TWI765388B - Cleaning module, cutting device, and method of manufacturing cut product - Google Patents

Cleaning module, cutting device, and method of manufacturing cut product Download PDF

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Publication number
TWI765388B
TWI765388B TW109137486A TW109137486A TWI765388B TW I765388 B TWI765388 B TW I765388B TW 109137486 A TW109137486 A TW 109137486A TW 109137486 A TW109137486 A TW 109137486A TW I765388 B TWI765388 B TW I765388B
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Taiwan
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container
cleaning
cutting
cut products
cut
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TW109137486A
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Chinese (zh)
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TW202118557A (en
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宮田和志
黃善夏
石橋幹司
森下慎也
大西將馬
堀本京太郎
尾關貴俊
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日商Ｔｏｗａ股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02076—Cleaning after the substrates have been singulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)

Abstract

本發明提供一種清洗模組、切割裝置以及切割品之製造方法，即使在切割品之尺寸小之情況下亦能夠提高清洗效率。清洗模組包含：容器(21)，其收納封裝基板被切割而形成之多個切割品(Sa)；旋轉機構(22)，其使容器(21)旋轉；供液機構(23)，其向容器(21)內供給清洗液；以及排液機構(24)，其排出容器(21)內之清洗液；多個切割品(Sa)在浸漬於清洗液之狀態下，在藉由旋轉機構(22)旋轉之容器(21)內被清洗。The present invention provides a cleaning module, a cutting device and a method for manufacturing a cut product, which can improve cleaning efficiency even when the size of the cut product is small. The cleaning module comprises: a container (21) for accommodating a plurality of cut products (Sa) formed by cutting a package substrate; a rotation mechanism (22) for rotating the container (21); a liquid supply mechanism (23) for feeding A cleaning liquid is supplied in the container (21); and a liquid discharge mechanism (24) is used to discharge the cleaning liquid in the container (21); a plurality of cut products (Sa) are immersed in the cleaning liquid, and the rotating mechanism ( 22) The inside of the rotating container (21) is cleaned.

Description

清洗模組、切割裝置以及切割品之製造方法Cleaning module, cutting device and manufacturing method of cutting product

本發明係關於一種清洗模組、包括清洗模組之切割裝置以及切割品之製造方法。 The present invention relates to a cleaning module, a cutting device including the cleaning module, and a manufacturing method of a cutting product.

搭載有晶片的引線框架、基板等通常藉由樹脂封裝而用作電子部件。以往，習知有如下切割裝置：在將以搭載多個晶片之方式佈線之基板共同進行樹脂封裝而製造封裝基板後，將該封裝基板切割(單片化)而製造多個切割品(電子部件)(例如，參照專利文獻1)。 A lead frame on which a chip is mounted, a substrate, and the like are generally used as electronic components by resin encapsulation. Conventionally, a dicing apparatus has been known in which a package substrate is produced by resin-sealing the substrates wired so as to mount a plurality of chips together, and then the package substrate is diced (separated into pieces) to produce a plurality of diced products (electronic components). ) (for example, refer to Patent Document 1).

專利文獻1所記載之切割裝置包含：切削單元，其將封裝基板切割為多個切割品；輸送單元，其抽吸並輸送多個切割品；上表面清洗單元，其利用噴射之清洗液對多個切割品之上表面進行清洗；下表面清洗單元，其利用由海綿等構成之清洗輥對多個切割品之下表面進行清洗；以及乾燥單元，其利用加熱器或暖風對多個切割品之上表面及下表面進行乾燥。切割、清洗、乾燥後之多個切割品用刷子刷落至去毛刺容器中，擺動機構使去毛刺容器擺動，由此對切割品賦予振動而除去毛刺。 The dicing device described in Patent Document 1 includes a cutting unit that dices a package substrate into a plurality of diced products; a conveying unit that sucks and transports the plurality of diced products; and an upper surface cleaning unit that uses a sprayed cleaning liquid to The upper surface of each cut product is cleaned; the lower surface cleaning unit is used to clean the lower surface of the plurality of cut products using a cleaning roller composed of sponges, etc.; The upper and lower surfaces are dried. After cutting, cleaning, and drying, a plurality of cut products are brushed and dropped into the deburring container, and the swing mechanism swings the deburring container, thereby imparting vibration to the cut products and removing burrs.

在先技術文獻 prior art literature 專利文獻 Patent Literature

專利文獻1：日本特開2017-084893號公報。 Patent Document 1: Japanese Patent Laid-Open No. 2017-084893.

在以往的切割裝置中，對封裝基板被切割而形成之多個切割品進行輸送、清洗、乾燥，但若切割品之尺寸小至不足例如2mm見方，則輸送等變得困難。特定言之，若切割品之尺寸變小，則在清洗時容易發生晶片移位(切割品自抽吸位置移動)、切割品之飛散。 In a conventional dicing apparatus, a plurality of diced products formed by dicing a package substrate are transported, cleaned, and dried. However, when the size of the diced products is smaller than, for example, 2 mm square, transportation and the like become difficult. Specifically, when the size of the diced product is reduced, wafer displacement (moving of the diced product from the suction position) and scattering of the diced product easily occur during cleaning.

因此，期望即使在切割品之尺寸小之情況下，亦能夠提高清洗效率之清洗模組、切割裝置以及切割品之製造方法。 Therefore, even when the size of the cut product is small, a cleaning module, a cutting device, and a manufacturing method of the cut product that can improve cleaning efficiency are desired.

本發明涉及之清洗模組之特徵結構在於，包含：容器，其收納封裝基板被切割而形成之多個切割品；旋轉機構，其使該容器旋轉；供液機構，其向該容器內供給清洗液；以及排液機構，其排出該容器內之該清洗液，多個該等切割品在浸漬於該清洗液之狀態下，在藉由該旋轉機構旋轉之該容器內被清洗。 The cleaning module according to the present invention is characterized by comprising: a container for accommodating a plurality of cut products formed by cutting a package substrate; a rotation mechanism for rotating the container; and a liquid supply mechanism for supplying cleaning into the container liquid; and a liquid discharge mechanism that discharges the cleaning liquid in the container, and a plurality of the cut products are cleaned in the container rotated by the rotating mechanism while being immersed in the cleaning liquid.

本發明涉及之切割裝置之特徵結構在於，包含：該清洗模組；切割機構，其切割該封裝基板；以及輸送機構，其將由該切割機構切割而形成之多個該等切割品輸送至該容器。 The characteristic structure of the cutting device according to the present invention includes: the cleaning module; a cutting mechanism for cutting the package substrate; and a conveying mechanism for transporting a plurality of the cut products formed by cutting by the cutting mechanism to the container .

本發明涉及之切割品之製造方法的特徵在於，包含：切割工序，其切割封裝基板而形成多個切割品；收納工序，其將多個該等切割品收納在容器中；清洗工序，其向該容器內供給清洗液，使該容器旋轉來清洗多個該等切割品；以及取出工序，其使該容器上下反轉，取出多個該等切割品。 The method for producing a diced product according to the present invention is characterized by comprising: a dicing step of dicing a package substrate to form a plurality of diced products; a storage process of storing a plurality of the diced products in a container; and a cleaning step of A cleaning solution is supplied in the container, and the container is rotated to clean a plurality of the cut products; and a take-out step is to turn the container upside down to take out a plurality of the cut products.

根據本發明，提供一種清洗模組、切割裝置以及切割品之製造方法，即使在切割品之尺寸小之情況下亦能夠提高清洗效率。 According to the present invention, a cleaning module, a cutting device and a method for manufacturing a cut product are provided, which can improve the cleaning efficiency even when the size of the cut product is small.

1:切割模組 1: Cutting module

2:清洗模組 2: Cleaning module

2A:清洗機構 2A: Cleaning mechanism

2B:流體供排機構 2B: Fluid supply and discharge mechanism

2C:回收箱 2C: Recycle Bin

3:控制部 3: Control Department

4:輸送機構 4: Conveying mechanism

4A:輸送箱 4A: Delivery box

11:接收部 11: Receiving Department

11a:預工作台 11a: Pre-bench

12:切割機構 12: Cutting mechanism

12a:切割用移送機構 12a: Transfer mechanism for cutting

12b:切割台 12b: Cutting table

12c:切割部 12c: Cutting section

12c1:主軸部 12c1: Spindle part

12c2:旋轉刀片 12c2: Rotary Blade

20a:分支部 20a: Branches

20b:最高水位 20b: Maximum water level

21:容器 21: Container

21b:內筒(內容器) 21b: Inner cylinder (inner container)

21b1:傾斜面 21b1: Inclined surface

21c:微細孔(貫通孔) 21c: Micro hole (through hole)

21d:環狀凸緣 21d: annular flange

21d1:傾斜突起 21d1: Oblique protrusion

22:旋轉機構 22: Rotary mechanism

22a:電動馬達 22a: Electric motors

22b:旋轉軸 22b: Rotary axis

23:供液機構 23: Liquid supply mechanism

23a:供液管 23a: Liquid supply pipe

24:排液機構 24: Drainage mechanism

24a:排液管 24a: Drain pipe

25:供氣機構 25: Air supply mechanism

25a:供氣管 25a: Air supply pipe

26:排氣機構 26: Exhaust mechanism

26a:排氣管 26a: Exhaust pipe

27:轉動反轉機構 27: Rotate the reversing mechanism

27a:夾緊機構 27a: Clamping mechanism

27a1:夾緊部件 27a1: Clamping parts

27b:轉動機構 27b: Turning mechanism

27b1:轉動軸 27b1: Rotary axis

27c:內筒反轉機構(反轉機構) 27c: Inner cylinder reversing mechanism (reversing mechanism)

27c1:反轉軸 27c1: Reverse axis

27d:內筒上下機構 27d: Inner cylinder up and down mechanism

28:排出機構 28: Discharge mechanism

28a:外筒(外容器) 28a: Outer cylinder (outer container)

28a1:內插管 28a1: Intubation tube

28a2:傾斜突起 28a2: Oblique protrusion

28b:排出管 28b: discharge pipe

29:真空機構 29: Vacuum mechanism

29a:真空管 29a: Vacuum Tube

30:蓋 30: Cover

31:蓋移動機構 31: Cover moving mechanism

41:管口(吸嘴) 41: Nozzle (suction nozzle)

42:流體管 42: Fluid Tube

42a:一端 42a: one end

42b:另一端 42b: the other end

43:液體供給機構 43: Liquid supply mechanism

44:移動體 44: Moving body

44a:旋轉本體 44a: rotating body

44a1:旋轉軸 44a1: Rotary axis

44b:突出部 44b: Protrusion

44c:引導槽 44c: Guide slot

45:收納部 45: Storage Department

46:驅動機構 46: Drive mechanism

46a:旋轉驅動機構 46a: Rotary drive mechanism

46b:滑動驅動機構 46b: Sliding drive mechanism

D:切割裝置 D: cutting device

E:樹脂成形裝置 E: Resin molding device

S:封裝基板 S: package substrate

Sa:切割品 Sa: cut product

T:中間筒(劃分壁) T: Intermediate cylinder (dividing wall)

Va~Vf:開閉閥 Va~Vf: On-off valve

圖1係展示切割裝置之示意圖；圖2係展示輸送機構之概略立體圖；圖3係展示清洗模組之概略立體圖；圖4係圖3之IV-IV線剖視圖；圖5係展示清洗模組之驅動方式的圖；圖6係展示將多個切割品收納於容器內之狀態的剖視圖；圖7係展示在容器內對多個切割品進行清洗之狀態的剖視圖；圖8係展示在容器內對多個切割品進行乾燥之狀態的剖視圖；圖9係展示使清洗模組之容器移動之狀態的剖視圖；圖10係展示使清洗模組之容器移動之狀態的俯視圖；圖11係展示清洗模組之反轉機構的概略立體圖； 圖12係展示其他實施方式涉及之輸送機構的概略圖；圖13係展示其他實施方式涉及之輸送機構之切割品輸送狀態的概略圖。 Fig. 1 is a schematic diagram showing a cutting device; Fig. 2 is a schematic perspective view showing a conveying mechanism; Fig. 3 is a schematic perspective view showing a cleaning module; Fig. 4 is a sectional view taken along the line IV-IV of Fig. 3; Figure 6 is a cross-sectional view showing a state in which a plurality of cut products are accommodated in a container; Figure 7 is a cross-sectional view showing a state in which a plurality of cut products are cleaned in the container; A cross-sectional view of a state in which a plurality of cut products are being dried; FIG. 9 is a cross-sectional view showing a state in which the container of the cleaning module is moved; FIG. 10 is a top view showing a state in which the container of the cleaning module is moved; FIG. 11 is a state of showing the cleaning module A schematic perspective view of the reversing mechanism; FIG. 12 is a schematic diagram showing a conveying mechanism according to another embodiment; FIG. 13 is a schematic diagram showing a cutting product conveying state of the conveying mechanism according to another embodiment.

以下，基於圖式對本發明涉及之清洗模組、切割裝置以及切割品之製造方法的實施方式進行說明。但是，並不限於以下的實施方式，在不脫離其主旨之範疇內能夠進行各種變形。 Hereinafter, embodiments of the cleaning module, the cutting device, and the manufacturing method of the cut product according to the present invention will be described based on the drawings. However, it is not limited to the following embodiment, and various deformation|transformation is possible in the range which does not deviate from the summary.

[裝置結構] [device structure]

搭載有晶片之引線框架、基板等成形對象物藉由進行樹脂封裝而用作電子部件。作為對成形對象物進行樹脂封裝之技術，可舉出壓縮方式或轉移方式。壓縮方式例如係在脫模膜上供給液態或粉粒體狀之樹脂後，將該脫模膜載置於成形模具之腔中，並將成形對象物浸漬在脫模膜上之樹脂中進行樹脂成形的方式。轉移方式例如係將成形對象物收納於成形模具之腔中，向成形模具之罐供給樹脂料片而進行加熱、熔融後，將熔融樹脂供給至腔而進行樹脂成形的方式。 Molded objects such as lead frames and substrates on which chips are mounted are used as electronic components by resin encapsulation. As a technique for resin-encapsulating the object to be molded, a compression method or a transfer method can be mentioned. The compression method is, for example, after supplying a resin in liquid or granular form on a release film, placing the release film in the cavity of a molding die, and immersing the object to be molded in the resin on the release film for resin removal. the way it takes shape. The transfer method is, for example, a method in which an object to be molded is accommodated in a cavity of a molding die, a resin tablet is supplied to a tank of the molding die, heated and melted, and then molten resin is supplied to the cavity to perform resin molding.

關於壓縮方式或轉移方式之樹脂成形裝置，自製造效率化之觀點出發，有時使用製造將以搭載多個晶片之方式佈線之基板共同進行樹脂封裝之模具陣列封裝(mold array packaging，MAP)等封裝基板的裝置。在該裝置中製造封裝基板後，利用切割裝置切割(單片化)，所形成之切割品在經過品質檢查之後被用作電子部件。在切割裝置中，對封裝基板被切割而 形成之多個切割品進行輸送、清洗、乾燥，但若切割品之尺寸小至例如不足2mm見方，則輸送等變得困難。特定言之，若切割品之尺寸變小，則在清洗時容易發生晶片移位(切割品自抽吸位置移動)、切割品之飛散。因此，在本實施方式中，提供即使在切割品之尺寸小之情況下亦能夠提高清洗效率的清洗模組、切割裝置以及切割品之製造方法。以下，將搭載有多個半導體晶片之封裝基板作為切割對象物之一例進行說明，有時將重力方向作為下方、將與重力方向相反之方向作為上方進行說明。 For resin molding apparatuses of a compression method or a transfer method, from the viewpoint of manufacturing efficiency, mold array packaging (MAP) or the like is sometimes used to manufacture resin-packaged substrates that are wired so as to mount a plurality of chips. A device that encapsulates a substrate. After the package substrate is produced in this apparatus, it is cut (singulated) with a dicing apparatus, and the formed cut product is used as an electronic component after passing the quality inspection. In the dicing device, the package substrate is diced to The formed plurality of cut products are transported, washed, and dried. However, when the size of the cut products is as small as, for example, less than 2 mm square, transportation and the like become difficult. Specifically, when the size of the diced product is reduced, wafer displacement (moving of the diced product from the suction position) and scattering of the diced product easily occur during cleaning. Therefore, the present embodiment provides a cleaning module, a cutting device, and a method for manufacturing a cut product that can improve cleaning efficiency even when the size of the cut product is small. Hereinafter, a package substrate on which a plurality of semiconductor chips are mounted will be described as an example of a dicing object, and the direction of gravity may be referred to as the downward direction and the direction opposite to the direction of gravity may be described as the upper direction.

圖1中展示切割裝置D之示意圖。本實施方式中之切割裝置D與樹脂成形裝置E分體構成，接收由樹脂成形裝置E進行了樹脂封裝之封裝基板S，將該封裝基板S切割、清洗、乾燥，製造多個切割品Sa。該等製造出之切割品Sa在經過了規定之品質檢查之後被用作電子部件。 A schematic diagram of a cutting device D is shown in FIG. 1 . The dicing device D in this embodiment is constituted separately from the resin molding device E, receives the package substrate S resin-encapsulated by the resin molding device E, cuts, cleans, and dries the package substrate S to manufacture a plurality of diced products Sa. These manufactured cut products Sa are used as electronic components after passing through a prescribed quality inspection.

切割裝置D包含切割模組1、清洗模組2以及控制部3。切割模組1及清洗模組2能夠獨立地安裝或拆卸。另外，切割裝置D在切割模組1及清洗模組2之範圍內包含輸送機構4。控制部3作為控制切割裝置D之動作之軟體，包括儲存於硬碟機(Hard Disk Drive，HDD)、記憶體等硬體之程式，藉由電腦之中央處理單元(Central Processing Unit，CPU)執行。亦即，控制部3控制切割模組1、清洗模組2以及輸送機構4之動作。 The cutting device D includes a cutting module 1 , a cleaning module 2 and a control unit 3 . The cutting module 1 and the cleaning module 2 can be installed or removed independently. In addition, the cutting device D includes a conveying mechanism 4 within the scope of the cutting module 1 and the cleaning module 2 . The control unit 3 is a software for controlling the action of the cutting device D, including programs stored in a hard disk drive (Hard Disk Drive, HDD), memory and other hardware, and executed by a central processing unit (CPU) of the computer . That is, the control unit 3 controls the operations of the cutting module 1 , the cleaning module 2 and the conveying mechanism 4 .

切割模組1包含接收部11及切割機構12。此外，接收部11、切割機構12之個數亦可以設定成一個或兩個以上，沒有特別限定。 The cutting module 1 includes a receiving portion 11 and a cutting mechanism 12 . In addition, the number of the receiving portion 11 and the cutting mechanism 12 may be set to one or two or more, and is not particularly limited.

接收部11自樹脂成形裝置E接收俯視呈矩形狀之封裝基板S作為切割對象物。所接收之封裝基板S載置於預工作台11a上。切割機構12包含移送封裝基板S之兩個切割用移送機構12a、配置在切割用移送機構12a上之兩個切割台12b、以及兩個切割部12c。切割用移送機構12a構成為在封裝基板S被固定在切割台12b上之狀態下，能夠在Y方向上移動，並且能夠在θ方向上旋轉。切割用移送機構12a及切割部12c之驅動源沒有特別限定，例如可以使用伺服馬達等電動馬達。 The receiving unit 11 receives the package substrate S having a rectangular shape in plan view from the resin molding apparatus E as a dicing object. The received package substrate S is placed on the pre-stage 11a. The dicing mechanism 12 includes two dicing transfer mechanisms 12a that transfer the package substrate S, two dicing tables 12b arranged on the dicing transfer mechanism 12a, and two dicing portions 12c. The transfer mechanism 12a for dicing is configured to be movable in the Y direction and rotatable in the θ direction in a state where the package substrate S is fixed to the dicing table 12b. The drive source of the transfer mechanism 12a for cutting and the cutting part 12c is not particularly limited, and, for example, an electric motor such as a servo motor can be used.

在切割台12b中，自接收部11接收之封裝基板S以被樹脂封裝之一側作為下表面，藉由空氣吸附等被固定。切割部12c包含主軸部12c1及旋轉刀片12c2，藉由旋轉刀片12c2切割固定於切割台12b之封裝基板S。另外，在切割台12b之上表面、亦即固定封裝基板S之固定面上，以能夠供旋轉刀片12c2進入之方式形成有槽。旋轉刀片12c2固定於主軸部12c1之旋轉軸，構成為能夠沿X方向及Z方向移動，並且能夠高速旋轉。切割用移送機構12a沿Y方向及θ方向移動及旋轉，旋轉刀片12c2沿X方向及Z方向移動，由此調整旋轉刀片12c2與封裝基板S之相對位置。一邊反覆進行該相對位置之調整，一邊利用旋轉刀片12c2將封裝基板S以自上表面朝向下表面貫通之方式切割，形成俯視呈矩形狀之多個切割品Sa。此時，亦可以一邊向旋轉刀片12c2與封裝基板S之接觸部位供給切削水，一邊進行切割。另外，亦可以使切割用移送機構12a或旋轉刀片12c2中之任一者移動而進行相對位置之調整。另外，兩個切割部12c能夠處於主軸部12c1為直線狀且旋轉刀片12c2相互對置的位置，兩個旋轉刀片12c2之間隔距離係可變的，在X方向上亦能夠移動至兩個切割台12b中任一者之上部。 In the dicing table 12b, the package substrate S received from the receiving portion 11 is fixed by air suction or the like with the resin-packaged side serving as the lower surface. The cutting part 12c includes a spindle part 12c1 and a rotating blade 12c2, and the package substrate S fixed to the cutting table 12b is cut by the rotating blade 12c2. In addition, a groove is formed on the upper surface of the dicing table 12b, that is, on the fixing surface to which the package substrate S is fixed, so that the rotary blade 12c2 can enter. The rotary blade 12c2 is fixed to the rotation shaft of the main shaft portion 12c1, and is configured to be movable in the X direction and the Z direction, and to be able to rotate at high speed. The transfer mechanism 12a for dicing moves and rotates in the Y direction and the θ direction, and the rotary blade 12c2 moves in the X direction and the Z direction, whereby the relative position of the rotary blade 12c2 and the package substrate S is adjusted. While repeatedly performing the relative position adjustment, the package substrate S is diced by the rotary blade 12c2 so as to penetrate from the upper surface to the lower surface, thereby forming a plurality of diced products Sa having a rectangular shape in plan view. At this time, dicing may be performed while supplying cutting water to the contact portion of the rotary blade 12c2 and the package substrate S. In addition, the relative position may be adjusted by moving either of the transfer mechanism 12a for dicing or the rotary blade 12c2. In addition, the two cutting parts 12c can be located at the positions where the main shaft part 12c1 is linear and the rotating blades 12c2 are opposed to each other, the distance between the two rotating blades 12c2 is variable, and the two cutting tables can also be moved in the X direction. Above any of 12b.

清洗模組2包含清洗機構2A、流體供排機構2B及俯視呈矩形狀之回收箱2C。清洗機構2A將多個切割品Sa與水等清洗液一起收納在容器21內，藉由使該容器21旋轉而產生液流來清洗多個切割品Sa。流體供排機構2B包含氣體供排泵(未圖示)，該氣體供排泵向清洗機構2A之容器21內供給壓縮空氣(氣體之一例)、或者抽吸後述之流體管42內之空氣並將其排出。另外，流體供排機構2B能夠自供水源(例如自來水道、工廠內之純水供給管)向容器21內供給清洗液。清洗模組2之細節將在後面敍述。 The cleaning module 2 includes a cleaning mechanism 2A, a fluid supply and discharge mechanism 2B, and a collection box 2C that is rectangular in plan view. The cleaning mechanism 2A accommodates the plurality of cut products Sa in the container 21 together with a cleaning liquid such as water, and cleans the plurality of cut products Sa by rotating the container 21 to generate a liquid flow. The fluid supply and discharge mechanism 2B includes a gas supply and discharge pump (not shown) that supplies compressed air (an example of gas) into the container 21 of the cleaning mechanism 2A, or sucks the air in the fluid pipe 42 described later and sucks the air. Drain it. In addition, the fluid supply and discharge mechanism 2B can supply the cleaning liquid into the container 21 from a water supply source (for example, a water supply, a pure water supply pipe in a factory). Details of the cleaning module 2 will be described later.

輸送機構4將由切割機構12切割而形成之多個切割品Sa輸送至清洗機構2A之容器21。如圖2所示，本實施方式中之輸送機構4包含：管口41(吸嘴之一例)，由側視呈三角形狀之中空板部件形成；流體管42，氣體及液體與切割品Sa一起流通；氣體供排泵，設置於流體供排機構2B；以及液體供給機構43。形成於管口41之一端之開口覆蓋封裝基板S之一邊(短邊)，形成於管口41之另一端之開口與流體管42連通。管口41利用流體供排機構2B所包括之氣體供排泵之驅動力來抽吸切割台12b上之全部的切割品Sa。具體而言，管口41構成為能夠沿X方向及Z方向移動，將配置於封裝基板S之一邊上之一行多個切割品Sa以覆蓋形成於一端之開口的方式對位後，一邊沿著封裝基板S之另一邊(長邊，X方向)移動一邊對全部的切割品Sa進行抽吸。流體管42之一端42a與供給水等液體之液體供給機構43連接，流體管42之另一端42b與容器21之內部連通。該液體供給機構43將來自上述流體供排機構2B之供水源(例如自來水道、工廠內之純水供給管)的液體供給至流體管42內。自管口41抽吸之多個切割品Sa流入流體管42， 藉由自液體供給機構43供給之液流輸送至容器21。 The conveying mechanism 4 conveys the plurality of cut products Sa formed by cutting by the cutting mechanism 12 to the container 21 of the cleaning mechanism 2A. As shown in FIG. 2, the conveying mechanism 4 in this embodiment includes: a nozzle 41 (an example of a suction nozzle), which is formed by a hollow plate member having a triangular shape in side view; a fluid pipe 42, which contains gas and liquid together with the cut product Sa The gas supply and discharge pump is installed in the fluid supply and discharge mechanism 2B; and the liquid supply mechanism 43 . The opening formed at one end of the nozzle 41 covers one side (short side) of the package substrate S, and the opening formed at the other end of the nozzle 41 communicates with the fluid pipe 42 . The nozzle 41 uses the driving force of the gas supply and discharge pump included in the fluid supply and discharge mechanism 2B to suck all the cut products Sa on the cutting table 12b. Specifically, the nozzle 41 is configured so as to be movable in the X direction and the Z direction, and after aligning a row of a plurality of dicing products Sa arranged on one side of the package substrate S so as to cover the opening formed at one end, While the other side (long side, X direction) of the package substrate S is moved, all the diced products Sa are sucked. One end 42a of the fluid pipe 42 is connected to a liquid supply mechanism 43 for supplying liquid such as water, and the other end 42b of the fluid pipe 42 is communicated with the inside of the container 21 . The liquid supply mechanism 43 supplies liquid into the fluid pipe 42 from a water supply source (eg, a water supply, a pure water supply pipe in a factory) of the above-mentioned fluid supply and discharge mechanism 2B. The plurality of cuttings Sa sucked from the nozzle 41 flow into the fluid pipe 42, It is delivered to the container 21 by the liquid flow supplied from the liquid supply mechanism 43 .

以下，使用圖3至圖4對清洗模組2之清洗機構2A進行詳細說明。 Hereinafter, the cleaning mechanism 2A of the cleaning module 2 will be described in detail with reference to FIGS. 3 to 4 .

清洗模組2之清洗機構2A包含：容器21，收納封裝基板S被切割而形成之多個切割品Sa；旋轉機構22，使容器21旋轉；供液機構23，向容器21內供給清洗液；排液機構24，排出容器21內之清洗液；供氣機構25，向容器21內供給壓縮空氣(氣體之一例)；排氣機構26，排出容器21內之空氣(氣體之一例)；以及轉動反轉機構27，使容器21轉動及反轉。另外，清洗機構2A還可以包含：排出機構28，以在容器21內超過規定之水位時將越過中間筒T(劃分壁之一例)之上端面(頂部)的包括切屑等微小垃圾之清洗液排出；以及真空機構29，抽吸上述的輸送機構4之流體管42內之空氣。 The cleaning mechanism 2A of the cleaning module 2 includes: a container 21 for accommodating a plurality of cut products Sa formed by cutting the package substrate S; a rotation mechanism 22 for rotating the container 21; a liquid supply mechanism 23 for supplying cleaning liquid into the container 21; The liquid discharge mechanism 24 discharges the cleaning liquid in the container 21; the air supply mechanism 25 supplies compressed air (an example of gas) into the container 21; the exhaust mechanism 26 discharges the air (an example of the gas) in the container 21; The reversing mechanism 27 rotates and reverses the container 21 . In addition, the cleaning mechanism 2A may further include a discharge mechanism 28 for discharging the cleaning liquid including the fine waste such as chips, which has passed over the upper end surface (top) of the intermediate cylinder T (an example of the partition wall) when the water level in the container 21 exceeds a predetermined level. ; And the vacuum mechanism 29, which sucks the air in the fluid pipe 42 of the above-mentioned conveying mechanism 4.

容器21配製成相對於重力方向傾斜規定角度。該規定角度為5°至50°，較佳為10°至40°，更佳設定在20°至30°之範圍內。容器21包含：有底筒狀之內筒21b(內容器之一例)，底壁形成為圓錐形狀；以及外筒28a(外容器之一例)，配置在內筒21b之外側，內筒21b及外筒28a構成為能夠一體旋轉。在內筒21b之底壁之內表面形成有以愈接近中央(旋轉機構22之旋轉軸22b)愈往重力方向的方式傾斜的傾斜面21b1。 The container 21 is prepared to be inclined at a predetermined angle with respect to the direction of gravity. The predetermined angle is 5° to 50°, preferably 10° to 40°, and more preferably set within the range of 20° to 30°. The container 21 includes an inner tube 21b (an example of an inner container) having a bottomed cylindrical shape, the bottom wall of which is formed in a conical shape, and an outer tube 28a (an example of an outer container) disposed outside the inner tube 21b. The cylinder 28a is configured to be rotatable integrally. The inner surface of the bottom wall of the inner cylinder 21b is formed with an inclined surface 21b1 inclined so as to be inclined toward the direction of gravity as it approaches the center (the rotation axis 22b of the rotation mechanism 22).

在內筒21b與外筒28a之間以不能旋轉之方式固定有中間筒T(劃分壁之一例)。在內筒21b中，自比側壁上之中間筒T之上端面稍高的位置(規定 的水位)至底壁，形成有大小使得切屑等微小垃圾通過但不能使切割品Sa通過的多個微細孔21c(貫通孔之一例)。亦即，內筒21b自中間筒T之上端面附近之側壁至底壁包含網狀結構。另外，在內筒21b形成有向徑向外側呈環狀延伸之環狀凸緣21d，在該環狀凸緣21d之下表面形成有在旋轉方向觀察時包含傾斜面之多個傾斜突起21d1(參照圖3之放大圖)。中間筒T之底壁以固定有排液機構24之排液管24a之圓錐台形狀構成。外筒28a作為排出機構28構成，排出機構28用於在容器21內超過規定的水位時將經由內筒21b之微細孔21c而越過中間筒T之上端面的包括切屑等微小垃圾之清洗液排出。外筒28a之底壁以內插管28a1突出之圓錐台形狀構成，內插管28a1以能夠相對旋轉之方式內插於向排出目的地(例如下水道、工廠內之排出管)排出清洗液的排出管28b(參照圖4)。另外，在外筒28a之上端外表面上突出形成有多個傾斜突起28a2，該多個傾斜突起28a2包含相對於內筒21b之傾斜突起21d1之傾斜面而在旋轉方向上抵接之傾斜面(參照圖3之放大圖)。 An intermediate tube T (an example of a partition wall) is fixed between the inner tube 21b and the outer tube 28a so as not to rotate. In the inner tube 21b, from a position slightly higher than the upper end surface of the intermediate tube T on the side wall (prescribed water level) to the bottom wall, and there are formed a plurality of fine holes 21c (an example of through-holes) that are sized to allow the passage of fine waste such as chips, but not allow the passage of the cut product Sa. That is, the inner tube 21b includes a mesh structure from the side wall near the upper end surface of the intermediate tube T to the bottom wall. In addition, an annular flange 21d extending annularly outward in the radial direction is formed on the inner cylinder 21b, and a plurality of inclined protrusions 21d1 ( Refer to the enlarged view of Figure 3). The bottom wall of the intermediate cylinder T is formed in the shape of a truncated cone in which the liquid discharge pipe 24a of the liquid discharge mechanism 24 is fixed. The outer cylinder 28a is constituted as a discharge mechanism 28 for discharging the cleaning liquid including fine wastes such as chips, passing through the fine holes 21c of the inner cylinder 21b and over the upper end surface of the intermediate cylinder T when the water level in the container 21 exceeds a predetermined level. . The bottom wall of the outer cylinder 28a is formed in the shape of a truncated cone in which the inner tube 28a1 protrudes, and the inner tube 28a1 is relatively rotatably inserted into the discharge pipe that discharges the cleaning liquid to the discharge destination (such as the sewers, the discharge pipe in the factory). 28b (see Figure 4). In addition, on the outer surface of the upper end of the outer cylinder 28a, a plurality of inclined protrusions 28a2 are formed to protrude, and the plurality of inclined protrusions 28a2 include inclined surfaces that abut against in the rotational direction with respect to the inclined surfaces of the inclined protrusions 21d1 of the inner cylinder 21b (see Enlarged view of Figure 3).

另外，在清洗模組2設置有封閉內筒21b之上部開口之蓋30，設置有使該蓋30上下移動的由氣缸等構成之蓋移動機構31。在蓋30上固定有輸送機構4之流體管42、供液機構23之供液管23a以及供氣機構25之供氣管25a。在使蓋30緊貼於內筒21b之狀態下，自流體管42向內筒21b內藉由液流供給多個切割品Sa，自供液管23a向內筒21b內供給清洗液。此時，在內筒21b形成有多個微細孔21c，因此內筒21b內之清洗液向中間筒T內流出，但切割品Sa無法通過微細孔21c。在本實施方式中，由於藉由液流將多個切割品Sa供給至內筒21b內，因此能夠防止切割品Sa附著於流體管42 之管內而殘留這樣的不良情況。 In addition, the cleaning module 2 is provided with a cover 30 that closes the upper opening of the inner cylinder 21b, and a cover moving mechanism 31 composed of an air cylinder or the like that moves the cover 30 up and down. A fluid pipe 42 of the conveying mechanism 4 , a liquid supply pipe 23 a of the liquid supply mechanism 23 , and an air supply pipe 25 a of the gas supply mechanism 25 are fixed to the cover 30 . With the lid 30 in close contact with the inner cylinder 21b, the plurality of cut products Sa are supplied by the liquid flow into the inner cylinder 21b from the fluid pipe 42, and the cleaning liquid is supplied into the inner cylinder 21b from the liquid supply pipe 23a. At this time, since a plurality of fine holes 21c are formed in the inner tube 21b, the cleaning liquid in the inner tube 21b flows out into the intermediate tube T, but the cut product Sa cannot pass through the fine holes 21c. In the present embodiment, since the plurality of cut products Sa are supplied into the inner cylinder 21b by the liquid flow, it is possible to prevent the cut products Sa from adhering to the fluid tube 42 . Such a defect remains in the tube.

旋轉機構22包含：電動馬達22a，使內筒21b及外筒28a圍繞旋轉軸22b旋轉；以及上述內筒21b之傾斜突起21d1及外筒28a之傾斜突起28a2。藉由利用電動馬達22a之驅動力使外筒28a旋轉，外筒28a之傾斜突起28a2與內筒21b之傾斜突起21d1抵接，內筒21b亦一體地旋轉。內筒21b及外筒28a藉由旋轉機構22旋轉而在網眼結構之內筒21b的內部產生液流，在內筒21b內浸漬在清洗液中之多個切割品Sa被迴旋的清洗液清洗。 The rotation mechanism 22 includes an electric motor 22a for rotating the inner cylinder 21b and the outer cylinder 28a around the rotation axis 22b, and the inclined protrusions 21d1 of the inner cylinder 21b and the inclined protrusions 28a2 of the outer cylinder 28a. When the outer cylinder 28a is rotated by the driving force of the electric motor 22a, the inclined protrusion 28a2 of the outer cylinder 28a comes into contact with the inclined protrusion 21d1 of the inner cylinder 21b, and the inner cylinder 21b also rotates integrally. The inner cylinder 21b and the outer cylinder 28a are rotated by the rotating mechanism 22 to generate a liquid flow inside the inner cylinder 21b of the mesh structure, and the plurality of cut products Sa immersed in the cleaning liquid in the inner cylinder 21b are cleaned by the swirling cleaning liquid .

供液機構23包含供液管23a，該供液管23a之一端與自來水道或工廠內之純水供給管連接且另一端與蓋30連接。排液機構24包含排液管24a，該排液管24a之一端與下水道或工廠內之排出管連接且另一端與中間筒T之底壁連接。在供液機構23之供液管23a以及排液機構24之排液管24a分別設置有由電磁閥等構成之開閉閥Va以及開閉閥Vb。 The liquid supply mechanism 23 includes a liquid supply pipe 23 a, one end of which is connected to a water supply pipe or a pure water supply pipe in a factory, and the other end is connected to the cover 30 . The draining mechanism 24 includes a draining pipe 24a, one end of the draining pipe 24a is connected to the drain pipe in the sewer or the factory, and the other end is connected to the bottom wall of the intermediate cylinder T. The liquid supply pipe 23a of the liquid supply mechanism 23 and the liquid discharge pipe 24a of the liquid discharge mechanism 24 are respectively provided with an on-off valve Va and an on-off valve Vb composed of a solenoid valve or the like.

供氣機構25包含：氣體供排泵，設置於流體供排機構2B；以及供氣管25a，一端以能夠導入壓縮空氣等的方式與氣體供排泵連接，另一端與蓋30連接。排氣機構26包含排氣管26a，該排氣管26a之一端與外部空氣連接且另一端經由分支部20a與中間筒T及外筒28a之底壁連接。在供氣機構25之供氣管25a及排氣機構26之排氣管26a上分別設置有由電磁閥等構成之開閉閥Vc及開閉閥Vd。此外，供氣機構25不需要包含氣體供排泵，只要係能夠向供氣管25a導入壓縮空氣等的結構即可，例如亦可以係工廠內之壓縮空氣供給用的配管經由電磁閥與供氣管25a之一端連接的結構。 The air supply mechanism 25 includes: a gas supply and discharge pump provided in the fluid supply and discharge mechanism 2B; The exhaust mechanism 26 includes an exhaust pipe 26a, one end of the exhaust pipe 26a is connected to the outside air and the other end is connected to the bottom wall of the intermediate cylinder T and the outer cylinder 28a via the branch portion 20a. On the air supply pipe 25a of the air supply mechanism 25 and the exhaust pipe 26a of the exhaust mechanism 26, an on-off valve Vc and an on-off valve Vd composed of a solenoid valve or the like are respectively provided. In addition, the air supply mechanism 25 does not need to include a gas supply and discharge pump, as long as it is a structure capable of introducing compressed air or the like into the air supply pipe 25a. For example, a pipe for supplying compressed air in a factory may pass through a solenoid valve and the air supply pipe 25a. A structure connected at one end.

轉動反轉機構27包含：夾緊機構27a，使夾持內筒21b之夾緊部件27a1工作；內筒上下機構27d，使由夾緊部件27a1夾持之內筒21b上下移動；轉動機構27b，使內筒21b圍繞轉動軸27b1轉動；以及內筒反轉機構27c(反轉機構之一例)，使內筒21b圍繞反轉軸27c1旋轉而上下反轉。轉動反轉機構27之驅動源由電動馬達、氣缸等構成。 The rotation reversing mechanism 27 includes: a clamping mechanism 27a, which makes the clamping member 27a1 holding the inner cylinder 21b work; an inner cylinder up-down mechanism 27d, which makes the inner cylinder 21b clamped by the clamping member 27a1 move up and down; the rotating mechanism 27b, The inner cylinder 21b is rotated around the rotation shaft 27b1; and the inner cylinder reversing mechanism 27c (an example of the reversing mechanism) is rotated around the reversing shaft 27c1 to reverse up and down. The drive source of the rotation reversing mechanism 27 is constituted by an electric motor, an air cylinder, or the like.

排出機構28包含：外筒28a；以及排出管28b，一端與下水道或工廠內之排出管連接，另一端與外筒28a之底壁連接。真空機構29包含：氣體供排泵，設置於流體供排機構2B；以及真空管29a，其一端以能夠排氣之方式與氣體供排泵連接且另一端經由分支部20a與中間筒T及外筒28a之底壁連接。在排出機構28之排出管28b及真空機構29之真空管29a上分別設置有由電磁閥等構成之開閉閥Ve及開閉閥Vf。上述排出管28b在分支部20a中與排液管24a合流而向下方延伸，排氣管26a及真空管29a在分支部20a中與排出管28b合流而向上方延伸。藉由該結構，液體在排液管24a及排出管28b內流動，氣體在排氣管26a及真空管29a內流通。本實施方式中之分支部20a位於比中間筒T之上端面(越過中間筒T之上端面之最高水位20b)靠上方的位置，切割品Sa之清洗、乾燥時越過中間筒T之上端面之清洗液不會因分支部20a與容器21內之最高水位20b的水位差而流入排氣管26a及真空管29a。另外，在切割品Sa之清洗中，排液機構24之開閉閥Vb處於閉閥狀態時，滯留於排液管24a之清洗液不會因分支部20a與容器21內之最高水位20b的水位差而流入排氣管26a及真空管29a。萬一滯留於排液管24a之清洗液達到分支部20a之水位之情況下，亦自與分支部20a連接 之排出管28b排出。此外，真空機構29若不使外筒28a內成為負壓，則不需要包含氣體供排泵，只要係能夠經由分支部20a自真空管29a排氣之結構即可，例如亦可以係工廠內之排氣管道與真空管29a之一端連接的結構。 The discharge mechanism 28 includes: an outer cylinder 28a; and a discharge pipe 28b, one end of which is connected to a drain pipe in a sewer or a factory, and the other end is connected to the bottom wall of the outer cylinder 28a. The vacuum mechanism 29 includes: a gas supply and exhaust pump provided in the fluid supply and exhaust mechanism 2B; and a vacuum pipe 29a, one end of which is connected to the gas supply and exhaust pump in a way that can be exhausted, and the other end is connected to the intermediate cylinder T and the outer cylinder through the branch portion 20a The bottom wall of 28a is connected. The discharge pipe 28b of the discharge mechanism 28 and the vacuum pipe 29a of the vacuum mechanism 29 are provided with an on-off valve Ve and an on-off valve Vf composed of a solenoid valve or the like, respectively. The discharge pipe 28b joins with the discharge pipe 24a in the branch part 20a and extends downward, and the discharge pipe 26a and the vacuum pipe 29a join with the discharge pipe 28b in the branch part 20a and extend upward. With this structure, the liquid flows in the liquid discharge pipe 24a and the discharge pipe 28b, and the gas flows in the discharge pipe 26a and the vacuum pipe 29a. In this embodiment, the branch portion 20a is located above the upper end surface of the intermediate cylinder T (the highest water level 20b that crosses the upper end surface of the intermediate cylinder T), and the cut product Sa crosses the upper end surface of the intermediate cylinder T during cleaning and drying. The cleaning liquid does not flow into the exhaust pipe 26a and the vacuum pipe 29a due to the water level difference between the branch portion 20a and the highest water level 20b in the container 21 . In addition, when the on-off valve Vb of the liquid discharge mechanism 24 is in the closed state during the cleaning of the cut product Sa, the cleaning liquid remaining in the liquid discharge pipe 24a will not be caused by the difference in the water level between the branch portion 20a and the highest water level 20b in the container 21. Then, it flows into the exhaust pipe 26a and the vacuum pipe 29a. In case the cleaning liquid remaining in the drain pipe 24a reaches the water level of the branch part 20a, it is also connected to the branch part 20a. The discharge pipe 28b is discharged. In addition, the vacuum mechanism 29 does not need to include a gas supply and exhaust pump unless the outer cylinder 28a becomes a negative pressure, as long as it is a structure capable of exhausting the gas from the vacuum pipe 29a through the branch portion 20a, for example, it can also be a gas exhaust pump in a factory. A structure in which the gas pipe is connected to one end of the vacuum pipe 29a.

[切割品之製造方法] [Manufacturing method of cut product]

使用圖1至圖11對切割品Sa之製造方法進行說明。 The manufacturing method of the cut product Sa will be described with reference to FIGS. 1 to 11 .

如圖1所示，用樹脂成形裝置E樹脂成形之封裝基板S被輸送至接收部11，該封裝基板S被載置在預工作台11a上。接著，切割用移送機構12a將自接收部11接收之作為切割對象物的封裝基板S以樹脂封裝之一側作為下表面而固定在切割台12b上，並移送至切割部12c。然後，藉由切割用移送機構12a及切割部12c，調整封裝基板S與旋轉刀片12c2的相對位置，利用旋轉刀片12c2以自上表面朝向下表面貫通的方式對封裝基板S進行切割，形成俯視呈矩形狀之多個切割品Sa(切割工序)。 As shown in FIG. 1, the package board|substrate S resin-molded by the resin molding apparatus E is conveyed to the receiving part 11, and this package board|substrate S is mounted on the pre-table 11a. Next, the transfer mechanism 12a for dicing fixes the package substrate S as a dicing object received from the receiving portion 11 on the dicing table 12b with one side of the resin package as the lower surface, and transfers it to the dicing portion 12c. Then, the relative positions of the package substrate S and the rotary blade 12c2 are adjusted by the transfer mechanism 12a for dicing and the dicing portion 12c, and the rotary blade 12c2 cuts the package substrate S so as to penetrate from the upper surface to the lower surface to form a plan view. A plurality of rectangular cut products Sa (cutting process).

接著，輸送機構4將由切割機構12切割而形成之多個切割品Sa輸送至清洗機構2A之容器21(輸送工序)。如圖2所示，本實施方式中之輸送機構4在停止了位於切割台12b上之切割品Sa之空氣吸附的狀態下，管口41抽吸切割台12b上之多個切割品Sa而流入流體管42，並藉由自液體供給機構43供給之液流輸送至容器21，將多個切割品Sa自流體管42之另一端42b收納至容器21之內部(輸送工序、收納工序)。此時，如圖5之輸送收納工序所示，在將供液機構23、排液機構24、供氣機構25、排氣機構26以及排出機構28之開閉閥Va至Ve設為關閉狀態，並將旋轉機構22設為非驅動狀 態的狀態下，打開真空機構29之開閉閥Vf。其結果，如圖6所示，藉由流體供排機構2B所包括之氣體供排泵，經由與真空機構29之真空管29a連通的容器21及流體管42使負壓作用於管口41，從而抽吸多個切割品Sa(亦參照圖2)。由此，利用管口41抽吸多個切割品Sa，藉由液流輸送至容器21，因此即使在切割品Sa之尺寸例如小至不足2mm見方的情況下，亦能夠一下子抽吸、輸送。 Next, the transport mechanism 4 transports the plurality of cut products Sa formed by cutting by the cutting mechanism 12 to the container 21 of the cleaning mechanism 2A (transport process). As shown in FIG. 2 , in the conveying mechanism 4 in the present embodiment, the nozzle 41 sucks the plurality of cut products Sa on the cutting table 12b and flows into the state where the air suction of the cut products Sa on the cutting table 12b is stopped. The fluid tube 42 is transported to the container 21 by the liquid flow supplied from the liquid supply mechanism 43, and the plurality of cut objects Sa are accommodated in the container 21 from the other end 42b of the fluid tube 42 (transporting step, storage step). At this time, as shown in the transportation and storage process of FIG. 5 , the on-off valves Va to Ve of the liquid supply mechanism 23 , the liquid discharge mechanism 24 , the air supply mechanism 25 , the exhaust mechanism 26 , and the discharge mechanism 28 are closed, and The rotating mechanism 22 is in a non-driven state In this state, the on-off valve Vf of the vacuum mechanism 29 is opened. As a result, as shown in FIG. 6 , by the gas supply and discharge pump included in the fluid supply and discharge mechanism 2B, the negative pressure acts on the nozzle 41 through the container 21 and the fluid pipe 42 communicated with the vacuum pipe 29a of the vacuum mechanism 29 , thereby A plurality of cut products Sa are suctioned (see also FIG. 2 ). As a result, the plurality of cut products Sa are suctioned by the nozzle 41 and transported to the container 21 by the liquid flow. Therefore, even when the size of the cut products Sa is as small as, for example, less than 2 mm square, it can be sucked and transported at once. .

接著，清洗機構2A利用供液機構23向容器21(內筒21b)內供給清洗液，由此多個切割品Sa與清洗液一起被收納在容器21(內筒21b)內，清洗液通過微細孔21c而存在於中間筒T之內側。然後，藉由利用旋轉機構22使容器21(內筒21b及外筒28a)旋轉來清洗多個切割品Sa(清洗工序)。此時，如圖5之清洗工序所示，在將排液機構24及供氣機構25之開閉閥Vb、Vc設為關閉狀態的情況下，關閉真空機構29之開閉閥Vf，驅動旋轉機構22，並且打開供液機構23、排氣機構26及排出機構28之開閉閥Va、Vd、Ve。其結果，如圖7所示，藉由供液機構23向容器21之內筒21b內供給清洗液，藉由旋轉機構22使容器21旋轉，由此清洗多個切割品Sa。另外，經由內筒21b之微細孔21c而越過中間筒T之上端面的包括切屑等微小垃圾的清洗液藉由排出機構28排出，內筒21b內之空氣藉由排氣機構26排出。 Next, the cleaning mechanism 2A supplies the cleaning liquid into the container 21 (inner cylinder 21b) by the liquid supply mechanism 23, whereby the plurality of cut products Sa are accommodated in the container 21 (inner cylinder 21b) together with the cleaning liquid, and the cleaning liquid passes through the fine The hole 21c exists inside the intermediate cylinder T. As shown in FIG. Then, by rotating the container 21 (the inner cylinder 21b and the outer cylinder 28a) by the rotation mechanism 22, the plurality of cut products Sa are washed (washing step). At this time, as shown in the cleaning process of FIG. 5 , when the on-off valves Vb and Vc of the liquid discharge mechanism 24 and the air supply mechanism 25 are closed, the on-off valve Vf of the vacuum mechanism 29 is closed, and the rotation mechanism 22 is driven. , and open the on-off valves Va, Vd, Ve of the liquid supply mechanism 23, the exhaust mechanism 26, and the discharge mechanism 28. As a result, as shown in FIG. 7 , the cleaning liquid is supplied into the inner cylinder 21b of the container 21 by the liquid supply mechanism 23, and the container 21 is rotated by the rotating mechanism 22, thereby cleaning the plurality of cut products Sa. In addition, the cleaning liquid including fine waste such as chips, which has passed over the upper end surface of the intermediate cylinder T through the fine holes 21c of the inner cylinder 21b, is discharged by the discharge mechanism 28, and the air in the inner cylinder 21b is discharged by the exhaust mechanism 26.

由此，在本實施方式中，藉由使容器21(內筒21b及外筒28a)旋轉，在浸漬於清洗液之切割品Sa之周邊產生液流，因此能夠均勻地清洗切割品Sa之整個區域。亦即，即使在切割品Sa之尺寸小至不足例如2mm見方的情況下，亦能夠清洗至各個角落，能夠提高清洗效率。另外，由於使供給 有清洗液之容器21(內筒21b及外筒28a)旋轉，因此切割品Sa之清洗結構簡便，清洗液之供給、排出亦極其容易。而且，由於容器21相對於重力方向傾斜地配置，因此在使容器21旋轉時，多個切割品Sa之位置容易在上下方向上變動，能夠提高清洗效率。另外，若設置有在超過了規定的水位時排出包括切屑等微小垃圾之清洗液的排出機構28，則內筒21b內之水位調整機構簡便。 Accordingly, in the present embodiment, by rotating the container 21 (the inner cylinder 21b and the outer cylinder 28a), a liquid flow is generated around the cut product Sa immersed in the cleaning solution, so that the entire cut product Sa can be washed uniformly area. That is, even when the size of the cut product Sa is smaller than, for example, 2 mm square, it can be cleaned to every corner, and the cleaning efficiency can be improved. In addition, since the supply The container 21 (the inner cylinder 21b and the outer cylinder 28a) containing the cleaning liquid rotates, so the cleaning structure of the cut product Sa is simple, and the supply and discharge of the cleaning liquid are also extremely easy. Moreover, since the container 21 is arrange|positioned inclined with respect to the gravitational direction, when the container 21 is rotated, the position of the several cut product Sa is easy to fluctuate in an up-down direction, and cleaning efficiency can be improved. In addition, if the discharge mechanism 28 for discharging the cleaning liquid including fine debris such as chips when the water level exceeds a predetermined level is provided, the water level adjustment mechanism in the inner cylinder 21b can be simplified.

接著，在藉由清洗工序對多個切割品Sa進行清洗之後，利用排液機構24及排出機構28將包括切屑等微小垃圾之清洗液排出，利用供氣機構25向容器21之內筒21b內供給壓縮空氣，並且一邊利用旋轉機構22使容器21(內筒21b及外筒28a)旋轉一邊使多個切割品Sa乾燥(乾燥工序)。此時，如圖5之乾燥工序所示，維持真空機構29之開閉閥Vf之關閉狀態，排氣機構26及排出機構28之開閉閥Vd、Ve之打開狀態，在繼續旋轉機構22之驅動的狀態下關閉供液機構23之開閉閥Va，打開排液機構24及供氣機構25之開閉閥Vb、Vc。其結果，如圖8所示，利用排液機構24及排出機構28排出容器21內之包括切屑等微小垃圾之清洗液，利用流體供排機構2B之氣體供排泵經由供氣管25a向容器21之內筒21b內供給壓縮空氣，一邊利用旋轉機構22使容器21(內筒21b及外筒28a)旋轉一邊使多個切割品Sa乾燥。亦即，由於一邊使容器21旋轉一邊對多個切割品Sa進行乾燥，因此能夠使多個切割品Sa流動而對切割品Sa整個區域進行乾燥。此時，內筒21b之底壁之內表面由傾斜面21b1形成，因此在使容器21旋轉時，堆積於容器21之底壁中央部分之多個切割品Sa的位置向徑向外側移動。其結果，能夠減少多個切割品Sa之重疊，能夠提高切割品Sa之乾燥效率。這 樣，即使在切割品Sa之尺寸例如小至不足2mm見方的情況下，亦能夠有效地使其乾燥。而且，若在容器21內完成切割品Sa之清洗以及乾燥，則不需要另外設置乾燥容器，能夠實現清洗模組2(切割裝置D)的緊湊化。 Next, after cleaning the plurality of cut products Sa in the cleaning process, the cleaning liquid including the fine waste such as chips is discharged by the liquid discharge mechanism 24 and the discharge mechanism 28 , and the air supply mechanism 25 is used to discharge the cleaning liquid into the inner cylinder 21 b of the container 21 . While supplying compressed air, the plurality of cut products Sa are dried while rotating the container 21 (the inner cylinder 21b and the outer cylinder 28a) by the rotating mechanism 22 (drying step). At this time, as shown in the drying process of FIG. 5, the closed state of the on-off valve Vf of the vacuum mechanism 29 and the open state of the on-off valves Vd and Ve of the exhaust mechanism 26 and the discharge mechanism 28 are maintained, and the driving of the rotating mechanism 22 is continued. In this state, the on-off valve Va of the liquid supply mechanism 23 is closed, and the on-off valves Vb and Vc of the liquid discharge mechanism 24 and the gas supply mechanism 25 are opened. As a result, as shown in FIG. 8 , the cleaning liquid including chips and other fine wastes in the container 21 is discharged by the liquid discharge mechanism 24 and the discharge mechanism 28 , and the gas supply and discharge pump of the fluid supply and discharge mechanism 2B is used for the container 21 through the gas supply pipe 25a. Compressed air is supplied into the inner cylinder 21b, and the plurality of cut products Sa are dried while rotating the container 21 (the inner cylinder 21b and the outer cylinder 28a) by the rotating mechanism 22. That is, since the plurality of cut products Sa are dried while rotating the container 21, the plurality of cut products Sa can be flowed and the entire region of the cut products Sa can be dried. At this time, since the inner surface of the bottom wall of the inner cylinder 21b is formed by the inclined surface 21b1, when the container 21 is rotated, the positions of the plurality of cut products Sa accumulated in the center of the bottom wall of the container 21 are moved radially outward. As a result, the overlapping of the plurality of cut products Sa can be reduced, and the drying efficiency of the cut products Sa can be improved. This In this way, even when the size of the cut product Sa is as small as, for example, less than 2 mm square, it can be effectively dried. Furthermore, if the cleaning and drying of the cut product Sa are completed in the container 21, there is no need to provide a separate drying container, and the cleaning module 2 (the cutting device D) can be made compact.

接著，關閉排液機構24、供氣機構25、排氣機構26以及排出機構28之開閉閥Vb至Ve，停止旋轉機構22之驅動後，藉由轉動反轉機構27使內筒21b轉動及上下反轉，取出多個切割品Sa(取出工序)。使用圖9至圖11對該取出工序進行說明。 Next, the on-off valves Vb to Ve of the liquid discharge mechanism 24 , the air supply mechanism 25 , the exhaust mechanism 26 , and the discharge mechanism 28 are closed, and the driving of the rotation mechanism 22 is stopped. It is reversed, and the some cut product Sa is taken out (extraction process). The extraction process will be described with reference to FIGS. 9 to 11 .

如圖9所示，藉由蓋移動機構31使蓋30上升，並且在利用夾緊機構27a之夾緊部件27a1夾持內筒21b的狀態下，藉由內筒上下機構27d使內筒21b上升，使內筒21b自中間筒T脫離。接著，如圖10所示，藉由轉動機構27b使內筒21b圍繞轉動軸27b1轉動而移動至回收箱2C之上方。接著，如圖11所示，藉由內筒反轉機構27c使內筒21b圍繞反轉軸27c1上下反轉，使收納於內筒21b內之多個切割品Sa下落至回收箱2C而取出。然後，回收收納於回收箱2C之清洗、乾燥完的切割品Sa。這樣，使容器21之內筒21b上下反轉而取出切割品Sa，因此，不會如以往那樣簡單地利用刷子將被抽吸之狀態的切割品Sa排出，不會出現切割品Sa夾在刷子上或飛散的不良情況。 As shown in FIG. 9, the lid 30 is raised by the lid moving mechanism 31, and the inner cylinder 21b is raised by the inner cylinder up-down mechanism 27d in a state where the inner cylinder 21b is clamped by the clamping member 27a1 of the clamping mechanism 27a. , the inner tube 21b is detached from the intermediate tube T. Next, as shown in FIG. 10, the inner cylinder 21b is rotated about the rotation axis 27b1 by the rotation mechanism 27b, and is moved to the upper part of 2C of collection boxes. Next, as shown in FIG. 11, the inner cylinder 21b is reversed up and down around the reversing axis 27c1 by the inner cylinder reversing mechanism 27c, and the plurality of cut products Sa accommodated in the inner cylinder 21b are dropped to the collection box 2C and taken out. Then, the cleaned and dried cut product Sa accommodated in the collection box 2C is collected. In this way, the inner tube 21b of the container 21 is turned upside down to take out the cut product Sa, so that the cut product Sa in the suctioned state is not simply discharged by the brush as in the past, and the cut product Sa is not caught by the brush. bad condition of flying up or flying.

[其他實施方式] [Other Embodiments]

以下，對於與上述的實施方式相同的部件，為了容易理解，使用相同的術語、符號進行說明。 Hereinafter, the same terms and symbols will be used for the same components as those in the above-described embodiments for easy understanding.

<1>如圖12至圖13所示，輸送機構4還可以包含收納多個切割品Sa之收納部45，將收納有多個切割品Sa之收納部45移動至內筒21b，自收納部45向內筒21b轉移多個切割品Sa(輸送工序)。更詳細而言，本實施方式中之輸送機構4包含：移動體44，配置在切割機構12之切割台12b上，能夠一邊與封裝基板S被切割而形成之多個切割品Sa接觸一邊移動；收納部45，能夠收納多個切割品Sa；以及驅動機構46，驅動移動體44，此等移動體44、收納部45以及驅動機構46在輸送箱4A內構成為一體單元。另外，輸送機構4將輸送箱4A輸送至清洗機構2A之容器21。 <1> As shown in FIGS. 12 to 13 , the conveying mechanism 4 may further include a storage portion 45 that stores a plurality of cut products Sa, and moves the storage portion 45 that stores a plurality of cut products Sa to the inner cylinder 21 b, and from the storage portion 45 The plurality of cut products Sa are transferred to the inner cylinder 21b (conveying process). More specifically, the conveying mechanism 4 in this embodiment includes: a moving body 44, which is arranged on the cutting table 12b of the cutting mechanism 12, and can move while being in contact with a plurality of dicing products Sa formed by dicing the package substrate S; The accommodating part 45 can accommodate a plurality of cut products Sa; and the drive mechanism 46 drives the moving body 44 , and the moving body 44 , the accommodating part 45 , and the driving mechanism 46 constitute an integrated unit in the transport box 4A. In addition, the transport mechanism 4 transports the transport box 4A to the container 21 of the cleaning mechanism 2A.

移動體44包含：旋轉本體44a，以旋轉軸44a1為中心旋轉；多個突出部44b，自旋轉本體44a之周圍向徑向外側突出；以及引導槽44c，支承旋轉軸44a1並引導旋轉本體44a之滑動移動。多個突出部44b在與切割品Sa接觸而自切割台12b分離時不易變形，並由不損傷切割品Sa之耐綸、聚對苯二甲酸丁二醇酯(PBT)等樹脂材料構成。藉由後述之滑動驅動機構46b，旋轉本體44a構成為能夠沿著引導槽44c在切割台12b上前進或後退移動。 The movable body 44 includes: a rotating body 44a that rotates around the rotating shaft 44a1; a plurality of protrusions 44b that protrude radially outward from the periphery of the rotating body 44a; and a guide groove 44c that supports the rotating shaft 44a1 and guides the rotating body 44a. Swipe to move. The plurality of protrusions 44b are not easily deformed when they come into contact with the dicing product Sa and are separated from the dicing table 12b, and are made of resin materials such as nylon and polybutylene terephthalate (PBT) which do not damage the dicing product Sa. The rotary body 44a is configured to be able to move forward or backward on the cutting table 12b along the guide groove 44c by the slide drive mechanism 46b described later.

驅動機構46包含：旋轉驅動機構46a，使移動體44旋轉驅動；以及滑動驅動機構46b，使移動體44沿著切割台12b之表面滑動移動。該驅動機構46之驅動源由伺服馬達等電動馬達、氣缸等構成。 The drive mechanism 46 includes: a rotation drive mechanism 46a for rotationally driving the moving body 44; and a sliding drive mechanism 46b for sliding the moving body 44 along the surface of the cutting table 12b. The drive source of the drive mechanism 46 is constituted by an electric motor such as a servo motor, an air cylinder, or the like.

作為切割品Sa之輸送方法，首先，如圖12所示，在停止了位於切割 台12b上之切割品Sa之空氣吸附的狀態下，使封裝基板S被切割而形成之多個切割品Sa與藉由旋轉驅動機構46a旋轉後的移動體44的突出部44b接觸而自切割台12b分離。接著，在移動體44之突出部44b與切割品Sa接觸的狀態下，藉由滑動驅動機構46b使移動體44前進，將切割品Sa朝向收納部45推出。此時，由旋轉驅動機構46a旋轉的移動體44之突出部44b與下一個切割品Sa接觸而自切割台12b分離。反覆進行切割台12b上之切割品Sa之分離及推出，將全部的多個切割品Sa最終收納於收納部45。 As a method of conveying the cut product Sa, first, as shown in FIG. 12 , after stopping the cutting In a state in which the dicing product Sa on the table 12b is sucked by air, the plurality of dicing products Sa formed by dicing the package substrate S come into contact with the protruding portion 44b of the moving body 44 rotated by the rotation driving mechanism 46a, and are separated from the dicing table. 12b separation. Next, the movable body 44 is moved forward by the slide drive mechanism 46b in a state in which the protruding portion 44b of the movable body 44 is in contact with the cut product Sa, and the cut product Sa is pushed out toward the accommodating portion 45 . At this time, the protrusion 44b of the movable body 44 rotated by the rotation drive mechanism 46a comes into contact with the next cut product Sa and is separated from the cutting table 12b. Separation and push-out of the cut products Sa on the cutting table 12 b are repeated, and all the plurality of cut products Sa are finally accommodated in the accommodating portion 45 .

接著，輸送機構4將輸送箱4A(收納有多個切割品Sa之收納部45)以容器21之開口成為收納部45之下方的方式輸送至清洗機構2A之容器21的附近。接著，輸送機構4使輸送箱4A傾動的同時使其振動，使多個切割品Sa下落至容器21內。這樣，若在轉移至內筒21b之前將切割品Sa收納於收納部45，則僅輸送收納有多個切割品Sa之收納部45即可，能夠提高輸送效率。而且，若使輸送箱4A傾動而振動，則能夠一次將多個切割品Sa收納於容器21，因此與藉由液流、抽吸來輸送切割品Sa的情況相比，不易產生切割品Sa之回收不良。另外，在圖12至圖13所示之結構中，與上述的實施方式中的切割後之切割品Sa之輸送以及向容器21之收納的說明不同。亦即，並非將多個切割品Sa自流體管42之另一端42b收納於容器21之內部，而是將多個切割品Sa自輸送機構4之輸送箱4A直接收納於容器21之內部。 Next, the conveyance mechanism 4 conveys the conveyance box 4A (accommodating part 45 in which a plurality of cut products Sa are accommodated) to the vicinity of the container 21 of the cleaning mechanism 2A so that the opening of the container 21 becomes below the accommodation part 45 . Next, the conveyance mechanism 4 tilts the conveyance box 4A and vibrates the conveyance box 4A to drop the plurality of cut products Sa into the container 21 . In this way, if the cut product Sa is accommodated in the accommodating part 45 before transferring to the inner tube 21b, only the accommodating part 45 in which the plurality of cut products Sa are accommodated may be conveyed, and the conveyance efficiency can be improved. In addition, when the conveyance box 4A is tilted and vibrated, a plurality of cut products Sa can be accommodated in the container 21 at a time, and therefore, compared with the case of conveying the cut products Sa by liquid flow and suction, it is less likely that the cut products Sa will be damaged. Poor recycling. In addition, in the structure shown in FIG. 12-FIG. 13, it differs from the description of the conveyance of the cut product Sa after cutting and the storage in the container 21 in the above-mentioned embodiment. That is, instead of storing the plurality of cut products Sa inside the container 21 from the other end 42b of the fluid tube 42 , the plurality of cut products Sa are directly stored inside the container 21 from the transport box 4A of the transport mechanism 4 .

<2>在上述實施方式中，在容器21內設置有中間筒T，但亦可以省略中間筒T而使自形成於內筒21b之側壁(劃分壁之一例)之排出孔流出的清洗 液藉由排出機構28排出。在該情況下，排液機構24之排液管24a與內筒21b連接。另外，亦可以省略中間筒T及外筒28a，僅由內筒21b構成容器21，藉由供液機構23、排液機構24控制清洗液之供給量。 <2> In the above-described embodiment, the intermediate cylinder T is provided in the container 21 , but the intermediate cylinder T may be omitted and the cleaning to flow out from the discharge hole formed in the side wall (an example of the dividing wall) of the inner cylinder 21 b may be The liquid is discharged by the discharge mechanism 28 . In this case, the drain pipe 24a of the drain mechanism 24 is connected to the inner cylinder 21b. In addition, the intermediate cylinder T and the outer cylinder 28a may be omitted, the container 21 may be constituted only by the inner cylinder 21b, and the supply amount of the cleaning liquid may be controlled by the liquid supply mechanism 23 and the liquid discharge mechanism 24.

<3>在上述的實施方式中，藉由供氣機構25向容器21之內筒21b內供給空氣而使多個切割品Sa乾燥，但亦可以在容器21外設置使多個切割品Sa乾燥的乾燥裝置。 <3> In the above-described embodiment, the air supply mechanism 25 supplies air into the inner cylinder 21b of the container 21 to dry the plurality of cut products Sa, but the plurality of cut products Sa may be provided outside the container 21 to dry drying device.

<4>在上述的實施方式中，藉由轉動反轉機構27使容器21之內筒21b轉動及反轉而使多個切割品Sa下落，但亦可以省略轉動反轉機構27，藉由抽吸等方式取出容器21內之切割品Sa。 <4> In the above-mentioned embodiment, the inner cylinder 21b of the container 21 is rotated and reversed by the rotation reversing mechanism 27 to drop the plurality of cut products Sa, but the rotation reversing mechanism 27 may be omitted, and the Take out the cut product Sa in the container 21 by suction or the like.

<5>在上述的實施方式中，在乾燥工序中，一邊利用旋轉機構22使容器21(中間筒T)旋轉，一邊利用由供氣機構25供給之壓縮空氣使多個切割品Sa乾燥，但亦可以在停止了容器21之旋轉的狀態下利用由供氣機構25供給之壓縮空氣使多個切割品Sa乾燥。 <5> In the above-described embodiment, in the drying step, the plurality of cut products Sa are dried by the compressed air supplied from the air supply mechanism 25 while the container 21 (intermediate cylinder T) is rotated by the rotating mechanism 22 . The plurality of cut products Sa may be dried by the compressed air supplied from the air supply mechanism 25 in a state in which the rotation of the container 21 is stopped.

<6>在上述的實施方式中的輸送機構4中，將液體供給機構43與流體管42之一端42a連接，藉由液流來輸送多個切割品Sa，但亦可以省略液體供給機構43，僅藉由利用真空機構29之抽吸來輸送多個切割品Sa。 <6> In the transport mechanism 4 in the above-described embodiment, the liquid supply mechanism 43 is connected to one end 42a of the fluid pipe 42, and the plurality of cut products Sa are transported by the liquid flow, but the liquid supply mechanism 43 may be omitted. The plurality of cut products Sa are conveyed only by suction by the vacuum mechanism 29 .

<7>在上述<1>所示之輸送機構4中，將輸送箱4A輸送至容器21，但亦可以藉由抽吸、液流將由移動體44自切割台12b分離的多個切割品Sa輸 送至容器21。 <7> In the transport mechanism 4 shown in the above <1>, the transport box 4A is transported to the container 21, but the plurality of cut products Sa separated from the cutting table 12b by the moving body 44 may be separated by suction or liquid flow. lose to container 21.

<8>在上述的實施方式中，藉由旋轉機構22使容器21之內筒21b及外筒28a旋轉，但亦可以僅使容器21之內筒21b旋轉，亦可以使容器21之內筒21b及中間筒T旋轉，旋轉對象沒有特別限定。 <8> In the above-described embodiment, the inner cylinder 21b and the outer cylinder 28a of the container 21 are rotated by the rotating mechanism 22, but only the inner cylinder 21b of the container 21 may be rotated, or the inner cylinder 21b of the container 21 may be rotated And the intermediate cylinder T rotates, and the object of rotation is not particularly limited.

<9>在上述的實施方式中，將供液管23a之一端連接於自來水道或工廠內之純水供給管，將排液管24a及排出管28b之一端連接於下水道或工廠內之排出管，但亦可以在流體供排機構2B設置清洗液槽，將供液管23a、排液管24a及排出管28b之一端連接於清洗液槽，使清洗液循環。在該情況下，較佳在供液管23a或排液管24a以及排出管28b設置用於過濾清洗液之過濾機構。 <9> In the above-mentioned embodiment, one end of the liquid supply pipe 23a is connected to the water supply pipe or the pure water supply pipe in the factory, and one ends of the liquid discharge pipe 24a and the discharge pipe 28b are connected to the sewer or the discharge pipe in the factory However, a cleaning liquid tank can also be provided in the fluid supply and discharge mechanism 2B, and one end of the liquid supply pipe 23a, the liquid discharge pipe 24a and the discharge pipe 28b can be connected to the cleaning liquid tank to circulate the cleaning liquid. In this case, it is preferable to provide a filter mechanism for filtering the cleaning liquid in the liquid supply pipe 23a, the liquid discharge pipe 24a, and the discharge pipe 28b.

<10>亦可以不使容器21相對於重力方向傾斜，而是沿著重力方向呈直立姿勢。另外，內筒21b之底壁亦可以不設置傾斜面21b1而平坦地形成。 <10> The container 21 may not be inclined with respect to the direction of gravity, but may be in an upright posture along the direction of gravity. In addition, the bottom wall of the inner cylinder 21b may be formed flat without providing the inclined surface 21b1.

[上述實施方式之概要] [Outline of the above-mentioned embodiment]

以下，對在上述實施方式中說明之清洗模組2、切割裝置D以及切割品Sa之製造方法的概要進行說明。 Hereinafter, the outline of the manufacturing method of the cleaning module 2, the dicing apparatus D, and the dicing product Sa which were demonstrated in the said embodiment is demonstrated.

(1)清洗模組2之特徵結構在於，包含：容器21，其收納封裝基板S被切割而形成之多個切割品Sa；旋轉機構22，其使容器21旋轉；供液機構 23，其向容器21內供給清洗液；以及排液機構24，其將容器21內之清洗液排出；多個切割品Sa在浸漬於清洗液之狀態下在藉由旋轉機構22旋轉之容器21內被清洗。 (1) The characteristic structure of the cleaning module 2 includes: a container 21 that accommodates a plurality of cut products Sa formed by cutting the package substrate S; a rotating mechanism 22 that rotates the container 21; and a liquid supply mechanism 23, which supplies the cleaning liquid into the container 21; and a liquid discharge mechanism 24, which discharges the cleaning liquid in the container 21; the plurality of cut products Sa are immersed in the cleaning liquid The state of the container 21 rotated by the rotating mechanism 22 Inside is cleaned.

根據本結構，在藉由旋轉機構22旋轉之容器21內產生迴旋的液流，利用清洗液對多個切割品Sa進行清洗。亦即，並非如以往那樣對靜止狀態之切割品Sa吹送清洗液，或按壓清洗刷進行清洗，而是在將切割品Sa浸漬於清洗液之狀態下進行清洗，因此能夠防止切割品Sa之晶片移位、飛散，能夠均勻地清洗切割品Sa之整個區域。其結果，即使切割品Sa之尺寸小，亦能夠清洗至各個角落，能夠提高清洗效率。 According to this configuration, a swirling liquid flow is generated in the container 21 rotated by the rotating mechanism 22, and the plurality of cut products Sa are cleaned with the cleaning liquid. That is, instead of blowing the cleaning liquid or pressing the cleaning brush to the diced product Sa in a stationary state, cleaning is performed in a state where the diced product Sa is immersed in the cleaning solution as in the past. Displacement and scattering can uniformly clean the entire area of the cut product Sa. As a result, even if the size of the cut product Sa is small, it can be cleaned to every corner, and the cleaning efficiency can be improved.

另外，由於使供給有清洗液之容器21旋轉，因此切割品Sa之清洗結構簡便，清洗液之供給、排出亦極其容易。這樣，可提供能夠提高清洗效率之清洗模組2。 In addition, since the container 21 in which the cleaning liquid is supplied is rotated, the cleaning structure of the cut product Sa is simple, and the supply and discharge of the cleaning liquid are also extremely easy. In this way, the cleaning module 2 capable of improving the cleaning efficiency can be provided.

(2)還可以包含：供氣機構25，向容器21內供給壓縮空氣(氣體)；以及排氣機構26，排出容器21內之空氣(氣體)。 (2) It may further include: an air supply mechanism 25 for supplying compressed air (gas) into the container 21 ; and an exhaust mechanism 26 for discharging the air (gas) in the container 21 .

若如本結構那樣包括供氣機構25及排氣機構26，則能夠在容器21內使清洗後之切割品Sa乾燥。其結果，不需要在容器21外另外設置乾燥容器，能夠實現清洗模組2之緊湊化。 If the air supply mechanism 25 and the exhaust mechanism 26 are included as in the present configuration, the cleaned cut product Sa can be dried in the container 21 . As a result, it is not necessary to provide a drying container other than the container 21, and the cleaning module 2 can be made compact.

(3)還可以包含：轉動反轉機構27(反轉機構)，使內筒21b(容器21)上 下反轉。 (3) It may also include: rotating the reversing mechanism 27 (reversing mechanism), so that the inner cylinder 21b (container 21) is Reverse down.

若如本結構那樣設置使內筒21b反轉的轉動反轉機構27，則能夠順暢地進行切割品Sa之排出。另外，由於不像以往那樣用刷子將被抽吸之狀態的切割品Sa排出，因此不存在切割品Sa被刷子夾住或飛散的不良情況。 If the rotation inversion mechanism 27 which reverses the inner cylinder 21b is provided like this structure, the discharge|emission of the cut product Sa can be performed smoothly. In addition, since the cut product Sa in the suctioned state is not discharged with a brush as in the past, there is no problem that the cut product Sa is caught by the brush or scattered.

(4)容器21包含：內筒21b(內容器)，至少在底壁形成有切割品Sa不能通過之大小的微細孔21c(貫通孔)；以及外筒28a(外容器)，配置在內筒21b之外側，在內筒21b與外筒28a之間形成有中間筒T(劃分壁)，供給至內筒21b之清洗液通過微細孔21c而存在於內筒21b及中間筒T之內側，本結構還可以包含排出機構28，排出機構28將清洗液中之越過中間筒T之頂部的清洗液自外筒28a排出。 (4) The container 21 includes: an inner cylinder 21b (inner container) having at least a bottom wall formed with fine holes 21c (through holes) of a size in which the cut product Sa cannot pass; and an outer cylinder 28a (outer container) arranged in the inner cylinder On the outer side of 21b, an intermediate cylinder T (partitioning wall) is formed between the inner cylinder 21b and the outer cylinder 28a, and the cleaning liquid supplied to the inner cylinder 21b passes through the fine holes 21c and exists inside the inner cylinder 21b and the intermediate cylinder T. The structure may further include a discharge mechanism 28, and the discharge mechanism 28 discharges the cleaning liquid that has passed over the top of the intermediate cylinder T in the cleaning liquid from the outer cylinder 28a.

如本結構那樣，若設置將越過中間筒T之頂部的清洗液自外筒28a排出的排出機構28，則使得用於調整水位之機構簡單。 As in the present structure, if the discharge mechanism 28 for discharging the cleaning liquid that has passed over the top of the intermediate cylinder T from the outer cylinder 28a is provided, the mechanism for adjusting the water level can be simplified.

(5)容器21亦可以相對於重力方向傾斜地配置。 (5) The container 21 may be arranged to be inclined with respect to the direction of gravity.

若如本結構那樣容器21相對於重力方向傾斜地配置，則在使容器21旋轉時，多個切割品Sa之位置容易在上下方向上變動。亦即，由於多個切割品Sa之流動性提高，因此能夠提高切割品Sa之清洗效率、乾燥效率。 When the container 21 is arranged so as to be inclined with respect to the gravitational direction as in this configuration, when the container 21 is rotated, the positions of the plurality of cut products Sa are likely to fluctuate in the vertical direction. That is, since the fluidity of the plurality of cut products Sa is improved, the cleaning efficiency and drying efficiency of the cut products Sa can be improved.

(6)內筒21b(容器21)之底壁之內表面亦可以由以愈接近旋轉機構22之 旋轉軸22b則愈往重力方向的方式傾斜的傾斜面21b1形成。 (6) The inner surface of the bottom wall of the inner cylinder 21b (container 21) can also be made closer to the rotation mechanism 22. The rotating shaft 22b is formed with an inclined surface 21b1 inclined toward the direction of gravity.

如本結構那樣，若內筒21b之底壁之內表面由傾斜面21b1形成，則在使容器21旋轉時，堆積在容器21之底壁中央部分之多個切割品Sa的位置向徑向外側移動。其結果，能夠減少多個切割品Sa之重疊，能夠提高切割品Sa之清洗效率、乾燥效率。 If the inner surface of the bottom wall of the inner cylinder 21b is formed by the inclined surface 21b1 as in this structure, when the container 21 is rotated, the positions of the plurality of cut products Sa accumulated in the center portion of the bottom wall of the container 21 are radially outward. move. As a result, the overlapping of the plurality of cut products Sa can be reduced, and the cleaning efficiency and drying efficiency of the cut products Sa can be improved.

(7)切割裝置D之特徵結構在於，包含：上述(1)至(6)中任一項之清洗模組2；切割機構12，切割封裝基板S；以及輸送機構4，將由切割機構12切割而形成之多個切割品Sa輸送至容器21。 (7) The characteristic structure of the cutting device D is that it includes: the cleaning module 2 according to any one of the above (1) to (6); a cutting mechanism 12 for cutting the packaging substrate S; and a conveying mechanism 4 for cutting by the cutting mechanism 12 The formed plurality of cut products Sa are transported to the container 21 .

在本結構中，由於包括清洗效率高之清洗模組2，並且包括向用於清洗之容器21輸送切割品Sa之輸送機構4，因此能夠提供清洗效率高之切割裝置D。 In this structure, since the cleaning module 2 with high cleaning efficiency is included, and the conveying mechanism 4 for conveying the cut product Sa to the container 21 for cleaning is included, the cutting device D with high cleaning efficiency can be provided.

(8)輸送機構4亦可以利用管口41(吸嘴)抽吸多個切割品Sa而輸送至容器21。 (8) The transport mechanism 4 may suck a plurality of cut products Sa with the nozzle 41 (suction nozzle) and transport them to the container 21 .

在本結構中，由於利用管口41抽吸切割品Sa而向容器21輸送，因此即使在切割品Sa之尺寸小之情況下亦能夠一下子抽吸、輸送。 In this structure, since the cut product Sa is sucked by the spout 41 and conveyed to the container 21, even when the size of the cut product Sa is small, it can be sucked and conveyed at once.

(9)輸送機構4亦可以藉由液流將多個切割品Sa輸送至容器21。 (9) The transport mechanism 4 may transport the plurality of cut products Sa to the container 21 by the liquid flow.

如本結構那樣，若藉由液流將切割品Sa輸送至容器21，則能夠順暢地輸送切割品Sa。 As in this configuration, when the cut product Sa is transported to the container 21 by the liquid flow, the cut product Sa can be transported smoothly.

(10)輸送機構4還可以包含收納多個切割品Sa之收納部45，將收納有多個切割品Sa之收納部45輸送至容器21的附近，並自收納部45向容器21轉移多個切割品Sa。 (10) The conveying mechanism 4 may further include the storage portion 45 that stores the plurality of cut products Sa, and the storage portion 45 that stores the plurality of cut products Sa may be transported to the vicinity of the container 21 , and the plurality of cut products Sa may be transferred from the storage portion 45 to the container 21 . Cuts Sa.

如本結構那樣，若在轉移至容器21之前將切割品Sa收納於收納部45，則僅輸送收納有多個切割品Sa之收納部45即可，能夠提高輸送效率。 As in this configuration, if the cut product Sa is accommodated in the storage portion 45 before being transferred to the container 21 , only the storage portion 45 in which the plurality of cut products Sa are accommodated may be conveyed, and the conveyance efficiency can be improved.

(11)切割品Sa之製造方法之特徵在於，包含：切割工序，切割封裝基板S而形成多個切割品Sa；收納工序，將多個切割品Sa收納於容器21；清洗工序，向容器21內供給清洗液，使容器21旋轉而清洗多個切割品Sa；以及取出工序，使內筒21b(容器21)上下反轉而取出多個切割品Sa。 (11) The method for producing the cut product Sa is characterized by comprising: a dicing step of cutting the package substrate S to form a plurality of cut products Sa; a storage step of storing the plurality of cut products Sa in the container 21 ; A cleaning liquid is supplied inside, and the container 21 is rotated to wash the plurality of cut products Sa; and in the extraction step, the inner cylinder 21b (container 21 ) is turned upside down to take out the plurality of cut products Sa.

根據本方法，在藉由旋轉機構22旋轉之容器21內產生液流，利用清洗液對多個切割品Sa進行清洗。亦即，並非如以往那樣對靜止狀態之切割品Sa吹送清洗液，或者按壓清洗刷進行清洗，而是在將切割品Sa浸漬於清洗液之狀態下進行清洗，因此能夠防止切割品Sa之晶片移位、飛散，能夠均勻地清洗切割品Sa之整個區域。其結果，即使切割品Sa之尺寸小，亦能夠清洗至各個角落，能夠提高清洗效率。另外，由於使內筒21b上下反轉而取出切割品Sa，因此，不存在如以往那樣用刷子將被抽吸之狀態的 切割品Sa排出的不良情況，不會出現切割品Sa夾在刷子上或飛散的不良情況。 According to this method, a liquid flow is generated in the container 21 rotated by the rotating mechanism 22, and the plurality of cut products Sa are cleaned with the cleaning liquid. That is, instead of blowing the cleaning solution on the dicing product Sa in a stationary state or pressing the cleaning brush for cleaning, the cleaning is performed in a state where the dicing product Sa is immersed in the cleaning solution, so that the wafer of the dicing product Sa can be prevented. Displacement and scattering can uniformly clean the entire area of the cut product Sa. As a result, even if the size of the cut product Sa is small, it can be cleaned to every corner, and the cleaning efficiency can be improved. In addition, since the cut product Sa is taken out by inverting the inner cylinder 21b up and down, there is no such thing as a state of being sucked by a brush as in the past. In the case of the discharge of the cut product Sa, there is no problem that the cut product Sa is caught on the brush or scattered.

(12)還可以包含：乾燥工序，在藉由清洗工序清洗了多個切割品Sa之後排出清洗液，向容器21內供給壓縮空氣(氣體)以使上述容器旋轉的同時使多個切割品Sa乾燥。 (12) It may further include a drying step of discharging the cleaning liquid after cleaning the plurality of cut products Sa in the cleaning step, and supplying compressed air (gas) into the container 21 to rotate the container while rotating the plurality of cut products Sa dry.

如本方法那樣，若在容器21內完成切割品Sa之清洗及乾燥，則不需要另外設置乾燥容器，能夠實現切割裝置D之緊湊化。而且，由於一邊使容器21旋轉一邊對多個切割品Sa進行乾燥，因此能夠使多個切割品Sa流動而對切割品Sa整個區域進行乾燥。 As in the present method, if the cleaning and drying of the cut product Sa are completed in the container 21, there is no need to provide a separate drying container, and the cutting device D can be made compact. Furthermore, since the plurality of cut products Sa are dried while rotating the container 21, the plurality of cut products Sa can be flowed and the entire area of the cut products Sa can be dried.

(13)在切割工序之後且在清洗工序之前還可以包含將多個切割品Sa輸送至容器21之輸送工序，輸送工序可以利用管口41(吸嘴)抽吸多個切割品Sa而輸送至容器21。 (13) After the cutting process and before the cleaning process, a conveying process of conveying the plurality of cut products Sa to the container 21 may be included. container 21.

在本方法中，由於利用管口41抽吸切割品Sa而向容器21輸送，因此即使在切割品Sa之尺寸小之情況下亦能夠一下子抽吸、輸送。 In this method, since the cut product Sa is sucked by the spout 41 and conveyed to the container 21, even when the size of the cut product Sa is small, it can be sucked and conveyed at once.

(14)在切割工序之後且在清洗工序之前還可以包含將多個切割品Sa輸送至容器21之輸送工序，輸送工序可以藉由液流將多個切割品Sa輸送至容器21。 (14) After the cutting process and before the cleaning process, a conveying process of conveying the plurality of cut products Sa to the container 21 may be included, and the conveying process may convey the plurality of cut products Sa to the container 21 by liquid flow.

如本方法那樣，若藉由液流將切割品Sa輸送至容器21，則能夠順暢地輸送切割品Sa。 As in the present method, when the cut product Sa is transported to the container 21 by the liquid flow, the cut product Sa can be transported smoothly.

(15)在切割工序之後且在清洗工序之前還可以包含將多個切割品Sa輸送至容器21之輸送工序，輸送工序可以在將多個切割品Sa收納於收納部45並將收納部45輸送至容器21的附近之後，將多個切割品Sa自收納部45轉移至容器21。 (15) After the cutting process and before the cleaning process, a conveying process of conveying the plurality of cut products Sa to the container 21 may be included. After reaching the vicinity of the container 21 , the plurality of cut products Sa are transferred to the container 21 from the accommodating portion 45 .

如本方法那樣，若在轉移至容器21之前將切割品Sa收納於收納部45，則僅輸送收納有多個切割品Sa之收納部45即可，能夠提高輸送效率。 As in the present method, when the cut product Sa is stored in the storage portion 45 before being transferred to the container 21 , only the storage portion 45 in which the plurality of cut products Sa are stored may be conveyed, and the conveyance efficiency can be improved.

此外，上述的實施方式(包含其他實施方式，以下相同)所揭示之結構只要不產生矛盾，就能夠與在其他實施方式中揭示之結構組合來應用。另外，在本說明書中揭示之實施方式係例示，本發明之實施方式並不限定於此，能夠在不脫離本發明之目的的範疇內適當改變。 In addition, the structures disclosed in the above-mentioned embodiments (including other embodiments, the same below) can be applied in combination with the structures disclosed in the other embodiments, as long as there is no conflict. In addition, the embodiment disclosed in this specification is an illustration, and the embodiment of this invention is not limited to this, It can change suitably in the range which does not deviate from the objective of this invention.

工業應用性 Industrial applicability

本發明能夠用於清洗模組、包括清洗模組之切割裝置以及切割品之製造方法，尤其在切割品之尺寸小至不足2mm見方的情況下係有效的。 The present invention can be used for a cleaning module, a cutting device including the cleaning module, and a manufacturing method of a cut product, and is especially effective when the size of the cut product is as small as less than 2 mm square.

2:清洗模組 2: Cleaning module

2A:清洗機構 2A: Cleaning mechanism

2B:流體供排機構 2B: Fluid supply and discharge mechanism

4:輸送機構 4: Conveying mechanism

20a:分支部 20a: Branches

20b:最高水位 20b: Maximum water level

21:容器 21: Container

21b:內筒(內容器) 21b: Inner cylinder (inner container)

21b1:傾斜面 21b1: Inclined surface

21c:微細孔(貫通孔) 21c: Micro hole (through hole)

22:旋轉機構 22: Rotary mechanism

22a:電動馬達 22a: Electric motors

22b:旋轉軸 22b: Rotary axis

23:供液機構 23: Liquid supply mechanism

23a:供液管 23a: Liquid supply pipe

24:排液機構 24: Drainage mechanism

24a:排液管 24a: Drain pipe

25:供氣機構 25: Air supply mechanism

25a:供氣管 25a: Air supply pipe

26:排氣機構 26: Exhaust mechanism

26a:排氣管 26a: Exhaust pipe

27:轉動反轉機構 27: Rotate the reversing mechanism

27a:夾緊機構 27a: Clamping mechanism

27a1:夾緊部件 27a1: Clamping parts

27b:轉動機構 27b: Turning mechanism

27b1:轉動軸 27b1: Rotary axis

27c:內筒反轉機構(反轉機構) 27c: Inner cylinder reversing mechanism (reversing mechanism)

27c1:反轉軸 27c1: Reverse axis

27d:內筒上下機構 27d: Inner cylinder up and down mechanism

28:排出機構 28: Discharge mechanism

28a:外筒(外容器) 28a: Outer cylinder (outer container)

28a1:內插管 28a1: Intubation tube

28b:排出管 28b: discharge pipe

29:真空機構 29: Vacuum mechanism

29a:真空管 29a: Vacuum Tube

30:蓋 30: Cover

31:蓋移動機構 31: Cover moving mechanism

42:流體管 42: Fluid Tube

43:液體供給機構 43: Liquid supply mechanism

Sa:切割品 Sa: cut product

T:中間筒(劃分壁) T: Intermediate cylinder (dividing wall)

Va~Vf:開閉閥 Va~Vf: On-off valve

Claims (14)

一種清洗模組，其包含：容器，其收納封裝基板被切割而形成之多個切割品；旋轉機構，其使上述容器旋轉；供液機構，其向上述容器內供給清洗液；排液機構，其排出上述容器內之上述清洗液；以及反轉機構，其使上述容器上下反轉；多個上述切割品在浸漬於上述清洗液之狀態下，在藉由上述旋轉機構旋轉之上述容器內被清洗。 A cleaning module, comprising: a container for accommodating a plurality of cut products formed by cutting a package substrate; a rotation mechanism for rotating the container; a liquid supply mechanism for supplying cleaning liquid into the container; a liquid discharge mechanism, It discharges the above-mentioned cleaning liquid in the above-mentioned container; and a reversing mechanism, which inverts the above-mentioned container up and down; a plurality of the above-mentioned cut products are immersed in the above-mentioned cleaning liquid. cleaning. 如請求項1之清洗模組，其復包含：供氣機構，其向上述容器內供給氣體；及排氣機構，其排出上述容器內之上述氣體。 The cleaning module of claim 1 further comprises: a gas supply mechanism, which supplies gas into the container; and an exhaust mechanism, which discharges the gas in the container. 如請求項1或2之清洗模組，其中，上述容器相對於重力方向傾斜地配置。 The cleaning module according to claim 1 or 2, wherein the container is arranged to be inclined with respect to the direction of gravity. 一種清洗模組，其包含：容器，其收納封裝基板被切割而形成之多個切割品；旋轉機構，其使上述容器旋轉；供液機構，其向上述容器內供給清洗液；以及排液機構，其排出上述容器內之上述清洗液； 多個上述切割品在浸漬於上述清洗液之狀態下，在藉由上述旋轉機構旋轉之上述容器內被清洗；其中，上述容器包含：內容器，其至少在底壁形成有上述切割品不能通過之大小之貫通孔；以及外容器，其配置在上述內容器之外側，在上述內容器與上述外容器之間形成有劃分壁，供給至上述內容器之上述清洗液藉由上述貫通孔而存在於上述內容器及上述劃分壁之內側，上述清洗模組復包含排出機構，上述排出機構將上述清洗液中之越過上述劃分壁之頂部的上述清洗液自上述外容器排出。 A cleaning module, comprising: a container for accommodating a plurality of cut products formed by cutting a package substrate; a rotation mechanism for rotating the container; a liquid supply mechanism for supplying cleaning liquid into the container; and a liquid discharge mechanism , which discharges the above-mentioned cleaning solution in the above-mentioned container; A plurality of the above-mentioned cut products are cleaned in the above-mentioned container rotated by the above-mentioned rotating mechanism while being immersed in the above-mentioned cleaning liquid; wherein, the above-mentioned container includes: an inner container having at least a bottom wall formed in which the above-mentioned cut products cannot pass through. a through hole of the same size; and an outer container arranged outside the inner container, a partition wall is formed between the inner container and the outer container, and the cleaning liquid supplied to the inner container exists through the through hole Inside the inner container and the dividing wall, the cleaning module further includes a discharge mechanism, and the discharge mechanism discharges the cleaning liquid that has passed the top of the dividing wall in the cleaning liquid from the outer container. 一種清洗模組，其包含：容器，其收納封裝基板被切割而形成之多個切割品；旋轉機構，其使上述容器旋轉；供液機構，其向上述容器內供給清洗液；以及排液機構，其排出上述容器內之上述清洗液；多個上述切割品在浸漬於上述清洗液之狀態下，在藉由上述旋轉機構旋轉之上述容器內被清洗；其中，上述容器之底壁之內表面由傾斜面形成，上述傾斜面以愈接近上述旋轉機構之旋轉軸則愈往重力方向的方式傾斜。 A cleaning module, comprising: a container for accommodating a plurality of cut products formed by cutting a package substrate; a rotation mechanism for rotating the container; a liquid supply mechanism for supplying cleaning liquid into the container; and a liquid discharge mechanism , which discharges the above-mentioned cleaning liquid in the above-mentioned container; a plurality of the above-mentioned cutting products are cleaned in the above-mentioned container rotated by the above-mentioned rotating mechanism under the state of being immersed in the above-mentioned cleaning liquid; wherein, the inner surface of the bottom wall of the above-mentioned container is The said inclined surface is formed by the inclined surface, and the said inclined surface is inclined so that the direction of gravity may become closer as it approaches the rotation axis of the said rotation mechanism. 一種切割裝置，其包含：如請求項1至5中任一項之清洗模組；切割機構，其切割上述封裝基板；以及輸送機構，其將由上述切割機構切割而形成之多個上述切割品輸送 至上述容器。 A cutting device, comprising: a cleaning module according to any one of claims 1 to 5; a cutting mechanism for cutting the package substrate; and a conveying mechanism for transporting a plurality of the cut products formed by cutting the cutting mechanism to the above container. 如請求項6之切割裝置，其中，上述輸送機構利用吸嘴抽吸多個上述切割品並輸送至上述容器。 The cutting device according to claim 6, wherein the conveying mechanism sucks a plurality of the cut products using a suction nozzle and conveys them to the container. 一種切割裝置，其包含：清洗模組，其包含：收納封裝基板被切割而形成之多個切割品之容器、使上述容器旋轉之旋轉機構、向上述容器內供給清洗液之供液機構、以及排出上述容器內之上述清洗液之排液機構，且多個上述切割品係在浸漬於上述清洗液之狀態下，在藉由上述旋轉機構旋轉之上述容器內被清洗；切割機構，其切割上述封裝基板；以及輸送機構，其將由上述切割機構切割而形成之多個上述切割品輸送至上述容器；其中，上述輸送機構藉由液流將多個上述切割品輸送至上述容器。 A dicing device comprising: a cleaning module including: a container for accommodating a plurality of cut products formed by cutting a package substrate, a rotation mechanism for rotating the container, a liquid supply mechanism for supplying a cleaning liquid into the container, and A liquid discharge mechanism for discharging the cleaning liquid in the container, and a plurality of the cutting products are cleaned in the container rotated by the rotating mechanism while being immersed in the cleaning liquid; a cutting mechanism for cutting the above A package substrate; and a conveying mechanism for conveying a plurality of the cut products formed by the cutting mechanism to the container; wherein the conveying mechanism conveys the plurality of the cut products to the container by a liquid flow. 一種切割裝置，其包含：清洗模組，其包含：收納封裝基板被切割而形成之多個切割品之容器、使上述容器旋轉之旋轉機構、向上述容器內供給清洗液之供液機構、以及排出上述容器內之上述清洗液之排液機構，且多個上述切割品係在浸漬於上述清洗液之狀態下，在藉由上述旋轉機構旋轉之上述容器內被清洗；切割機構，其切割上述封裝基板；以及 輸送機構，其將由上述切割機構切割而形成之多個上述切割品輸送至上述容器；其中，上述輸送機構包含收納多個上述切割品之收納部，將收納有多個上述切割品之上述收納部輸送至上述容器的附近，自上述收納部向上述容器轉移多個上述切割品。 A dicing device comprising: a cleaning module including: a container for accommodating a plurality of cut products formed by cutting a package substrate, a rotation mechanism for rotating the container, a liquid supply mechanism for supplying a cleaning liquid into the container, and A liquid discharge mechanism for discharging the cleaning liquid in the container, and a plurality of the cutting products are cleaned in the container rotated by the rotating mechanism while being immersed in the cleaning liquid; a cutting mechanism for cutting the above package substrate; and A conveying mechanism for conveying a plurality of the cut products formed by cutting by the cutting mechanism to the container; wherein the conveying mechanism includes a storage portion for accommodating a plurality of the cut products, and the storage portion for storing a plurality of the cut products It conveys to the vicinity of the said container, and transfers a plurality of said cut products from the said storage part to the said container. 一種切割品之製造方法，其包含：切割工序，其切割封裝基板而形成多個切割品；收納工序，其將多個上述切割品收納在容器中；清洗工序，其向上述容器內供給清洗液，使上述容器旋轉來清洗多個上述切割品；以及取出工序，其使上述容器上下反轉，取出多個上述切割品。 A method for manufacturing a diced product, comprising: a dicing step of dicing a package substrate to form a plurality of diced products; a storage step of accommodating a plurality of the diced products in a container; and a cleaning step of supplying a cleaning solution into the container , rotating the container to wash a plurality of the cut products; and a take-out step of inverting the container up and down to take out a plurality of the cut products. 如請求項10之切割品之製造方法，其復包含：乾燥工序，其在藉由上述清洗工序清洗了多個上述切割品之後，排出上述清洗液，向上述容器內供給氣體以使上述容器旋轉的同時使多個上述切割品乾燥。 The method for producing a cut product according to claim 10, further comprising: a drying step of discharging the cleaning liquid after cleaning the plurality of cut products by the cleaning step, and supplying gas into the container to rotate the container At the same time, a plurality of the above-mentioned cut products are dried. 如請求項10或11之切割品之製造方法，其中，在上述切割工序之後且在上述清洗工序之前復包含將多個上述切割品輸送至上述容器之輸送工序，上述輸送工序利用吸嘴抽吸多個上述切割品並輸送至上述容器。 The method for producing a cut product according to claim 10 or 11, wherein after the cutting process and before the cleaning process, a conveying process of conveying a plurality of the cut products to the container is further included, and the conveying process is suctioned by a suction nozzle A plurality of the above-mentioned cut products are transported to the above-mentioned container. 如請求項10或11之切割品之製造方法，其中，在上述切割工序之後且在上述清洗工序之前復包含將多個上述切割品輸送至上述容器之輸送工序，上述輸送工序藉由液流將多個上述切割品輸送至上述容器。 The method for producing a cut product according to claim 10 or 11, wherein after the cutting process and before the cleaning process, a conveying process of conveying a plurality of the cut products to the container is further included, and the conveying process transports the cut products by liquid flow. A plurality of the above-mentioned cut products are conveyed to the above-mentioned container. 如請求項10或11之切割品之製造方法，其中，在上述切割工序之後且在上述清洗工序之前復包含將多個上述切割品輸送至上述容器之輸送工序，上述輸送工序將多個上述切割品收納於收納部，將上述收納部輸送至上述容器的附近之後，自上述收納部向上述容器轉移多個上述切割品。 The method for producing a cut product according to claim 10 or 11, wherein a conveying process of conveying a plurality of the cut products to the container is further included after the cutting process and before the cleaning process, and the conveying process transfers a plurality of the cut products A product is accommodated in a accommodating part, and after the said accommodating part is conveyed to the vicinity of the said container, a plurality of said cut products are transferred from the said accommodating part to the said container.
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Families Citing this family (1)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209342A (en) * 1978-07-03 1980-06-24 Sperry Corporation Dynamic cleaning method and apparatus for removal of remnant material
JPH058228A (en) * 1991-04-30 1993-01-19 Panatsuku Kogyo Kk Chip washing device
US20020134408A1 (en) * 2001-03-22 2002-09-26 Christison Pamela L. Integrated circuit assembly cleaning apparatus and method
JP2004207424A (en) * 2002-12-25 2004-07-22 Towa Corp Cutting-off method and equipment of substrate
JP2008135467A (en) * 2006-11-27 2008-06-12 Towa Corp Apparatus and method for manufacturing electronic component
JP2017084893A (en) * 2015-10-26 2017-05-18 株式会社ディスコ Dividing device
CN107243477A (en) * 2017-05-26 2017-10-13 深圳市科伟达超声波设备有限公司 A kind of Cleaning of Parts system and cleaning method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2895328B2 (en) * 1992-10-13 1999-05-24 ローム株式会社 Semiconductor device manufacturing method
JP2520850B2 (en) * 1993-11-01 1996-07-31 株式会社廣瀬脱水機製作所 Overturning centrifugal washing and drying equipment
JPH08238464A (en) * 1995-03-03 1996-09-17 Ricoh Elemex Corp Rotating basket and cleaning and/or drying apparatus provided with the basket
JP3761361B2 (en) * 1999-01-12 2006-03-29 富士通株式会社 Cleaning device and cleaning method
JP3749095B2 (en) * 2000-08-08 2006-02-22 Ｔｄｋ株式会社 Chip type electronic component separation cleaning and drying equipment
CN105278048B (en) 2014-07-25 2017-05-24 鸿富锦精密工业（深圳）有限公司 Optical fiber connector assembling jig
JP6762651B2 (en) * 2016-02-22 2020-09-30 株式会社ディスコ Processing method
JP7018323B2 (en) 2018-01-22 2022-02-10 Ｔｏｗａ株式会社 Processing equipment and product manufacturing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209342A (en) * 1978-07-03 1980-06-24 Sperry Corporation Dynamic cleaning method and apparatus for removal of remnant material
JPH058228A (en) * 1991-04-30 1993-01-19 Panatsuku Kogyo Kk Chip washing device
US20020134408A1 (en) * 2001-03-22 2002-09-26 Christison Pamela L. Integrated circuit assembly cleaning apparatus and method
JP2004207424A (en) * 2002-12-25 2004-07-22 Towa Corp Cutting-off method and equipment of substrate
JP2008135467A (en) * 2006-11-27 2008-06-12 Towa Corp Apparatus and method for manufacturing electronic component
JP2017084893A (en) * 2015-10-26 2017-05-18 株式会社ディスコ Dividing device
CN107243477A (en) * 2017-05-26 2017-10-13 深圳市科伟达超声波设备有限公司 A kind of Cleaning of Parts system and cleaning method

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