CN218039121U

CN218039121U - Substrate post-processing device

Info

Publication number: CN218039121U
Application number: CN202222910292.5U
Authority: CN
Inventors: 韩晓铠; 刘远航; 马旭
Original assignee: Huahaiqingke Co Ltd
Current assignee: Huahaiqingke Co Ltd
Priority date: 2022-11-02
Filing date: 2022-11-02
Publication date: 2022-12-13
Anticipated expiration: 2032-11-02

Abstract

The utility model discloses a base plate aftertreatment device, it includes: a chuck for vacuum-adsorbing a substrate to be processed; the connecting seat is arranged at the lower part of the sucker and is connected with an output shaft of the driving motor so as to drive the sucker and the substrate thereon to rotate; a post-treatment module disposed on an upper side of the suction cup to spray a cleaning solution toward a surface of the substrate; the cleaning assembly is arranged on the upper side of the sucker and comprises a cleaning seat, a cleaning brush is arranged on the lower portion of the cleaning seat, the cleaning seat further comprises a suction hole channel, and the suction hole channel surrounds the cleaning brush so as to remove particles on the surface of the sucker to the outer side of the sucker.

Description

Substrate post-processing device

Technical Field

The utility model belongs to the technical field of the base plate grinding, particularly, relate to a base plate aftertreatment device.

Background

In the semiconductor field, a substrate is thinned to a predetermined thickness by grinding the back surface of the substrate by a grinding processing apparatus before being divided into semiconductor chips; and the opposite side of the substrate is provided with electronic devices.

After the substrate is ground, a large amount of particles can be remained on the surface of the substrate, the surface of the sucking disc needs to be cleaned by means of the substrate post-processing device, and the sucking disc surface accumulation of the particles in the substrate post-processing device is avoided.

In a conventional substrate post-processing apparatus, a surface of a chuck is cleaned by a substrate post-processing module. Because the sucking disc is porous ceramic, its inside is very easily remained tiny particulate matter, and the base plate aftertreatment module can't carry out effective cleanness to the sucking disc surface, causes partial particulate matter to remain in the sucking disc surface. These remaining fine particles may affect the flatness of the chuck surface, reduce the processing quality of the substrate surface, and even cause stress concentration and substrate breakage.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a base plate aftertreatment device aims at solving one of the technical problem that exists among the prior art at least.

An embodiment of the utility model provides a base plate aftertreatment device, include:

a chuck for vacuum-adsorbing a substrate to be processed;

the connecting seat is arranged at the lower part of the sucker and is connected with an output shaft of the driving motor so as to drive the sucker and the substrate thereon to rotate;

a post-treatment module disposed at an upper side of the suction cup to spray a cleaning solution toward a surface of the substrate;

the cleaning assembly is arranged on the upper side of the sucker and comprises a cleaning seat, a cleaning brush is arranged on the lower portion of the cleaning seat, and the cleaning seat further comprises a suction hole channel which surrounds the cleaning brush so as to remove particles on the surface of the sucker to the outer side of the sucker.

In one embodiment, the cleaning assembly further comprises a swing arm and a rotary motor; one end of the swing arm is rotatably connected to the outer side of the sucker, and the other end of the swing arm is connected with the cleaning seat; and the output shaft of the rotating motor is connected with the cleaning brush to drive the cleaning brush to rotate around the central axis.

In one embodiment, the cleaning seat is a disc-shaped structure, and a first groove is arranged at the lower part of the cleaning seat and used for installing the cleaning brush.

In one embodiment, the upper portion of the cleaning seat is provided with a second groove, and the suction duct is provided to extend downward through a bottom surface of the second groove.

In one embodiment, the upper part of the cleaning seat is provided with a cover plate, and the cover plate and the second groove form a chamber communicated with the suction duct; the cover plate is provided with a vent hole communicated with the cavity, and the vent hole is connected with an external vacuum source.

In one embodiment, the suction duct is a circular hole which is provided in a vertical direction through a thickness direction of the cleaning holder.

In one embodiment, the number of the suction openings is a plurality, and the suction openings are uniformly distributed on the basis of the central axis of the cleaning seat.

In one embodiment, the suction duct is inclined in the thickness direction of the cleaning seat, and the inclination direction of the suction duct matches with the rotation direction of the suction cup.

In one embodiment, the inclined direction of the suction hole channel is consistent with the centrifugal direction of the particles on the surface of the sucker.

In one embodiment, the inner side wall of the suction duct is provided with a protective layer made of polytetrafluoroethylene.

The beneficial effects of the utility model include:

a. the cleaning assembly is provided with a plurality of suction ducts which are arranged towards the lower side and connected with an external vacuum source, so that particles on the surface of the sucker can be quickly removed;

b. the inner side wall of the suction hole channel is provided with the protective layer to prevent particles from attaching, so that the smoothness of the suction hole channel is ensured, and the using effect of the cleaning component is improved;

c. the suction pore slope of clean seat sets up, and the incline direction in suction pore is unanimous with the centrifugal direction of sucking disc surface particulate matter, and the particulate matter can get into suction pore fast, strengthens clean subassembly's clean ability.

Drawings

The advantages of the invention will become clearer and more easily understood from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:

fig. 1 is a schematic view of a substrate thinning apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view of a substrate post-processing apparatus according to an embodiment of the present invention;

fig. 3 is a schematic view of a cleaning assembly according to an embodiment of the present invention;

fig. 4 is a schematic view of a cleaning base according to an embodiment of the present invention;

FIG. 5 is a bottom view of the cleaning base shown in FIG. 4;

FIG. 6 is a top view of a cleaning assembly disposed on the upper side of the suction cup in accordance with an embodiment of the present invention;

FIG. 7 is a schematic view of the cleaning seat of the present invention;

fig. 8 is a cross-sectional view of a cleaning base according to an embodiment of the present invention;

fig. 9 is a partial enlarged view at a in fig. 8.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are provided to illustrate the concepts of the present invention; the description is intended to be illustrative and exemplary in nature, and is not to be construed as limiting the embodiments of the invention or the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.

The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of the respective portions and the mutual relationships thereof. It is to be understood that in order to facilitate a clear description of the structure of the various elements of the embodiments of the invention, the figures are not to scale and that like reference numerals are used to indicate like parts in the figures.

In the present invention, the Substrate (Substrate) is also called Wafer (W), and its meaning and actual function are equivalent.

Fig. 1 is a schematic diagram of a substrate thinning apparatus provided by an embodiment of the present invention, the substrate thinning apparatus includes an apparatus front-end module 1, a grinding module 3 for grinding a substrate, and a polishing module 2 for performing chemical mechanical polishing on the substrate after finishing grinding.

The equipment front end module 1 is arranged on one side of the front end of the substrate thinning equipment, is a transition module for conveying a substrate from the outside to the inside of an equipment machine table, and is used for realizing the entrance and exit of the substrate. The apparatus front end module 1 includes a substrate storage unit 11 and a first transfer unit 12.

The substrate storage unit 11 includes a plurality of Front Opening Unified Pod (FOUP), and specifically, the Front Opening FOUP may be two, three, or the like. The front opening substrate transport box is a container for protecting, transporting and storing substrates in a semiconductor process. The first transfer unit 12 includes a pick-and-place manipulator and a first transfer rail, not shown, which is disposed along the width direction of the device front end module 1, and a base of the pick-and-place manipulator is mounted on the first transfer rail, and the base can slide on the first transfer rail to realize movement between different positions.

The grinding module 3 is disposed at an end of the substrate thinning apparatus for performing grinding, such as rough grinding and/or fine grinding, of the substrate. The grinding module 3 includes a grinding unit 31, a fourth transfer unit 32, and a cleaning unit 33.

The polishing module 2 is arranged between the equipment front-end module 1 and the grinding module 3. The polishing module 2 includes a second transmission unit 21, a third transmission unit 22, and a chemical mechanical polishing unit 23. In fig. 1, the fourth transfer unit 32 is provided with a simple robot for substrate transfer between the grinding module 3 and the second transfer unit 21.

And a substrate post-processing apparatus 100 disposed between the front-end module 1 and the chemical mechanical polishing unit 23 to perform cleaning and/or drying processing on the substrate, thereby obtaining a substrate with satisfactory surface cleanliness.

The following outlines the work flow of the substrate thinning apparatus shown in fig. 1, and includes:

first, the pick-and-place manipulator of the first transfer unit 12 picks up the substrate from the substrate transfer cassette of the substrate storage unit 11, and transfers the substrate to the fixed buffer of the second transfer unit 21 by the pick-and-place manipulator;

then, the dry manipulator of the third transfer unit 22 transports the substrate placed in the fixed buffer to the mobile buffer, and at this time, the mobile buffer is close to the fixed buffer;

then, the movable buffer part carries the substrate to move close to the grinding module 3 (as shown by a dotted line in fig. 1);

then, the simple manipulator of the fourth transmission unit 32 conveys the substrate placed in the moving buffer part to the worktable of the grinding unit 31, so that the substrate is fixed on the ceramic chuck corresponding to the current loading and unloading station;

then, the circular workbench rotates forwards by 120 degrees, and the substrate moves to a rough grinding station for rough grinding; after the rough grinding is finished, the workbench rotates forwards by 120 degrees, and the substrate moves to a finish grinding station for finish grinding; after finish grinding is finished, the workbench rotates in the reverse direction for 240 degrees, and the substrate moves to a loading and unloading station;

the ground substrate is taken down by the simple manipulator and placed to the mobile buffer part after being cleaned by the cleaning unit 33 at the loading and unloading station; the moving buffer part moves to the other end of the second transfer unit 21 so that the wet robot of the third transfer unit 22 takes the substrate off and places it on a deposit part (load cup) of the chemical mechanical polishing unit;

the substrate is polished in the chemical mechanical polishing unit 23; after the chemical mechanical polishing, the substrate is taken out from the loading cup by the wet robot of the third transfer unit 22 and then is carried into the substrate post-processing apparatus 100; the substrate post-processing apparatus 100 may clean and dry the substrate, and after the substrate is cleaned and dried, the pick-and-place robot of the first transfer unit 12 takes the clean substrate out of the substrate post-processing apparatus 100 and puts the clean substrate into the substrate transport box for storage.

Fig. 2 is a schematic view of a substrate post-processing apparatus 100 according to an embodiment of the present invention, in which the substrate post-processing apparatus 100 includes:

a chuck 10 for vacuum-adsorbing a substrate to be processed;

the connecting base 20 is arranged at the lower part of the sucking disc 10, and the connecting base 20 is connected with an output shaft of the driving motor 30 so as to drive the sucking disc 10 and a substrate thereon to rotate; specifically, the driving motor 30 is fixed to the connecting base 20 through a coupling, so as to transmit the rotation motion of the driving motor 30 to the suction cup 10, and further drive the suction cup 10 and the substrate thereon to rotate;

and a post-treatment module 40 disposed on the upper side of the chuck 10 to spray a cleaning solution toward the surface of the substrate to complete the surface cleaning of the substrate. It is understood that the post-treatment module 40 may also spray a fluid, such as IPA vapor, toward the substrate surface to peel off a water film from the substrate surface to dry the substrate surface.

It should be noted that the above-mentioned suction cup 10, the connection base 20, the driving motor 30 and the post-processing module 40 are required to be disposed in a relatively closed box (not shown in fig. 2) to prevent external particles from entering the inside of the box and interfering with the post-processing effect of the substrate. In the embodiment shown in fig. 2, the chuck 10 is generally a ceramic chuck made of a porous material, and a vacuum line, not shown, is provided at a lower portion of the chuck 10 to fix a substrate to be processed to a surface of the chuck 10 by vacuum suction.

In the substrate post-processing apparatus 100, a small amount of fine particles may remain on the surface of the chuck 10 during use, which may affect the flatness of the surface of the chuck 10 and even cause the substrate to be broken.

In order to solve the above technical problem, the substrate post-processing apparatus 100 shown in fig. 2 further includes a cleaning assembly 50 disposed on the upper side of the suction cup 10 to clean the surface of the suction cup 10, so as to clean particles on the surface of the suction cup 10.

Fig. 3 is a schematic structural diagram of a cleaning assembly 50 according to an embodiment of the present invention, wherein the cleaning assembly 50 includes a swing arm 51 and a cleaning base 52. The one end of swing arm 51 is rotated and is set up in the outside of sucking disc 10, and the other end of swing arm 51 is connected with clean seat 52 to, clean seat 52 sets up in the below of swing arm 51, with the surperficial particulate matter of clearance sucking disc 10.

Further, the lower portion of the cleaning seat 52 is provided with a cleaning brush 53, the cleaning brush 53 is disposed toward the surface of the suction cup 10, and the lower portion of the cleaning brush 53 is provided with certain elastic bristles to brush up the particles on the surface of the suction cup 10, so that the particles are separated from the surface of the suction cup 10.

During the cleaning group, the suction cup 10 is rotated about an axis by the drive motor 30. The particles are unevenly distributed on the surface of the suction cup 10 due to the rotation of the suction cup 10, and are more concentrated at the edge of the suction cup 10, and the cleaning assembly 50 moves along the edge of the suction cup 10 to suck out the particles scraped off. The cleaning assembly 50 oscillates about a fixed point and the cleaning assembly 50 moves across the surface of the suction cup 10 to suck out the brushed particles.

In fig. 3, the cleaning assembly 50 further includes a rotating motor 54, the rotating motor 54 is disposed above the swing arm 51, and an output shaft of the rotating motor 54 is connected to the cleaning brush 53 to drive the cleaning brush 53 to rotate around a central axis thereof, so as to clean the surface of the suction cup 10.

In the embodiment shown in fig. 3, the cleaning seat 52 includes a suction duct 52a, and the suction duct 52a is disposed around the cleaning brush 53 to remove the particles on the surface of the suction cup 10 to the outside of the suction cup 10. Specifically, the suction duct 52a is connected to an external vacuum source, and when the bottom surface of the cleaning assembly 50 abuts against the surface of the suction cup 10, the particles brushed off by the cleaning brush 53 and detached from the surface of the suction cup 10 can be transmitted to the outside of the suction cup 10 through the suction duct 52a, so as to enhance the capability of rapidly removing the particles from the surface of the suction cup 10 and improve the cleaning effect of the surface of the suction cup 10.

Fig. 4 is a schematic structural diagram of a cleaning seat 52 according to an embodiment of the present invention, in which the cleaning seat 52 is a disk-shaped structure, and a first groove 52b is formed at a lower portion of the cleaning seat.

In fig. 4, the first recess 52b is a circular hole for mounting the cleaning brush 53. It can be understood that the shape and size of the cleaning brush 53 match with those of the first groove 52b, and a gap is provided between the outer side wall of the cleaning brush 53 and the inner side wall of the first groove 52b, so that the rotating motor 54 drives the cleaning brush 53 to rotate smoothly without interfering with the inner side wall of the cleaning base 52.

In fig. 4, a second recess 52c is formed in an upper portion of the cleaning base 52, the second recess 52c is an annular hole, and the suction duct 52a extends downward and through a bottom surface of the second recess 52 c. A boss 56 is provided at a middle position of the cleaning holder 52, a through hole is provided at a middle position of the boss 56, and an output shaft of the rotary motor 54 is connected to the cleaning brush 53 in the first groove 52b via the through hole of the boss 56.

In the embodiment shown in fig. 4, the upper portion of the cleaning seat 52 is provided with a cover plate 55, and the cover plate 55 and the second recess 52C form a chamber C that communicates with the suction duct 52 a. The lid plate 55 is provided with a vent hole 55a communicating with the chamber C, and the vent hole 55a is connected to an external vacuum source. The particles on the surface of the suction cup 10 can enter the chamber C through the suction hole 52a and then be transported to the outside of the suction cup 10 through the vent hole 55 a.

In the embodiment shown in fig. 3, the front end of the swing arm 51 is provided with a swing arm passage 51a connected to an external vacuum source, and the swing arm passage 51a communicates with a vent hole 55a shown in fig. 4, so that the external vacuum source communicates with the chamber C and the suction passage 52a to suck the particles on the surface of the suction cup 10.

As an embodiment of the present invention, the suction hole 52a may be a circular hole which is formed in a thickness direction vertically penetrating the cleaning base 52, as shown in fig. 4.

Fig. 5 is a bottom view of the cleaning holder 52 shown in fig. 4, and the number of the suction holes 52a is plural and is uniformly distributed based on the central axis of the cleaning holder 52 to ensure uniformity of cleaning of the cleaning assembly 50 for the particulate matter.

It will be appreciated that the transverse cross-section of the suction port channel 52a may have other shapes, such as oval, kidney-shaped, etc., to avoid the corners of the suction port channel 52a and prevent particles from adhering to the inner side walls of the suction port channel 52a and causing the suction port channel 52a to become clogged.

Fig. 6 is a plan view of the cleaning assembly 50 disposed on the upper side of the suction cup 10, one end of the swing arm 51 is disposed on the outer side of the suction cup 10, and the cleaning seat 52 on the other end thereof is disposed above the suction cup 10. The swing arm 51 swings the cleaning base 52 around a rotation point, and a cleaning brush 53 (shown in fig. 3) at the lower part of the cleaning base 52 brushes off particles on the surface of the suction cup 10. The suction tunnel 52a, which is in communication with an external vacuum source, removes particulate matter from the surface of the suction cup 10 to ensure cleanliness of the surface of the suction cup 10.

Fig. 7 is a schematic structural view of the cleaning base 52 of the present invention, and in order to clearly show the position and structure of the suction duct 52a, the cover plate 55 disposed on the upper portion of the cleaning base 52 is especially removed. In this embodiment, the suction duct 52a is provided obliquely in the thickness direction of the cleaning seat 52.

In fig. 7, the suction passage 52a is indicated by a dotted line, and the inclination direction of the suction passage 52a matches the rotation direction of the suction cup 10. Specifically, the inclined direction of the suction passage 52a is consistent with the centrifugal direction of the particles on the surface of the suction cup 10, so that the particles on the surface of the suction cup 10 enter the chamber C through the inclined suction passage 52a and are then conveyed to the outside of the suction cup 10 through a pipeline. In one aspect of this embodiment, the inclined suction port 52a is at an angle of 40-80 ° to the lower end surface of the cleaning base 52, and preferably the inclined suction port 52a is at an angle of 60 ° to the lower end surface of the cleaning base 52.

Fig. 8 is a sectional view of a cleaning base 52 according to an embodiment of the present invention, and fig. 9 is a partially enlarged view of a portion a in fig. 8. In this embodiment, the inner side wall of the suction hole passage 52a is provided with the protective layer 52d shown in fig. 9, and the protective layer 52d can effectively prevent the particles from adhering to the inner side wall of the suction hole passage 52a, and prevent the suction hole passage 52a from being blocked.

In some embodiments, the protective layer 52d is made of a hydrophobic or superhydrophobic material; preferably, the protective layer 52d is made of polytetrafluoroethylene.

Since the cleaning base 52 needs to directly abut against the surface of the suction cup 10, the cleaning base 52 can be made of non-metallic material with good wear resistance, such as polyphenylene sulfide (PPS) and Polyetheretherketone (PEEK), so as to ensure the service life of the cleaning base 52.

It should be noted that, the substrate post-processing device 100 provided by the present invention uses the vacuum ceramic chuck to fix the substrate, compared with the existing solution of clamping the wafer by the clamping jaws to perform post-processing, the substrate post-processing device of the present invention has the advantages of high stability and low cost; in addition, since the thinned surface of the substrate faces upward and the unprocessed surface is disposed toward the top surface of the ceramic chuck, the substrate post-processing apparatus 100 can clean only the thinned surface of the wafer. That is, the utility model provides a base plate post processing apparatus 100 can be applicable to the not high operating mode of cleanliness factor requirement of base plate unprocessed side. In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A substrate post-processing apparatus, comprising:

a chuck for vacuum-adsorbing a substrate to be processed;

the cleaning assembly is arranged on the upper side of the sucker and comprises a cleaning seat, a cleaning brush is arranged on the lower portion of the cleaning seat, the cleaning seat further comprises a suction hole channel, and the suction hole channel surrounds the cleaning brush so as to remove particles on the surface of the sucker to the outer side of the sucker.

2. The substrate post-processing apparatus of claim 1, wherein the cleaning assembly further comprises a swing arm and a rotary motor; one end of the swing arm is rotatably connected to the outer side of the sucker, and the other end of the swing arm is connected with the cleaning seat; and an output shaft of the rotating motor is connected with the cleaning brush to drive the cleaning brush to rotate around the central axis.

3. The substrate post-processing apparatus according to claim 1, wherein the cleaning base has a disk-shaped structure, and a first recess is formed at a lower portion thereof for receiving the cleaning brush.

4. The substrate post-processing apparatus according to claim 3, wherein the cleaning holder is provided at an upper portion thereof with a second groove, and the suction hole passage is provided to extend downward through a bottom surface of the second groove.

5. The substrate post-processing apparatus according to claim 4, wherein a cover plate is provided at an upper portion of the cleaning holder, the cover plate and the second groove forming a chamber communicating with the suction port; the cover plate is provided with a vent hole communicated with the cavity, and the vent hole is connected with an external vacuum source.

6. The substrate post-processing apparatus according to claim 4, wherein the suction hole passage is a circular hole which is vertically disposed through a thickness direction of the cleaning holder.

7. The substrate post-processing apparatus according to claim 4, wherein the number of the suction ports is plural and is uniformly distributed with reference to a central axis of the cleaning holder.

8. The substrate post-processing apparatus according to claim 4, wherein the suction hole is provided obliquely in a thickness direction of the cleaning holder, and an oblique direction of the suction hole matches a rotation direction of the suction cup.

9. The substrate post-processing apparatus according to claim 8, wherein the suction port has an inclined direction corresponding to a centrifugal direction of particles on the surface of the chuck.

10. The substrate post-processing apparatus of claim 1, wherein an inner sidewall of the suction port is provided with a protective layer made of polytetrafluoroethylene.