KR20210052254A - Cleaning module, cutting device, and method of manufacturing cut product - Google Patents

Abstract

Provided are a cleaning module, which can increase cleaning efficiency even when the size of a cut product is small, a cutting device, and a manufacturing method of a cut product. The cleaning module includes: a container (21) for accommodating a plurality of cut products (Sa) formed by cutting a package substrate; a rotating mechanism (22) for rotating the container (21); a liquid supply mechanism (23) for supplying a cleaning liquid into the container (21); and a drainage mechanism (24) for discharging the cleaning liquid in the container (21). The several cut products (Sa) are cleaned in the container (21) rotated by the rotating mechanism (22) in a state immersed in the cleaning liquid.

Description

Cleaning module, cutting device, and manufacturing method of cutting products {CLEANING MODULE, CUTTING DEVICE, AND METHOD OF MANUFACTURING CUT PRODUCT}

The present invention relates to a cleaning module, a cutting device including a cleaning module, and a method of manufacturing a cut product.

A lead frame or a substrate on which a chip is mounted is generally used as an electronic component by sealing with resin. Conventionally, a cutting device for manufacturing a plurality of cut products (electronic parts) by cutting (separating) the package board after manufacturing a package board by collectively resin-sealing a wiring board by mounting a plurality of chips is known. Yes (see, for example, Patent Document 1).

The cutting device described in Patent Document 1 includes a cutting means for cutting a package substrate into a plurality of cut products, a conveying means for sucking and conveying a plurality of cut products, and a top surface cleaning that cleans the upper surfaces of the plurality of cut products with a sprayed cleaning solution. A means, a lower surface cleaning means for washing the lower surfaces of the plurality of cut products with a cleaning roller made of a sponge or the like, and a drying means for drying the upper and lower surfaces of the plurality of cut products by means of a heater or warm air. The plurality of cut products after cutting, washing and drying are dropped into the deburring container with a brush, and the shaking mechanism shakes the deburring container, thereby imparting vibration to the cut product to remove the burrs.

Japanese Patent Publication No. 2017-084893

In a conventional cutting apparatus, a plurality of cut products formed by cutting a package substrate are conveyed, cleaned, and dried. However, if the size of the cut products is smaller than a square with a side of 2 mm, for example, conveyance or the like becomes difficult. In particular, when the size of the cut product is small, chip shift (the cut product moves from the suction position) and scattering of the cut product are likely to occur during cleaning.

Therefore, even when the size of the cut product is small, a cleaning module, a cutting device, and a method of manufacturing a cut product that can increase cleaning efficiency are desired.

The characteristic configuration of the cleaning module according to the present invention includes a container for accommodating a plurality of cut products formed by cutting a package substrate, a rotation mechanism for rotating the container, a liquid supply device for supplying a cleaning liquid into the container, and A drainage mechanism for discharging the cleaning liquid is provided, and the plurality of cut products are cleaned in the container rotated by the rotating mechanism while immersed in the cleaning liquid.

A characteristic configuration of the cutting device according to the present invention includes the cleaning module, a cutting mechanism for cutting the package substrate, and a transport mechanism for transporting a plurality of cut products cut and formed by the cutting mechanism to the container. Is at the point.

Features of the method for manufacturing a cut product according to the present invention include a cutting step of cutting a package substrate to form a plurality of cut products, a receiving step of accommodating the plurality of cut products in a container, and supplying a cleaning liquid into the container, The present invention comprises a washing step of rotating the container to wash the plurality of cut products, and a take-out step of removing the plurality of cut products by inverting the container up and down.

According to the present invention, even when the size of a cut product is small, a cleaning module, a cutting device, and a method of manufacturing a cut product capable of increasing cleaning efficiency are provided.

1 is a schematic diagram showing a cutting device.
2 is a schematic perspective view showing a conveyance mechanism.
3 is a schematic perspective view showing a cleaning module.
4 is a cross-sectional view taken along line IV-IV of FIG. 3.
5 is a diagram showing a driving mode of a cleaning module.
6 is a cross-sectional view showing a state in which a plurality of cut products are accommodated in a container.
7 is a cross-sectional view showing a state in which a plurality of cut products are washed in a container.
8 is a cross-sectional view showing a state in which a plurality of cut products are dried in a container.
9 is a cross-sectional view showing a state in which the container of the cleaning module is moved.
10 is a plan view showing a state in which the container of the cleaning module is moved.
11 is a schematic perspective view showing a reversing mechanism of the cleaning module.
12 is a schematic diagram showing a conveying mechanism according to another embodiment.
13 is a schematic diagram showing a conveying state of a cut product of a conveying mechanism according to another embodiment.

Hereinafter, embodiments of a cleaning module, a cutting device, and a method for manufacturing a cut product according to the present invention will be described with reference to the drawings. However, it is not limited to the following embodiments, and various modifications are possible within a range not departing from the gist.

[Device configuration]

A molded object such as a lead frame or a substrate on which a chip is mounted is used as an electronic component by sealing with resin. As a technique of resin-sealing the object to be molded, a compression method or a transfer method may be mentioned. The compression method is, for example, a method of supplying a resin in a liquid or powder form onto a release film, then loading the release film into a cavity of a molding mold, and immersing the object to be molded in the resin on the release film to perform resin molding. The transfer method is, for example, a method in which an object to be molded is accommodated in a cavity of a mold, a resin tablet is supplied to a port of the mold to be heated and melted, and then a molten resin is supplied to the cavity for resin molding.

In the resin molding apparatus of the compression method or the transfer method, a device for manufacturing a package substrate such as MAP (molded array packaging) that encapsulates a wiring substrate by mounting a plurality of chips in a resin from the viewpoint of manufacturing efficiency is used. There are cases. After manufacturing a package substrate in this apparatus, it is cut (redivided) in a cutting apparatus, and the formed cut product is used as an electronic component after quality inspection. In the cutting device, a plurality of cut products formed by cutting the package substrate are transported, cleaned, and dried. However, if the size of the cut product is smaller than a square having a side of 2 mm, for example, conveyance or the like becomes difficult. In particular, when the size of the cut product is small, chip shift (the cut product moves from the suction position) and scattering of the cut product are likely to occur during cleaning. Therefore, in this embodiment, even when the size of a cut product is small, a cleaning module, a cutting device, and a method of manufacturing a cut product that can increase cleaning efficiency are provided. Hereinafter, a package substrate on which a plurality of semiconductor chips are mounted is described as an example of an object to be cut, and in some cases, the direction of gravity is downward and the direction opposite to the direction of gravity is upward.

1, a schematic diagram of the cutting device D is shown. The cutting device (D) in this embodiment is configured as a separate body from the resin molding device (E), and a package substrate (S) resin-sealed by the resin molding device (E) is introduced, and the package substrate (S) is ) Is cut, washed, and dried to produce a plurality of cut products (Sa). This manufactured cut product Sa is used as an electronic component after passing through a predetermined quality inspection.

The cutting device (D) has a cutting module (1), a cleaning module (2), and a control unit (3). The cutting module 1 and the cleaning module 2 can be mounted or removed independently. Moreover, the cutting device D has the conveyance mechanism 4 over the cutting module 1 and the cleaning module 2. The control unit 3 is software that controls the operation of the cutting device D, is composed of a program stored in hardware such as an HDD or a memory, and is executed by the CPU of the computer. That is, the control part 3 controls the operation|movement of the cutting module 1, the cleaning module 2, and the conveyance mechanism 4.

The cutting module 1 has an introduction part 11 and a cutting mechanism 12. In addition, the number of the introduction part 11 and the cutting mechanism 12 may be formed by 1 or 2 or more, and is not specifically limited.

The introduction part 11 introduces, from the resin molding apparatus E, the package substrate S having a rectangular shape in plan view as an object to be cut. The introduced package substrate S is mounted on the pre-stage 11a. The cutting mechanism 12 includes two cutting transfer mechanisms 12a for transferring the package substrate S, two cutting tables 12b disposed on the cutting transfer mechanism 12a, and two cutting portions ( 12c). The cutting transfer mechanism 12a is configured to be movable in the Y direction and rotatable in the θ direction while the package substrate S is fixed on the cutting table 12b. Although the drive source of the cutting feed mechanism 12a and the cutting part 12c is not specifically limited, For example, an electric motor, such as a servo motor, can be used.

In the cutting table 12b, the package substrate S received from the introduction part 11 is fixed by air adsorption or the like with the resin-sealed side as the lower surface. The cutting portion 12c includes a spindle portion 12c1 and a rotating blade 12c2, and cuts the package substrate S fixed to the cutting table 12b by the rotating blade 12c2. Further, a groove is formed on the upper surface of the cutting table 12b, that is, the fixed surface on which the package substrate S is fixed, so that the rotary blade 12c2 can enter. The rotating blade 12c2 is fixed to the rotating shaft of the spindle 12c1, and is configured to be movable in the X and Z directions and to be capable of high-speed rotation. The cutting feed mechanism 12a moves and rotates in the Y and θ directions, and the rotating blade 12c2 moves in the X and Z directions, thereby adjusting the relative position of the rotating blade 12c2 and the package substrate S. do. While repeating the adjustment of this relative position, the package substrate S is cut so as to penetrate from the upper surface to the lower surface by the rotating blade 12c2, and a plurality of cut products Sa having a rectangular shape in plan view are formed. . At this time, cutting water may be cut while supplying cutting water to the contact portion between the rotary blade 12c2 and the package substrate S. Further, either the cutting feed mechanism 12a or the rotary blade 12c2 may be moved to adjust the relative position. In addition, the two cutting portions 12c can be positioned so that the spindle portion 12c1 has a linear shape and the rotating blades 12c2 face each other, the distance of the interval between the two rotating blades 12c2 is variable, and the X direction In this case, it is movable to either upper part of the two cutting tables 12b.

The cleaning module 2 has a cleaning mechanism 2A, a fluid supply/discharge mechanism 2B, and a recovery box 2C having a rectangular shape in plan view. The cleaning mechanism 2A accommodates a plurality of cut products Sa together with a cleaning liquid such as water in the container 21, and rotates the container 21 to generate a liquid to clean the plurality of cut products Sa. do. The fluid supply/discharge mechanism 2B supplies compressed air (an example of a gas) into the container 21 of the cleaning mechanism 2A, or a gas supply/discharge pump (shown) that sucks and discharges air in the fluid pipe 42 to be described later. Not included). In addition, the fluid supply/discharge mechanism 2B can supply the cleaning liquid into the container 21 from a water supply source (for example, a water supply or a pure water supply pipe in a factory). Details of the cleaning module 2 will be described later.

The conveyance mechanism 4 conveys the plurality of cut products Sa cut and formed by the cutting mechanism 12 to the container 21 of the cleaning mechanism 2A. As shown in Fig. 2, the conveyance mechanism 4 in the present embodiment includes a nozzle 41 (an example of a suction nozzle) formed of a hollow plate member having a triangular shape when viewed from the side, and a gas and a liquid are cut products. A fluid pipe 42 circulating together with (Sa), a gas supply/discharge pump provided in the fluid supply/discharge mechanism 2B, and a liquid supply mechanism 43 are included. The opening formed at one end of the nozzle 41 covers one side (shorter side) of the package substrate S, and the opening formed at the other end of the nozzle 41 communicates with the fluid pipe 42. The nozzle 41 sucks all the cut products Sa on the cutting table 12b by the driving force of the gas supply/discharge pump included in the fluid supply/discharge mechanism 2B. Specifically, the nozzle 41 is configured to be movable in the X and Z directions, and an opening formed at one end of a plurality of cut products Sa in a row disposed on one side of the package substrate S After aligning the position so as to cover, all the cut products Sa are sucked while moving along the other side (long side, X direction) of the package substrate S. One end 42a of the fluid pipe 42 is connected to a liquid supply mechanism 43 for supplying a liquid such as water, and the other end 42b of the fluid pipe 42 communicates with the inside of the container 21 Has been. This liquid supply mechanism 43 supplies liquid from a water supply source (for example, a water supply or a pure water supply pipe in a factory) of the fluid supply/discharge mechanism 2B described above into the fluid pipe 42. The plurality of cut products Sa sucked from the nozzle 41 flows into the fluid pipe 42 and is conveyed to the container 21 by the liquid flow supplied from the liquid supply mechanism 43.

Hereinafter, the cleaning mechanism 2A of the cleaning module 2 will be described in detail with reference to FIGS. 3 to 4.

The cleaning mechanism 2A of the cleaning module 2 includes a container 21 for accommodating a plurality of cut products Sa formed by cutting the package substrate S, and a rotation mechanism 22 for rotating the container 21 Wow, a liquid supply mechanism 23 for supplying the cleaning liquid into the container 21, a drain mechanism 24 for discharging the cleaning liquid in the container 21, and a supply air supplying compressed air (an example of a gas) into the container 21 A mechanism 25, an exhaust mechanism 26 for discharging air (an example of a gas) in the container 21, and a rotation reversing mechanism 27 for rotating and inverting the container 21 are included. In addition, the cleaning mechanism 2A contains fine particles such as cutting chips that have crossed the upper end surface (top part) of the intermediate cylinder T (an example of a partition wall) when the container 21 exceeds a predetermined water level. A drain mechanism 28 for draining the cleaning liquid to be drained, and a vacuum mechanism 29 for sucking air in the fluid pipe 42 of the transport mechanism 4 described above may be included.

The container 21 is disposed so as to be inclined at a predetermined angle with respect to the direction of gravity. This predetermined angle is set within the range of 5° to 50°, preferably 10° to 40°, and more preferably 20° to 30°. The container 21 includes a bottomed cylindrical inner cylinder 21b (an example of an inner container) with a bottom wall formed in a conical shape, and an outer cylinder 28a (an example of an outer container) disposed outside the inner cylinder 21b. It has, and the inner cylinder 21b and the outer cylinder 28a are constituted so as to be integrally rotatable. On the inner surface of the bottom wall of the inner cylinder 21b, an inclined surface 21b1 inclined toward the direction of gravity as it approaches the center (rotation shaft 22b of the rotation mechanism 22) is formed.

Between the inner cylinder 21b and the outer cylinder 28a, an intermediate cylinder T (an example of a partition wall) is fixed so as not to be rotatable. Of the inner cylinder 21b, from a position slightly higher than the upper end of the intermediate cylinder T in the side wall (a predetermined water level) to the bottom wall, fine particles such as cutting chips pass, but the cut product Sa does not pass. A large number of fine holes 21c (an example of a through hole) of a size are formed. That is, the inner cylinder 21b has a mesh structure from the side wall near the upper end surface of the intermediate cylinder T to the bottom wall. Further, in the inner cylinder 21b, an annular flange 21d extending in an annular shape is formed on the outer side in the radial direction, and on the lower surface of the annular flange 21d, a plurality of inclined projections 21d1 having an inclined surface as viewed from the rotational direction. Is formed (see enlarged view of Fig. 3). The bottom wall of the intermediate cylinder T is constituted in a truncated cone shape to which the drain pipe 24a of the drain mechanism 24 is fixed. The outer cylinder 28a contains fine particles such as cutting chips that cross the top surface of the intermediate cylinder T through the fine holes 21c of the inner cylinder 21b when the inside of the vessel 21 exceeds a predetermined water level. It is configured as a drain mechanism 28 for draining the cleaning liquid. The bottom wall of the outer cylinder 28a is a truncated cone in which an inner insertion pipe 28a1 inserted inside so as to be able to be rotated relative to the drain pipe 28b for discharging the cleaning liquid to a drainage (for example, a sewer, a drain pipe in a factory) protrudes. It is composed of a shape (see Fig. 4). Further, on the upper outer surface of the outer cylinder 28a, a plurality of inclined protrusions 28a2 having an inclined surface abutting in the rotational direction with respect to the inclined surface of the inclined protrusion 21d1 of the inner cylinder 21b are protruded (Fig. 3). See enlarged view).

In addition, the cleaning module 2 is provided with a cover 30 that closes the upper opening of the inner cylinder 21b, and a cover moving mechanism 31 composed of an air cylinder or the like for vertically moving the cover 30 is provided. have. To the lid 30, a fluid pipe 42 of the conveyance mechanism 4, a liquid supply pipe 23a of the liquid supply mechanism 23, and a supply pipe 25a of the air supply mechanism 25 are fixed. In a state in which the lid 30 is in close contact with the inner cylinder 21b, a plurality of cut products Sa are supplied from the fluid pipe 42 in the inner cylinder 21b by liquid, and the liquid supply pipe 23a in the inner cylinder 21b The cleaning liquid is supplied from At this time, since a plurality of fine holes 21c are formed in the inner cylinder 21b, the cleaning liquid in the inner cylinder 21b flows out into the intermediate barrel T, but the cut product Sa can pass through the fine holes 21c. none. In this embodiment, since a plurality of cut products Sa are supplied into the inner cylinder 21b by a liquid flow, problems such as the cut products Sa adhere to and remain in the pipe of the fluid pipe 42 can be prevented. have.

The rotation mechanism 22 includes an electric motor 22a that rotates the inner cylinder 21b and the outer cylinder 28a around the rotation shaft 22b, and the inclined projections 21d1 and the outer cylinder 28a of the above-described inner cylinder 21b. It includes the inclined protrusion 28a2. When the outer cylinder 28a rotates by the driving force of the electric motor 22a, the inclined protrusion 28a2 of the outer cylinder 28a abuts against the inclined protrusion 21d1 of the inner cylinder 21b, and the inner cylinder 21b also rotates integrally. . The inner cylinder 21b and the outer cylinder 28a are rotated by the rotation mechanism 22 to generate a liquid flow in the inner cylinder 21b having a mesh structure, and a plurality of cut products (Sa ) Is cleaned by the rotating cleaning liquid.

The liquid supply mechanism 23 includes a liquid supply pipe 23a having one end connected to a water supply or a pure water supply pipe in a factory and the other end connected to a lid 30. The drainage mechanism 24 includes a drainage pipe 24a having one end connected to a sewerage system or a drainage pipe in a factory and the other end connected to the bottom wall of the intermediate cylinder T. In the liquid supply pipe 23a of the liquid supply mechanism 23 and the liquid discharge pipe 24a of the liquid discharge mechanism 24, an on/off valve Va and an on/off valve Vb each constituted by a solenoid valve or the like are provided.

The air supply mechanism 25 includes a gas supply/discharge pump provided in the fluid supply/discharge mechanism 2B, and a supply pipe 25a having one end connected to the gas supply/discharge pump and the other end connected to the cover 30 so as to be able to introduce compressed air, etc. Includes. The exhaust mechanism 26 includes an exhaust pipe 26a connected to an intermediate cylinder T and a bottom wall of the outer cylinder 28a with one end connected to the outside air and the other end through a branch portion 20a. In the supply pipe 25a of the air supply mechanism 25 and the exhaust pipe 26a of the exhaust mechanism 26, an on/off valve Vc and an on/off valve Vd each constituted by a solenoid valve or the like are provided. In addition, the air supply mechanism 25 does not need to include a gas supply and discharge pump, and may be of a configuration capable of introducing compressed air or the like into the supply pipe 25a. For example, the compressed air supply piping pipe in the factory is an air supply pipe ( 25a) may be connected to one end through a solenoid valve.

The rotation and reversal mechanism 27 is an inner cylinder that vertically moves a chuck mechanism 27a that operates a clamp member 27a1 that holds the inner cylinder 21b, and an inner cylinder 21b that is sandwiched between the clamp member 27a1. The vertical mechanism 27d, the rotation mechanism 27b for rotating the inner cylinder 21b around the rotation shaft 27b1, and the inner cylinder reversing mechanism 27c for vertically inverting by rotating the inner cylinder 21b around the reversing shaft 27c1 ) (An example of a reversing mechanism) is included. The drive source of the rotation and reversal mechanism 27 is constituted by an electric motor, an air cylinder, or the like.

The drain mechanism 28 includes an outer cylinder 28a and a drain pipe 28b having one end connected to a sewer or a drain pipe in a factory and the other end connected to the bottom wall of the outer cylinder 28a. The vacuum mechanism 29 includes a gas supply/discharge pump provided in the fluid supply/discharge mechanism 2B, one end is connected to the gas supply/discharge pump so as to be evacuable, and the other end is the intermediate cylinder T and the outer cylinder 28a via a branch portion 20a. It includes a vacuum tube 29a connected to the bottom wall of ). In the drain pipe 28b of the drain mechanism 28 and the vacuum pipe 29a of the vacuum mechanism 29, an on-off valve Ve and an on-off valve Vf each constituted by a solenoid valve or the like are provided. The above-described drain pipe 28b merges with the drain pipe 24a from the branch portion 20a and extends downward, and the exhaust pipe 26a and the vacuum pipe 29a merge with the drain pipe 28b at the branch portion 20a. So it extends upwards. With this configuration, the liquid flows down the inside of the drain pipe 24a and the drain pipe 28b, and the gas flows through the exhaust pipe 26a and the vacuum tube 29a. The branching part 20a in this embodiment is located above the upper end surface of the intermediate cylinder T (the highest water level 20b over the upper end surface of the intermediate cylinder T), and the cut product Sa The cleaning liquid that has passed over the top surface of the intermediate cylinder T during cleaning and drying of the pipe is caused by the difference in head between the branch portion 20a and the highest water level 20b in the container 21, and thus the exhaust pipe 26a and the vacuum tube 29a. It doesn't flow into it. In addition, when the on-off valve Vb of the drainage mechanism 24 is in the closed state during the cleaning of the cut product Sa, the cleaning liquid remaining in the drainage pipe 24a is at the highest level in the branch 20a and the container 21. It does not flow into the exhaust pipe 26a and the vacuum tube 29a due to the water head difference of (20b). Even if the cleaning liquid remaining in the drain pipe 24a reaches the water level of the branch portion 20a, it is drained from the drain pipe 28b connected to the branch portion 20a. In addition, the vacuum mechanism 29 does not need to include a gas supply/discharge pump as long as the inside of the outer cylinder 28a is not at a negative pressure, and may be configured to be evacuated from the vacuum tube 29a through the branch portion 20a. For example, the exhaust duct in the factory may be connected to one end of the vacuum tube 29a.

[Method of manufacturing cut products]

A method of manufacturing the cut product Sa will be described with reference to FIGS. 1 to 11.

As shown in FIG. 1, the package board|substrate S resin-molded by the resin molding apparatus E is conveyed to the introduction part 11, and this package board|substrate S is mounted on the pre-stage 11a. Subsequently, the cutting transfer mechanism 12a fixes the package substrate S as the cutting object received from the introduction part 11 to the cutting table 12b with the resin-sealed side as the lower surface, until the cutting part 12c Transfer. And the relative position of the package substrate S and the rotary blade 12c2 is adjusted by the cutting transfer mechanism 12a and the cutting part 12c, and the package substrate S is the upper surface by the rotary blade 12c2. It is cut so as to penetrate toward the lower surface from, and a plurality of cut products Sa having a rectangular shape in plan view are formed (cutting step).

Subsequently, the conveyance mechanism 4 conveys the plurality of cut products Sa formed by cutting by the cutting mechanism 12 to the container 21 of the cleaning mechanism 2A (transport process). As shown in FIG. 2, in the conveyance mechanism 4 in this embodiment, the nozzle 41 is the cutting table in the state where air adsorption of the cut product Sa on the cutting table 12b is stopped. (12b) A plurality of cut products Sa are sucked and introduced into the fluid pipe 42, and are conveyed to the container 21 by the liquid flow supplied from the liquid supply mechanism 43, and the plurality of cut products Sa ) Is accommodated in the container 21 from the other end 42b of the fluid pipe 42 (transport process, accommodation process). At this time, as shown in the conveyance accommodation process of FIG. 5, the on-off valves Va to Ve of the liquid supply mechanism 23, the liquid drain mechanism 24, the air supply mechanism 25, the exhaust mechanism 26, and the drain mechanism 28 are closed. In the state, with the rotation mechanism 22 in a non-driving state, the on-off valve Vf of the vacuum mechanism 29 is opened. As a result, as shown in FIG. 6, the container 21 and the fluid pipe 42 communicated with the vacuum tube 29a of the vacuum mechanism 29 are connected by the gas supply and discharge pump included in the fluid supply and discharge mechanism 2B. Through this, a negative pressure is applied to the nozzle 41, so that a plurality of cut products Sa are sucked (refer to FIG. 2). In this way, since the plurality of cut products Sa are sucked by the nozzle 41 and are conveyed to the container 21 by the liquid flow, the size of the cut products Sa is less than a square with one side of, for example, 2 mm. Even when it is small, it can be sucked and conveyed at once.

Subsequently, the cleaning mechanism 2A supplies the cleaning liquid into the container 21 (inner cylinder 21b) by the liquid supply mechanism 23, so that the plurality of cut products Sa together with the cleaning liquid are transferred to the container 21 (inner cylinder (inner cylinder)). 21b)), and the cleaning liquid is present on the inside of the intermediate cylinder T through the fine hole 21c. Then, by rotating the container 21 (the inner cylinder 21b and the outer cylinder 28a) by the rotation mechanism 22, a plurality of cut products Sa are cleaned (washing step). At this time, as shown in the cleaning process in FIG. 5, with the on/off valves Vb and Vc of the drainage mechanism 24 and the air supply mechanism 25 in a closed state, the on/off valve Vf of the vacuum mechanism 29 is closed and rotated. While driving the mechanism 22, the on-off valves Va, Vd, and Ve of the liquid supply mechanism 23, the exhaust mechanism 26, and the drain mechanism 28 are opened. As a result, as shown in FIG. 7, the cleaning liquid is supplied into the inner cylinder 21b of the container 21 by the liquid supply mechanism 23, and a plurality of cuttings are performed by rotating the container 21 by the rotation mechanism 22. The product (Sa) is washed. In addition, the cleaning liquid containing fine particles such as cutting chips and the like that has crossed the top surface of the intermediate cylinder T through the fine holes 21c of the inner cylinder 21b is drained by the drain mechanism 28, and the inner cylinder ( The air in 21b) is exhausted by the exhaust mechanism 26.

As described above, in the present embodiment, by rotating the container 21 (the inner cylinder 21b and the outer cylinder 28a), a liquid flow is generated around the cut product Sa immersed in the cleaning solution, so that the cut product Sa The whole area can be cleaned without exception. That is, even when the size of the cut product Sa is smaller than, for example, a square of 2 mm on one side, it becomes possible to clean up to every corner, and the cleaning efficiency can be improved. Further, since the container 21 (the inner cylinder 21b and the outer cylinder 28a) supplied with the cleaning liquid is rotated, the cleaning configuration of the cut product Sa is simple, and the supply and discharge of the cleaning liquid are also very easy. In addition, since the container 21 is arranged inclined with respect to the direction of gravity, when the container 21 is rotated, the positions of the plurality of cut products Sa are liable to fluctuate in the vertical direction, so that cleaning efficiency can be improved. . Further, if the drain mechanism 28 for draining the cleaning liquid containing fine particles such as cutting chips when the predetermined water level is exceeded is provided, the water level adjustment mechanism in the inner cylinder 21b is simple.

Subsequently, after washing the plurality of cut products Sa by the cleaning process, the cleaning liquid containing fine particles such as cutting chips is discharged by the drainage mechanism 24 and the drain mechanism 28, and the air supply mechanism 25 By supplying compressed air into the inner cylinder 21b of the vessel 21, and rotating the vessel 21 (the inner cylinder 21b and the outer cylinder 28a) by the rotation mechanism 22, a plurality of cut products (Sa) Is dried (drying process). At this time, as shown in the drying process in Fig. 5, the on/off valve Vf of the vacuum mechanism 29 is closed, and the open/closed valves Vd and Ve of the exhaust mechanism 26 and the drain mechanism 28 are maintained and rotated. While continuing to drive the mechanism 22, the on/off valve Va of the liquid supply mechanism 23 is closed, and the on/off valves Vb and Vc of the liquid discharge mechanism 24 and the air supply mechanism 25 are opened. As a result, as shown in Fig. 8, the cleaning liquid containing fine particles such as cutting chips in the container 21 is discharged by the drain mechanism 24 and the drain mechanism 28, and the fluid supply/discharge mechanism 2B Compressed air is supplied into the inner cylinder 21b of the vessel 21 through the supply pipe 25a by the gas supply and discharge pump of the vessel 21 (the inner cylinder 21b and the outer cylinder 28a) by the rotary mechanism 22. Dry the plurality of cut products (Sa) while rotating ). That is, since the plurality of cut products Sa are dried while rotating the container 21, the entire cut product Sa can be dried by flowing the plurality of cut products Sa. At this time, since the inner surface of the bottom wall of the inner cylinder 21b is formed as an inclined surface 21b1, when the container 21 is rotated, the position of the plurality of cut products Sa deposited on the center portion of the bottom wall of the container 21 is It moves outward in the radial direction. As a result, it becomes possible to reduce the overlapping of the plurality of cut products Sa, and the drying efficiency of the cut products Sa can be improved. In this way, even when the size of the cut product Sa is smaller than, for example, a square of 2 mm on one side, it can be dried efficiently. In addition, when cleaning and drying of the cut product Sa is completed in the container 21, there is no need to separately provide a drying container, and the cleaning module 2 (cutting device D) can be made compact.

Subsequently, the on-off valves Vb to Ve of the drain mechanism 24, the air supply mechanism 25, the exhaust mechanism 26, and the drain mechanism 28 are closed, and the driving of the rotation mechanism 22 is stopped, and then the rotation reversing mechanism. By (27), the inner cylinder 21b is rotated and vertically reversed to take out a plurality of cut products Sa (takeout step). This take-out process will be described with reference to FIGS. 9 to 11.

As shown in Fig. 9, the lid 30 is raised by the lid moving mechanism 31, and the inner cylinder 21b is held in place by the clamp member 27a1 of the chuck mechanism 27a. The inner cylinder 21b is raised by the vertical mechanism 27d, and the inner cylinder 21b is separated from the intermediate cylinder T. Next, as shown in FIG. 10, the inner cylinder 21b is rotated around the rotational shaft 27b1 by the rotational mechanism 27b, and is moved upward of the recovery box 2C. Subsequently, as shown in Fig. 11, the inner cylinder 21b is vertically reversed around the reversing shaft 27c1 by the inner cylinder reversing mechanism 27c, and a plurality of cut products Sa accommodated in the inner cylinder 21b are collected in a collection box. Drop it on (2C) and take it out. Then, the washed and dried cut product Sa stored in the recovery box 2C is recovered. In this way, since the cut product Sa is taken out by inverting the inner cylinder 21b of the container 21 up and down, as in the prior art, the cut product Sa in a sucked state is not simply dispensed with a brush, There is no problem that the cut product (Sa) is caught or scattered by the brush.

[Other embodiments]

Hereinafter, members similar to those in the above-described embodiment will be described using the same terms and symbols in order to facilitate understanding.

<1> As shown in Figs. 12 to 13, the conveying mechanism 4 has a storage unit 45 for accommodating a plurality of cut products Sa, and a number in which a plurality of cut products Sa are accommodated. The payment 45 may be moved to the inner cylinder 21b, and a plurality of cut products Sa may be moved from the storage portion 45 to the inner cylinder 21b (transport step). In more detail, the conveyance mechanism 4 in the present embodiment is disposed on the cutting table 12b of the cutting mechanism 12, and a plurality of cut products Sa formed by cutting the package substrate S ), a movable body 44 that is movable while in contact with, a storage unit 45 capable of storing a plurality of cut products Sa, and a drive mechanism 46 for driving the movable body 44, and these movable bodies 44 , The storage unit 45 and the drive mechanism 46 are configured as an integral unit in the transfer box 4A. Moreover, the conveyance mechanism 4 conveys the conveyance box 4A to the container 21 of the cleaning mechanism 2A.

The moving body 44 supports a rotating body 44a rotating around a rotating shaft 44a1, a plurality of protrusions 44b protruding radially outward from the periphery of the rotating body 44a, and a rotating shaft 44a1. And, it includes a guide groove (44c) for guiding the slide movement of the rotating body (44a). The plurality of protrusions 44b are difficult to deform when separated from the cutting table 12b in contact with the cut product Sa, and do not damage the cut product Sa, such as nylon or PBT (polybutylene terephthalate). It is made of resin material. By the slide drive mechanism 46b described later, the rotating main body 44a is comprised so that it can move forward or backward on the cutting table 12b along the guide groove 44c.

The drive mechanism 46 includes a rotation drive mechanism 46a that drives the moving body 44 to rotate, and a slide drive mechanism 46b that slides the moving body 44 along the surface of the cutting table 12b. The drive source of this drive mechanism 46 is constituted by an electric motor such as a servo motor, an air cylinder, or the like.

As a method of conveying the cut product Sa, first, as shown in FIG. 12, the package substrate S is cut while the air adsorption of the cut product Sa on the cutting table 12b is stopped. The formed plurality of cut products Sa are separated from the cutting table 12b by contacting the protrusion 44b of the moving body 44 rotated by the rotation drive mechanism 46a. Subsequently, with the protrusion 44b of the moving body 44 in contact with the cut product Sa, the moving body 44 is advanced by the slide drive mechanism 46b, and the cut product Sa is stored in the receiving part 45 Extrude toward. At this time, the protrusion 44b of the moving body 44 rotated by the rotation drive mechanism 46a contacts the next cut product Sa and is separated from the cutting table 12b. Separation and extrusion of the cut product Sa on the cutting table 12b are repeated, and finally all the plurality of cut products Sa are accommodated in the storage unit 45.

Subsequently, the conveyance mechanism 4 moves the conveyance box 4A (the storage part 45 in which the plurality of cut products Sa are accommodated) so that the opening of the container 21 is below the storage part 45, It is conveyed to the vicinity of the container 21 of the cleaning mechanism 2A. Subsequently, the conveyance mechanism 4 makes the conveyance box 4A vibrate while tilting, and causes a plurality of cut products Sa to fall into the container 21. In this way, if the cut product Sa is stored in the storage unit 45 before being moved to the inner cylinder 21b, it is only necessary to transport the storage unit 45 in which a plurality of cut products Sa are stored, thereby improving the transport efficiency. You can increase it. In addition, when the transport box 4A is tilted and vibrated, it becomes possible to accommodate a plurality of cut products Sa in the container 21 at once, compared to the case of transporting the cut products Sa by liquid flow or suction, It is difficult to cause poor recovery of the cut product (Sa). In addition, in the configuration shown in FIGS. 12 to 13, it is different from the description of conveyance of the cut product Sa after cutting and storage in the container 21 in the above-described embodiment. That is, the plurality of cut products Sa are not accommodated in the container 21 from the other end 42b of the fluid pipe 42, but a plurality of cut products Sa are transferred to the transfer box of the transfer mechanism 4 ( It is accommodated in the inside of the container 21 directly from 4A).

<2> In the above-described embodiment, the intermediate cylinder T is provided in the container 21, but the intermediate cylinder T is omitted and the drain hole is discharged from the drain hole formed in the side wall (an example of the partition wall) of the inner cylinder 21b. The cleaning liquid may be discharged by the drain mechanism 28. In this case, the drain pipe 24a of the drain mechanism 24 is connected to the inner cylinder 21b. In addition, the intermediate cylinder T and the outer cylinder 28a may be omitted, and the container 21 may be configured only with the inner cylinder 21b, and the supply amount of the cleaning liquid may be controlled by the liquid supply mechanism 23 or the liquid drain mechanism 24.

<3> In the above-described embodiment, air is supplied into the inner cylinder 21b of the container 21 by the air supply mechanism 25 to dry the plurality of cut products Sa, but a plurality of cuts outside the container 21 A drying device for drying the product Sa may be provided.

<4> In the above-described embodiment, the inner cylinder 21b of the container 21 is rotated and reversed by the rotation and reversal mechanism 27 to drop a plurality of cut products Sa, but the rotation and reversal mechanism 27 is omitted. Alternatively, the cut product Sa in the container 21 may be taken out by suction or the like.

<5> In the above-described embodiment, in the drying process, while rotating the container 21 (intermediate cylinder T) by the rotary mechanism 22, the compressed air supplied by the air supply mechanism 25 is used. Although the plurality of cut products Sa are dried, the plurality of cut products Sa may be dried using compressed air supplied by the air supply mechanism 25 in a state in which rotation of the container 21 is stopped.

<6> In the conveyance mechanism 4 in the above-described embodiment, the liquid supply mechanism 43 is connected to the one end 42a of the fluid pipe 42, and a plurality of cut products Sa are conveyed by a liquid flow. However, the liquid supply mechanism 43 may be omitted, and a plurality of cut products Sa may be conveyed only by suction by the vacuum mechanism 29.

<7> In the transport mechanism 4 shown in the above <1>, the transport box 4A was transported to the container 21, but a plurality of cut products (Sa) separated from the cutting table 12b by the moving body 44 ) May be conveyed to the container 21 by suction or liquid flow.

<8> In the above-described embodiment, the inner cylinder 21b and the outer cylinder 28a of the container 21 are rotated by the rotation mechanism 22, but only the inner cylinder 21b of the container 21 may be rotated, and the container ( The inner cylinder 21b and the intermediate cylinder T of 21) may be rotated, and the rotation object is not particularly limited.

<9> In the above-described embodiment, one end of the liquid supply pipe 23a is connected to a water supply or a pure water supply pipe in a factory, and one end of the drain pipe 24a and the drain pipe 28b is connected to a sewer or a drain pipe in the factory. , A cleaning liquid tank may be provided in the fluid supply/discharge mechanism 2B, and one end of the liquid supply pipe 23a, the liquid drain pipe 24a, and the drain pipe 28b may be connected to the cleaning liquid tank to circulate the cleaning liquid. In this case, it is preferable to provide a filtering mechanism for filtering the washing liquid in the liquid supply pipe 23a or the drain pipe 24a and the drain pipe 28b.

<10> The container 21 may not be inclined with respect to the direction of gravity, and may be in an upright posture along the direction of gravity. In addition, the bottom wall of the inner cylinder 21b may be formed flat without providing the inclined surface 21b1.

[Summary of the above embodiment]

Hereinafter, the outline of the manufacturing method of the cleaning module 2, the cutting device D, and the cut product Sa described in the above-described embodiment will be described.

(1) The characteristic configuration of the cleaning module 2 is a container 21 for accommodating a plurality of cut products Sa formed by cutting the package substrate S, and a rotating mechanism 22 for rotating the container 21 Wow, a liquid supply mechanism 23 for supplying the cleaning liquid into the container 21, and a drainage mechanism 24 for discharging the cleaning liquid in the container 21, wherein the plurality of cut products Sa are immersed in the cleaning liquid. It is in the point that it is cleaned in the container 21 rotated by the rotating mechanism 22 in FIG.

According to this configuration, a liquid flow that swings in the container 21 rotated by the rotation mechanism 22 is generated, and a plurality of cut products Sa are cleaned with the cleaning liquid. That is, the cutting product Sa is cleaned while being immersed in the cleaning liquid, rather than spraying a cleaning solution or cleaning with a cleaning brush on the cut product Sa, which is in a stationary state, as in the prior art. The chip shift and scattering of Sa) can be prevented, and the entire cut product Sa can be cleaned without omission. As a result, even if the size of the cut product Sa is small, it becomes possible to clean up to every nook and cranny, and the cleaning efficiency can be improved.

Further, since the container 21 supplied with the cleaning liquid is rotated, the cleaning configuration of the cut product Sa is simple, and the supply and discharge of the cleaning liquid are also very easy. In this way, the cleaning module 2 capable of increasing the cleaning efficiency could be provided.

(2) An air supply mechanism 25 for supplying compressed air (gas) into the container 21 and an exhaust mechanism 26 for discharging air (gas) in the container 21 may be further provided.

If the air supply mechanism 25 and the exhaust mechanism 26 are provided as in this configuration, the cut product Sa after washing can be dried in the container 21. As a result, it is not necessary to separately provide a drying container outside the container 21, and compactness of the cleaning module 2 is achieved.

(3) The inner cylinder 21b (container 21) may be further provided with a rotation and reversing mechanism 27 (reversing mechanism) for vertically inverting.

If the rotation and reversal mechanism 27 for inverting the inner cylinder 21b is provided as in this configuration, the cut product Sa can be dispensed smoothly. In addition, since the cut product Sa in a sucked state is not dispensed with the brush as in the prior art, there is no problem that the cut product Sa is caught or scattered by the brush.

(4) The container 21 includes an inner cylinder 21b (the contents) in which a fine hole 21c (through hole) having a size in which the cut product Sa does not pass through at least on the bottom wall, and the outer side of the inner cylinder 21b It includes an outer cylinder 28a (outer container) disposed in, and an intermediate cylinder T (compartment wall) is formed between the inner cylinder 21b and the outer cylinder 28a, and the cleaning liquid supplied to the inner cylinder 21b is A drain mechanism 28 for draining from the outer cylinder 28a the cleaning liquid, which is present on the inner side of the inner cylinder 21b and the intermediate cylinder T through the fine hole 21c, and has passed through the top of the intermediate cylinder T among the cleaning solutions. You may further include.

As in this configuration, if the drain mechanism 28 for draining the cleaning liquid that has passed through the top of the intermediate cylinder T from the outer cylinder 28a is provided, the mechanism for adjusting the water level is simple.

(5) The container 21 may be disposed inclined with respect to the direction of gravity.

If the container 21 is arranged inclined with respect to the direction of gravity as in this configuration, when the container 21 is rotated, the positions of the plurality of cut products Sa are liable to fluctuate in the vertical direction. That is, since the fluidity of the plurality of cut products Sa is improved, the cleaning efficiency and drying efficiency of the cut products Sa can be improved.

(6) The inner surface of the bottom wall of the inner cylinder 21b (container 21) may be formed as an inclined surface 21b1 inclined toward the direction of gravity as it approaches the rotation shaft 22b of the rotation mechanism 22.

If the inner surface of the bottom wall of the inner cylinder 21b is formed as an inclined surface 21b1 as in this configuration, when the container 21 is rotated, the plurality of cut products Sa deposited on the central portion of the bottom wall of the container 21 The position moves outward in the radial direction. As a result, it becomes possible to reduce the overlapping of a plurality of cut products Sa, and the cleaning efficiency and drying efficiency of the cut products Sa can be improved.

(7) The characteristic configuration of the cutting device D is the cleaning module 2 according to any one of the above (1) to (6), the cutting mechanism 12 for cutting the package substrate S, and the cutting mechanism ( It is in the point provided with the conveyance mechanism 4 which conveys the plurality of cut products Sa formed by cutting by 12) to the container 21.

In this configuration, a cleaning module 2 having high cleaning efficiency is provided, and a transfer mechanism 4 for transferring the cut product Sa to the container 21 for cleaning is provided, so that cutting with high cleaning efficiency Device D can be provided.

(8) The conveyance mechanism 4 may suck a plurality of cut products Sa by the nozzle 41 (suction nozzle) and convey it to the container 21.

In this configuration, since the cut product Sa is sucked by the nozzle 41 and conveyed to the container 21, even when the size of the cut product Sa is small, it can be sucked and conveyed at once.

(9) The conveyance mechanism 4 may convey a plurality of cut products Sa to the container 21 by a liquid flow.

As in this configuration, when the cut product Sa is conveyed to the container 21 by a liquid flow, the cut product Sa can be smoothly conveyed.

(10) The conveyance mechanism 4 has a storage part 45 for storing a plurality of cut products Sa, and a storage part 45 in which a plurality of cut products Sa are accommodated in the vicinity of the container 21 By conveying to, a plurality of cut products Sa may be transferred from the storage portion 45 to the container 21.

As in this configuration, if the cut product (Sa) is stored in the storage unit 45 before moving to the container 21, it is only necessary to transport the storage unit 45 in which a plurality of cut products (Sa) are stored. You can increase the efficiency.

(11) The characteristics of the manufacturing method of the cut product Sa are the cutting process of cutting the package substrate S to form a plurality of cut products Sa, and the plurality of cut products Sa into the container 21. The receiving process to accommodate, the cleaning process of supplying the cleaning liquid into the container 21, rotating the container 21 to clean a plurality of cut products Sa, and the inner cylinder 21b (container 21) are vertically reversed. It is in a point including a take-out step of taking out a plurality of cut products Sa.

According to this method, a liquid flow is generated in the container 21 rotated by the rotation mechanism 22, and a plurality of cut products Sa are cleaned with the cleaning liquid. That is, the cutting product Sa is cleaned while being immersed in the cleaning liquid, rather than spraying a cleaning solution or cleaning with a cleaning brush against the cutting product Sa, which is in a stationary state, as in the prior art. ) Chip shift and scattering can be prevented, and the entire cut product (Sa) can be thoroughly cleaned. As a result, even if the size of the cut product Sa is small, it becomes possible to clean up to every nook and cranny, and the cleaning efficiency can be improved. In addition, since the cut product Sa is taken out by inverting the inner cylinder 21b up and down, the cut product Sa in a sucked state is not dispensed with a brush as in the prior art, and the cut product Sa is applied to the brush. There is no problem of being caught or scattered.

(12) After cleaning a plurality of cut products (Sa) by a cleaning process, the cleaning solution is discharged, and compressed air (gas) is supplied into the container 21 to dry the plurality of cut products (Sa) while rotating the container. You may further include a drying process to let you do.

When washing and drying of the cut product Sa is completed in the container 21 as in this method, there is no need to separately provide a drying container, and the cutting device D is compacted. In addition, since the plurality of cut products Sa are dried while rotating the container 21, the entire cut product Sa can be dried by flowing the plurality of cut products Sa.

(13) After the cutting process and before the cleaning process, a transfer process of transferring the plurality of cut products Sa to the container 21 is further included, and the transfer process includes a plurality of cut products by means of a nozzle 41 (suction nozzle). (Sa) may be sucked and conveyed to the container 21.

In this method, since the cut product Sa is sucked by the nozzle 41 and conveyed to the container 21, even when the size of the cut product Sa is small, it can be sucked and conveyed at once.

(14) After the cutting process and before the cleaning process, a transfer process of transferring the plurality of cut products Sa to the container 21 is further included, and the transfer process includes the plurality of cut products Sa by a liquid flow to the container 21 ).

As in this method, when the cut product Sa is conveyed to the container 21 by a liquid flow, the cut product Sa can be smoothly conveyed.

(15) After the cutting process and before the cleaning process, a transfer process of transferring the plurality of cut products Sa to the container 21 is further included, and the transfer process includes the plurality of cut products Sa to the storage unit 45. After receiving and conveying the storage part 45 to the vicinity of the container 21, a plurality of cut products Sa may be moved from the storage part 45 to the container 21.

As in this method, if the cut product (Sa) is stored in the storage unit 45 before being transferred to the container 21, it is only necessary to transport the storage unit 45 in which a plurality of cut products (Sa) are stored. You can increase the efficiency.

In addition, the configuration disclosed in the above-described embodiment (including other embodiments, the same hereinafter) can be applied in combination with the configuration disclosed in the other embodiments, as long as no contradiction occurs. In addition, embodiment disclosed in this specification is an illustration, embodiment of this invention is not limited to this, It is possible to change suitably within the range which does not deviate from the object of this invention.

The present invention can be used for a cleaning module, a cutting device equipped with a cleaning module, and a method for manufacturing a cut product, and is particularly effective when the size of the cut product is smaller than a square having a side of 2 mm.

1: cutting module
2: cleaning module
2A: cleaning mechanism
3: control unit
4: conveyance mechanism
12: cutting mechanism
21: Courage
21b: inner box (contents)
21b1: slope
21c: fine hole (through hole)
22: rotating mechanism
22b: rotating shaft
23: supply mechanism
24: drainage mechanism
25: air supply mechanism
26: exhaust mechanism
27: rotation and reversal mechanism
27a: chuck mechanism
27b: rotating mechanism
27c: inner cylinder reversing mechanism (reversing mechanism)
27d: inner cylinder upper and lower mechanism
28: drain mechanism
28a: external cylinder (external container)
29: vacuum apparatus
41: nozzle (suction nozzle)
42: fluid pipe
43: liquid supply mechanism
44: moving object
45: storage unit
D: cutting device
E: resin molding device
S: package board
Sa: cut product
T: middle barrel (compartment wall)

Claims (15)

A container for accommodating a plurality of cut products formed by cutting the package substrate,
A rotating mechanism for rotating the container,
A liquid supply mechanism for supplying a cleaning liquid into the container,
And a drainage mechanism for discharging the cleaning liquid in the container,
A cleaning module in which the plurality of cut products are cleaned in the container rotated by the rotating mechanism while immersed in the cleaning liquid. The method of claim 1,
A cleaning module further comprising an air supply mechanism for supplying gas into the container, and an exhaust mechanism for discharging the gas in the container. The method of claim 1,
A cleaning module further comprising an inversion mechanism for vertically inverting the container. The method of claim 1,
The container includes an inner container in which a through hole having a size through which the cut product does not pass through at least a bottom wall is formed, and an external container disposed outside the inner container,
A partition wall is formed between the inner container and the outer container, and the cleaning liquid supplied to the inner container is present inside the inner container and the partition wall through the through hole,
A cleaning module further comprising a drain mechanism for draining the cleaning liquid from the external container among the cleaning liquids, which has passed over the top of the partition wall. The method of claim 1,
The container is a cleaning module disposed inclined with respect to the direction of gravity. The method of claim 1,
A cleaning module in which the inner surface of the bottom wall of the container is formed as an inclined surface inclined toward the direction of gravity as it approaches the rotation axis of the rotation mechanism. The cleaning module according to any one of claims 1 to 6, and
A cutting mechanism for cutting the package substrate,
A cutting device including a conveying mechanism for conveying a plurality of cut products cut and formed by the cutting mechanism to the container. The method of claim 7,
The conveying mechanism is a cutting device that sucks a plurality of cut products by a suction nozzle and conveys them to the container. The method of claim 7,
The conveying mechanism is a cutting device that conveys a plurality of the cut products to the container by a liquid flow. The method of claim 7,
The conveying mechanism has a storage unit for storing a plurality of the cut products, and conveys the storage unit in which the plurality of cut products are stored to the vicinity of the container, and transfers the plurality of cut products from the storage unit to the container. Cutting device. A cutting process of cutting the package substrate to form a plurality of cut products,
A receiving process of accommodating a plurality of the cut products in a container,
A cleaning step of supplying a cleaning liquid into the container and rotating the container to clean the plurality of cut products;
A method for manufacturing a cut product comprising a take-out step of inverting the container up and down to take out a plurality of cut products. The method of claim 11,
A method for producing a cut product, further comprising a drying step of discharging the cleaning liquid after washing the plurality of cut products by the cleaning process, and drying the plurality of cut products while rotating the container by supplying gas into the container. . The method of claim 11 or 12,
It further comprises a conveying step of conveying the plurality of cut products to the container after the cutting step and before the cleaning step,
The conveyance step is a method for producing a cut product in which a plurality of cut products are sucked by a suction nozzle and are conveyed to the container. The method of claim 11 or 12,
It further comprises a conveying step of conveying the plurality of cut products to the container after the cutting step and before the cleaning step,
The conveying step is a method for producing a cut product in which a plurality of cut products are conveyed to the container by a liquid flow. The method of claim 11 or 12,
It further comprises a conveying step of conveying the plurality of cut products to the container after the cutting step and before the cleaning step,
In the conveyance step, a plurality of cut products are accommodated in a storage unit, the storage unit is conveyed to the vicinity of the container, and then a plurality of cut products are transferred from the storage unit to the container.

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