84の位置は、貯液槽81の側壁部81bであっても良い。この場合、液排出口84は、沈下した加工屑が排出されやすくするために、底部81aにできるだけ近い位置であることが望ましい。 For example, the positions of the liquid supply port 83 and the liquid discharge port 84 may be the side wall 81 b of the liquid storage tank 81. In this case, it is desirable that the liquid discharge port 84 be located as close as possible to the bottom 81 a in order to facilitate discharge of the sunken cuttings.
また、液供給口83及び液排出口84を貯液槽81の底部又は側壁部81bに設けることなく、図4に示すように、貯液槽81とは別に設けた液供給管8A及び液排出管8Bにより構成しても良い。この場合、液供給管8Aにおける貯液槽81側の開口が液供給口83となり、液排出管8Bにおける貯液槽81側の液排出口84となる。この場合、液排出口84は、貯液槽81の底部81aにできるだけ近い位置に配置されることが望ましい。また、液排出管8Bには吸引ポンプ(図示なし)が設けられており、貯液槽81内の水が吸引される。 Further, without providing the liquid supply port 83 and the liquid discharge port 84 at the bottom or side wall portion 81b of the liquid storage tank 81, the liquid supply pipe 8A and the liquid discharge provided separately from the liquid storage tank 81 as shown in FIG. You may comprise by the pipe | tube 8B. In this case, the opening on the liquid storage tank 81 side in the liquid supply pipe 8A is the liquid supply port 83, and the opening in the liquid discharge pipe 8B is the liquid discharge port 84 on the liquid storage tank 81 side. In this case, it is desirable that the liquid outlet 84 be disposed as close as possible to the bottom 81 a of the liquid storage tank 81. Further, a suction pump (not shown) is provided in the liquid discharge pipe 8B, and the water in the liquid storage tank 81 is suctioned.
また、仕切り板87の高さ寸法は略同一でなくてもよく、その高さ寸法が平面視における長手方向において異なるように構成しても良い。例えば、仕切り板87の中央部の高さ寸法を両端部よりも低くすることによって、中央部における洗浄液の流れを早くしたり、また、その逆の構成にすることによって、両端部における洗浄液の流れを速くすることができる。さらに、液供給口83との位置関係に応じて高さ寸法を設定することが考えられる。例えば、液供給口83に近い部分は高さ寸法を高くし、液供給口83から遠い部分は高さ寸法を低くすることによって、流れの均一化を図ることなどが考えられる。 Further, the height dimension of the partition plate 87 may not be substantially the same, and the height dimension may be configured to be different in the longitudinal direction in plan view. For example, by making the height dimension of the central part of the partition plate 87 lower than both end parts, the flow of the cleaning liquid in the central part can be made faster, or vice versa. Can be faster. Furthermore, it is conceivable to set the height dimension in accordance with the positional relationship with the liquid supply port 83. For example, it is conceivable to make the flow uniform by increasing the height of the portion close to the liquid supply port 83 and decreasing the height of the portion far from the liquid supply port 83.
加えて、図5に示すように、貯液槽81の底部81aが、液供給口83側から液排出口84側に向かって下る傾斜部81a1を有する構成としても良い。図5においては、仕切り板87を有する構成であり、傾斜部81a1は、仕切り板87から液排出口84側に向かって下るように構成されている。傾斜部81a1は、平面状(直線状)のものに限られず、幅方向中央が凹んだ湾曲状をなすものであっても良いし、液排出口84に向かった洗浄液の流れを形成するものであれば良い。この傾斜部81a1により、効率良く加工屑を液排出口84から排出させることができる。 In addition, as shown in FIG. 5, the bottom 81 a of the liquid storage tank 81 may have an inclined portion 81 a 1 that descends from the liquid supply port 83 side toward the liquid discharge port 84 side. In FIG. 5, the partition plate 87 is provided, and the inclined portion 81a1 is configured to descend from the partition plate 87 toward the liquid discharge port 84 side. The inclined portion 81a1 is not limited to a flat (straight) shape, and may be a curved shape with a concave in the center in the width direction, and forms a flow of cleaning liquid toward the liquid discharge port 84. It is good if it is. By this inclined portion 81a1, the processing waste can be efficiently discharged from the liquid discharge port 84.
その上、図5に示すように、洗浄機構8が、貯液槽81の上方において洗浄ローラ82に接触して洗浄ローラ82に付着した加工屑を除去する除去部材89をさらに備えるものであっても良い。この除去部材89は、図5に示すように、洗浄ローラ82の中心軸82xに沿って設けられた棒状をなすものであり、洗浄時に回転する洗浄ローラ82に接触するものである。洗浄ローラ82が回転ブラシの場合には、ブラシ毛の間に入り込んだ加工屑を除去しやすくするために複数の突起89aを有する櫛状をなすものとすることが考えられる。この除去部材89は、洗浄ローラ82に付着した加工屑を除去する機能の他に、洗浄ローラ82に含まれる水を切る機能も発揮する。なお、除去部材89は、洗浄ローラ82が洗浄液から出て切断済基板W’に向かう途中に設けているが、切断済基板W’から洗浄液に向かう途中に設けても良い。 In addition, as shown in FIG. 5, the cleaning mechanism 8 further includes a removing member 89 that contacts the cleaning roller 82 above the liquid storage tank 81 and removes processing waste adhering to the cleaning roller 82. Also good. As shown in FIG. 5, the removing member 89 has a rod shape provided along the central axis 82x of the cleaning roller 82, and contacts the cleaning roller 82 that rotates during cleaning. In the case where the cleaning roller 82 is a rotating brush, it can be considered that the cleaning roller 82 has a comb shape having a plurality of protrusions 89a in order to easily remove the processing debris that has entered between the bristles. The removing member 89 has a function of removing water contained in the cleaning roller 82 in addition to the function of removing the processing dust attached to the cleaning roller 82. The removing member 89 is provided on the way from the cleaning liquid 82 to the cut substrate W ′, but may be provided on the way from the cut substrate W ′ to the cleaning liquid.
前記実施形態において、樹脂封止された封止済基板Wを切断する場合には、封止済基板Wは樹脂側の面を上にして移送される。このとき、洗浄機構7は、切断済基板W’の樹脂側の面を洗浄するものとなり、洗浄機構8は、切断済基板W’の基板側の面を洗浄するものとなる。 In the embodiment, when the sealed substrate W sealed with the resin is cut, the sealed substrate W is transferred with the surface on the resin side up. At this time, the cleaning mechanism 7 cleans the resin-side surface of the cut substrate W ′, and the cleaning mechanism 8 cleans the substrate-side surface of the cut substrate W ′.
洗浄ローラは、回転ブラシの他に、スポンジ状などの含水性を有する素材から構成されたものであっても良い。 The cleaning roller may be made of a sponge-like or other water-permeable material other than the rotating brush.
その上、前記実施形態では、シングルカットテーブル方式であって、ツインスピンドル構成の切断装置を説明したが、これに限らず、シングルカットテーブル方式であって、シングルスピンドル構成の切断装置、ツインカットテーブル方式であって、シングルスピンドル構成の切断装置、ツインカットテーブル方式であって、ツインスピンドル構成の切断装置などであってもよい。 In addition, in the above embodiment, the single-cut table type twin-spindle cutting apparatus has been described. However, the present invention is not limited thereto, and the single-cut table type single-spindle-type cutting apparatus and twin-cut table are used. The method may be a cutting apparatus having a single spindle configuration or a twin-cut table system, a cutting apparatus having a twin spindle configuration, or the like.
加えて、本発明の加工装置は、切断以外の加工を行うものであってもよく、例えば切削や研削などのそのほかの機械加工を行うものであってもよい。 In addition, the processing apparatus of the present invention may perform processing other than cutting, and may perform other machining such as cutting and grinding.
その他、本発明は前記実施形態に限られず、その趣旨を逸脱しない範囲で種々の変形が可能であるのは言うまでもない。 In addition, it goes without saying that the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention.
100 ・・・切断装置(加工装置)
W ・・・封止済基板(封止済板状部材、被加工物)
W’ ・・・切断済基板(切断済板状部材)
P ・・・製品
A ・・・板状部材供給ユニット
B ・・・板状部材切断ユニット
C ・・・検査ユニット
D ・・・収容ユニット
CTL ・・・制御部
2 ・・・板状部材供給機構
3 ・・・切断用テーブル
4 ・・・移動機構
5 ・・・回転機構
6A ・・・スピンドル(加工機構)
61A ・・・回転刃
6B ・・・スピンドル(加工機構)
61B ・・・回転刃
7 ・・・洗浄機構
71 ・・・噴射洗浄機構
72 ・・・乾燥機構
8 ・・・洗浄機構
9 ・・・搬送機構
10 ・・・検査用ステージ
11 ・・・カメラ
12 ・・・インデックステーブル
13 ・・・移送機構
14 ・・・良品用トレイ
15 ・・・不良品用トレイ
80 ・・・支持体
81 ・・・貯液槽
81H ・・・開口部
81a ・・・底部
81b ・・・側壁部
82 ・・・洗浄ローラ
82a ・・・軸部
82b ・・・ブラシ毛
82x ・・・中心軸
83 ・・・液供給口
84 ・・・液排出口
85 ・・・供給管
87 ・・・仕切り板
S1 ・・・第1貯液室
S2 ・・・第2貯液室
88 ・・・カバー部材
8A ・・・液供給管
8B ・・・液排出管
81a1・・・傾斜部
86 ・・・水切り部材
89 ・・・除去部材
100 ... Cutting device (processing device)
W ... Sealed substrate (Sealed plate member, workpiece)
W '... Cut substrate (cut plate member)
P ··· Product A · · · Plate-like member supply unit B · · · Plate-like member cutting unit C · · · · · · · · · · · · · · Inspection unit D · · · accommodation unit CTL · · · control unit 2 · · · plate-like member supply mechanism 3 ... Cutting table 4 ... Moving mechanism 5 ... Rotating mechanism 6A ... Spindle (processing mechanism)
61A ··· Rotary blade 6B · · · Spindle (machining mechanism)
61B ··· Rotary blade 7 ··· Cleaning mechanism 71 ··· Spray cleaning mechanism 72 ··· Drying mechanism 8 ··· Cleaning mechanism 9 ··· Transport mechanism 10 ··· Stage for inspection 11 ··· Camera 12 · · · Index table 13 · · · Transfer mechanism 14 · · · · · Good tray 15 · · · Defective tray 80 · · · Support 81 · · · Storage tank 81 H · · · Opening 81a · · · · Bottom 81b ··· Side wall 82 · · · · Cleaning roller 82a · · · Shaft portion 82b · · · Brush bristles 82x · · · Center axis 83 · · · Liquid supply port 84 ··· Liquid discharge port 85 ··· Supply pipe 87 ... Partition plate S1 ... First liquid storage chamber S2 ... Second liquid storage chamber 88 ... Cover member 8A ... Liquid supply pipe 8B ... Liquid discharge pipe 81 a1 ... Inclined portion 86 · · · Draining member 89 · · · Removal member
Claims (12)
前記洗浄機構は、洗浄液を貯留する貯液槽と、当該貯液槽内の洗浄液に一部が浸漬された状態で回転し、前記貯液槽の上方に位置する前記加工が施された被加工物に接触する洗浄ローラとを含み、
前記貯液槽内に洗浄液を供給する液供給口と前記貯液槽内から洗浄液を排出する液排出口とが、前記洗浄ローラを挟んで配置されている、加工装置。 A processing mechanism for processing the workpiece, and a cleaning mechanism for cleaning the workpiece subjected to the processing,
The cleaning mechanism is a liquid storage tank for storing the cleaning liquid, and is rotated in a state where the cleaning liquid is partly immersed in the cleaning liquid in the liquid storage tank. Cleaning rollers that come into contact with objects,
A processing apparatus, wherein a liquid supply port for supplying a cleaning liquid into the liquid storage tank and a liquid discharge port for discharging a cleaning liquid from the liquid storage tank are disposed sandwiching the cleaning roller.
前記洗浄機構は、前記液供給口を覆うように設けられたカバー部材をさらに含む、請求項1又は2記載の加工装置。 The liquid supply port is formed at the bottom of the liquid storage tank,
The processing apparatus according to claim 1, wherein the cleaning mechanism further includes a cover member provided to cover the liquid supply port.
前記液供給口及び前記液排出口は、前記中心軸を挟んで配置されている、請求項1乃至3の何れか一項に記載の加工装置。 The cleaning roller has a cylindrical shape and rotates around its central axis,
The processing apparatus according to any one of claims 1 to 3, wherein the liquid supply port and the liquid discharge port are disposed to sandwich the central axis.
前記加工が施された被加工物を洗浄する洗浄工程とを含み、
前記洗浄工程は、洗浄機構を用いて行われ、
前記洗浄機構は、洗浄液を貯留する貯液槽と、当該貯液槽内の洗浄液に一部が浸漬された状態で回転し、前記貯液槽の上方に位置する前記加工が施された被加工物に接触する洗浄ローラとを含み、
前記貯液槽内に洗浄液を供給する液供給口と前記貯液槽内から洗浄液を排出する液排出口とが、前記洗浄ローラを挟んで配置されている、製品の製造方法。 A processing step of processing a workpiece;
And d) cleaning the processed workpiece.
The cleaning step is performed using a cleaning mechanism,
The cleaning mechanism is a liquid storage tank for storing a cleaning liquid, and is rotated while partially immersed in the cleaning liquid in the liquid storage tank, and the processed workpiece is located above the liquid storage tank. Cleaning rollers that come into contact with objects,
A method of manufacturing a product, wherein a liquid supply port for supplying a cleaning liquid into the liquid storage tank and a liquid discharge port for discharging the cleaning liquid from the liquid storage tank are disposed with the cleaning roller interposed therebetween.
前記洗浄機構は、前記液供給口を覆うように設けられたカバー部材をさらに含む、請求項8記載の製品の製造方法。 The liquid supply port is formed at the bottom of the liquid storage tank,
The product manufacturing method according to claim 8, wherein the cleaning mechanism further includes a cover member provided to cover the liquid supply port.
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JP2021072395A (en) * | 2019-10-31 | 2021-05-06 | Towa株式会社 | Cleaning module, cutting device, and manufacturing method of cut product |
JP7149248B2 (en) | 2019-10-31 | 2022-10-06 | Towa株式会社 | Cleaning module, cutting device and method for manufacturing cut products |
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CN110866360B (en) * | 2019-11-19 | 2021-08-24 | 南京航空航天大学 | Modal calculation method for rotary ceramic matrix composite blade |
CN111604981A (en) * | 2020-05-25 | 2020-09-01 | 广东嘉元科技股份有限公司 | Copper foil slitting equipment with dust removal function |
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TW201932205A (en) | 2019-08-16 |
KR102243615B1 (en) | 2021-04-23 |
CN110064611A (en) | 2019-07-30 |
CN110064611B (en) | 2022-04-05 |
TWI740094B (en) | 2021-09-21 |
KR20190089740A (en) | 2019-07-31 |
JP7018323B2 (en) | 2022-02-10 |
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