WO2023079807A1 - Cutting device and method for manufacturing cut article - Google Patents

Cutting device and method for manufacturing cut article Download PDF

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Publication number
WO2023079807A1
WO2023079807A1 PCT/JP2022/030037 JP2022030037W WO2023079807A1 WO 2023079807 A1 WO2023079807 A1 WO 2023079807A1 JP 2022030037 W JP2022030037 W JP 2022030037W WO 2023079807 A1 WO2023079807 A1 WO 2023079807A1
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WO
WIPO (PCT)
Prior art keywords
blade
flange
cleaning
spindle
cutting device
Prior art date
Application number
PCT/JP2022/030037
Other languages
French (fr)
Japanese (ja)
Inventor
聡子 堀
将馬 大西
翔 吉岡
京太郎 堀本
Original Assignee
Towa株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa株式会社 filed Critical Towa株式会社
Priority to CN202280054149.0A priority Critical patent/CN117794689A/en
Priority to KR1020247003933A priority patent/KR20240024291A/en
Publication of WO2023079807A1 publication Critical patent/WO2023079807A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00Means for securing grinding wheels on rotary arbors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007Cleaning of grinding wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06Dust extraction equipment on grinding or polishing machines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present invention relates to technology of a cutting device and a method of manufacturing a cut product.
  • Patent Document 1 discloses a cutting device equipped with a blade replacement mechanism that can replace the blade attached to the spindle. Specifically, the blade replacement mechanism described in Patent Literature 1 holds a blade and a flange for fixing the blade, which can be attached to and detached from the spindle. A blade change mechanism allows blade changes to occur automatically.
  • the present invention has been made in view of the above circumstances, and the problem to be solved is to provide a cutting device and a method for manufacturing a cut product that can clean the flange.
  • the cutting device includes a blade changing mechanism for changing a blade provided in a spindle portion, and a blade changing mechanism for changing the blade to the spindle. a cleaning mechanism for cleaning the pair of flanges for fixing to the part.
  • the method for manufacturing a cut product according to the present invention includes steps of replacing the blade provided on the spindle portion using the cutting device, cleaning the pair of flanges, and cutting an object to be cut with the blade. and C. cutting the object.
  • the flange can be cleaned.
  • FIG. 2 is an enlarged cross-sectional perspective view showing the configuration of the spindle section;
  • the sealed substrate W for example, a BGA (ball grid array) package substrate, a CSP (chip size package) package substrate, an LED (light emitting diode) package substrate, or the like is used.
  • a sealed lead frame obtained by resin-sealing a lead frame having a semiconductor chip mounted thereon may be used.
  • the cutting device 1 shown in FIG. 1 is a processing device that separates a plurality of cut products (products P) by cutting a sealed substrate W, which is an object to be cut.
  • the cutting device 1 comprises a substrate supply module A, a cutting module B and a storage module C as components. Each component is removable and replaceable with respect to other components.
  • the substrate supply module A is mainly provided with a substrate supply mechanism 11 and a controller CTL.
  • the sealed substrate W which is the object to be cut, is unloaded from the substrate supply mechanism 11 and transferred to the cutting module B by a transfer mechanism (not shown).
  • the control section CTL controls the operation of each section of the cutting device 1 .
  • the controller CTL can be provided in a module other than the substrate supply module A.
  • the control unit CTL can be divided into a plurality of units. For example, each module may be provided with a control unit CTL, and each unit may be controlled by linking the control units CTL.
  • the cutting module B shown in FIG. 1 mainly includes a cutting table 21, a cutting jig 22, a moving mechanism 23, a rotating mechanism 24, a spindle section 25, a partition wall 26, a blade changing table 27, a blade changing mechanism 100, and a closing section. 200, a first cleaning mechanism 310 (cleaning mechanism 300) and a second cleaning mechanism 320 (cleaning mechanism 300) are provided.
  • a twin-cut table type cutting device 1 having two cutting tables 21 is exemplified.
  • a cutting jig 22 is provided on the cutting table 21 .
  • the cutting table 21 can be moved in the Y direction by a moving mechanism 23 and can be rotated in the ⁇ direction by a rotating mechanism 24 .
  • the cutting device 1 having a twin-spindle structure having two spindle portions 25 is exemplified.
  • the two spindles 25 are independently movable in the X and Z directions.
  • the partition wall 26 is provided at an appropriate position so as to partition the space in which the spindle part 25 is arranged and the space in which the blade exchange table 27 is arranged.
  • the partition wall 26 is arranged behind one spindle portion 25 (on the right side in the drawing).
  • the partition wall 26 is arranged so as to surround the blade exchange table 27 .
  • a part of the partition wall 26 is formed with an opening 26a that connects the space in which the spindle part 25 is arranged and the space in which the blade exchange table 27 is arranged.
  • a used blade housing section 27a housing a used blade 25a used in the spindle section 25 and a replacement unused blade 25a are housed on the upper surface of the blade exchange table 27.
  • An unused blade accommodation portion 27b is provided.
  • the used blade housing portion 27a is formed in a box shape with an open top.
  • a second cleaning mechanism 320 (cleaning mechanism 300), which will be described later, is provided on the upper surface of the blade exchange table 27. As shown in FIG.
  • the configurations of the unused blade storage portion 27b and the used blade storage portion 27a are not limited to this embodiment, and can be arbitrarily changed.
  • the used blade housing portion 27a may be configured to have a columnar member extending vertically. In such a configuration, it is possible to hold the blade 25a by inserting the center of the blade 25a into the cylindrical member.
  • the blade replacement mechanism 100 replaces the blade 25a provided on the spindle section 25.
  • the blade exchange mechanism 100 is arranged behind the two spindles 25 (on the right side in the drawing).
  • the blade replacement mechanism 100 is provided with a closing portion 200 capable of closing the opening 26 a of the partition wall 26 .
  • the blade exchange mechanism 100 is also provided with a first cleaning mechanism 310 (cleaning mechanism 300), which will be described later.
  • the sealed substrate W is cut by relatively moving the cutting table 21 and the two spindles 25 while the sealed substrate W is held on the cutting table 21. can be individualized.
  • the blade 25a of the spindle part 25 cuts the sealed substrate W held on the cutting table 21 by rotating in a plane including the Y direction and the Z direction. At this time, the sealed substrate W can also be cut while spraying cutting water toward the blade 25a.
  • the storage module C is mainly provided with an inspection table 31 and a tray 32 .
  • an assembly of a plurality of products P obtained by cutting the sealed substrate W into individual pieces is placed.
  • a plurality of products P are inspected by an inspection camera (not shown) and sorted into non-defective products and defective products.
  • the sorted non-defective products are accommodated in the tray 32 .
  • the sorted defective products are accommodated in a separately prepared tray (not shown) and excluded from the products P. Note that it is not always necessary to inspect the product P in the storage module C.
  • the blade replacement mechanism 100 mainly includes a support section 110, a holding section 120 and a moving section .
  • the support part 110 supports the holding part 120 and the first cleaning mechanism 310 which will be described later.
  • the support portion 110 can be formed by combining appropriate members (bar-shaped member, plate-shaped member, etc.).
  • the support part 110 is formed in a long shape elongated in one direction (the X direction in FIGS. 2 and 3).
  • the holding portion 120 is capable of holding the blade 25 a provided on the spindle portion 25 and the second flange 25 d for fixing the blade 25 a to the spindle portion 25 .
  • the holding portion 120 is provided at one end portion of the support portion 110 in the longitudinal direction.
  • FIG. 4 shows a partial cross section of one of the two spindles 25 (spindle 25 on the left side of the page in FIG. 2).
  • a substantially annular first flange 25c is fixed to the rotating shaft 25b of the spindle portion 25 . Furthermore, a substantially annular second flange 25d is provided so as to face the first flange 25c.
  • the first flange 25c and the second flange 25d are embodiments of one flange and the other flange, respectively, according to the present invention.
  • the second flange 25d is pressed toward the first flange 25c by tightening the detachable member 25e such as a nut to the boss portion of the first flange 25c.
  • a first contact surface 25f and a second contact surface 25g projecting in directions facing each other are formed on the outer peripheral portions of the first flange 25c and the second flange 25d.
  • a substantially annular blade 25a is sandwiched and fixed between the first contact surface 25f and the second contact surface 25g.
  • the holding part 120 shown in FIGS. 2 and 3 can rotate the detachable member 25e attached to the spindle part 25 to attach and detach the detachable member 25e to the boss portion of the first flange 25c. Further, the holding portion 120 can hold the blade 25a and the second flange 25d independently.
  • a method for holding the blade 25a and the second flange 25d by the holding portion 120 for example, there is a method of holding the blade 25a by suction, a method of hooking the blade 25a or the like with a claw-like member to hold the blade 25a mechanically, and the like. mentioned.
  • the holding section 120 can remove the blade 25 a and the second flange 25 d attached to the spindle section 25 from the spindle section 25 . Moreover, the holding part 120 can attach the blade 25a and the second flange 25d that it holds to the spindle part 25 .
  • the moving part 130 moves the supporting part 110 in any direction.
  • the moving part 130 mainly includes a rotating part 131 , a first linear moving part 132 , a second linear moving part 133 and a third linear moving part 134 .
  • the rotating part 131 rotates the supporting part 110 .
  • the rotating portion 131 can support the supporting portion 110 and rotate the supporting portion 110 using the driving force of a driving source such as a motor.
  • the rotating portion 131 can rotate the supporting portion 110 around an axis parallel to the Y direction.
  • the first linear moving part 132 moves the rotating part 131 linearly.
  • the first linear moving part 132 supports the rotating part 131 and can move the rotating part 131 using the driving force of a driving source such as a motor.
  • the first linear moving part 132 can linearly move the rotating part 131 along the Y direction.
  • the second linear movement section 133 linearly moves the first linear movement section 132 .
  • the second linearly moving part 133 supports the first linearly moving part 132 and can move the first linearly moving part 132 using the driving force of a driving source such as a motor.
  • the second linear movement part 133 can linearly move the first linear movement part 132 along the Z direction.
  • the third linear movement section 134 shown in FIG. 2 linearly moves the second linear movement section 133 .
  • the third linearly moving part 134 supports the second linearly moving part 133 and can move the second linearly moving part 133 using the driving force of a driving source such as a motor.
  • the third linear movement section 134 can linearly move the second linear movement section 133 along the X direction.
  • the supporting part 110 can be moved to an arbitrary position and arbitrarily rotated around the axis along the Y direction.
  • the closing part 200 can close the opening 26 a of the partition wall 26 .
  • the closing portion 200 is formed in a plate shape corresponding to the opening portion 26a.
  • the closing part 200 is arranged on one side of the support part 110 (on the right side of the drawing in FIG. 2) in the X direction.
  • the closing part 200 is provided on the moving part 130 with the plate surface facing in the X direction.
  • the blocking part 200 is provided on the second linear movement part 133 and can be linearly moved in the X direction by the third linear movement part 134 .
  • the cleaning mechanism 300 is for cleaning the flanges (the first flange 25c and the second flange 25d) for fixing the blade 25a to the spindle portion 25. As shown in FIG.
  • the cleaning mechanism 300 mainly comprises a first cleaning mechanism 310 and a second cleaning mechanism 320 .
  • the first cleaning mechanism 310 shown in FIG. 3 cleans the first flange 25c attached to the spindle portion 25.
  • the first cleaning mechanism 310 shown in FIG. The first cleaning mechanism 310 mainly comprises a first cleaning sponge 311 and air nozzles 312 .
  • the first cleaning sponge 311 shown in FIGS. 3 and 5(a) is a cleaning member for cleaning the first flange 25c.
  • the first cleaning sponge 311 is formed in a cylindrical shape having the same outer diameter as the first flange 25c.
  • the first cleaning sponge 311 is attached to one longitudinal end of the support 110 via a disk-shaped attachment member 311a.
  • the first cleaning sponge 311 is provided on the side opposite to the holding portion 120 in the longitudinal direction of the support portion 110 .
  • the first cleaning sponge 311 is provided at a position inverted 180 degrees from the holding portion 120 with the rotating shaft of the rotating portion 131 as the center.
  • the "side opposite to the holding section 120" on which the first cleaning sponge 311 is arranged is an example of the "side different from the holding section" according to the present invention.
  • the first cleaning sponge 311 is not limited to the cylindrical shape shown in FIG. 5(a), and may be of any shape.
  • a cylinder may be divided into a plurality of pieces. As a result, the corners of the sponge can clean the first flange 25c, and the cleaning ability of the first cleaning sponge 311 can be improved.
  • the air nozzle 312 shown in FIG. 3 can blow out compressed air supplied from a compressor (not shown).
  • the air nozzle 312 is provided at one longitudinal end of the support 110 (on the same side as the first cleaning sponge 311).
  • the air nozzle 312 is arranged with the blowing direction of air directed toward the first cleaning sponge 311 side.
  • the second cleaning mechanism 320 cleans the second flange 25d that has been removed from the spindle section 25 (held by the holding section 120).
  • the second cleaning mechanism 320 mainly includes a second cleaning sponge 321 and a driving section 322 .
  • the second cleaning sponge 321 shown in FIG. 2 is a cleaning member for cleaning the second flange 25d.
  • the second cleaning sponge 321 is formed in a cylindrical shape having the same diameter as the second flange 25d.
  • the second cleaning sponge 321 is formed in the same shape as the first cleaning sponge 311 shown in FIG.
  • the second cleaning sponge 321 is provided on the upper surface of the blade exchange table 27 with the axis of the cylinder directed in the Z direction.
  • the driving section 322 rotates the second cleaning sponge 321 .
  • the drive unit 322 has a drive source such as a motor, for example.
  • the output shaft of the drive part 322 is connected to the second cleaning sponge 321 .
  • the driving force of the driving portion 322 can rotate the second cleaning sponge 321 around an axis parallel to the Z direction.
  • the blocking part 200 stands by at a position blocking the opening 26a of the partition wall 26, as indicated by the two-dot chain line in FIG.
  • the opening 26a By closing the opening 26a with the closing part 200 in this way, the space in which the blade exchange table 27 is arranged and the space in which the spindle part 25 is arranged can be separated.
  • the holding section 120 and the first cleaning mechanism 310 are located in the space where the blade exchange table 27 is arranged.
  • the cutting of the sealed substrate W by the cutting device 1 is temporarily interrupted.
  • the replacement of the blade 25a and the cleaning of the first flange 25c and the second flange 25d can be performed at any timing.
  • the wear amount of the blade 25a can be detected by an appropriate sensor, and the blade 25a can be replaced when the wear amount exceeds a certain amount.
  • the blade 25a can be replaced at the timing when the operation time of the cutting device 1, the production number of the product P, and the like exceed a predetermined value.
  • the moving part 130 moves the closing part 200 integrally with the supporting part 110 and the holding part 120, and the opening 26a of the partition wall 26 is opened.
  • the support portion 110 and the like can move between the space on the spindle portion 25 side and the space on the blade exchange base 27 side through the opened opening portion 26a.
  • the support section 110 is turned over by the moving section 130, and the holding section 120 is moved to a position facing the blade 25a of the spindle section 25. As shown in FIG. Then, the second flange 25 d and the blade 25 a are removed from the spindle portion 25 by the holding portion 120 .
  • the holding part 120 is moved by the moving part 130 to a position facing the used blade storage part 27a provided in the blade exchange table 27 from above. Then, the holding portion 120 releases the blade 25a, and the used blade 25a is stored in the used blade storage portion 27a.
  • the moving part 130 moves the second flange 25d held by the holding part 120 to a position where it comes into contact with the upper surface of the second cleaning sponge 321 of the second cleaning mechanism 320. be.
  • the drive unit 322 rotates the second cleaning sponge 321 to clean the surface of the second flange 25d (particularly, the second contact surface 25g shown in FIG. 4). As a result, chips and the like adhering to the second flange 25d can be removed.
  • the holding section 120 is moved by the moving section 130 to a position facing the unused blade housing section 27b provided in the blade exchange base 27 from above.
  • the unused blade 25a housed in the unused blade housing portion 27b is held by the holding portion 120.
  • the holding portion 120 can store the used blade housing portion 27a and the unused blade housing portion 27a. The movement distance when moving between the blade accommodating portion 27b and the second cleaning mechanism 320 can be kept short.
  • the support portion 110 is moved by the moving portion 130, and the tip of the air nozzle 312 is directed to the first flange 25c attached to the spindle portion 25. Then, as shown in FIG. In this state, air is blown out from the air nozzle 312 to remove shavings and water droplets adhering to the first flange 25c.
  • the moving part 130 moves the first cleaning sponge 311 of the first cleaning mechanism 310 to a position where it comes into contact with the first flange 25c attached to the spindle part 25. Then, as shown in FIG. In this state, the rotation of the spindle portion 25 cleans the surface of the first flange 25c (especially the first contact surface 25f shown in FIG. 4). As a result, chips and the like adhering to the first flange 25c can be removed.
  • the support section 110 is turned over by the moving section 130, and the holding section 120 is moved to a position facing the first flange 25c of the spindle section 25. As shown in FIG. Then, the second flange 25 d and the blade 25 a held by the holding portion 120 are attached to the spindle portion 25 .
  • the closing part 200 moves to the position to close the opening part 26a of the partition wall 26 again. (See Figure 2). Thereafter, the cutting of the sealed substrate W by the cutting device 1 is resumed.
  • the step of replacing the blade 25a provided on the spindle portion 25 and the step of cleaning the first flange 25c and the second flange 25d can be performed in parallel. Further, a step of cutting the sealed substrate W with the replaced blade 25a can be performed.
  • the cutting apparatus 1 includes a blade replacement mechanism 100 for replacing the blade 25a provided on the spindle portion 25, and a pair of flanges for fixing the blade 25a to the spindle portion 25. and a cleaning mechanism 300 for cleaning the first flange 25c and the second flange 25d).
  • a blade replacement mechanism 100 for replacing the blade 25a provided on the spindle portion 25, and a pair of flanges for fixing the blade 25a to the spindle portion 25.
  • a cleaning mechanism 300 for cleaning the first flange 25c and the second flange 25d.
  • the cleaning mechanism 300 includes a first cleaning mechanism 310 that cleans the first flange 25c (one flange) of the pair of flanges, and a second flange 25d (the other flange) of the pair of flanges. and a second cleaning mechanism 320 that cleans the By configuring in this way, the pair of flanges can be cleaned more effectively by cleaning the pair of flanges individually.
  • the first cleaning mechanism 310 can clean the first flange 25c attached to the spindle portion 25, and the second cleaning mechanism 320 can clean the first flange 25c attached to the spindle portion 25.
  • the second flange 25d can be cleaned. With this configuration, the second flange 25d removed from the spindle portion 25 and the first flange 25c remaining on the spindle portion 25 when replacing the blade 25a can be cleaned.
  • the first cleaning mechanism 310 can clean the first flange 25c while the first flange 25c attached to the spindle portion 25 is rotated by the rotation of the spindle portion 25. As shown in FIG. With this configuration, the rotation of the spindle portion 25 can be used to clean the first flange 25c. As a result, the structure of the first cleaning mechanism 310 can be simplified.
  • the blade replacement mechanism 100 includes a holding portion 120 capable of holding the blade 25a and the second flange 25d, a support portion 110 supporting the holding portion 120 and the first cleaning mechanism 310, and the and a moving part 130 capable of moving the support part 110 , and the first cleaning mechanism 310 is provided on a different side of the support part 110 from the holding part 120 .
  • the first cleaning mechanism 310 and the holding portion 120 are provided on the opposite sides, the bias of the center of gravity of the support portion 110 can be effectively prevented.
  • the second cleaning mechanism 320 can clean the second flange 25d held by the holding portion 120. As shown in FIG. With this configuration, the second flange 25d held by the holding portion 120 can be washed as it is when the blade 25a is replaced, so the second flange 25d can be washed efficiently.
  • the cutting device 1 partitions the space in which the spindle portion 25 is arranged and the space in which the replacement blade 25a is arranged, and is moved by the partition wall 26 having the opening portion 26a and the moving portion 130. and a closing portion 200 that closes the opening 26a when the blade changing mechanism 100 is in place.
  • the holder 120 and the like can be moved through the opening 26a, and the opening 26a can be closed by the closing part 200 as necessary. For example, by closing the opening 26a with the closing part 200 during the cutting of the sealed substrate W, it is possible to prevent shavings and the like from adhering to the replacement blade 25a.
  • the holding portion 120 and the first cleaning mechanism 310 are arranged in the space on the replacement blade 25a side. It is also possible to prevent shavings and the like generated during the cutting of W from adhering to the holding portion 120 and the like.
  • the method for manufacturing the product P (cut product) includes steps of replacing the blade 25a provided on the spindle portion 25 using the cutting device 1, and cleaning the pair of flanges. and a step of cutting the sealed substrate W (object to be cut) with the blade 25a.
  • the flange can be cleaned.
  • the process of replacing the blade 25a and the process of cleaning the pair of flanges can be performed in parallel, so that the product P can be manufactured efficiently.
  • the configuration of the moving unit 130 of the present embodiment is an example, and any configuration capable of moving the holding unit 120 and the first cleaning mechanism 310 to the required positions is a specific configuration. is not limited.
  • the closing part 200 is provided in the second linearly moving part 133, the present invention is not limited to this. That is, the closing part 200 may be configured to be moved by the moving part 130 to close the opening 26a. is also possible.
  • the shapes of the first cleaning sponge 311 and the second cleaning sponge 321 are not limited to the shapes of this embodiment (see FIG. 5), and can be arbitrarily changed.
  • the cleaning mechanism 300 performs cleaning using sponges (the first cleaning sponge 311 and the second cleaning sponge 321) as cleaning members
  • the present invention is not limited to this. It is also possible to use a cleaning member (for example, a waste cloth, etc.).
  • the cleaning mechanism 300 cleans the flange with the sponge and the air nozzle 312, but the method of cleaning the flange is not limited to this, and any cleaning method can be used to clean the flange. It is possible. For example, it is also possible to clean the flange by spraying cleansing water on the flange, or to clean the flange by sucking chips and the like adhering to the flange. Also, the cleaning mechanism 300 can combine a plurality of cleaning methods to clean the flange.
  • FIGS. 7B and 7C an example of cleaning the first flange 25c with the first flange 25c attached to the spindle portion 25 (see FIGS. 7B and 7C) was shown, but the present invention is not limited to For example, the cleaning of the first flange 25c may be performed after the first flange 25c is removed from the spindle portion 25.
  • FIG. a separate mechanism for attaching and detaching the first flange 25c may be provided to automatically attach and detach the first flange 25c.
  • the holding part 120 and the first cleaning mechanism 310 are provided on the opposite side of the support part 110 (a position reversed 180 degrees when viewed from the front, see FIG. 6, etc.) was shown, but the present invention is not limited to this, and the holding section 120 and the first cleaning mechanism 310 can be provided at arbitrary positions on the support section 110 .
  • the first cleaning mechanism 310 can be arranged at a position rotated by 90 degrees or rotated by 120 degrees with respect to the holding portion 120 .
  • both the holding part 120 and the first cleaning mechanism 310 are provided on the support part 110, and an example is shown in which they are moved integrally, but the present invention is not limited to this.
  • the holding part 120 and the first cleaning mechanism 310 may be provided on separate members and moved independently of each other.
  • cutting of the sealed substrate W by the cutting device 1 is temporarily interrupted to replace the blade 25a and clean the flange.
  • the timing to perform can be determined arbitrarily.
  • the blade 25a can be replaced before the cutting device 1 starts cutting the sealed substrate W or after the cutting device 1 has completely cut the sealed substrate W.
  • FIG. when a plurality of spindle units 25 are provided in the cutting device 1 as in the present embodiment, the blades 25a of the respective spindle units 25 may be replaced at the same timing or at different timings. is also possible.
  • Cutting Device 25 Spindle 25a Blade 25c First Flange 25d Second Flange 26 Partition Wall 26a Opening 100 Blade Replacement Mechanism 110 Supporting Part 120 Holding Part 130 Moving Part 200 Blocking Part 300 Cleaning Mechanism 310 First Cleaning Mechanism 320 Second Cleaning Mechanism

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Sawing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Provided are a cutting device capable of washing a flange, and a method for manufacturing a cut article. The present invention comprises: a blade replacement mechanism for replacing a blade provided on a spindle part; and a washing mechanism for washing a pair of flanges for fixing the blade to the spindle part.

Description

切断装置及び切断品の製造方法CUTTING DEVICE AND CUTTING PRODUCT MANUFACTURING METHOD
 本発明は、切断装置及び切断品の製造方法の技術に関する。 The present invention relates to technology of a cutting device and a method of manufacturing a cut product.
 特許文献1には、スピンドル部に取り付けられたブレードを交換可能なブレード交換機構を具備する切断装置が開示されている。具体的には、特許文献1に記載されているブレード交換機構は、ブレードと、ブレードを固定するためのフランジと、をそれぞれ保持し、スピンドル部に脱着することができる。ブレード交換機構によって、ブレードの交換を自動的に行うことができる。 Patent Document 1 discloses a cutting device equipped with a blade replacement mechanism that can replace the blade attached to the spindle. Specifically, the blade replacement mechanism described in Patent Literature 1 holds a blade and a flange for fixing the blade, which can be attached to and detached from the spindle. A blade change mechanism allows blade changes to occur automatically.
特開2019-5857号公報JP 2019-5857 A
 ここで、特許文献1に記載のような切断装置においては、切断時に生じる切削屑や水滴がフランジに付着することがあるため、適宜フランジの洗浄作業を行うことが好ましい。そこで、作業負担軽減の観点から、自動的にフランジの洗浄を行うことが可能な技術が求められている。 Here, in the cutting device as described in Patent Document 1, cutting chips and water droplets generated during cutting may adhere to the flange, so it is preferable to clean the flange as appropriate. Therefore, from the viewpoint of reducing the work load, there is a demand for a technique capable of automatically cleaning the flange.
 本発明は以上の如き状況に鑑みてなされたものであり、その解決しようとする課題は、フランジの洗浄を行うことが可能な切断装置及び切断品の製造方法を提供することである。 The present invention has been made in view of the above circumstances, and the problem to be solved is to provide a cutting device and a method for manufacturing a cut product that can clean the flange.
 本発明の解決しようとする課題は以上の如くであり、この課題を解決するため、本発明に係る切断装置は、スピンドル部に設けられたブレードを交換するブレード交換機構と、前記ブレードを前記スピンドル部に固定するための一対のフランジを洗浄する洗浄機構と、を備えるものである。 The problem to be solved by the present invention is as described above. In order to solve this problem, the cutting device according to the present invention includes a blade changing mechanism for changing a blade provided in a spindle portion, and a blade changing mechanism for changing the blade to the spindle. a cleaning mechanism for cleaning the pair of flanges for fixing to the part.
 また、本発明に係る切断品の製造方法は、前記切断装置を用いて、前記スピンドル部に設けられた前記ブレードを交換する工程と、前記一対のフランジを洗浄する工程と、前記ブレードで切断対象物を切断する工程と、を含むものである。 Further, the method for manufacturing a cut product according to the present invention includes steps of replacing the blade provided on the spindle portion using the cutting device, cleaning the pair of flanges, and cutting an object to be cut with the blade. and C. cutting the object.
 本発明によれば、フランジの洗浄を行うことができる。 According to the present invention, the flange can be cleaned.
一実施形態に係る切断装置の全体的な構成を示した平面模式図。BRIEF DESCRIPTION OF THE DRAWINGS The plane schematic diagram which showed the whole structure of the cutting device which concerns on one Embodiment. ブレード交換機構、洗浄機構及びスピンドルの位置関係を示した斜視図。The perspective view which showed the positional relationship of a blade exchange mechanism, a washing|cleaning mechanism, and a spindle. 移動部の動作を示した斜視図。The perspective view which showed the operation|movement of a moving part. スピンドル部の構成を示した拡大断面斜視図。FIG. 2 is an enlarged cross-sectional perspective view showing the configuration of the spindle section; (a)第一洗浄スポンジの形状を示した斜視図。(b)第一洗浄スポンジの変形例を示した斜視図。(a) A perspective view showing the shape of the first cleaning sponge. (b) A perspective view showing a modification of the first cleaning sponge. (a)エアノズルからの空気でブレードを洗浄する様子を示した模式図。(b)第二フランジ及びブレードがスピンドルから取り外される様子を示した模式図。(c)使用済みのブレードが収容される様子を示した模式図。(d)第二フランジが第二洗浄スポンジで洗浄される様子を示した模式図。(a) A schematic diagram showing how a blade is cleaned with air from an air nozzle. (b) A schematic diagram showing how the second flange and blade are removed from the spindle. (c) A schematic diagram showing how a used blade is stored. (d) The schematic diagram which showed a mode that the 2nd flange was wash|cleaned by the 2nd washing|cleaning sponge. (a)保持部が未使用のブレードを保持する様子を示した模式図。(b)エアノズルからの空気で第一フランジを洗浄する様子を示した模式図。(c)第一フランジが第一洗浄スポンジで洗浄される様子を示した模式図。(d)第二フランジ及びブレードがスピンドルに取り付けられる様子を示した模式図。(a) The schematic diagram which showed a mode that the holding|maintenance part hold|maintains an unused blade. (b) A schematic diagram showing how the first flange is cleaned with air from an air nozzle. (c) The schematic diagram which showed a mode that the 1st flange was wash|cleaned by the 1st washing sponge. (d) A schematic diagram showing how the second flange and blade are attached to the spindle.
<切断装置1の構成>
 まず、本実施形態に係る切断装置1の構成について説明する。本実施形態においては、例えば、切断装置1による切断対象物として、半導体チップが装着された基板を樹脂封止した封止済基板Wを用いる場合の、切断装置1の構成について説明する。
<Configuration of cutting device 1>
First, the configuration of the cutting device 1 according to this embodiment will be described. In this embodiment, for example, the configuration of the cutting apparatus 1 will be described in the case of using a sealed substrate W obtained by resin-sealing a substrate on which a semiconductor chip is mounted as an object to be cut by the cutting apparatus 1 .
 封止済基板Wとしては、例えば、BGA(Ball grid array)パッケージ基板、CSP(Chip size package)パッケージ基板、LED(Light emitting diode)パッケージ基板等が使用される。また、切断対象物としては、封止済基板Wだけでなく、半導体チップが装着されたリードフレームを樹脂封止した封止済みリードフレームが使用されることもある。 As the sealed substrate W, for example, a BGA (ball grid array) package substrate, a CSP (chip size package) package substrate, an LED (light emitting diode) package substrate, or the like is used. Moreover, as the object to be cut, not only the sealed substrate W, but also a sealed lead frame obtained by resin-sealing a lead frame having a semiconductor chip mounted thereon may be used.
 図1に示す切断装置1は、切断対象物である封止済基板Wを切断することによって、複数の切断品(製品P)に個片化する加工装置である。切断装置1は、構成要素として、基板供給モジュールA、切断モジュールB及び収納モジュールCを具備する。各構成要素は、他の構成要素に対して着脱可能かつ交換可能である。 The cutting device 1 shown in FIG. 1 is a processing device that separates a plurality of cut products (products P) by cutting a sealed substrate W, which is an object to be cut. The cutting device 1 comprises a substrate supply module A, a cutting module B and a storage module C as components. Each component is removable and replaceable with respect to other components.
<基板供給モジュールA>
 基板供給モジュールAには、主として基板供給機構11及び制御部CTLが設けられる。
<Substrate supply module A>
The substrate supply module A is mainly provided with a substrate supply mechanism 11 and a controller CTL.
 切断対象物である封止済基板Wは、基板供給機構11から搬出され、移送機構(不図示)によって切断モジュールBに移送される。制御部CTLは切断装置1の各部の動作を制御するものである。制御部CTLによって切断装置1の各部が制御されることで、封止済基板Wの搬入、封止済基板Wの切断、製品Pの検査、製品Pの搬出等を行うことができる。なお、制御部CTLは、基板供給モジュールA以外のモジュールに設けることも可能である。また制御部CTLは、複数に分割して設けることも可能である。例えば、各モジュールに制御部CTLを設け、制御部CTL同士を連係させて各部を制御することも可能である。 The sealed substrate W, which is the object to be cut, is unloaded from the substrate supply mechanism 11 and transferred to the cutting module B by a transfer mechanism (not shown). The control section CTL controls the operation of each section of the cutting device 1 . By controlling each part of the cutting device 1 by the control part CTL, loading of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, unloading of the product P, and the like can be performed. Note that the controller CTL can be provided in a module other than the substrate supply module A. Also, the control unit CTL can be divided into a plurality of units. For example, each module may be provided with a control unit CTL, and each unit may be controlled by linking the control units CTL.
<切断モジュールB>
 図1に示す切断モジュールBには、主として切断用テーブル21、切断用治具22、移動機構23、回転機構24、スピンドル部25、仕切壁26、ブレード交換台27、ブレード交換機構100、閉塞部200、第一洗浄機構310(洗浄機構300)及び第二洗浄機構320(洗浄機構300)が設けられる。
<Cutting module B>
The cutting module B shown in FIG. 1 mainly includes a cutting table 21, a cutting jig 22, a moving mechanism 23, a rotating mechanism 24, a spindle section 25, a partition wall 26, a blade changing table 27, a blade changing mechanism 100, and a closing section. 200, a first cleaning mechanism 310 (cleaning mechanism 300) and a second cleaning mechanism 320 (cleaning mechanism 300) are provided.
 本実施形態では、2個の切断用テーブル21を有するツインカットテーブル方式の切断装置1を例示している。切断用テーブル21には、切断用治具22が設けられる。切断用テーブル21は、移動機構23によってY方向に移動可能であり、かつ、回転機構24によってθ方向に回動可能である。 In this embodiment, a twin-cut table type cutting device 1 having two cutting tables 21 is exemplified. A cutting jig 22 is provided on the cutting table 21 . The cutting table 21 can be moved in the Y direction by a moving mechanism 23 and can be rotated in the θ direction by a rotating mechanism 24 .
 また本実施形態では、2個のスピンドル部25を有するツインスピンドル構成の切断装置1を例示している。2個のスピンドル部25は、互いに独立してX方向及びZ方向に移動可能である。 Also, in this embodiment, the cutting device 1 having a twin-spindle structure having two spindle portions 25 is exemplified. The two spindles 25 are independently movable in the X and Z directions.
 仕切壁26は、スピンドル部25が配置される空間と、ブレード交換台27が配置される空間と、を仕切るように適宜の位置に設けられる。本実施形態では、仕切壁26は一方のスピンドル部25の背後(図示右側)に配置される。また仕切壁26は、ブレード交換台27を囲むように配置される。仕切壁26の一部分には、スピンドル部25が配置される空間と、ブレード交換台27が配置される空間と、を接続する開口部26aが形成される。 The partition wall 26 is provided at an appropriate position so as to partition the space in which the spindle part 25 is arranged and the space in which the blade exchange table 27 is arranged. In this embodiment, the partition wall 26 is arranged behind one spindle portion 25 (on the right side in the drawing). Moreover, the partition wall 26 is arranged so as to surround the blade exchange table 27 . A part of the partition wall 26 is formed with an opening 26a that connects the space in which the spindle part 25 is arranged and the space in which the blade exchange table 27 is arranged.
 図1及び図2に示すブレード交換台27の上面には、スピンドル部25で使用された使用済みのブレード25aが収容される使用済みブレード収容部27aと、交換用の未使用のブレード25aが収容される未使用ブレード収容部27bが設けられる。使用済みブレード収容部27aは、上面が開放された箱状に形成される。また、ブレード交換台27の上面には、後述する第二洗浄機構320(洗浄機構300)が設けられる。 1 and 2, a used blade housing section 27a housing a used blade 25a used in the spindle section 25 and a replacement unused blade 25a are housed on the upper surface of the blade exchange table 27. An unused blade accommodation portion 27b is provided. The used blade housing portion 27a is formed in a box shape with an open top. A second cleaning mechanism 320 (cleaning mechanism 300), which will be described later, is provided on the upper surface of the blade exchange table 27. As shown in FIG.
 なお、未使用ブレード収容部27b及び使用済みブレード収容部27aの構成は本実施形態に限るものではなく、任意に変更することが可能である。一例として、使用済みブレード収容部27aを、上下に延びる円柱状の部材を具備する構成とすることも可能である。このような構成においては、円柱状の部材にブレード25aの中心を挿入することで、ブレード25aを保持することが可能である。 The configurations of the unused blade storage portion 27b and the used blade storage portion 27a are not limited to this embodiment, and can be arbitrarily changed. As an example, the used blade housing portion 27a may be configured to have a columnar member extending vertically. In such a configuration, it is possible to hold the blade 25a by inserting the center of the blade 25a into the cylindrical member.
 ブレード交換機構100は、スピンドル部25に設けられたブレード25aを交換するものである。ブレード交換機構100は、2個のスピンドル部25の背後(図示右側)に配置される。ブレード交換機構100には、仕切壁26の開口部26aを閉塞可能な閉塞部200が設けられる。またブレード交換機構100には、後述する第一洗浄機構310(洗浄機構300)が設けられる。 The blade replacement mechanism 100 replaces the blade 25a provided on the spindle section 25. The blade exchange mechanism 100 is arranged behind the two spindles 25 (on the right side in the drawing). The blade replacement mechanism 100 is provided with a closing portion 200 capable of closing the opening 26 a of the partition wall 26 . The blade exchange mechanism 100 is also provided with a first cleaning mechanism 310 (cleaning mechanism 300), which will be described later.
 切断モジュールBにおいて、切断用テーブル21に封止済基板Wが保持された状態で、切断用テーブル21と2個のスピンドル部25とを相対的に移動させることで、封止済基板Wを切断して個片化することができる。スピンドル部25のブレード25aは、Y方向及びZ方向を含む面内において回転することで、切断用テーブル21に保持された封止済基板Wを切断する。この際、ブレード25aに向かって切削水を噴射しながら封止済基板Wを切断することもできる。 In the cutting module B, the sealed substrate W is cut by relatively moving the cutting table 21 and the two spindles 25 while the sealed substrate W is held on the cutting table 21. can be individualized. The blade 25a of the spindle part 25 cuts the sealed substrate W held on the cutting table 21 by rotating in a plane including the Y direction and the Z direction. At this time, the sealed substrate W can also be cut while spraying cutting water toward the blade 25a.
<収納モジュールC>
 収納モジュールCには、主として検査用テーブル31及びトレイ32が設けられる。
<Storage module C>
The storage module C is mainly provided with an inspection table 31 and a tray 32 .
 検査用テーブル31には、封止済基板Wを切断して個片化された複数の製品Pからなる集合体が載置される。複数の製品Pは、検査用のカメラ(不図示)によって検査され、良品と不良品とに選別される。選別された良品は、トレイ32に収容される。選別された不良品は、別途用意されたトレイ(不図示)に収容され、製品Pから除外される。なお、収納モジュールCにおいて、必ずしも製品Pの検査を行う必要はない。 On the inspection table 31, an assembly of a plurality of products P obtained by cutting the sealed substrate W into individual pieces is placed. A plurality of products P are inspected by an inspection camera (not shown) and sorted into non-defective products and defective products. The sorted non-defective products are accommodated in the tray 32 . The sorted defective products are accommodated in a separately prepared tray (not shown) and excluded from the products P. Note that it is not always necessary to inspect the product P in the storage module C.
<ブレード交換機構100等の詳細な構成>
 次に、ブレード交換機構100、閉塞部200及び洗浄機構300の構成について、より詳細に説明する。なお、ブレード交換機構100等の各部の詳細な構造や形状等は特に限定しないため、本実施形態では各部の形状等を適宜簡略化して図示している。
<Detailed Configuration of Blade Exchange Mechanism 100, etc.>
Next, the configurations of the blade replacement mechanism 100, the blocking section 200, and the cleaning mechanism 300 will be described in more detail. Since the detailed structure, shape, etc. of each part of the blade exchange mechanism 100 and the like are not particularly limited, the shapes of each part, etc. are appropriately simplified and illustrated in this embodiment.
<ブレード交換機構100>
 図2及び図3に示すように、ブレード交換機構100は、主として支持部110、保持部120及び移動部130を具備する。
<Blade exchange mechanism 100>
As shown in FIGS. 2 and 3, the blade replacement mechanism 100 mainly includes a support section 110, a holding section 120 and a moving section .
 支持部110は、保持部120及び後述する第一洗浄機構310を支持するものである。支持部110は、適宜の部材(棒状部材、板状部材等)を組み合わせて形成することができる。本実施形態では、支持部110は一方向(図2及び図3では、X方向)に長い長手状に形成されている。 The support part 110 supports the holding part 120 and the first cleaning mechanism 310 which will be described later. The support portion 110 can be formed by combining appropriate members (bar-shaped member, plate-shaped member, etc.). In this embodiment, the support part 110 is formed in a long shape elongated in one direction (the X direction in FIGS. 2 and 3).
 保持部120は、スピンドル部25に設けられたブレード25a、及び、ブレード25aをスピンドル部25に固定するための第二フランジ25dを保持することが可能なものである。保持部120は、支持部110の長手方向における一端部に設けられる。 The holding portion 120 is capable of holding the blade 25 a provided on the spindle portion 25 and the second flange 25 d for fixing the blade 25 a to the spindle portion 25 . The holding portion 120 is provided at one end portion of the support portion 110 in the longitudinal direction.
 ここで、図4を用いて、スピンドル部25(特に、ブレード25aの固定に関する部位)の構成について説明する。図4は、2個のスピンドル部25のうち一方(図2における紙面左側のスピンドル部25)の一部分の断面を示したものである。 Here, using FIG. 4, the configuration of the spindle portion 25 (particularly, the portion related to fixing the blade 25a) will be described. FIG. 4 shows a partial cross section of one of the two spindles 25 (spindle 25 on the left side of the page in FIG. 2).
 スピンドル部25の回転軸25bには、略円環状の第一フランジ25cが固定される。さらに、第一フランジ25cと対向するように、略円環状の第二フランジ25dが設けられる。なお、第一フランジ25c及び第二フランジ25dは、それぞれ本発明に係る一方のフランジ及び他方のフランジの実施の一形態である。 A substantially annular first flange 25c is fixed to the rotating shaft 25b of the spindle portion 25 . Furthermore, a substantially annular second flange 25d is provided so as to face the first flange 25c. The first flange 25c and the second flange 25d are embodiments of one flange and the other flange, respectively, according to the present invention.
 ナット等の脱着部材25eが第一フランジ25cのボス部分に締め付けられることによって、第二フランジ25dが第一フランジ25cに向かって押し付けられる。第一フランジ25c及び第二フランジ25dの外周部分には、互いに向き合う方向に突出した第一接触面25f及び第二接触面25gが形成されている。第一接触面25fと第二接触面25gとの間に略円環状のブレード25aが挟まれて固定される。 The second flange 25d is pressed toward the first flange 25c by tightening the detachable member 25e such as a nut to the boss portion of the first flange 25c. A first contact surface 25f and a second contact surface 25g projecting in directions facing each other are formed on the outer peripheral portions of the first flange 25c and the second flange 25d. A substantially annular blade 25a is sandwiched and fixed between the first contact surface 25f and the second contact surface 25g.
 図2及び図3に示す保持部120は、スピンドル部25に取り付けられた脱着部材25eを回転させて、脱着部材25eを第一フランジ25cのボス部分に着脱することができる。また保持部120は、ブレード25a及び第二フランジ25dをそれぞれ独立して保持することができる。保持部120がブレード25a及び第二フランジ25dを保持する方法としては、例えばブレード25a等を吸着して保持する方法や、爪状の部材をブレード25a等に引っ掛けて機械的に保持する方法等が挙げられる。 The holding part 120 shown in FIGS. 2 and 3 can rotate the detachable member 25e attached to the spindle part 25 to attach and detach the detachable member 25e to the boss portion of the first flange 25c. Further, the holding portion 120 can hold the blade 25a and the second flange 25d independently. As a method for holding the blade 25a and the second flange 25d by the holding portion 120, for example, there is a method of holding the blade 25a by suction, a method of hooking the blade 25a or the like with a claw-like member to hold the blade 25a mechanically, and the like. mentioned.
 このように保持部120は、スピンドル部25に取り付けられたブレード25a及び第二フランジ25dを、スピンドル部25から取り外すことができる。また保持部120は、保持しているブレード25a及び第二フランジ25dを、スピンドル部25に取り付けることができる。 Thus, the holding section 120 can remove the blade 25 a and the second flange 25 d attached to the spindle section 25 from the spindle section 25 . Moreover, the holding part 120 can attach the blade 25a and the second flange 25d that it holds to the spindle part 25 .
 移動部130は、支持部110を任意の方向に移動させるものである。移動部130は、主として回転部131、第一直線移動部132、第二直線移動部133及び第三直線移動部134を具備する。 The moving part 130 moves the supporting part 110 in any direction. The moving part 130 mainly includes a rotating part 131 , a first linear moving part 132 , a second linear moving part 133 and a third linear moving part 134 .
 回転部131は、支持部110を回転させるものである。回転部131は、支持部110を支持すると共に、モータ等の駆動源の駆動力を用いて支持部110を回転させることができる。回転部131は、Y方向に平行な軸線回りに支持部110を回転させることができる。 The rotating part 131 rotates the supporting part 110 . The rotating portion 131 can support the supporting portion 110 and rotate the supporting portion 110 using the driving force of a driving source such as a motor. The rotating portion 131 can rotate the supporting portion 110 around an axis parallel to the Y direction.
 第一直線移動部132は、回転部131を直線的に移動させるものである。第一直線移動部132は、回転部131を支持すると共に、モータ等の駆動源の駆動力を用いて回転部131を移動させることができる。第一直線移動部132は、回転部131をY方向に沿って直線的に移動させることができる。 The first linear moving part 132 moves the rotating part 131 linearly. The first linear moving part 132 supports the rotating part 131 and can move the rotating part 131 using the driving force of a driving source such as a motor. The first linear moving part 132 can linearly move the rotating part 131 along the Y direction.
 第二直線移動部133は、第一直線移動部132を直線的に移動させるものである。第二直線移動部133は、第一直線移動部132を支持すると共に、モータ等の駆動源の駆動力を用いて第一直線移動部132を移動させることができる。第二直線移動部133は、第一直線移動部132をZ方向に沿って直線的に移動させることができる。 The second linear movement section 133 linearly moves the first linear movement section 132 . The second linearly moving part 133 supports the first linearly moving part 132 and can move the first linearly moving part 132 using the driving force of a driving source such as a motor. The second linear movement part 133 can linearly move the first linear movement part 132 along the Z direction.
 図2に示す第三直線移動部134は、第二直線移動部133を直線的に移動させるものである。第三直線移動部134は、第二直線移動部133を支持すると共に、モータ等の駆動源の駆動力を用いて第二直線移動部133を移動させることができる。第三直線移動部134は、第二直線移動部133をX方向に沿って直線的に移動させることができる。 The third linear movement section 134 shown in FIG. 2 linearly moves the second linear movement section 133 . The third linearly moving part 134 supports the second linearly moving part 133 and can move the second linearly moving part 133 using the driving force of a driving source such as a motor. The third linear movement section 134 can linearly move the second linear movement section 133 along the X direction.
 上記のように構成された移動部130の各部の移動を組み合わせることにより、支持部110を任意の位置に移動させると共に、Y方向に沿った軸線回りに任意に回転させることができる。 By combining the movement of each part of the moving part 130 configured as described above, the supporting part 110 can be moved to an arbitrary position and arbitrarily rotated around the axis along the Y direction.
<閉塞部200>
 閉塞部200は、仕切壁26の開口部26aを閉塞することが可能なものである。閉塞部200は、開口部26aに応じた形状の板状に形成される。閉塞部200は、X方向において、支持部110の一側(図2における紙面右側)に配置される。閉塞部200は、板面をX方向に向けた状態で移動部130に設けられる。具体的には、閉塞部200は第二直線移動部133に設けられ、第三直線移動部134によってX方向に直線的に移動することができる。
<Blocking part 200>
The closing part 200 can close the opening 26 a of the partition wall 26 . The closing portion 200 is formed in a plate shape corresponding to the opening portion 26a. The closing part 200 is arranged on one side of the support part 110 (on the right side of the drawing in FIG. 2) in the X direction. The closing part 200 is provided on the moving part 130 with the plate surface facing in the X direction. Specifically, the blocking part 200 is provided on the second linear movement part 133 and can be linearly moved in the X direction by the third linear movement part 134 .
<洗浄機構300>
 洗浄機構300は、スピンドル部25にブレード25aを固定するためのフランジ(第一フランジ25c及び第二フランジ25d)を洗浄するためのものである。洗浄機構300は、主として第一洗浄機構310及び第二洗浄機構320を具備する。
<Washing Mechanism 300>
The cleaning mechanism 300 is for cleaning the flanges (the first flange 25c and the second flange 25d) for fixing the blade 25a to the spindle portion 25. As shown in FIG. The cleaning mechanism 300 mainly comprises a first cleaning mechanism 310 and a second cleaning mechanism 320 .
 図3に示す第一洗浄機構310は、スピンドル部25に取り付けられた状態の第一フランジ25cを洗浄するものである。第一洗浄機構310は、主として第一洗浄スポンジ311及びエアノズル312を具備する。 The first cleaning mechanism 310 shown in FIG. 3 cleans the first flange 25c attached to the spindle portion 25. The first cleaning mechanism 310 shown in FIG. The first cleaning mechanism 310 mainly comprises a first cleaning sponge 311 and air nozzles 312 .
 図3及び図5(a)に示す第一洗浄スポンジ311は、第一フランジ25cを洗浄するための洗浄部材である。第一洗浄スポンジ311は、第一フランジ25cと同等の外径を有する円筒状に形成される。第一洗浄スポンジ311は、円板状の取付部材311aを介して、支持部110の長手方向における一端部に取り付けられる。第一洗浄スポンジ311は、支持部110の長手方向において、保持部120と反対側に設けられる。言い換えると、第一洗浄スポンジ311は、回転部131の回転軸を中心として、保持部120から180度反転した位置に設けられる。なお、本実施形態において第一洗浄スポンジ311が配置された「保持部120と反対側」は、本発明に係る「保持部と異なる側」の一例である。 The first cleaning sponge 311 shown in FIGS. 3 and 5(a) is a cleaning member for cleaning the first flange 25c. The first cleaning sponge 311 is formed in a cylindrical shape having the same outer diameter as the first flange 25c. The first cleaning sponge 311 is attached to one longitudinal end of the support 110 via a disk-shaped attachment member 311a. The first cleaning sponge 311 is provided on the side opposite to the holding portion 120 in the longitudinal direction of the support portion 110 . In other words, the first cleaning sponge 311 is provided at a position inverted 180 degrees from the holding portion 120 with the rotating shaft of the rotating portion 131 as the center. In this embodiment, the "side opposite to the holding section 120" on which the first cleaning sponge 311 is arranged is an example of the "side different from the holding section" according to the present invention.
 なお、第一洗浄スポンジ311は、図5(a)に示す円筒状に限らず、任意の形状とすることができる。例えば図5(b)に示す変形例のように、円筒を複数に分割した形状としてもよい。これによって、スポンジの角部で第一フランジ25cの洗浄を行うことができ、第一洗浄スポンジ311の洗浄能力の向上を図ることができる。 Note that the first cleaning sponge 311 is not limited to the cylindrical shape shown in FIG. 5(a), and may be of any shape. For example, as in a modification shown in FIG. 5B, a cylinder may be divided into a plurality of pieces. As a result, the corners of the sponge can clean the first flange 25c, and the cleaning ability of the first cleaning sponge 311 can be improved.
 図3に示すエアノズル312は、コンプレッサ(不図示)から供給された圧縮空気を吹き出すことができる。エアノズル312は、支持部110の長手方向における一端部(第一洗浄スポンジ311と同じ側)に設けられる。エアノズル312は、空気の吹き出し方向を第一洗浄スポンジ311側に向けた状態で配置される。 The air nozzle 312 shown in FIG. 3 can blow out compressed air supplied from a compressor (not shown). The air nozzle 312 is provided at one longitudinal end of the support 110 (on the same side as the first cleaning sponge 311). The air nozzle 312 is arranged with the blowing direction of air directed toward the first cleaning sponge 311 side.
 第二洗浄機構320は、スピンドル部25から取り外された状態(保持部120に保持された状態)の第二フランジ25dを洗浄するものである。第二洗浄機構320は、主として第二洗浄スポンジ321及び駆動部322を具備する。 The second cleaning mechanism 320 cleans the second flange 25d that has been removed from the spindle section 25 (held by the holding section 120). The second cleaning mechanism 320 mainly includes a second cleaning sponge 321 and a driving section 322 .
 図2に示す第二洗浄スポンジ321は、第二フランジ25dを洗浄するための洗浄部材である。第二洗浄スポンジ321は、第二フランジ25dと同等の径を有する円筒状に形成される。第二洗浄スポンジ321は、図5に示す第一洗浄スポンジ311と同様の形状に形成される。第二洗浄スポンジ321は、円筒の軸線をZ方向に向けた状態で、ブレード交換台27の上面に設けられる。 The second cleaning sponge 321 shown in FIG. 2 is a cleaning member for cleaning the second flange 25d. The second cleaning sponge 321 is formed in a cylindrical shape having the same diameter as the second flange 25d. The second cleaning sponge 321 is formed in the same shape as the first cleaning sponge 311 shown in FIG. The second cleaning sponge 321 is provided on the upper surface of the blade exchange table 27 with the axis of the cylinder directed in the Z direction.
 駆動部322は、第二洗浄スポンジ321を回転させるものである。駆動部322は、例えばモータ等の駆動源を有する。駆動部322の出力軸は、第二洗浄スポンジ321に接続される。駆動部322の駆動力によって、第二洗浄スポンジ321をZ方向に平行な軸線回りに回転させることができる。 The driving section 322 rotates the second cleaning sponge 321 . The drive unit 322 has a drive source such as a motor, for example. The output shaft of the drive part 322 is connected to the second cleaning sponge 321 . The driving force of the driving portion 322 can rotate the second cleaning sponge 321 around an axis parallel to the Z direction.
<ブレード交換機構100等の動作>
 次に、以上の如く構成されたブレード交換機構100及び洗浄機構300が、スピンドル部25に設けられたブレード25aの交換、並びに、第一フランジ25c及び第二フランジ25dの洗浄を行う動作について説明する。なお、以下では2個のスピンドル部25のうち、一方のスピンドル部25(例えば、図2における紙面左側のスピンドル部25)のブレード25aの交換等を行う場合について説明する。
<Operation of Blade Exchange Mechanism 100, etc.>
Next, the operation of the blade replacement mechanism 100 and the cleaning mechanism 300 configured as described above to replace the blade 25a provided on the spindle portion 25 and to clean the first flange 25c and the second flange 25d will be described. . In the following, the case of replacing the blade 25a of one of the two spindles 25 (for example, the spindle 25 on the left side of the drawing in FIG. 2) will be described.
 切断装置1による封止済基板Wの切断が行われている場合、図2に二点鎖線で示すように、閉塞部200は、仕切壁26の開口部26aを閉塞する位置で待機する。このように、開口部26aを閉塞部200によって閉塞することで、ブレード交換台27が配置された空間と、スピンドル部25が配置された空間を区画することができる。これによって、封止済基板Wの切断時に生じる切削屑や水滴が、ブレード交換台27(特に、交換用のブレード25aが収容される未使用ブレード収容部27b)に付着するのを防止することができる。なおこの状態では、保持部120及び第一洗浄機構310は、ブレード交換台27が配置された空間に位置している。 When the cutting device 1 is cutting the sealed substrate W, the blocking part 200 stands by at a position blocking the opening 26a of the partition wall 26, as indicated by the two-dot chain line in FIG. By closing the opening 26a with the closing part 200 in this way, the space in which the blade exchange table 27 is arranged and the space in which the spindle part 25 is arranged can be separated. As a result, it is possible to prevent shavings and water droplets generated during cutting of the sealed substrate W from adhering to the blade exchange table 27 (particularly, the unused blade housing portion 27b housing the replacement blade 25a). can. In this state, the holding section 120 and the first cleaning mechanism 310 are located in the space where the blade exchange table 27 is arranged.
 ブレード25aの交換等を行う場合、切断装置1による封止済基板Wの切断は一時的に中断される。なお、ブレード25aの交換、並びに、第一フランジ25c及び第二フランジ25dの洗浄は、任意のタイミングで行うことができる。例えば、ブレード25aの磨耗量を適宜のセンサで検出し、磨耗量が一定量を超えたタイミングでブレード25aの交換等を行うことができる。また、切断装置1の稼働時間、製品Pの生産数等が所定の値を超えたタイミングでブレード25aの交換等を行うこともできる。 When replacing the blade 25a or the like, the cutting of the sealed substrate W by the cutting device 1 is temporarily interrupted. The replacement of the blade 25a and the cleaning of the first flange 25c and the second flange 25d can be performed at any timing. For example, the wear amount of the blade 25a can be detected by an appropriate sensor, and the blade 25a can be replaced when the wear amount exceeds a certain amount. Also, the blade 25a can be replaced at the timing when the operation time of the cutting device 1, the production number of the product P, and the like exceed a predetermined value.
 ブレード25aの交換等を行う場合、移動部130によって支持部110及び保持部120と一体的に閉塞部200が移動し、仕切壁26の開口部26aが開放される。支持部110等は、開放された開口部26aを介して、スピンドル部25側の空間と、ブレード交換台27側の空間と、の間を移動することができる。 When the blade 25a is replaced, etc., the moving part 130 moves the closing part 200 integrally with the supporting part 110 and the holding part 120, and the opening 26a of the partition wall 26 is opened. The support portion 110 and the like can move between the space on the spindle portion 25 side and the space on the blade exchange base 27 side through the opened opening portion 26a.
 ブレード25aの交換等を行う場合、まず図6(a)に示すように、移動部130によって支持部110が移動され、エアノズル312の先端がスピンドル部25に取り付けられたブレード25aに向けられる。この状態でエアノズル312から空気が吹き出され、ブレード25aに付着した切削屑や水滴が除去される。 When replacing the blade 25a or the like, first, as shown in FIG. In this state, air is blown out from the air nozzle 312 to remove shavings and water droplets adhering to the blade 25a.
 なお、エアノズル312によって除去できなかった切削屑や水滴は、ブレード25aに残ることになる。すると、後述するように、スピンドル部25から第二フランジ25dとブレード25aを取り外す際に、ブレード25aに残った切削屑や水滴が第一フランジ25c及び第二フランジ25dに付着して汚染することがある。 Note that cutting debris and water droplets that cannot be removed by the air nozzle 312 remain on the blade 25a. Then, as will be described later, when the second flange 25d and the blade 25a are removed from the spindle portion 25, chips and water droplets remaining on the blade 25a may adhere to the first flange 25c and the second flange 25d and contaminate them. be.
 次に図6(b)に示すように、移動部130によって、支持部110が反転されると共に、保持部120がスピンドル部25のブレード25aと対向する位置に移動される。そして、保持部120によってスピンドル部25から第二フランジ25dとブレード25aが取り外される。 Next, as shown in FIG. 6(b), the support section 110 is turned over by the moving section 130, and the holding section 120 is moved to a position facing the blade 25a of the spindle section 25. As shown in FIG. Then, the second flange 25 d and the blade 25 a are removed from the spindle portion 25 by the holding portion 120 .
 次に図6(c)に示すように、移動部130によって、保持部120がブレード交換台27に設けられた使用済みブレード収容部27aに上方から対向する位置に移動される。そして、保持部120によるブレード25aの保持が解除され、使用済みのブレード25aが使用済みブレード収容部27aに収容される。 Next, as shown in FIG. 6(c), the holding part 120 is moved by the moving part 130 to a position facing the used blade storage part 27a provided in the blade exchange table 27 from above. Then, the holding portion 120 releases the blade 25a, and the used blade 25a is stored in the used blade storage portion 27a.
 次に図6(d)に示すように、移動部130によって、保持部120に保持された第二フランジ25dが、第二洗浄機構320の第二洗浄スポンジ321の上面と接触する位置に移動される。この状態で、駆動部322によって第二洗浄スポンジ321が回転されることで、第二フランジ25dの表面(特に、図4に示す第二接触面25g)が洗浄される。これによって、第二フランジ25dに付着した切削屑等を除去することができる。 Next, as shown in FIG. 6(d), the moving part 130 moves the second flange 25d held by the holding part 120 to a position where it comes into contact with the upper surface of the second cleaning sponge 321 of the second cleaning mechanism 320. be. In this state, the drive unit 322 rotates the second cleaning sponge 321 to clean the surface of the second flange 25d (particularly, the second contact surface 25g shown in FIG. 4). As a result, chips and the like adhering to the second flange 25d can be removed.
 次に図7(a)に示すように、移動部130によって、保持部120がブレード交換台27に設けられた未使用ブレード収容部27bに上方から対向する位置に移動される。そして、未使用ブレード収容部27bに収容された未使用のブレード25aが、保持部120によって保持される。本実施形態のように、使用済みブレード収容部27a、未使用ブレード収容部27b及び第二洗浄機構320を同じブレード交換台27に設けることで、保持部120が使用済みブレード収容部27a、未使用ブレード収容部27b及び第二洗浄機構320の間を移動する際の移動距離を短く抑えることができる。 Next, as shown in FIG. 7(a), the holding section 120 is moved by the moving section 130 to a position facing the unused blade housing section 27b provided in the blade exchange base 27 from above. The unused blade 25a housed in the unused blade housing portion 27b is held by the holding portion 120. As shown in FIG. By providing the used blade housing portion 27a, the unused blade housing portion 27b, and the second cleaning mechanism 320 in the same blade exchange table 27 as in the present embodiment, the holding portion 120 can store the used blade housing portion 27a and the unused blade housing portion 27a. The movement distance when moving between the blade accommodating portion 27b and the second cleaning mechanism 320 can be kept short.
 次に図7(b)に示すように、移動部130によって支持部110が移動され、エアノズル312の先端がスピンドル部25に取り付けられた第一フランジ25cに向けられる。この状態でエアノズル312から空気が吹き出され、第一フランジ25cに付着した切削屑や水滴が除去される。 Next, as shown in FIG. 7(b), the support portion 110 is moved by the moving portion 130, and the tip of the air nozzle 312 is directed to the first flange 25c attached to the spindle portion 25. Then, as shown in FIG. In this state, air is blown out from the air nozzle 312 to remove shavings and water droplets adhering to the first flange 25c.
 次に図7(c)に示すように、移動部130によって、第一洗浄機構310の第一洗浄スポンジ311が、スピンドル部25に取り付けられた第一フランジ25cと接触する位置に移動される。この状態で、スピンドル部25が回転することで、第一フランジ25cの表面(特に、図4に示す第一接触面25f)が洗浄される。これによって、第一フランジ25cに付着した切削屑等を除去することができる。 Next, as shown in FIG. 7(c), the moving part 130 moves the first cleaning sponge 311 of the first cleaning mechanism 310 to a position where it comes into contact with the first flange 25c attached to the spindle part 25. Then, as shown in FIG. In this state, the rotation of the spindle portion 25 cleans the surface of the first flange 25c (especially the first contact surface 25f shown in FIG. 4). As a result, chips and the like adhering to the first flange 25c can be removed.
 次に図7(d)に示すように、移動部130によって、支持部110が反転されると共に、保持部120がスピンドル部25の第一フランジ25cと対向する位置に移動される。そして、保持部120に保持された第二フランジ25dとブレード25aが、スピンドル部25に取り付けられる。 Next, as shown in FIG. 7(d), the support section 110 is turned over by the moving section 130, and the holding section 120 is moved to a position facing the first flange 25c of the spindle section 25. As shown in FIG. Then, the second flange 25 d and the blade 25 a held by the holding portion 120 are attached to the spindle portion 25 .
 なお、上述の例では一方のスピンドル部25のブレード25aの交換等を行う動作を説明したが、もう一方のスピンドル部25のブレード25aの交換等を行う動作についても概ね同様であるため、説明は省略する。 In the above example, the operation of exchanging the blade 25a of one spindle portion 25 was explained, but the operation of exchanging the blade 25a of the other spindle portion 25 is generally the same, so the explanation is omitted. omitted.
 上述のように、スピンドル部25のブレード25aの交換、並びに、第一フランジ25c及び第二フランジ25dの洗浄が完了すると、再び閉塞部200が仕切壁26の開口部26aを閉塞する位置に移動する(図2参照)。その後、切断装置1による封止済基板Wの切断が再開される。 As described above, when the replacement of the blade 25a of the spindle part 25 and the cleaning of the first flange 25c and the second flange 25d are completed, the closing part 200 moves to the position to close the opening part 26a of the partition wall 26 again. (See Figure 2). Thereafter, the cutting of the sealed substrate W by the cutting device 1 is resumed.
 このように、本実施形態では、スピンドル部25に設けられたブレード25aを交換する工程と、第一フランジ25c及び第二フランジ25dを洗浄する工程と、を並行して行うことができる。また、交換されたブレード25aで封止済基板Wを切断する工程を実行することができる。 Thus, in this embodiment, the step of replacing the blade 25a provided on the spindle portion 25 and the step of cleaning the first flange 25c and the second flange 25d can be performed in parallel. Further, a step of cutting the sealed substrate W with the replaced blade 25a can be performed.
 以上の如く、本実施形態に係る切断装置1は、スピンドル部25に設けられたブレード25aを交換するブレード交換機構100と、前記ブレード25aを前記スピンドル部25に固定するための一対のフランジ(第一フランジ25c及び第二フランジ25d)を洗浄する洗浄機構300と、を備えるものである。
 このように構成することにより、フランジの洗浄を行うことができる。また洗浄機構300によってフランジの洗浄を行うことで、ユーザーの洗浄作業の負担の軽減を図ることができる。またフランジの洗浄を行うことで、ブレード25aを適切に固定することができる。
As described above, the cutting apparatus 1 according to the present embodiment includes a blade replacement mechanism 100 for replacing the blade 25a provided on the spindle portion 25, and a pair of flanges for fixing the blade 25a to the spindle portion 25. and a cleaning mechanism 300 for cleaning the first flange 25c and the second flange 25d).
By configuring in this way, the flange can be cleaned. Further, by cleaning the flange by the cleaning mechanism 300, it is possible to reduce the user's burden of cleaning work. By cleaning the flange, the blade 25a can be properly fixed.
 また、前記洗浄機構300は、前記一対のフランジのうち、第一フランジ25c(一方のフランジ)を洗浄する第一洗浄機構310と、前記一対のフランジのうち、第二フランジ25d(他方のフランジ)を洗浄する第二洗浄機構320と、を備えるものである。
 このように構成することにより、一対のフランジを個別に洗浄することで、一対のフランジをより効果的に洗浄することができる。
The cleaning mechanism 300 includes a first cleaning mechanism 310 that cleans the first flange 25c (one flange) of the pair of flanges, and a second flange 25d (the other flange) of the pair of flanges. and a second cleaning mechanism 320 that cleans the
By configuring in this way, the pair of flanges can be cleaned more effectively by cleaning the pair of flanges individually.
 また、前記第一洗浄機構310は、前記スピンドル部25に取り付けられた状態の前記第一フランジ25cを洗浄可能であり、前記第二洗浄機構320は、前記スピンドル部25から取り外された状態の前記第二フランジ25dを洗浄可能である。
 このように構成することにより、ブレード25aを交換する際にスピンドル部25から取り外された第二フランジ25dと、スピンドル部25に残った第一フランジ25cを、それぞれ洗浄することができる。
The first cleaning mechanism 310 can clean the first flange 25c attached to the spindle portion 25, and the second cleaning mechanism 320 can clean the first flange 25c attached to the spindle portion 25. The second flange 25d can be cleaned.
With this configuration, the second flange 25d removed from the spindle portion 25 and the first flange 25c remaining on the spindle portion 25 when replacing the blade 25a can be cleaned.
 また、前記第一洗浄機構310は、前記スピンドル部25の回転により前記スピンドル部25に取り付けられた前記第一フランジ25cが回転した状態で、前記第一フランジ25cを洗浄可能である。
 このように構成することにより、スピンドル部25の回転を利用して、第一フランジ25cの洗浄を行うことができる。これによって、第一洗浄機構310の構造の簡素化を図ることができる。
Further, the first cleaning mechanism 310 can clean the first flange 25c while the first flange 25c attached to the spindle portion 25 is rotated by the rotation of the spindle portion 25. As shown in FIG.
With this configuration, the rotation of the spindle portion 25 can be used to clean the first flange 25c. As a result, the structure of the first cleaning mechanism 310 can be simplified.
 また、前記ブレード交換機構100は、前記ブレード25a及び前記第二フランジ25dを保持することが可能な保持部120と、前記保持部120及び前記第一洗浄機構310を支持する支持部110と、前記支持部110を移動させることが可能な移動部130と、を備え、前記第一洗浄機構310は、前記支持部110において、前記保持部120と異なる側に設けられるものである。
 このように構成することにより、第一洗浄機構310と保持部120を異なる側に設けることで、支持部110の重心が偏るのを抑制することができる。これによって、支持部110の移動を円滑に行うことができる。特に本実施形態では、第一洗浄機構310と保持部120を反対側に設けているため、支持部110の重心の偏りを効果的に防止することができる。
Further, the blade replacement mechanism 100 includes a holding portion 120 capable of holding the blade 25a and the second flange 25d, a support portion 110 supporting the holding portion 120 and the first cleaning mechanism 310, and the and a moving part 130 capable of moving the support part 110 , and the first cleaning mechanism 310 is provided on a different side of the support part 110 from the holding part 120 .
By configuring in this way, by providing the first cleaning mechanism 310 and the holding portion 120 on different sides, it is possible to prevent the center of gravity of the support portion 110 from becoming biased. Thereby, the support part 110 can be smoothly moved. Particularly in this embodiment, since the first cleaning mechanism 310 and the holding portion 120 are provided on the opposite sides, the bias of the center of gravity of the support portion 110 can be effectively prevented.
 また、前記第二洗浄機構320は、前記保持部120が保持する前記第二フランジ25dを洗浄可能である。
 このように構成することにより、ブレード25aを交換する際に保持部120によって保持された第二フランジ25dをそのまま洗浄することができるため、第二フランジ25dの洗浄を効率的に行うことができる。
Further, the second cleaning mechanism 320 can clean the second flange 25d held by the holding portion 120. As shown in FIG.
With this configuration, the second flange 25d held by the holding portion 120 can be washed as it is when the blade 25a is replaced, so the second flange 25d can be washed efficiently.
 また、切断装置1は、前記スピンドル部25が配置される空間と、交換用のブレード25aが配置される空間と、を仕切ると共に、開口部26aを有する仕切壁26と、前記移動部130によって移動可能であり、前記ブレード交換機構100が所定の位置にある場合に前記開口部26aを閉塞する閉塞部200と、を備えるものである。
 このように構成することにより、開口部26aを介して保持部120等を移動させることができると共に、必要に応じて閉塞部200によって開口部26aを閉塞することができる。例えば、封止済基板Wの切断中には閉塞部200によって開口部26aを閉塞することによって、切削屑等が交換用のブレード25aに付着するのを防止することができる。特に本実施形態では、閉塞部200が開口部26aを閉塞した状態において、保持部120及び第一洗浄機構310が交換用のブレード25a側の空間に配置されることになるため、封止済基板Wの切断中に生じる切削屑等が保持部120等に付着するのを防止することもできる。
Further, the cutting device 1 partitions the space in which the spindle portion 25 is arranged and the space in which the replacement blade 25a is arranged, and is moved by the partition wall 26 having the opening portion 26a and the moving portion 130. and a closing portion 200 that closes the opening 26a when the blade changing mechanism 100 is in place.
With this configuration, the holder 120 and the like can be moved through the opening 26a, and the opening 26a can be closed by the closing part 200 as necessary. For example, by closing the opening 26a with the closing part 200 during the cutting of the sealed substrate W, it is possible to prevent shavings and the like from adhering to the replacement blade 25a. Particularly in this embodiment, when the closing portion 200 closes the opening portion 26a, the holding portion 120 and the first cleaning mechanism 310 are arranged in the space on the replacement blade 25a side. It is also possible to prevent shavings and the like generated during the cutting of W from adhering to the holding portion 120 and the like.
 また、本実施形態に係る製品P(切断品)の製造方法は、前記切断装置1を用いて、前記スピンドル部25に設けられた前記ブレード25aを交換する工程と、前記一対のフランジを洗浄する工程と、前記ブレード25aで封止済基板W(切断対象物)を切断する工程と、を含むものである。
 このように構成することにより、フランジの洗浄を行うことができる。特に本実施形態では、ブレード25aを交換する工程と、一対のフランジを洗浄する工程と、を並行して行うことができるため、製品Pの製造を効率的に行うことができる。
In addition, the method for manufacturing the product P (cut product) according to the present embodiment includes steps of replacing the blade 25a provided on the spindle portion 25 using the cutting device 1, and cleaning the pair of flanges. and a step of cutting the sealed substrate W (object to be cut) with the blade 25a.
By configuring in this way, the flange can be cleaned. Particularly in this embodiment, the process of replacing the blade 25a and the process of cleaning the pair of flanges can be performed in parallel, so that the product P can be manufactured efficiently.
 以上、本発明の実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲に記載された発明の技術的思想の範囲内で適宜の変更が可能である。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and can be appropriately modified within the scope of the technical ideas of the invention described in the claims. .
 例えば、本実施形態の移動部130の構成(図3等参照)は一例であり、保持部120及び第一洗浄機構310を必要な位置に移動させることができる構成であれば、具体的な構成は限定されない。また、閉塞部200は第二直線移動部133に設けられるものとしたが、本発明はこれに限るものではない。すなわち閉塞部200は、移動部130によって移動して開口部26aを閉塞できる構成であればよく、例えば第二直線移動部133とは独立して第三直線移動部134に設けられる構成とすることも可能である。 For example, the configuration of the moving unit 130 of the present embodiment (see FIG. 3, etc.) is an example, and any configuration capable of moving the holding unit 120 and the first cleaning mechanism 310 to the required positions is a specific configuration. is not limited. Moreover, although the closing part 200 is provided in the second linearly moving part 133, the present invention is not limited to this. That is, the closing part 200 may be configured to be moved by the moving part 130 to close the opening 26a. is also possible.
 また本実施形態では、第一フランジ25cを洗浄する場合、スピンドル部25を回転させる例を示したが(図7(c)参照)、例えば第一洗浄スポンジ311を回転させる構成とすることも可能である。 In this embodiment, when cleaning the first flange 25c, an example is shown in which the spindle portion 25 is rotated (see FIG. 7(c)). is.
 また、第一洗浄スポンジ311及び第二洗浄スポンジ321の形状は本実施形態の形状(図5参照)に限るものではなく、任意に変更することができる。 Further, the shapes of the first cleaning sponge 311 and the second cleaning sponge 321 are not limited to the shapes of this embodiment (see FIG. 5), and can be arbitrarily changed.
 また本実施形態に係る洗浄機構300は、洗浄部材としてスポンジ(第一洗浄スポンジ311及び第二洗浄スポンジ321)を用いて洗浄を行うものとしたが、本発明はこれに限るものではなく、任意の洗浄部材(例えば、ウエス等)を用いることも可能である。 Further, although the cleaning mechanism 300 according to the present embodiment performs cleaning using sponges (the first cleaning sponge 311 and the second cleaning sponge 321) as cleaning members, the present invention is not limited to this. It is also possible to use a cleaning member (for example, a waste cloth, etc.).
 また本実施形態に係る洗浄機構300は、スポンジ及びエアノズル312によってフランジの洗浄を行うものとしたが、フランジの洗浄方法はこれに限るものではなく、任意の洗浄方法でフランジの洗浄を行うことが可能である。例えば、フランジに洗浄水を吹き付けて洗浄することや、フランジに付着した切削屑等を吸引してフランジの洗浄を行うことも可能である。また洗浄機構300は、複数の洗浄方法を組み合わせてフランジの洗浄を行うことも可能である。 In addition, the cleaning mechanism 300 according to the present embodiment cleans the flange with the sponge and the air nozzle 312, but the method of cleaning the flange is not limited to this, and any cleaning method can be used to clean the flange. It is possible. For example, it is also possible to clean the flange by spraying cleansing water on the flange, or to clean the flange by sucking chips and the like adhering to the flange. Also, the cleaning mechanism 300 can combine a plurality of cleaning methods to clean the flange.
 また本実施形態では、第一フランジ25cをスピンドル部25に取り付けた状態で、第一フランジ25cの洗浄を行う例(図7(b)及び(c)参照)を示したが、本発明はこれに限るものではない。例えば、第一フランジ25cをスピンドル部25から取り外した状態で、第一フランジ25cの洗浄を行う構成とすることも可能である。この場合、第一フランジ25cの着脱を行う機構を別途設けて、自動的に第一フランジ25cの着脱を行うことも可能である。 Further, in the present embodiment, an example of cleaning the first flange 25c with the first flange 25c attached to the spindle portion 25 (see FIGS. 7B and 7C) was shown, but the present invention is not limited to For example, the cleaning of the first flange 25c may be performed after the first flange 25c is removed from the spindle portion 25. FIG. In this case, a separate mechanism for attaching and detaching the first flange 25c may be provided to automatically attach and detach the first flange 25c.
 また本実施形態では、保持部120と第一洗浄機構310とが支持部110の反対側(正面から見て180度反転した位置、図6等参照)に設けられる例を示したが、本発明はこれに限るものではなく、保持部120及び第一洗浄機構310は、支持部110の任意の位置に設けることが可能である。例えば第一洗浄機構310を、保持部120に対して90度回転した位置や、120度回転した位置に配置することも可能である。 Further, in the present embodiment, an example in which the holding part 120 and the first cleaning mechanism 310 are provided on the opposite side of the support part 110 (a position reversed 180 degrees when viewed from the front, see FIG. 6, etc.) was shown, but the present invention is not limited to this, and the holding section 120 and the first cleaning mechanism 310 can be provided at arbitrary positions on the support section 110 . For example, the first cleaning mechanism 310 can be arranged at a position rotated by 90 degrees or rotated by 120 degrees with respect to the holding portion 120 .
 また本実施形態では、保持部120と第一洗浄機構310をいずれも支持部110に設けて、一体的に移動させる例を示したが、本発明はこれに限るものではない。例えば、保持部120と第一洗浄機構310をそれぞれ別の部材に設けて、互いに独立して移動させる構成とすることも可能である。 Further, in this embodiment, both the holding part 120 and the first cleaning mechanism 310 are provided on the support part 110, and an example is shown in which they are moved integrally, but the present invention is not limited to this. For example, the holding part 120 and the first cleaning mechanism 310 may be provided on separate members and moved independently of each other.
 また、本実施形態では、切断装置1による封止済基板Wの切断を一時的に中断して、ブレード25aの交換、及び、フランジの洗浄を行う例を示したが、ブレード25aの交換等を行うタイミングは任意に決定することができる。例えば切断装置1による封止済基板Wの切断が開始される前や、切断装置1による封止済基板Wの切断が全て完了した後に、ブレード25aの交換等を行うことも可能である。また、本実施形態のように、切断装置1にスピンドル部25が複数設けられている場合、それぞれのスピンドル部25のブレード25aの交換等は、同じタイミングで行うことも、別々のタイミングで行うことも可能である。 In the present embodiment, cutting of the sealed substrate W by the cutting device 1 is temporarily interrupted to replace the blade 25a and clean the flange. The timing to perform can be determined arbitrarily. For example, the blade 25a can be replaced before the cutting device 1 starts cutting the sealed substrate W or after the cutting device 1 has completely cut the sealed substrate W. FIG. Further, when a plurality of spindle units 25 are provided in the cutting device 1 as in the present embodiment, the blades 25a of the respective spindle units 25 may be replaced at the same timing or at different timings. is also possible.
 1   切断装置
 25  スピンドル
 25a ブレード
 25c 第一フランジ
 25d 第二フランジ
 26  仕切壁
 26a 開口部
 100 ブレード交換機構
 110 支持部
 120 保持部
 130 移動部
 200 閉塞部
 300 洗浄機構
 310 第一洗浄機構
 320 第二洗浄機構
 
1 Cutting Device 25 Spindle 25a Blade 25c First Flange 25d Second Flange 26 Partition Wall 26a Opening 100 Blade Replacement Mechanism 110 Supporting Part 120 Holding Part 130 Moving Part 200 Blocking Part 300 Cleaning Mechanism 310 First Cleaning Mechanism 320 Second Cleaning Mechanism

Claims (8)

  1.  スピンドル部に設けられたブレードを交換するブレード交換機構と、
     前記ブレードを前記スピンドル部に固定するための一対のフランジを洗浄する洗浄機構と、
     を備える、切断装置。
    a blade replacement mechanism for replacing the blade provided in the spindle;
    a cleaning mechanism for cleaning a pair of flanges for fixing the blade to the spindle;
    A cutting device.
  2.  前記洗浄機構は、
     前記一対のフランジのうち、一方のフランジを洗浄する第一洗浄機構と、
     前記一対のフランジのうち、他方のフランジを洗浄する第二洗浄機構と、
     を備える、請求項1に記載の切断装置。
    The cleaning mechanism is
    a first cleaning mechanism for cleaning one of the pair of flanges;
    a second cleaning mechanism for cleaning the other flange of the pair of flanges;
    2. The cutting device of claim 1, comprising:
  3.  前記第一洗浄機構は、前記スピンドル部に取り付けられた状態の前記一方のフランジを洗浄可能であり、
     前記第二洗浄機構は、前記スピンドル部から取り外された状態の前記他方のフランジを洗浄可能である、
     請求項2に記載の切断装置。
    The first cleaning mechanism is capable of cleaning the one flange attached to the spindle,
    The second cleaning mechanism is capable of cleaning the other flange detached from the spindle.
    3. A cutting device according to claim 2.
  4.  前記第一洗浄機構は、前記スピンドル部の回転により前記スピンドル部に取り付けられた前記一方のフランジが回転した状態で、前記一方のフランジを洗浄可能である、請求項2又は請求項3に記載の切断装置。 4. The first cleaning mechanism according to claim 2 or 3, wherein the one flange attached to the spindle portion is rotated by the rotation of the spindle portion, and is capable of cleaning the one flange. cutting device.
  5.  前記ブレード交換機構は、
     前記ブレード及び前記他方のフランジを保持することが可能な保持部と、
     前記保持部及び前記第一洗浄機構を支持する支持部と、
     前記支持部を移動させることが可能な移動部と、
     を備え、
     前記第一洗浄機構は、前記支持部において、前記保持部と異なる側に設けられる、請求項3又は請求項4に記載の切断装置。
    The blade exchange mechanism is
    a holding part capable of holding the blade and the other flange;
    a support portion that supports the holding portion and the first cleaning mechanism;
    a moving part capable of moving the support part;
    with
    Said 1st washing|cleaning mechanism is a cutting device of Claim 3 or Claim 4 provided in the said support part on the different side from the said holding|maintenance part.
  6.  前記第二洗浄機構は、前記保持部が保持する前記他方のフランジを洗浄可能である、請求項5に記載の切断装置。 The cutting device according to claim 5, wherein the second cleaning mechanism is capable of cleaning the other flange held by the holding portion.
  7.  前記スピンドル部が配置される空間と、交換用のブレードが配置される空間と、を仕切ると共に、開口部を有する仕切壁と、
     前記移動部によって移動可能であり、前記ブレード交換機構が所定の位置にある場合に前記開口部を閉塞する閉塞部と、
     を備える、請求項5又は請求項6に記載の切断装置。
    a partition wall having an opening that separates the space in which the spindle part is arranged and the space in which the replacement blade is arranged;
    a closing part that is movable by the moving part and closes the opening when the blade replacement mechanism is at a predetermined position;
    7. A cutting device according to claim 5 or claim 6, comprising a
  8.  請求項1から請求項7までのいずれか一項に記載の切断装置を用いて、前記スピンドル部に設けられた前記ブレードを交換する工程と、前記一対のフランジを洗浄する工程と、前記ブレードで切断対象物を切断する工程と、を含む、切断品の製造方法。
     
    Using the cutting device according to any one of claims 1 to 7, replacing the blade provided on the spindle portion, cleaning the pair of flanges, and and cutting an object to be cut.
PCT/JP2022/030037 2021-11-08 2022-08-05 Cutting device and method for manufacturing cut article WO2023079807A1 (en)

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JP2002313752A (en) * 2001-04-12 2002-10-25 Disco Abrasive Syst Ltd Dicing device
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JP2019115961A (en) * 2017-12-27 2019-07-18 株式会社ディスコ Cutting device
JP2021037588A (en) * 2019-09-03 2021-03-11 Towa株式会社 Flange end face correction device, cutting device, flange end face correction method, and cut article manufacturing method
JP2021084140A (en) * 2019-11-25 2021-06-03 Towa株式会社 Blade replacement device and cutting system

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JP2002313752A (en) * 2001-04-12 2002-10-25 Disco Abrasive Syst Ltd Dicing device
JP2019089183A (en) * 2017-11-16 2019-06-13 株式会社ディスコ End face cleaning method and cutting device
JP2019115961A (en) * 2017-12-27 2019-07-18 株式会社ディスコ Cutting device
JP2021037588A (en) * 2019-09-03 2021-03-11 Towa株式会社 Flange end face correction device, cutting device, flange end face correction method, and cut article manufacturing method
JP2021084140A (en) * 2019-11-25 2021-06-03 Towa株式会社 Blade replacement device and cutting system

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