CN213635912U - Substrate grinding system - Google Patents
Substrate grinding system Download PDFInfo
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- CN213635912U CN213635912U CN202022577291.4U CN202022577291U CN213635912U CN 213635912 U CN213635912 U CN 213635912U CN 202022577291 U CN202022577291 U CN 202022577291U CN 213635912 U CN213635912 U CN 213635912U
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Abstract
The present disclosure relates to a substrate grinding system. Provided is a technology which can mount a plurality of cleaning devices in a region with high cleanliness and can restrain the increase of the installation area caused by the increase of the mounting number. The substrate grinding system includes a carry-in and carry-out section, a cleaning section, and a grinding section. The loading/unloading unit includes a mounting table, a1 st conveyance area, and a1 st conveyance device. The cleaning part comprises a1 st cleaning device, a2 nd conveying area and a2 nd conveying device. The substrate grinding system includes a3 rd conveying area and a3 rd conveying device. The 3 rd conveying area is arranged between the cleaning part and the grinding part. The 3 rd conveying device is arranged in the 3 rd conveying area and conveys the substrate relative to the cleaning part and the grinding part. The 3 rd conveying area is disposed adjacent to the 1 st cleaning device and the 2 nd conveying area, and the 3 rd conveying area is disposed on the opposite side of the 2 nd cleaning device with respect to the 2 nd conveying area. The cleaning portion and the grinding portion are separated by a partition wall.
Description
Technical area
The present disclosure relates to a substrate grinding system.
Background
The processing apparatus described in patent document 1 includes a1 st conveyance unit, a position adjustment mechanism, a2 nd conveyance unit, a turntable, a chuck table, a processing unit, and a cleaning mechanism. The 1 st transport unit transports the substrate from the cassette to the position adjustment mechanism. The position adjusting mechanism adjusts the position of the substrate. The 2 nd transfer unit transfers the substrate from the position adjustment mechanism to the chuck table on the turntable. When the chuck table holds the substrate by suction, the turntable rotates, and the substrate is disposed below the processing unit. The processing unit grinds the substrate using a grinding wheel. The 2 nd conveying unit sucks and holds the ground substrate, rotates the substrate, and conveys the ground substrate to the cleaning mechanism. The cleaning mechanism cleans the ground substrate. The 1 st transport unit transports the cleaned substrate from the cleaning mechanism to the cassette.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2019-185645
SUMMERY OF THE UTILITY MODEL
Problem to be solved by utility model
An aspect of the present disclosure provides a technique capable of mounting a plurality of cleaning devices in a region with high cleanliness and suppressing an increase in installation area due to an increase in the number of the devices mounted.
Means for solving the problems
The substrate grinding system according to a first aspect of the present disclosure includes a carry-in and carry-out section, a cleaning section, and a grinding section. The loading/unloading unit includes a mounting table on which a cassette for housing a substrate is mounted, a1 st conveyance area disposed adjacent to the mounting table, and a1 st conveyance device provided in the 1 st conveyance area and configured to load and unload the substrate into and from the cassette. The cleaning unit includes a1 st cleaning device for cleaning the substrate, a2 nd transport region disposed between the 1 st cleaning device and the 2 nd cleaning device, and a2 nd transport device provided in the 2 nd transport region and transporting the substrate to the 1 st cleaning device and the 2 nd cleaning device. The grinding section has a grinding device for grinding the substrate. The substrate grinding system includes a3 rd conveying area and a3 rd conveying device. The 3 rd conveying area is disposed between the cleaning section and the grinding section. The 3 rd conveying device is disposed in the 3 rd conveying area and conveys the substrate with respect to the cleaning part and the grinding part. The 3 rd conveying area is disposed adjacent to the 1 st cleaning device and the 2 nd conveying area, and the 3 rd conveying area is disposed on the opposite side of the 2 nd cleaning device with respect to the 2 nd conveying area. The cleaning portion and the grinding portion are separated by a partition wall.
A second technical means of the present disclosure is the substrate grinding system according to the first technical means, wherein the cleaning portion and the 3 rd conveyance area are partitioned by a partition wall, a conveyance port through which the substrate passes is formed in the partition wall that partitions the 1 st cleaning device and the 3 rd conveyance area, and a gate that opens and closes the conveyance port is provided in the conveyance port.
A third aspect of the present disclosure is the substrate grinding system according to the first or second aspect, wherein the cleaning unit includes a detection device that detects a center of the substrate before grinding by the grinding device.
A fourth technical means of the present disclosure is the substrate grinding system according to the third technical means, wherein the detecting device and the 1 st cleaning device are stacked in a vertical direction.
A fifth technical means of the present disclosure is the substrate grinding system according to any one of the first to fourth technical means, wherein the 1 st cleaning device cleans the substrate ground by the grinding device before the substrate is conveyed by the 2 nd conveying device, and the cleaning unit further includes a3 rd cleaning device for cleaning the substrate before the substrate is ground by the grinding device.
A sixth aspect of the present disclosure is the substrate grinding system according to the fifth aspect, wherein the 1 st cleaning device and the 3 rd cleaning device are stacked in a vertical direction.
A seventh technical means of the present disclosure is the substrate grinding system according to any one of the first to sixth technical means, wherein the 2 nd cleaning device includes a nozzle that ejects a chemical solution that etches the substrate ground by the grinding device.
An eighth technical means is the substrate grinding system according to any one of the first to seventh technical means, wherein the 1 st cleaning device includes a cleaning body that scrubs the substrate ground by the grinding device.
A ninth technical means of the present disclosure is the substrate grinding system according to any one of the first to eighth technical means, wherein the 3 rd transport means includes a chuck for suction-holding the substrate from above, and the 2 nd transport means includes a transport arm for holding the substrate from below.
Effect of the utility model
By adopting the technical scheme of the disclosure, a plurality of cleaning devices can be carried in a region with higher cleanliness, and the increase of the arrangement area caused by the increase of the carrying quantity can be inhibited.
Drawings
Fig. 1 is a plan view showing a substrate grinding system according to an embodiment.
Fig. 2 is a side view illustrating the substrate grinding system of fig. 1.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and description thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.
As shown in fig. 1, the substrate grinding system 1 includes a feeding and discharging unit 2, a cleaning unit 3, a grinding unit 5, and a control device 9. The feeding and discharging unit 2, the cleaning unit 3, and the grinding unit 5 are arranged in this order from the negative side in the X-axis direction to the positive side in the X-axis direction.
The loading/unloading unit 2 includes a mounting table 21. The mounting table 21 is used for mounting the cartridge C. The cassette C accommodates a plurality of substrates W at intervals in the vertical direction. The substrate W is a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer. A glass substrate may be used instead of the semiconductor substrate. The mounting table 21 includes a plurality of mounting plates 22 arranged in a row in the Y-axis direction. The cartridges C are placed on the plurality of placement plates 22. In addition, the number of the placing plates 22 is not particularly limited. Likewise, the number of cartridges C is also not particularly limited.
The carrying in/out unit 2 has a1 st conveyance area 23 disposed adjacent to the mounting table 21. The 1 st conveyance area 23 is disposed on the X-axis direction positive side of the stage 21. The 1 st conveyance area 23 is disposed on the X-axis direction negative side of a conveyor 35 described later.
The carrying in and out section 2 includes a1 st conveying device 24 provided in the 1 st conveying area 23. The 1 st transport device 24 carries in and out the substrate W with respect to the cassette C. The 1 st transport device 24 includes a1 st transport arm 24a that holds the substrate W. The 1 st transport arm 24a is movable in the horizontal direction (both the X-axis direction and the Y-axis direction) and the vertical direction, and is rotatable about the vertical axis. The 1 st conveyance device 24 conveys the substrate W between the cassette C and the transfer device 35. The number of the 1 st transport arm 24a may be one or more.
The cleaning section 3 has a1 st cleaning device 31 and a2 nd cleaning device 32. The 1 st cleaning device 31 cleans the substrate W. For example, the 1 st cleaning device 31 includes a cleaning body 31a for scrubbing the substrate W ground by the grinding device 51 described later. The cleaning body 31a is a sponge, a brush, or the like, and removes particles such as grinding dust. The cleaning body 31a may be disposed above the substrate W as long as the upper surface of the substrate W after grinding can be scrubbed by the cleaning body 31 a. However, the cleaning bodies 31a may be disposed above and below the substrate W, or may clean both the upper and lower surfaces of the substrate W.
The 2 nd cleaning device 32 also cleans the substrate W. For example, the 2 nd cleaning device 32 includes a nozzle 32a, and the nozzle 32a discharges a chemical solution for etching the substrate W ground by the grinding device 51. The nozzle 32a supplies the chemical solution to the center of the upper surface of the rotating substrate W. The chemical solution is wetted away from the center of the upper surface of the substrate W toward the edge by the centrifugal force. The chemical solution may be a general chemical solution, and may be, for example, a fluoronitric acid solution, an alkaline solution, or the like. The chemical solution etches the ground upper surface of the substrate W to remove the grinding marks.
As shown in fig. 2, the washing section 3 may further have a3 rd washing device 33. The 3 rd cleaning device 33 is different from the 1 st cleaning device 31 and the 2 nd cleaning device 32 in cleaning the substrate W before being ground by the grinding device 51. Since the clean substrate W can be placed on the chuck 51b of the grinding device 51 and the biting of foreign matter and the like can be suppressed, the grinding quality of the substrate W can be improved.
The 3 rd cleaning device 33 includes a cleaning body for scrubbing the substrate W, similarly to the 1 st cleaning device 31. The cleaning body is a sponge or a brush, etc., for removing particles. In order to suppress the biting of foreign matter when the substrate W is placed on the chuck 51b, the cleaning body may be disposed below the substrate W to scrub the lower surface of the substrate W. However, the cleaning bodies may be disposed above and below the substrate W, or may clean both the upper and lower surfaces of the substrate W.
In order to reduce the installation area of the substrate grinding system 1, the 1 st cleaning device 31 and the 3 rd cleaning device 33 may be stacked in the vertical direction. In fig. 2, the 1 st cleaning device 31 is disposed above the 3 rd cleaning device 33, but the arrangement of the 1 st cleaning device 31 and the 3 rd cleaning device 33 may be reversed, and the 1 st cleaning device 31 may be disposed below the 3 rd cleaning device 33.
The washing section 3 may further have a detection device 34. The detection device 34 detects the center of the substrate W before being ground by the grinding device 51. The center of the chuck 51b described later can be aligned with the center of the substrate W in a plan view. The detection device 34 may detect the crystal orientation of the substrate W, in addition to the center of the substrate W, and specifically may detect a notch or an orientation flat indicating the crystal orientation of the substrate W. In a rotation coordinate system rotating together with the chuck 51b, the crystal orientation of the substrate W can be aligned to a desired orientation.
In order to reduce the installation area of the substrate grinding system 1, the 1 st cleaning device 31 and the detection device 34 may be stacked in the vertical direction. In fig. 2, the 1 st washing device 31 is disposed above the detection device 34, but the arrangement of the 1 st washing device 31 and the detection device 34 may be reversed, and the 1 st washing device 31 may be disposed below the detection device 34. In fig. 2, the detection device 34 is disposed below both the 1 st cleaning device 31 and the 3 rd cleaning device 33, but the detection device 34 may be disposed between the 1 st cleaning device 31 and the 3 rd cleaning device 33, or the detection device 34 may be disposed above both the 1 st cleaning device 31 and the 3 rd cleaning device 33.
The cleaning section 3 also has a conveyor 35. The transfer device 35 temporarily stores the substrate W. A plurality of the transfer devices 35 may be stacked in the vertical direction. The arrangement and number of the transfer devices 35 are not particularly limited.
As shown in fig. 1, the cleaning unit 3 has a2 nd conveyance area 36 disposed between the 1 st cleaning device 31 and the 2 nd cleaning device 32. The 2 nd cleaning device 32 is disposed on the Y-axis direction positive side of the 2 nd conveying area 36, and the 1 st cleaning device 31 is disposed on the Y-axis direction negative side of the 2 nd conveying area 36. The transfer device 35 is disposed on the X-axis direction negative side of the 2 nd conveying area 36, and the grinding device 51 is disposed on the X-axis direction positive side of the 2 nd conveying area 36.
The cleaning unit 3 further includes a2 nd conveying device 37 provided in the 2 nd conveying area 36. The 2 nd transfer device 37 transfers the substrate W to the 1 st cleaning device 31 and the 2 nd cleaning device 32. The 2 nd transfer device 37 may transfer the substrate W to the 3 rd cleaning device 33. The 2 nd transport device 37 may transport the substrate W to the detection device 34. The 2 nd transfer device 37 may transfer the substrate W to the transfer device 35.
The 2 nd transfer device 37 includes a2 nd transfer arm 37a that holds the substrate W. The 2 nd transport arm 37a is movable in the horizontal direction (both the X-axis direction and the Y-axis direction) and the vertical direction, and is rotatable about the vertical axis. The 2 nd transfer arm 37a holds the substrate W from below. The substrate W is placed on the 2 nd transfer arm 37 a. The number of the 2 nd transfer arms 37a may be one or more.
The grinding section 5 includes a grinding device 51. The grinding device 51 grinds the substrate W. Grinding includes lapping. The abrasive used for grinding may be either of a fixed abrasive and a free abrasive. The grinding apparatus 51 includes, for example, a rotary table 51a, 4 chucks 51b, and 3 grinding units 51 c.
The turntable 51a holds 4 chucks 51b at equal intervals around a rotation center line Z1, and the turntable 51a rotates around a rotation center line Z1. The 4 chucks 51b rotate together with the rotary table 51a and move to the feed/discharge position a0, the 1 st grinding position a1, the 2 nd grinding position a2, the 3 rd grinding position A3, and the feed/discharge position a0 in this order.
The carry-in/out position a0 serves as both a carry-in position for carrying in the substrate W and a carry-out position for carrying out the substrate W. In the present embodiment, the carrying-in position and the carrying-out position are the same position, but the carrying-in position and the carrying-out position may be different positions. The 1-time grinding position a1 is a position where 1-time grinding is performed. The 2-time grinding position a2 is a position where 2-time grinding is performed. The 3-time grinding position a3 is a position where 3 times grinding is performed.
The 4 chucks 51b are rotatably attached to the rotary table 51a around respective rotation center lines. The chuck 51b rotates about the respective rotation center lines at the 1 st grinding position a1, the 2 nd grinding position a2, and the 3 rd grinding position A3.
One grinding unit 51c performs 1-time grinding of the substrate W at the 1-time grinding position a 1. The other grinding unit 51c performs 2-time grinding of the substrate W at the 2-time grinding position a 2. The remaining grinding unit 51c grinds the substrate W3 times at the 3-time grinding position a 3.
The number of the grinding units 51c may be one or more. The number of chucks 51b may be larger than the number of grinding units 51 c. The turntable 51a may be omitted. In the case where the rotary table 51a is not provided, the number of the chucks 51b may be the same as that of the grinding units 51c, or may be one.
As shown in fig. 1, the substrate grinding system 1 includes a3 rd conveyance region 61 disposed between the cleaning section 3 and the grinding section 5. The 3 rd conveying area 61 is disposed adjacent to the 1 st cleaning device 31 and the 2 nd conveying area 36, and the 3 rd conveying area 61 is disposed on the opposite side of the 2 nd cleaning device 32 with reference to the 2 nd conveying area 36.
The cleaning unit 3 has a shape in which corners of a rectangle are removed in a plan view, and the 3 rd conveyance area 61 is disposed at the removed position. The 3 rd conveying area 61 may be provided inside a casing covering both the cleaning unit 3 and the 3 rd conveying area 61, or may be provided inside another casing separate from the casing covering the cleaning unit 3, and connected to the cleaning unit 3.
The substrate grinding system 1 includes a3 rd conveyance device 62 provided in the 3 rd conveyance region 61. The 3 rd conveyance device 62 conveys the substrate W to the cleaning unit 3 and the grinding unit 5. Specifically, the 3 rd transfer device 62 transfers the substrate W from the detection device 34 to the chuck 51b of the grinding device 51, and transfers the substrate W from the chuck 51b to the 1 st cleaning device 31.
The 3 rd transport device 62 includes a chuck 62a that holds the substrate W. The chuck 62a holds the substrate W by suction from above. The suction pad 62a is movable in the horizontal direction (both directions of the X-axis direction and the Y-axis direction) and the vertical direction, and is rotatable about the vertical axis.
The cleaning portion 3 and the grinding portion 5 are separated by a partition wall 71. The partition wall 71 separates, for example, the 2 nd conveying area 36 of the grinding section 5 and the cleaning section 3. The partition wall 71 can suppress inflow of grinding chips from the grinding portion 5 to the cleaning portion 3.
According to the present embodiment, the cleaning unit 3 can be separated from the grinding unit 5, and a plurality of cleaning apparatuses can be mounted in a region with high cleanliness. Since most of the area of the grinding portion 5 is occupied by the grinding device 51, the number of cleaning devices to be mounted can be increased compared to the case where the cleaning devices are mounted in the remaining area of the grinding portion 5, and the cleaning performance can be improved. Further, since the cleaning apparatus is mounted on a region with high cleanliness, the cleaned substrate W can be maintained in a clean state.
In addition, according to the present embodiment, the 3 rd conveying area 61 is disposed at the notch position of the cleaning portion 3. Therefore, an increase in the installation area of the substrate grinding system 1 due to an increase in the number of cleaning apparatuses to be mounted can be suppressed.
The cleaning section 3 and the 3 rd conveyance area 61 are separated by a partition wall 72 and a partition wall 73. The partition wall 72 separates the 3 rd conveyance section 61 from the 2 nd conveyance section 36 of the cleaning section 3. In addition, the partition wall 73 separates the 3 rd conveying area 61 from the 1 st washing device 31 of the washing section 3. The partition walls 72 and 73 can prevent grinding chips from flowing from the grinding portion 5 to the cleaning portion 3 through the 3 rd conveying area 61.
The partition wall 73 has a transfer port through which the substrate W passes. The substrate W is conveyed from the detection device 34 to the chuck 51b of the grinding device 51 through the conveyance port of the partition wall 73. Further, the substrate W is transferred from the chuck 51b to the 1 st cleaning device 31 through the transfer port of the partition wall 73.
A shutter 74 for opening and closing the conveyance port is provided at the conveyance port of the partition wall 73. The shutter 74 normally closes the transfer port of the partition wall 73, and opens the transfer port of the partition wall 73 when the substrate W passes through. The inflow of the grinding chips from the grinding portion 5 to the cleaning portion 3 through the feed port of the partition wall 73 can be suppressed by the shutter 74, and the cleanliness of the cleaning portion 3 can be further improved.
The grinding section 5 and the 3 rd conveying area 61 may be separated by a partition wall 75. The partition wall 75 is formed with a transfer port through which the substrate W passes. The transfer port may be opened and closed by a shutter not shown.
The control device 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores a program for controlling various processes executed in the substrate grinding system 1. The control device 9 controls the operation of the substrate grinding system 1 by causing the CPU91 to execute a program stored in the storage medium 92.
Next, the operation of the substrate grinding system 1 will be described. The following operations are performed under the control of the control device 9.
First, the 1 st transport device 24 takes out the substrate W from the cassette C and transports the substrate W to the transfer device 35. Subsequently, the 2 nd transfer device 37 transfers the substrate W from the transfer device 35 to the 3 rd cleaning device 33.
Next, the 3 rd cleaning device 33 cleans the substrate W before being ground by the grinding device 51. Since the clean substrate W can be placed on the chuck 51b of the grinding device 51 and the biting of foreign matter and the like can be suppressed, the grinding quality of the substrate W can be improved. The 3 rd cleaning device 33 cleans the lower surface of the substrate W. After the substrate W is dried, the 2 nd transfer device 37 transfers the substrate W from the 3 rd cleaning device 33 to the detection device 34.
Further, the 3 rd washing apparatus 33 may be omitted. In this case, the 2 nd conveyance device 37 conveys the substrate W from the transfer device 35 to the detection device 34.
Next, the detection device 34 detects the center of the substrate W. The detection device 34 may also detect a notch or the like of the substrate W. Thereafter, the 3 rd transfer device 62 transfers the substrate W from the detection device 34 to the chuck 51b of the grinding device 51.
The controller 9 controls the 3 rd transfer device 62 based on the detection result of the detector 34 to align the center of the chuck 51b with the center of the substrate W. Further, the control device 9 controls the 3 rd transport device 62 based on the detection result of the detection device 34, and aligns the crystal orientation of the substrate W to a desired orientation in a rotation coordinate system rotating together with the chuck 51 b.
Next, the grinding device 51 grinds the upper surface of the substrate W. The substrate W rotates together with the turntable 51a, and moves to the carry-in and carry-out position a0, the 1 st grinding position a1, the 2 nd grinding position a2, the 3 rd grinding position A3, and the carry-in and carry-out position a0 in this order. Thereafter, the 3 rd transfer device 62 transfers the substrate W from the chuck 51b to the 1 st cleaning device 31.
Next, the 1 st cleaning device 31 cleans the upper surface of the substrate W to remove the grinding chips. After the substrate W is dried, the 2 nd transfer device 37 transfers the substrate W from the 1 st cleaning device 31 to the 2 nd cleaning device 32.
Next, the 2 nd cleaning device 32 etches the upper surface of the substrate W to remove the grinding marks. After the substrate W is dried, the 2 nd transfer device 37 transfers the substrate W from the 2 nd cleaning device 32 to the transfer device 35. Next, the 1 st transport device 24 transports the substrate W from the transfer device 35 to the cassette C. The substrate W is accommodated in the cassette C.
Further, although the 1 st transport device 24 of the present embodiment transports the substrate W taken out of the cassette C to the transport device 35, the technique of the present disclosure is not limited thereto. The 1 st transport device 24 may transport the substrate W taken out of the cassette C to the 3 rd cleaning device 33 or the detection device 34.
Although the substrate grinding system of the present disclosure has been described above, the present disclosure is not limited to the above embodiments and the like. Various changes, modifications, substitutions, additions, deletions, and combinations may be made within the scope of the claims set forth herein. These are of course also within the technical scope of the present disclosure.
Claims (9)
1. A substrate grinding system, characterized in that,
the substrate grinding system includes:
a carry-in/out unit having a mounting table on which a cassette for housing a substrate is mounted, a1 st conveyance area disposed adjacent to the mounting table, and a1 st conveyance device provided in the 1 st conveyance area and carrying in/out the substrate with respect to the cassette;
a cleaning unit including a1 st cleaning device for cleaning the substrate, a2 nd transport area disposed between the 1 st cleaning device and the 2 nd cleaning device, and a2 nd transport device provided in the 2 nd transport area and transporting the substrate to the 1 st cleaning device and the 2 nd cleaning device;
a grinding section having a grinding device for grinding the substrate;
a3 rd conveying area disposed between the cleaning part and the grinding part; and
a3 rd conveying device which is provided in the 3 rd conveying area and conveys the substrate with respect to the cleaning section and the grinding section,
the 3 rd conveying area is disposed adjacent to the 1 st cleaning device and the 2 nd conveying area, the 3 rd conveying area is disposed on the opposite side of the 2 nd cleaning device with respect to the 2 nd conveying area,
the cleaning portion and the grinding portion are separated by a partition wall.
2. The substrate grinding system of claim 1,
the cleaning part and the No. 3 conveying area are separated by a partition wall,
a conveying port through which the substrate passes is formed in a partition wall that separates the 1 st cleaning device and the 3 rd conveying area,
the conveying port is provided with a gate for opening and closing the conveying port.
3. The substrate grinding system of claim 1 or 2,
the cleaning unit includes a detection device for detecting the center of the substrate before being ground by the grinding device.
4. The substrate grinding system of claim 3,
the detection device and the 1 st cleaning device are stacked in a vertical direction.
5. The substrate grinding system of claim 1 or 2,
the 1 st cleaning device cleans the substrate ground by the grinding device before the substrate is conveyed by the 2 nd conveying device,
the cleaning unit further includes a3 rd cleaning device for cleaning the substrate before being ground by the grinding device.
6. The substrate grinding system of claim 5,
the 1 st cleaning device and the 3 rd cleaning device are stacked in a vertical direction.
7. The substrate grinding system of claim 1 or 2,
the 2 nd cleaning device includes a nozzle that ejects a chemical solution for etching the substrate ground by the grinding device.
8. The substrate grinding system of claim 1 or 2,
the 1 st cleaning device includes a cleaning body for scrubbing the substrate ground by the grinding device.
9. The substrate grinding system of claim 1 or 2,
the 3 rd transport device includes a chuck for holding the substrate by suction from above,
the 2 nd transport device includes a transport arm that holds the substrate from below.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-004416U | 2019-11-21 | ||
| JP2019004416U JP3225001U (en) | 2019-11-21 | 2019-11-21 | Substrate grinding system |
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| Publication Number | Publication Date |
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| CN213635912U true CN213635912U (en) | 2021-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022577291.4U Active CN213635912U (en) | 2019-11-21 | 2020-11-10 | Substrate grinding system |
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| JP (1) | JP3225001U (en) |
| CN (1) | CN213635912U (en) |
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| JP7422558B2 (en) | 2020-02-18 | 2024-01-26 | 東京エレクトロン株式会社 | Grinding system and grinding method |
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