TWI812389B - Cutting device and method of manufacturing cut product - Google Patents

Cutting device and method of manufacturing cut product Download PDF

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Publication number
TWI812389B
TWI812389B TW111129598A TW111129598A TWI812389B TW I812389 B TWI812389 B TW I812389B TW 111129598 A TW111129598 A TW 111129598A TW 111129598 A TW111129598 A TW 111129598A TW I812389 B TWI812389 B TW I812389B
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Taiwan
Prior art keywords
blade
flange
cleaning
main shaft
cleaning mechanism
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TW111129598A
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Chinese (zh)
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TW202319205A (en
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堀聡子
大西将馬
吉岡翔
堀本京太郎
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日商Towa股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00Means for securing grinding wheels on rotary arbors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007Cleaning of grinding wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06Dust extraction equipment on grinding or polishing machines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Sawing (AREA)

Abstract

本發明提供一種可進行凸緣的清洗的切斷裝置以及切斷品的製造方法。切斷裝置包括:刀片更換機構,對設於主軸部的刀片進行更換;以及清洗機構,對用於將所述刀片固定於所述主軸部的一對凸緣進行清洗。The present invention provides a cutting device capable of cleaning a flange and a method of manufacturing a cut product. The cutting device includes a blade replacement mechanism for replacing blades provided on the main shaft part, and a cleaning mechanism for cleaning a pair of flanges for fixing the blades to the main shaft part.

Description

切斷裝置以及切斷品的製造方法Cutting device and method of manufacturing cut product

本發明是有關於一種切斷裝置以及切斷品的製造方法的技術。The present invention relates to a cutting device and a method of manufacturing a cut product.

專利文獻1中揭示了一種切斷裝置,其包括刀片更換機構,所述刀片更換機構可對安裝於主軸部的刀片進行更換。具體而言,專利文獻1所揭示的刀片更換機構分別保持刀片與用於固定刀片的凸緣,且可裝卸於主軸部。藉由刀片更換機構,可自動進行刀片的更換。 [現有技術文獻] [專利文獻] Patent Document 1 discloses a cutting device including a blade replacement mechanism capable of replacing a blade mounted on a main shaft portion. Specifically, the blade replacement mechanism disclosed in Patent Document 1 holds a blade and a flange for fixing the blade, respectively, and is detachable from the main shaft. The blade replacement mechanism can automatically replace the blade. [Prior art documents] [Patent Document]

[專利文獻1]日本專利特開2019-5857號公報[Patent Document 1] Japanese Patent Application Publication No. 2019-5857

[發明所欲解決之課題][Problem to be solved by the invention]

此處,專利文獻1所揭示的切斷裝置中,切斷時產生的切削屑或水滴有時會附著於凸緣,因此較佳為適當地進行凸緣的清洗作業。因此,考慮到減輕作業負擔的觀點,尋求一種可自動地進行凸緣的清洗的技術。Here, in the cutting device disclosed in Patent Document 1, cutting chips or water droplets generated during cutting may adhere to the flange, so it is preferable to appropriately perform the cleaning operation of the flange. Therefore, from the viewpoint of reducing work load, a technology that can automatically perform flange cleaning is required.

本發明是有鑒於如上所述的狀況而完成,其欲解決的課題在於提供一種可進行凸緣的清洗的切斷裝置以及切斷品的製造方法。 [解決課題之手段] The present invention was completed in view of the above-mentioned situation, and the problem to be solved is to provide a cutting device capable of cleaning the flange and a method of manufacturing a cut product. [Means to solve the problem]

本發明所欲解決之課題如上,為了解決該課題,本發明的切斷裝置包括:刀片更換機構,對設於主軸部的刀片進行更換;以及清洗機構,對用於將所述刀片固定於所述主軸部的一對凸緣進行清洗。The problems to be solved by the present invention are as mentioned above. In order to solve the problems, the cutting device of the present invention includes: a blade replacement mechanism for replacing the blade provided on the main shaft; and a cleaning mechanism for fixing the blade to the main shaft. Clean the pair of flanges of the spindle part.

而且,本發明的切斷品的製造方法包括下述步驟:使用所述切斷裝置,對設於所述主軸部的所述刀片進行更換;對所述一對凸緣進行清洗;以及利用所述刀片來將切斷對象物予以切斷。 [發明的效果] Furthermore, the method of manufacturing a cut product of the present invention includes the following steps: using the cutting device to replace the blade provided on the main shaft part; cleaning the pair of flanges; and utilizing the Use the blade to cut the object to be cut. [Effects of the invention]

根據本發明,能夠進行凸緣的清洗。According to the present invention, the flange can be cleaned.

<切斷裝置1的結構> 首先,對本實施形態的切斷裝置1的結構進行說明。本實施形態中,例如,作為切斷裝置1的切斷對象物,對使用對安裝有半導體晶片的基板進行了樹脂密封的已密封基板W時的、切斷裝置1的結構進行說明。 <Structure of cutting device 1> First, the structure of the cutting device 1 of this embodiment is demonstrated. In this embodiment, for example, a structure of the cutting device 1 will be described when a sealed substrate W in which a substrate mounted with a semiconductor wafer is resin-sealed is used as an object to be cut by the cutting device 1 .

作為已密封基板W,例如使用球珊陣列(Ball Grid Array,BGA)封裝基板、晶片級封裝(Chip Size Package,CSP)封裝基板、發光二極體(Light Emitting Diode,LED)封裝基板等。而且,作為切斷對象物,不僅使用已密封基板W,亦有時使用對安裝有半導體晶片的引線框架進行了樹脂密封的已密封引線框架。As the sealed substrate W, for example, a Ball Grid Array (BGA) packaging substrate, a Chip Size Package (CSP) packaging substrate, a Light Emitting Diode (LED) packaging substrate, etc. are used. Furthermore, as the object to be cut, not only the sealed substrate W but also a sealed lead frame in which a lead frame on which a semiconductor chip is mounted is resin-sealed may be used.

圖1所示的切斷裝置1是藉由對作為切斷對象物的已密封基板W進行切斷而單片化為多個切斷品(製品P)的加工裝置。切斷裝置1包括基板供給模組A、切斷模組B以及收納模組C來作為構成元件。各構成元件相對於其他構成元件可裝卸且可更換。The cutting device 1 shown in FIG. 1 is a processing device that cuts a sealed substrate W as a cutting object into individual pieces into a plurality of cut products (products P). The cutting device 1 includes a substrate supply module A, a cutting module B, and a storage module C as constituent elements. Each component is detachable and replaceable with respect to other components.

<基板供給模組A> 在基板供給模組A中,主要設有基板供給機構11以及控制部CTL。 <Substrate supply module A> The substrate supply module A mainly includes a substrate supply mechanism 11 and a control unit CTL.

作為切斷對象物的已密封基板W自基板供給機構11被搬出,並藉由移送機構(未圖示)而移送至切斷模組B。控制部CTL對切斷裝置1的各部的動作進行控制。藉由控制部CTL來控制切斷裝置1的各部,藉此可進行已密封基板W的搬入、已密封基板W的切斷、製品P的檢查、製品P的搬出等。再者,控制部CTL亦可設於基板供給模組A以外的模組。而且,控制部CTL亦可分割為多個而設。例如,亦可在各模組中設置控制部CTL,使控制部CTL彼此聯繫地控制各部。The sealed substrate W as the object to be cut is carried out from the substrate supply mechanism 11 and transferred to the cutting module B by a transfer mechanism (not shown). The control unit CTL controls the operation of each part of the cutting device 1 . By controlling each part of the cutting device 1 by the control unit CTL, the sealed substrate W can be loaded in, the sealed substrate W can be cut, the product P can be inspected, the product P can be unloaded, and the like. Furthermore, the control unit CTL may be provided in a module other than the substrate supply module A. Furthermore, the control unit CTL may be divided into a plurality of units. For example, a control unit CTL may be provided in each module, and the control unit CTL may control each unit in association with each other.

<切斷模組B> 圖1所示的切斷模組B中,主要設有切斷用平台21、切斷用夾具22、移動機構23、旋轉機構24、主軸部25、分隔壁26、刀片更換台27、刀片更換機構100、封閉部200、第一清洗機構310(清洗機構300)以及第二清洗機構320(清洗機構300)。 <Cutting module B> The cutting module B shown in FIG. 1 is mainly provided with a cutting platform 21, a cutting jig 22, a moving mechanism 23, a rotating mechanism 24, a spindle part 25, a partition wall 26, a blade replacement table 27, and a blade replacement table. Mechanism 100, closing part 200, first cleaning mechanism 310 (cleaning mechanism 300) and second cleaning mechanism 320 (cleaning mechanism 300).

本實施形態中,例示了具有兩個切斷用平台21的雙切割平台式的切斷裝置1。在切斷用平台21設有切斷用夾具22。切斷用平台21可藉由移動機構23而沿Y方向移動,且可藉由旋轉機構24而沿θ方向轉動。In this embodiment, a double cutting platform type cutting device 1 having two cutting platforms 21 is exemplified. The cutting platform 21 is provided with a cutting jig 22 . The cutting platform 21 can be moved in the Y direction by the moving mechanism 23 and can be rotated in the θ direction by the rotating mechanism 24 .

而且,本實施形態中,例示了具有兩個主軸部25的雙主軸結構的切斷裝置1。兩個主軸部25可彼此獨立地沿X方向以及Z方向移動。Furthermore, in this embodiment, the cutting device 1 of the dual-spindle structure which has the two spindle parts 25 is illustrated. The two main shaft portions 25 can move in the X direction and the Z direction independently of each other.

分隔壁26被設在適當的位置,以對配置主軸部25的空間與配置刀片更換台27的空間進行分隔。本實施形態中,分隔壁26被配置於其中一個主軸部25的背後(圖示右側)。而且,分隔壁26是以圍繞刀片更換台27的方式而配置。在分隔壁26的一部分,形成有開口部26a,所述開口部26a將配置主軸部25的空間與配置刀片更換台27的空間加以連接。The partition wall 26 is provided at an appropriate position to separate the space where the main shaft part 25 is placed and the space where the blade changing table 27 is placed. In this embodiment, the partition wall 26 is disposed behind one of the main shaft portions 25 (on the right side in the figure). Furthermore, the partition wall 26 is arranged to surround the blade changing table 27 . An opening 26 a is formed in a part of the partition wall 26 to connect the space where the main shaft part 25 is placed and the space where the blade replacement table 27 is placed.

在圖1以及圖2所示的刀片更換台27的上表面,設有:已使用刀片收容部27a,收容經主軸部25使用的已使用的刀片25a;以及未使用刀片收容部27b,收容更換用的未使用的刀片25a。已使用刀片收容部27a形成為上表面開放的箱狀。而且,在刀片更換台27的上表面,設有後述的第二清洗機構320(清洗機構300)。The upper surface of the blade replacement table 27 shown in FIGS. 1 and 2 is provided with a used blade storage portion 27a that stores the used blades 25a used through the spindle portion 25, and an unused blade storage portion 27b that stores replacement blades. Unused blade 25a. The used blade housing 27a is formed in a box shape with an open upper surface. Furthermore, a second cleaning mechanism 320 (cleaning mechanism 300 ) to be described later is provided on the upper surface of the blade changing table 27 .

再者,未使用刀片收容部27b以及已使用刀片收容部27a的結構並不限於本實施形態,可任意變更。作為一例,亦可將已使用刀片收容部27a設為包括上下延伸的圓柱狀構件的結構。此種結構中,藉由將刀片25a的中心插入至圓柱狀構件,從而可保持刀片25a。In addition, the structure of the unused blade accommodating part 27b and the used blade accommodating part 27a is not limited to this embodiment, and can be changed arbitrarily. As an example, the used blade accommodating part 27a may have a structure including a cylindrical member extending up and down. In this structure, the blade 25a can be held by inserting the center of the blade 25a into the cylindrical member.

刀片更換機構100對設於主軸部25的刀片25a進行更換。刀片更換機構100被配置在兩個主軸部25的背後(圖示右側)。在刀片更換機構100,設有可封閉分隔壁26的開口部26a的封閉部200。而且,在刀片更換機構100,設有後述的第一清洗機構310(清洗機構300)。The blade replacement mechanism 100 replaces the blade 25a provided in the main shaft part 25. The blade changing mechanism 100 is arranged behind the two main shaft parts 25 (on the right side in the figure). The blade replacement mechanism 100 is provided with a closing portion 200 capable of closing the opening 26 a of the partition wall 26 . Furthermore, the blade replacement mechanism 100 is provided with a first cleaning mechanism 310 (cleaning mechanism 300) described below.

切斷模組B中,在已密封基板W被保持於切斷用平台21的狀態下,使切斷用平台21與兩個主軸部25相對移動,藉此,可將已密封基板W予以切斷而單片化。主軸部25的刀片25a在包含Y方向以及Z方向的面內旋轉,藉此,將被保持於切斷用平台21的已密封基板W予以切斷。此時,亦可一邊朝向刀片25a噴射切削水,一邊切斷已密封基板W。In the cutting module B, while the sealed substrate W is held on the cutting platform 21, the cutting platform 21 and the two spindle portions 25 are relatively moved, whereby the sealed substrate W can be cut. Broken and monolithic. The blade 25a of the main shaft part 25 rotates in the plane including the Y direction and the Z direction, thereby cutting the sealed substrate W held on the cutting platform 21. At this time, the sealed substrate W may be cut while spraying cutting water toward the blade 25a.

<收納模組C> 在收納模組C中,主要設有檢查用平台31以及托盤32。 <Storage Module C> The storage module C is mainly provided with an inspection platform 31 and a tray 32 .

在檢查用平台31,載置包含將已密封基板W予以切斷而單片化的多個製品P的集合體。多個製品P是藉由檢查用的攝影機(未圖示)進行檢查,被分選為良品與不良品。經分選的良品被收容至托盤32。經分選的不良品被收容至另行準備的托盤(未圖示),自製品P中予以排除。再者,收納模組C中,未必需要進行製品P的檢查。An assembly including a plurality of products P obtained by cutting the sealed substrate W into individual pieces is placed on the inspection stage 31 . A plurality of products P are inspected with an inspection camera (not shown) and sorted into good products and defective products. The sorted good products are stored in the tray 32 . The sorted defective products are stored in a separately prepared tray (not shown) and are excluded from the self-product P. Furthermore, in the storage module C, it is not necessarily necessary to inspect the product P.

<刀片更換機構100等的詳細結構> 接下來,更詳細地說明刀片更換機構100、封閉部200以及清洗機構300的結構。再者,刀片更換機構100等的各部的詳細結構或形狀等並無特別限定,因此在本實施形態中適當簡化地圖示了各部的形狀等。 <Detailed structure of blade replacement mechanism 100 etc.> Next, the structures of the blade replacement mechanism 100, the closing part 200, and the cleaning mechanism 300 are described in more detail. In addition, the detailed structure, shape, etc. of each part of the blade replacement mechanism 100 etc. are not specifically limited, Therefore, in this embodiment, the shape etc. of each part are simplified as appropriate and shown.

<刀片更換機構100> 如圖2以及圖3所示,刀片更換機構100主要包括支持部110、保持部120以及移動部130。 Blade replacement mechanism 100> As shown in FIGS. 2 and 3 , the blade replacement mechanism 100 mainly includes a support part 110 , a holding part 120 and a moving part 130 .

支持部110支持保持部120以及後述的第一清洗機構310。支持部110可將適當的構件(棒狀構件、板狀構件等)予以組合而形成。本實施形態中,支持部110形成為沿一方向(圖2以及圖3中為X方向)長的長條狀。The support part 110 supports the holding part 120 and the first cleaning mechanism 310 described later. The support part 110 can be formed by combining appropriate members (rod-shaped members, plate-shaped members, etc.). In this embodiment, the support portion 110 is formed in a long strip shape along one direction (the X direction in FIGS. 2 and 3 ).

保持部120可保持被設於主軸部25的刀片25a、以及用於將刀片25a固定至主軸部25的第二凸緣25d。保持部120被設於支持部110的長邊方向上的一端部。The holding part 120 can hold the blade 25a provided on the main shaft part 25 and the second flange 25d for fixing the blade 25a to the main shaft part 25. The holding part 120 is provided at one end of the supporting part 110 in the longitudinal direction.

此處,使用圖4來說明主軸部25(尤其是與刀片25a的固定相關的部位)的結構。圖4表示了兩個主軸部25中的其中一者(圖2中的紙面左側的主軸部25)的一部分的剖面。Here, the structure of the main shaft part 25 (particularly the part related to the fixation of the blade 25a) is demonstrated using FIG. 4. FIG. 4 shows a partial cross-section of one of the two main shaft parts 25 (the main shaft part 25 on the left side of the paper in FIG. 2 ).

在主軸部25的旋轉軸25b,固定有大致圓環狀的第一凸緣25c。進而,以與第一凸緣25c相向的方式設有大致圓環狀的第二凸緣25d。再者,第一凸緣25c以及第二凸緣25d分別為本發明的其中一個凸緣以及另一個凸緣的一實施形態。A substantially annular first flange 25c is fixed to the rotation shaft 25b of the main shaft portion 25. Furthermore, a substantially annular second flange 25d is provided to face the first flange 25c. Furthermore, the first flange 25c and the second flange 25d are respectively an embodiment of one flange and the other flange of the present invention.

藉由將螺母等的拆裝構件25e緊固至第一凸緣25c的凸起(boss)部分,從而第二凸緣25d朝向第一凸緣25c受到按壓。在第一凸緣25c以及第二凸緣25d的外周部分,形成有朝彼此相對的方向突出的第一接觸面25f以及第二接觸面25g。大致圓環狀的刀片25a被夾著固定在第一接觸面25f與第二接觸面25g之間。By fastening the detachable member 25e such as a nut to the boss portion of the first flange 25c, the second flange 25d is pressed toward the first flange 25c. A first contact surface 25f and a second contact surface 25g protruding in opposite directions are formed on the outer peripheral portions of the first flange 25c and the second flange 25d. The substantially annular blade 25a is sandwiched and fixed between the first contact surface 25f and the second contact surface 25g.

圖2以及圖3所示的保持部120使安裝於主軸部25的拆裝構件25e旋轉,從而可將拆裝構件25e裝卸於第一凸緣25c的凸起部分。而且,保持部120可分別獨立地保持刀片25a以及第二凸緣25d。作為保持部120保持刀片25a以及第二凸緣25d的方法,例如可列舉吸附保持刀片25a等的方法、或將爪狀的構件鉤掛至刀片25a等而機械保持的方法等。The holding part 120 shown in FIGS. 2 and 3 rotates the detachable member 25e attached to the main shaft part 25, so that the detachable member 25e can be attached to and detached from the convex part of the first flange 25c. Furthermore, the holding part 120 can hold the blade 25a and the second flange 25d independently. Examples of a method for holding the blade 25a and the second flange 25d by the holding portion 120 include a method of adsorbing and holding the blade 25a, or a method of mechanically holding the blade 25a by hooking a claw-shaped member.

如此,保持部120可自主軸部25拆卸被安裝於主軸部25的刀片25a以及第二凸緣25d。而且,保持部120可將所保持的刀片25a以及第二凸緣25d安裝至主軸部25。In this way, the holding part 120 can detach the blade 25 a and the second flange 25 d installed on the main shaft part 25 from the main shaft part 25 . Furthermore, the holding part 120 can attach the held blade 25a and the second flange 25d to the spindle part 25.

移動部130使支持部110朝任意的方向移動。移動部130主要包括旋轉部131、第一直線移動部132、第二直線移動部133以及第三直線移動部134。The moving part 130 moves the supporting part 110 in any direction. The moving part 130 mainly includes a rotating part 131, a first linear moving part 132, a second linear moving part 133, and a third linear moving part 134.

旋轉部131使支持部110旋轉。旋轉部131可支持支持部110,並且使用馬達等的驅動源的驅動力來使支持部110旋轉。旋轉部131可使支持部110繞與Y方向平行的軸線旋轉。The rotation part 131 rotates the support part 110. The rotating part 131 can support the supporting part 110 and rotate the supporting part 110 using the driving force of a driving source such as a motor. The rotating part 131 can rotate the supporting part 110 around an axis parallel to the Y direction.

第一直線移動部132使旋轉部131直線移動。第一直線移動部132可支持旋轉部131,並且使用馬達等的驅動源的驅動力來使旋轉部131移動。第一直線移動部132可使旋轉部131沿著Y方向來直線移動。The first linear moving part 132 linearly moves the rotating part 131. The first linear moving part 132 can support the rotating part 131 and move the rotating part 131 using the driving force of a driving source such as a motor. The first linear moving part 132 can linearly move the rotating part 131 along the Y direction.

第二直線移動部133使第一直線移動部132直線移動。第二直線移動部133可支持第一直線移動部132,並且使用馬達等的驅動源的驅動力來使第一直線移動部132移動。第二直線移動部133可使第一直線移動部132沿著Z方向來直線移動。The second linear movement part 133 linearly moves the first linear movement part 132. The second linear movement part 133 can support the first linear movement part 132 and move the first linear movement part 132 using the driving force of a driving source such as a motor. The second linear movement part 133 can linearly move the first linear movement part 132 along the Z direction.

圖2所示的第三直線移動部134使第二直線移動部133直線移動。第三直線移動部134可支持第二直線移動部133,並且使用馬達等的驅動源的驅動力來使第二直線移動部133移動。第三直線移動部134可使第二直線移動部133沿著X方向來直線移動。The third linear movement part 134 shown in FIG. 2 linearly moves the second linear movement part 133. The third linear movement part 134 can support the second linear movement part 133 and move the second linear movement part 133 using the driving force of a driving source such as a motor. The third linear movement part 134 can linearly move the second linear movement part 133 along the X direction.

藉由將如上所述般構成的移動部130的各部的移動加以組合,從而可使支持部110移動至任意的位置,並且使支持部110繞沿著Y方向的軸線任意旋轉。By combining the movements of the various parts of the moving part 130 configured as described above, the supporting part 110 can be moved to an arbitrary position and the supporting part 110 can be rotated arbitrarily around the axis along the Y direction.

<封閉部200> 封閉部200可封閉分隔壁26的開口部26a。封閉部200形成為與開口部26a相應的形狀的板狀。封閉部200在X方向上被配置在支持部110的一側(圖2中的紙面右側)。封閉部200是以將板面朝向X方向的狀態設於移動部130。具體而言,封閉部200被設於第二直線移動部133,藉由第三直線移動部134而可沿X方向直線移動。 Closed part 200> The closing part 200 can close the opening 26a of the partition wall 26. The closing part 200 is formed in a plate shape corresponding to the shape of the opening part 26a. The sealing part 200 is arranged on one side of the support part 110 in the X direction (right side of the paper in FIG. 2 ). The closing part 200 is provided on the moving part 130 with the board surface facing the X direction. Specifically, the closing part 200 is provided in the second linear movement part 133 and can linearly move in the X direction by the third linear movement part 134 .

<清洗機構300> 清洗機構300用於對用以將刀片25a固定至主軸部25的凸緣(第一凸緣25c以及第二凸緣25d)進行清洗。清洗機構300主要包括第一清洗機構310以及第二清洗機構320。 <Cleaning mechanism 300> The cleaning mechanism 300 is used to clean the flanges (the first flange 25c and the second flange 25d) used to fix the blade 25a to the main shaft part 25. The cleaning mechanism 300 mainly includes a first cleaning mechanism 310 and a second cleaning mechanism 320 .

圖3所示的第一清洗機構310對被安裝於主軸部25的狀態的第一凸緣25c進行清洗。第一清洗機構310主要包括第一清洗海綿311以及空氣噴嘴312。The first cleaning mechanism 310 shown in FIG. 3 cleans the first flange 25c in a state of being attached to the main shaft part 25. The first cleaning mechanism 310 mainly includes a first cleaning sponge 311 and an air nozzle 312 .

圖3以及圖5的(a)所示的第一清洗海綿311是用於對第一凸緣25c進行清洗的清洗構件。第一清洗海綿311形成為具有與第一凸緣25c等同的外徑的圓筒狀。第一清洗海綿311經由圓板狀的安裝構件311a而安裝於支持部110的長邊方向上的一端部。第一清洗海綿311是在支持部110的長邊方向上與保持部120設在相反側。換言之,第一清洗海綿311是設在以旋轉部131的旋轉軸為中心而自保持部120反轉了180度的位置。再者,本實施形態中,配置有第一清洗海綿311的「與保持部120為相反側」是本發明的「與保持部不同的一側」的一例。The first cleaning sponge 311 shown in FIG. 3 and FIG. 5( a ) is a cleaning member for cleaning the first flange 25 c. The first cleaning sponge 311 is formed in a cylindrical shape having the same outer diameter as the first flange 25c. The first cleaning sponge 311 is attached to one end of the support portion 110 in the longitudinal direction via a disk-shaped attachment member 311 a. The first cleaning sponge 311 is provided on the opposite side to the holding part 120 in the longitudinal direction of the supporting part 110 . In other words, the first cleaning sponge 311 is located at a position that is 180 degrees inverted from the holding part 120 with the rotation axis of the rotating part 131 as the center. In addition, in this embodiment, the "side opposite to the holding part 120" where the first cleaning sponge 311 is arranged is an example of the "side different from the holding part" in the present invention.

再者,第一清洗海綿311並不限於圖5的(a)所示的圓筒狀,可設為任意的形狀。例如亦可如圖5的(b)所示的變形例般,設為將圓筒分割為多個的形狀。藉此,可利用海綿的角部來進行第一凸緣25c的清洗,從而可實現第一清洗海綿311的清洗能力的提高。Furthermore, the first cleaning sponge 311 is not limited to the cylindrical shape shown in (a) of FIG. 5 , and can be formed into any shape. For example, the cylinder may be divided into a plurality of shapes like the modification shown in FIG. 5( b ). Thereby, the corner portion of the sponge can be used to clean the first flange 25c, thereby improving the cleaning ability of the first cleaning sponge 311.

圖3所示的空氣噴嘴312可噴出自壓縮機(未圖示)供給的壓縮空氣。空氣噴嘴312被設在支持部110的長邊方向上的一端部(與第一清洗海綿311相同的一側)。空氣噴嘴312是以使空氣的噴出方向朝向第一清洗海綿311側的狀態而配置。The air nozzle 312 shown in FIG. 3 can spray compressed air supplied from a compressor (not shown). The air nozzle 312 is provided at one end of the support portion 110 in the longitudinal direction (the same side as the first cleaning sponge 311 ). The air nozzle 312 is arranged such that the air ejection direction is directed toward the first cleaning sponge 311 side.

第二清洗機構320對自主軸部25拆卸的狀態(由保持部120予以保持的狀態)的第二凸緣25d進行清洗。第二清洗機構320主要包括第二清洗海綿321以及驅動部322。The second cleaning mechanism 320 cleans the second flange 25d in a state in which the main shaft portion 25 is detached (a state held by the holding portion 120). The second cleaning mechanism 320 mainly includes a second cleaning sponge 321 and a driving part 322.

圖2所示的第二清洗海綿321是用於對第二凸緣25d進行清洗的清洗構件。第二清洗海綿321形成為具有與第二凸緣25d等同的直徑的圓筒狀。第二清洗海綿321形成為與圖5的(a)及圖5的(b)所示的第一清洗海綿311同樣的形狀。第二清洗海綿321是以使圓筒的軸線朝向Z方向的狀態而設在刀片更換台27的上表面。The second cleaning sponge 321 shown in FIG. 2 is a cleaning member for cleaning the second flange 25d. The second cleaning sponge 321 is formed in a cylindrical shape having the same diameter as the second flange 25d. The second cleaning sponge 321 is formed in the same shape as the first cleaning sponge 311 shown in FIGS. 5(a) and 5(b) . The second cleaning sponge 321 is provided on the upper surface of the blade replacement table 27 with the axis of the cylinder facing the Z direction.

驅動部322使第二清洗海綿321旋轉。驅動部322例如具有馬達等的驅動源。驅動部322的輸出軸連接於第二清洗海綿321。藉由驅動部322的驅動力,可使第二清洗海綿321繞與Z方向平行的軸線旋轉。The driving part 322 rotates the second cleaning sponge 321. The drive unit 322 has a drive source such as a motor, for example. The output shaft of the driving part 322 is connected to the second cleaning sponge 321 . The second cleaning sponge 321 can be rotated around an axis parallel to the Z direction by the driving force of the driving part 322 .

<刀片更換機構100等的動作> 接下來說明如上所述般構成的刀片更換機構100以及清洗機構300進行被設於主軸部25的刀片25a的更換與第一凸緣25c以及第二凸緣25d的清洗的動作。再者,以下,對進行兩個主軸部25中的其中一個主軸部25(例如圖2中的紙面左側的主軸部25)的刀片25a的更換等的情況進行說明。 <Operation of blade replacement mechanism 100 etc.> Next, the operation of the blade replacement mechanism 100 and the cleaning mechanism 300 configured as above to replace the blade 25a provided in the main shaft part 25 and clean the first flange 25c and the second flange 25d will be described. In addition, the case where the blade 25a of one of the two main shaft parts 25 (for example, the main shaft part 25 on the left side of the paper in FIG. 2) is replaced is demonstrated below.

在正進行切斷裝置1對已密封基板W的切斷的情況下,如圖2中的兩點鏈線所示,封閉部200在封閉分隔壁26的開口部26a的位置處待機。藉由如此般利用封閉部200來封閉開口部26a,從而可劃分配置有刀片更換台27的空間與配置有主軸部25的空間。藉此,可防止已密封基板W的切斷時產生的切削屑或水滴附著於刀片更換台27(尤其是收容更換用的刀片25a的未使用刀片收容部27b)。再者,在此狀態下,保持部120以及第一清洗機構310位於配置有刀片更換台27的空間。When the cutting device 1 is cutting the sealed substrate W, as shown by the two-dot chain line in FIG. 2 , the sealing portion 200 waits at a position to seal the opening 26 a of the partition wall 26 . By closing the opening 26a with the closing portion 200 in this way, the space in which the blade changing table 27 is arranged and the space in which the main shaft portion 25 is arranged can be divided. This prevents cutting chips or water droplets generated during cutting of the sealed substrate W from adhering to the blade replacement table 27 (especially the unused blade accommodating portion 27 b that accommodates the replacement blade 25 a ). In addition, in this state, the holding part 120 and the first cleaning mechanism 310 are located in the space where the blade replacement table 27 is arranged.

在進行刀片25a的更換等的情況下,暫時中斷切斷裝置1對已密封基板W的切斷。再者,刀片25a的更換與第一凸緣25c以及第二凸緣25d的清洗可在任意的時機進行。例如,可利用適當的感測器來檢測刀片25a的磨損量,在磨損量超過了一定量的時機進行刀片25a的更換等。而且,亦可在切斷裝置1的運轉時間、製品P的生產數等超過規定值的時機進行刀片25a的更換等。When the blade 25a is replaced or the like, cutting of the sealed substrate W by the cutting device 1 is temporarily interrupted. Furthermore, the blade 25a can be replaced and the first flange 25c and the second flange 25d can be cleaned at any time. For example, an appropriate sensor can be used to detect the wear amount of the blade 25a, and the blade 25a can be replaced when the wear amount exceeds a certain amount. Furthermore, the blade 25a may be replaced at a timing when the operation time of the cutting device 1, the production number of products P, etc. exceed a predetermined value.

在進行刀片25a的更換等的情況下,封閉部200藉由移動部130而與支持部110以及保持部120一體地移動,分隔壁26的開口部26a被開放。支持部110等可經由經開放的開口部26a而在主軸部25側的空間與刀片更換台27側的空間之間移動。When the blade 25a is replaced or the like, the closing part 200 is moved integrally with the support part 110 and the holding part 120 by the moving part 130, and the opening part 26a of the partition wall 26 is opened. The support portion 110 and the like are movable between the space on the spindle portion 25 side and the space on the blade replacement table 27 side via the opened opening 26 a.

在進行刀片25a的更換等的情況下,首先如圖6的(a)所示,支持部110藉由移動部130來移動,空氣噴嘴312的前端朝向被安裝於主軸部25的刀片25a。在此狀態下,自空氣噴嘴312噴出空氣,附著於刀片25a的切削屑或水滴被去除。When replacing the blade 25a, first, as shown in FIG. In this state, air is ejected from the air nozzle 312 to remove cutting chips or water droplets adhering to the blade 25a.

再者,未能藉由空氣噴嘴312而去除的切削屑或水滴將殘留於刀片25a。於是,如後所述,在自主軸部25拆卸第二凸緣25d與刀片25a時,殘留於刀片25a的切削屑或水滴有時會附著於第一凸緣25c以及第二凸緣25d而造成污染。Furthermore, cutting chips or water droplets that cannot be removed by the air nozzle 312 will remain on the blade 25a. Therefore, as will be described later, when the second flange 25d and the blade 25a are removed from the spindle portion 25, cutting chips or water droplets remaining on the blade 25a may adhere to the first flange 25c and the second flange 25d, causing pollute.

接下來,如圖6的(b)所示,支持部110藉由移動部130而反轉,並且保持部120移動至與主軸部25的刀片25a相向的位置。繼而,藉由保持部120自主軸部25拆卸第二凸緣25d與刀片25a。Next, as shown in FIG. 6( b ), the support part 110 is reversed by the moving part 130 , and the holding part 120 is moved to a position facing the blade 25 a of the main shaft part 25 . Then, the second flange 25d and the blade 25a are detached from the main shaft part 25 through the holding part 120.

接下來,如圖6的(c)所示,藉由移動部130,保持部120移動至自上方與被設於刀片更換台27的已使用刀片收容部27a相向的位置。繼而,解除保持部120對刀片25a的保持,將已使用的刀片25a收容至已使用刀片收容部27a。Next, as shown in FIG. 6( c ), the holder 120 is moved by the moving part 130 to a position facing the used blade accommodating part 27 a provided on the blade replacement table 27 from above. Then, the holding part 120 releases the holding part 120 of the blade 25a, and the used blade 25a is accommodated in the used blade accommodating part 27a.

接下來,如圖6的(d)所示,藉由移動部130,由保持部120所保持的第二凸緣25d移動至與第二清洗機構320的第二清洗海綿321的上表面接觸的位置。在此狀態下,第二清洗海綿321藉由驅動部322而旋轉,藉此來對第二凸緣25d的表面(尤其是圖4所示的第二接觸面25g)進行清洗。藉此,可去除附著於第二凸緣25d的切削屑等。Next, as shown in FIG. 6(d) , the second flange 25d held by the holding part 120 is moved by the moving part 130 to contact the upper surface of the second cleaning sponge 321 of the second cleaning mechanism 320 . Location. In this state, the second cleaning sponge 321 is rotated by the driving part 322 to clean the surface of the second flange 25d (especially the second contact surface 25g shown in FIG. 4). Thereby, cutting chips etc. adhering to the 2nd flange 25d can be removed.

接下來,如圖7的(a)所示,藉由移動部130,保持部120移動至自上方與被設於刀片更換台27的未使用刀片收容部27b相向的位置。繼而,藉由保持部120來保持被收容於未使用刀片收容部27b中的未使用的刀片25a。如本實施形態般,將已使用刀片收容部27a、未使用刀片收容部27b以及第二清洗機構320設於相同的刀片更換台27,藉此可將保持部120在已使用刀片收容部27a、未使用刀片收容部27b以及第二清洗機構320之間移動時的移動距離抑制得短。Next, as shown in FIG. 7( a ), the moving part 130 moves the holding part 120 to a position facing the unused blade accommodating part 27 b provided in the blade changing table 27 from above. Then, the unused blade 25a accommodated in the unused blade accommodating part 27b is held by the holding part 120. As in this embodiment, the used blade storage portion 27a, the unused blade storage portion 27b, and the second cleaning mechanism 320 are provided on the same blade replacement table 27, whereby the holding portion 120 can be positioned between the used blade storage portion 27a and the second cleaning mechanism 320. The movement distance when moving between the unused blade accommodating part 27b and the second cleaning mechanism 320 is suppressed to be short.

接下來,如圖7的(b)所示,支持部110藉由移動部130而移動,空氣噴嘴312的前端朝向被安裝於主軸部25的第一凸緣25c。在此狀態下,自空氣噴嘴312噴出空氣,附著於第一凸緣25c的切削屑或水滴被去除。Next, as shown in FIG. 7( b ), the support part 110 is moved by the moving part 130 , and the front end of the air nozzle 312 faces the first flange 25 c attached to the main shaft part 25 . In this state, air is ejected from the air nozzle 312 to remove cutting chips or water droplets adhering to the first flange 25c.

接下來,如圖7的(c)所示,藉由移動部130,第一清洗機構310的第一清洗海綿311移動至與被安裝於主軸部25的第一凸緣25c接觸的位置。在此狀態下,藉由主軸部25旋轉,從而對第一凸緣25c的表面(尤其是圖4所示的第一接觸面25f)進行清洗。藉此,可去除附著於第一凸緣25c的切削屑等。Next, as shown in FIG. 7( c ), the moving part 130 moves the first cleaning sponge 311 of the first cleaning mechanism 310 to a position in contact with the first flange 25 c installed on the main shaft part 25 . In this state, the main shaft part 25 rotates to clean the surface of the first flange 25c (especially the first contact surface 25f shown in FIG. 4). Thereby, cutting chips etc. adhering to the first flange 25c can be removed.

接下來,如圖7的(d)所示,支持部110藉由移動部130而反轉,並且,保持部120移動至與主軸部25的第一凸緣25c相向的位置。繼而,將由保持部120所保持的第二凸緣25d與刀片25a安裝至主軸部25。Next, as shown in (d) of FIG. 7 , the support part 110 is reversed by the moving part 130 , and the holding part 120 is moved to a position facing the first flange 25 c of the main shaft part 25 . Then, the second flange 25d and the blade 25a held by the holding part 120 are attached to the main shaft part 25.

再者,所述的示例中,說明了進行其中一個主軸部25的刀片25a的更換等的動作,但關於進行另一個主軸部25的刀片25a的更換等的動作亦大致同樣,因此省略說明。In addition, in the above example, the operation|movement of replacing the blade 25a of one spindle part 25 etc. is demonstrated, but the operation|movement of replacing the blade 25a of the other spindle part 25 is also substantially the same, and a description is abbreviate|omitted.

如上所述,當主軸部25的刀片25a的更換與第一凸緣25c以及第二凸緣25d的清洗完成時,封閉部200再次移動至封閉分隔壁26的開口部26a的位置(參照圖2)。隨後,再次開始切斷裝置1對已密封基板W的切斷。As described above, when the replacement of the blade 25a of the main shaft part 25 and the cleaning of the first flange 25c and the second flange 25d are completed, the closing part 200 moves to the position of closing the opening 26a of the partition wall 26 again (see FIG. 2 ). Then, cutting of the sealed substrate W by the cutting device 1 is started again.

如此,本實施形態中,可並行地進行對設於主軸部25的刀片25a進行更換的步驟、與對第一凸緣25c以及第二凸緣25d進行清洗的步驟。而且,可執行利用經更換的刀片25a來切斷已密封基板W的步驟。In this way, in this embodiment, the step of replacing the blade 25a provided in the spindle part 25 and the step of cleaning the first flange 25c and the second flange 25d can be performed in parallel. Furthermore, the step of cutting the sealed substrate W using the replaced blade 25a may be performed.

如上所述,本實施形態的切斷裝置1包括:刀片更換機構100,對設於主軸部25的刀片25a進行更換;以及清洗機構300,對用於將所述刀片25a固定至所述主軸部25的一對凸緣(第一凸緣25c以及第二凸緣25d)進行清洗。 藉由如此般構成,從而可進行凸緣的清洗。而且,藉由利用清洗機構300來進行凸緣的清洗,從而可實現用戶的清洗作業的負擔的減輕。而且,藉由進行凸緣的清洗,可適當地固定刀片25a。 As described above, the cutting device 1 of this embodiment includes the blade replacement mechanism 100 for replacing the blade 25a provided on the main shaft part 25, and the cleaning mechanism 300 for fixing the blade 25a to the main shaft part. 25 (the first flange 25c and the second flange 25d). With this structure, the flange can be cleaned. Furthermore, by using the cleaning mechanism 300 to clean the flange, the burden of the cleaning work on the user can be reduced. Furthermore, by cleaning the flange, the blade 25a can be properly fixed.

而且,所述清洗機構300包括:第一清洗機構310,對所述一對凸緣中的第一凸緣25c(其中一個凸緣)進行清洗;以及第二清洗機構320,對所述一對凸緣中的第二凸緣25d(另一個凸緣)進行清洗。 藉由如此般構成,從而可各別地清洗一對凸緣,藉此,可更有效地清洗一對凸緣。 Furthermore, the cleaning mechanism 300 includes: a first cleaning mechanism 310 for cleaning the first flange 25c (one of the flanges) of the pair of flanges; and a second cleaning mechanism 320 for cleaning the pair of flanges. The second of the flanges 25d (the other flange) is cleaned. With such a structure, the pair of flanges can be cleaned separately, whereby the pair of flanges can be cleaned more effectively.

而且,所述第一清洗機構310可對被安裝於所述主軸部25的狀態的所述第一凸緣25c進行清洗,所述第二清洗機構320可對自所述主軸部25拆卸的狀態的所述第二凸緣25d進行清洗。 藉由如此般構成,從而可在更換刀片25a時對自主軸部25拆卸的第二凸緣25d與剩留於主軸部25的第一凸緣25c分別進行清洗。 Furthermore, the first cleaning mechanism 310 can clean the first flange 25c in a state of being attached to the main shaft part 25, and the second cleaning mechanism 320 can clean the first flange 25c in a state of being detached from the main shaft part 25. The second flange 25d is cleaned. With such a configuration, when the blade 25a is replaced, the second flange 25d removed from the main shaft part 25 and the first flange 25c remaining in the main shaft part 25 can be cleaned separately.

而且,所述第一清洗機構310可在安裝於所述主軸部25的所述第一凸緣25c藉由所述主軸部25的旋轉而旋轉的狀態下,對所述第一凸緣25c進行清洗。 藉由如此般構成,可利用主軸部25的旋轉來進行第一凸緣25c的清洗。藉此,可實現第一清洗機構310的結構的簡化。 Furthermore, the first cleaning mechanism 310 can clean the first flange 25c in a state where the first flange 25c mounted on the main shaft part 25 is rotated by the rotation of the main shaft part 25. Clean. With such a configuration, the first flange 25c can be cleaned by rotating the main shaft portion 25. Thereby, the structure of the first cleaning mechanism 310 can be simplified.

而且,所述刀片更換機構100包括:保持部120,可保持所述刀片25a以及所述第二凸緣25d;支持部110,支持所述保持部120以及所述第一清洗機構310;以及移動部130,可使所述支持部110移動,所述第一清洗機構310被設於所述支持部110中與所述保持部120不同的一側。 藉由如此般構成,將第一清洗機構310與保持部120設於不同側,藉此,可抑制支持部110的重心發生偏倚。藉此,可順滑地進行支持部110的移動。尤其,本實施形態中,由於將第一清洗機構310與保持部120設於相反側,因此可有效地防止支持部110的重心的偏倚。 Furthermore, the blade replacement mechanism 100 includes: a holding part 120 that can hold the blade 25a and the second flange 25d; a supporting part 110 that supports the holding part 120 and the first cleaning mechanism 310; and a mobile The first cleaning mechanism 310 is provided on a side of the support part 110 that is different from the holding part 120 . With such a configuration, the first cleaning mechanism 310 and the holding part 120 are provided on different sides, thereby suppressing the center of gravity of the supporting part 110 from being deviated. Thereby, the support part 110 can be moved smoothly. In particular, in this embodiment, since the first cleaning mechanism 310 and the holding part 120 are provided on opposite sides, deviation of the center of gravity of the supporting part 110 can be effectively prevented.

而且,所述第二清洗機構320可對所述保持部120所保持的所述第二凸緣25d進行清洗。 藉由如此般構成,可在更換刀片25a時直接對由保持部120所保持的第二凸緣25d進行清洗,因此可有效率地進行第二凸緣25d的清洗。 Furthermore, the second cleaning mechanism 320 can clean the second flange 25d held by the holding part 120. With such a configuration, the second flange 25d held by the holding part 120 can be directly cleaned when the blade 25a is replaced, so the second flange 25d can be cleaned efficiently.

而且,切斷裝置1包括:分隔壁26,對配置所述主軸部25的空間與配置更換用的刀片25a的空間進行分隔,並且具有開口部26a;以及封閉部200,可藉由所述移動部130來移動,當所述刀片更換機構100處於規定位置時封閉所述開口部26a。 藉由如此般構成,從而可經由開口部26a來使保持部120等移動,並且可根據需要而藉由封閉部200來封閉開口部26a。例如,在已密封基板W的切斷過程中藉由封閉部200來封閉開口部26a,藉此,可防止切削屑等附著於更換用的刀片25a。尤其在本實施形態中,在封閉部200封閉了開口部26a的狀態下,保持部120以及第一清洗機構310被配置於更換用的刀片25a側的空間,因此亦可防止已密封基板W的切斷中產生的切削屑等附著於保持部120等。 Furthermore, the cutting device 1 includes: a partition wall 26 that separates a space where the main shaft part 25 is placed and a space where the replacement blade 25a is placed, and has an opening 26a; and a closing part 200 that can be moved by the above-mentioned movement. The opening 26a is closed when the blade changing mechanism 100 is in a predetermined position. By configuring in this way, the holding part 120 etc. can be moved via the opening part 26a, and the opening part 26a can be closed by the closing part 200 as needed. For example, by closing the opening 26a with the closing portion 200 during cutting of the sealed substrate W, it is possible to prevent cutting chips and the like from adhering to the replacement blade 25a. Especially in this embodiment, in a state where the closing part 200 closes the opening 26a, the holding part 120 and the first cleaning mechanism 310 are arranged in the space on the side of the replacement blade 25a. Therefore, it is possible to prevent the sealed substrate W from being damaged. Chips and the like generated during cutting adhere to the holding portion 120 and the like.

而且,本實施形態的製品P(切斷品)的製造方法包括下述步驟:使用所述切斷裝置1,對設於所述主軸部25的所述刀片25a進行更換;對所述一對凸緣進行清洗;以及利用所述刀片25a來切斷已密封基板W(切斷對象物)。 藉由如此般構成,從而可進行凸緣的清洗。尤其在本實施形態中,可並行地進行更換刀片25a的步驟與清洗一對凸緣的步驟,因此可有效率地進行製品P的製造。 Moreover, the manufacturing method of the product P (cut product) of this embodiment includes the following steps: using the cutting device 1, replacing the blade 25a provided on the main shaft part 25; and replacing the pair of blades 25a. The flange is cleaned; and the sealed substrate W (cutting object) is cut using the blade 25a. With this structure, the flange can be cleaned. Especially in this embodiment, the step of replacing the blade 25a and the step of cleaning the pair of flanges can be performed in parallel, so that the product P can be manufactured efficiently.

以上,對本發明的實施形態進行了說明,但本發明並不限定於所述實施形態,可在申請專利範圍所記載的發明的技術思想的範圍內進行適當的變更。The embodiments of the present invention have been described above. However, the present invention is not limited to the embodiments and can be appropriately modified within the scope of the technical idea of the invention described in the claims.

例如,本實施形態的移動部130的結構(參照圖3等)為一例,只要是可使保持部120以及第一清洗機構310移動至所需位置的結構,則具體的結構不受限定。而且,封閉部200是被設於第二直線移動部133,但本發明並不限於此。即,封閉部200只要是可藉由移動部130來移動而封閉開口部26a的結構即可,例如亦可設為與第二直線移動部133獨立地設於第三直線移動部134的結構。For example, the structure of the moving part 130 in this embodiment (see FIG. 3 etc.) is an example, and the specific structure is not limited as long as the holding part 120 and the first cleaning mechanism 310 can be moved to a desired position. Moreover, the closing part 200 is provided in the second linear moving part 133, but the present invention is not limited thereto. That is, the closing part 200 only needs to be a structure that can be moved by the moving part 130 to close the opening part 26 a. For example, the closing part 200 may be provided in the third linear moving part 134 independently of the second linear moving part 133 .

而且,本實施形態中,表示了在對第一凸緣25c進行清洗時使主軸部25旋轉的示例(參照圖7的(c)),但亦可設為例如使第一清洗海綿311旋轉的結構。Furthermore, in this embodiment, an example is shown in which the main shaft part 25 is rotated when cleaning the first flange 25c (see (c) of FIG. 7 ). However, for example, the first cleaning sponge 311 may be rotated. structure.

而且,第一清洗海綿311以及第二清洗海綿321的形狀並不限於本實施形態的形狀(參照圖5的(a)及圖5的(b)),而可任意變更。Furthermore, the shapes of the first cleaning sponge 311 and the second cleaning sponge 321 are not limited to the shapes of this embodiment (refer to FIGS. 5(a) and 5(b) ), and may be changed arbitrarily.

而且,本實施形態的清洗機構300是使用海綿(第一清洗海綿311以及第二清洗海綿321)作為清洗構件來進行清洗,但本發明並不限於此,亦可使用任意的清洗構件(例如廢棉(waste)等)。Moreover, the cleaning mechanism 300 of this embodiment uses sponges (the first cleaning sponge 311 and the second cleaning sponge 321) as cleaning members to perform cleaning. However, the present invention is not limited to this, and any cleaning member (such as waste water, etc.) may also be used. Cotton (waste, etc.).

而且,本實施形態的清洗機構300是藉由海綿以及空氣噴嘴312來進行凸緣的清洗,但凸緣的清洗方法並不限於此,可利用任意的清洗方法來進行凸緣的清洗。例如,亦可對凸緣噴吹清洗水而進行清洗、或者對附著於凸緣的切削屑等進行抽吸而進行凸緣的清洗。而且,清洗機構300亦可將多個清洗方法加以組合而進行凸緣的清洗。Moreover, the cleaning mechanism 300 of this embodiment uses a sponge and an air nozzle 312 to clean the flange, but the flange cleaning method is not limited to this, and any cleaning method can be used to clean the flange. For example, the flange may be cleaned by spraying cleaning water onto the flange, or the flange may be cleaned by sucking cutting chips adhering to the flange. Moreover, the cleaning mechanism 300 can also combine multiple cleaning methods to clean the flange.

而且,本實施形態中,表示了在將第一凸緣25c安裝於主軸部25的狀態下進行第一凸緣25c的清洗的示例(參照圖7的(b)以及圖7的(c)),但本發明並不限於此。例如,亦可設為在將第一凸緣25c自主軸部25拆卸的狀態下進行第一凸緣25c的清洗的結構。此時,亦可另行設置進行第一凸緣25c的裝卸的機構,而自動進行第一凸緣25c的裝卸。Furthermore, this embodiment shows an example in which the first flange 25c is cleaned while the first flange 25c is attached to the main shaft part 25 (see FIG. 7(b) and FIG. 7(c) ). , but the present invention is not limited to this. For example, the first flange 25c may be cleaned in a state in which the first flange 25c is detached from the main shaft portion 25. At this time, a separate mechanism for attaching and detaching the first flange 25c may be provided to automatically attach and detach the first flange 25c.

而且,本實施形態中,表示了保持部120與第一清洗機構310被設於支持部110的相反側(自正面觀察反轉了180度的位置,參照圖6的(a)至圖6的(d)等)的示例,但本發明並不限於此,保持部120以及第一清洗機構310可設於支持部110的任意位置。例如亦可將第一清洗機構310配置於相對於保持部120而旋轉了90度的位置或者旋轉了120度的位置。Furthermore, in this embodiment, the holding part 120 and the first cleaning mechanism 310 are shown to be provided on the opposite side of the supporting part 110 (a position reversed by 180 degrees when viewed from the front, see FIG. 6( a ) to FIG. 6 (d), etc.), but the present invention is not limited thereto. The holding part 120 and the first cleaning mechanism 310 may be provided at any position of the supporting part 110. For example, the first cleaning mechanism 310 may be arranged at a position rotated by 90 degrees or at a position rotated by 120 degrees relative to the holding portion 120 .

而且,本實施形態中,表示了將保持部120與第一清洗機構310均設於支持部110而使他們一體地移動的示例,但本發明並不限於此。例如,亦可設為將保持部120與第一清洗機構310分別設於不同的構件而使他們彼此獨立地移動的結構。Moreover, in this embodiment, the example in which both the holding part 120 and the first cleaning mechanism 310 are provided in the support part 110 and they are moved integrally is shown, but the present invention is not limited to this. For example, the holding part 120 and the first cleaning mechanism 310 may be provided in different members so that they can move independently of each other.

而且,本實施形態中,表示了暫時中斷切斷裝置1對已密封基板W的切斷而進行刀片25a的更換以及凸緣的清洗的示例,但進行刀片25a的更換等的時機可任意決定。例如亦可在開始切斷裝置1對已密封基板W的切斷之前、或切斷裝置1對已密封基板W的切斷全部完成後,進行刀片25a的更換等。而且,如本實施形態般在切斷裝置1中設有多個主軸部25的情況下,各個主軸部25的刀片25a的更換等既可在相同的時機進行,亦可在不同的時機進行。Furthermore, this embodiment shows an example in which cutting of the sealed substrate W by the cutting device 1 is temporarily interrupted to replace the blade 25a and clean the flange. However, the timing of replacing the blade 25a can be determined arbitrarily. For example, the blade 25 a may be replaced before starting cutting of the sealed substrate W by the cutting device 1 or after all cutting of the sealed substrate W by the cutting device 1 is completed. Furthermore, when the cutting device 1 is provided with a plurality of main shaft portions 25 as in this embodiment, the replacement of the blades 25a of the respective main shaft portions 25 may be performed at the same timing or at different timings.

1:切斷裝置 11:基板供給機構 21:切斷用平台 22:切斷用夾具 23:移動機構 24:旋轉機構 25:主軸部 25a:刀片 25b:旋轉軸 25c:第一凸緣 25d:第二凸緣 25e:拆裝構件 25f:第一接觸面 25g:第二接觸面 26:分隔壁 26a:開口部 27:刀片更換台 27a:已使用刀片收容部 27b:未使用刀片收容部 31:檢查用平台 32:托盤 100:刀片更換機構 110:支持部 120:保持部 130:移動部 131:旋轉部 132:第一直線移動部 133:第二直線移動部 134:第三直線移動部 200:封閉部 300:清洗機構 310:第一清洗機構 311:第一清洗海綿 311a:安裝構件 312:空氣噴嘴 320:第二清洗機構 321:第二清洗海綿 322:驅動部 A:基板供給模組 B:切斷模組 C:收納模組 CTL:控制部 P:製品 W:已密封基板 X、Y、Z、θ:方向 1: Cut off device 11:Substrate supply mechanism 21: Cutting platform 22: Clamp for cutting 23:Mobile mechanism 24: Rotating mechanism 25:Spindle part 25a: Blade 25b:Rotation axis 25c: first flange 25d: Second flange 25e: Disassembly and assembly of components 25f: first contact surface 25g: Second contact surface 26:Partition wall 26a: opening 27:Blade changing station 27a: The blade storage part has been used 27b: Unused blade storage section 31: Inspection platform 32:Pallet 100:Blade changing mechanism 110:Support Department 120:Maintenance Department 130:Mobile Department 131:Rotation part 132: First linear movement unit 133: Second linear movement part 134: Third linear movement unit 200: Closed part 300: Cleaning mechanism 310: The first cleaning mechanism 311:The first cleaning sponge 311a: Installation components 312:Air nozzle 320: Second cleaning mechanism 321: Second cleaning sponge 322:Drive Department A:Substrate supply module B: Cut off module C: Storage module CTL:Control Department P:Products W: Sealed substrate X, Y, Z, θ: direction

圖1是表示一實施形態的切斷裝置的整體結構的平面示意圖。 圖2是表示刀片更換機構、清洗機構以及主軸的位置關係的立體圖。 圖3是表示移動部的動作的立體圖。 圖4是表示主軸部的結構的放大剖面立體圖。 圖5的(a)是表示第一清洗海綿的形狀的立體圖。圖5的(b)是表示第一清洗海綿的變形例的立體圖。 圖6的(a)是表示利用來自空氣噴嘴的空氣來清洗刀片的情況的示意圖。圖6的(b)是表示第二凸緣以及刀片自主軸拆卸的情況的示意圖。圖6的(c)是表示收容已使用的刀片的情況的示意圖。圖6的(d)是表示利用第二清洗海綿來清洗第二凸緣的情況的示意圖。 圖7的(a)是表示保持部保持未使用的刀片的情況的示意圖。圖7的(b)是表示利用來自空氣噴嘴的空氣來清洗第一凸緣的情況的示意圖。圖7的(c)是表示利用第一清洗海綿來清洗第一凸緣的情況的示意圖。圖7的(d)是表示第二凸緣以及刀片被安裝於主軸的情況的示意圖。 FIG. 1 is a schematic plan view showing the overall structure of a cutting device according to an embodiment. FIG. 2 is a perspective view showing the positional relationship between the blade replacement mechanism, the cleaning mechanism, and the spindle. FIG. 3 is a perspective view showing the operation of the moving unit. Fig. 4 is an enlarged cross-sectional perspective view showing the structure of the main shaft portion. (a) of FIG. 5 is a perspective view showing the shape of the first cleaning sponge. FIG. 5( b ) is a perspective view showing a modification of the first cleaning sponge. (a) of FIG. 6 is a schematic diagram showing a state of cleaning the blade with air from the air nozzle. (b) of FIG. 6 is a schematic diagram showing the second flange and the blade being detached from the spindle. (c) of FIG. 6 is a schematic diagram showing a state of storing a used blade. (d) of FIG. 6 is a schematic diagram showing a state of cleaning the second flange using a second cleaning sponge. FIG. 7( a ) is a schematic diagram showing a state in which the holding portion holds an unused blade. (b) of FIG. 7 is a schematic diagram showing the state of cleaning the first flange with air from the air nozzle. (c) of FIG. 7 is a schematic diagram showing the state of cleaning the first flange using the first cleaning sponge. (d) of FIG. 7 is a schematic diagram showing the second flange and the blade being attached to the spindle.

25:主軸部 25a:刀片 26:分隔壁 26a:開口部 27:刀片更換台 27a:已使用刀片收容部 27b:未使用刀片收容部 100:刀片更換機構 110:支持部 120:保持部 130:移動部 131:旋轉部 132:第一直線移動部 133:第二直線移動部 134:第三直線移動部 200:封閉部 300:清洗機構 310:第一清洗機構 311:第一清洗海綿 320:第二清洗機構 321:第二清洗海綿 322:驅動部 X、Y、Z:方向 25:Spindle part 25a: Blade 26:Partition wall 26a: opening 27:Blade changing station 27a: The blade storage part has been used 27b: Unused blade storage section 100:Blade changing mechanism 110:Support Department 120:Maintenance Department 130:Mobile Department 131:Rotation part 132: First linear movement unit 133: Second linear movement part 134: Third linear movement unit 200: Closed part 300: Cleaning mechanism 310: The first cleaning mechanism 311:The first cleaning sponge 320: Second cleaning mechanism 321: Second cleaning sponge 322:Drive Department X, Y, Z: direction

Claims (6)

一種切斷裝置,包括:刀片更換機構,對設於主軸部的刀片進行更換;以及清洗機構,對用於將所述刀片固定於所述主軸部的一對凸緣進行清洗,其中所述清洗機構包括:第一清洗機構,對所述一對凸緣中的其中一個凸緣進行清洗;以及第二清洗機構,對所述一對凸緣中的另一個凸緣進行清洗,其中所述第一清洗機構能夠對被安裝於所述主軸部的狀態的所述其中一個凸緣進行清洗,且所述第二清洗機構能夠對自所述主軸部拆卸的狀態的所述另一個凸緣進行清洗。 A cutting device includes: a blade replacement mechanism to replace the blade provided on the main shaft part; and a cleaning mechanism to clean a pair of flanges for fixing the blade to the main shaft part, wherein the cleaning mechanism The mechanism includes: a first cleaning mechanism for cleaning one of the pair of flanges; and a second cleaning mechanism for cleaning the other of the pair of flanges, wherein the third cleaning mechanism A cleaning mechanism can clean one of the flanges in a state of being installed on the main shaft part, and the second cleaning mechanism can clean the other flange in a state of being detached from the main shaft part. . 如請求項1所述的切斷裝置,其中所述第一清洗機構能夠在安裝於所述主軸部的所述其中一個凸緣藉由所述主軸部的旋轉而旋轉的狀態下,對所述其中一個凸緣進行清洗。 The cutting device according to claim 1, wherein the first cleaning mechanism is capable of cleaning the first cleaning mechanism in a state where the one flange mounted on the main shaft part is rotated by the rotation of the main shaft part. One of the flanges is cleaned. 如請求項1或請求項2所述的切斷裝置,其中所述刀片更換機構包括:保持部,能夠保持所述刀片以及所述另一個凸緣;支持部,支持所述保持部以及所述第一清洗機構;以及移動部,能夠使所述支持部移動,所述第一清洗機構被設於所述支持部中與所述保持部不同的 一側。 The cutting device according to claim 1 or claim 2, wherein the blade replacement mechanism includes: a holding part capable of holding the blade and the other flange; and a supporting part supporting the holding part and the other flange. a first cleaning mechanism; and a moving part capable of moving the support part, the first cleaning mechanism being provided in the support part at a location different from the holding part one side. 如請求項3所述的切斷裝置,其中所述第二清洗機構能夠對所述保持部所保持的所述另一個凸緣進行清洗。 The cutting device according to claim 3, wherein the second cleaning mechanism can clean the other flange held by the holding part. 如請求項3所述的切斷裝置,其包括:分隔壁,對配置所述主軸部的空間與配置更換用刀片的空間進行分隔,並且具有開口部;以及封閉部,能夠藉由所述移動部來移動,當所述刀片更換機構處於規定位置時封閉所述開口部。 The cutting device according to claim 3, which includes: a partition wall that separates a space where the main shaft part is arranged and a space where the replacement blade is arranged, and has an opening part; and a closing part that can be moved by the movement. The blade replacement mechanism moves to close the opening when the blade replacement mechanism is in a predetermined position. 一種切斷品的製造方法,包括下述步驟:使用如請求項1至請求項5中任一項所述的切斷裝置,對設於所述主軸部的所述刀片進行更換;對所述一對凸緣進行清洗;以及利用所述刀片來將切斷對象物予以切斷。 A method of manufacturing a cut product, including the following steps: using the cutting device according to any one of claims 1 to 5, replacing the blade provided on the main shaft part; The pair of flanges is cleaned; and the cutting object is cut using the blade.
TW111129598A 2021-11-08 2022-08-05 Cutting device and method of manufacturing cut product TWI812389B (en)

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