KR20190069464A - 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 - Google Patents

밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 Download PDF

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KR20190069464A
KR20190069464A KR1020197013177A KR20197013177A KR20190069464A KR 20190069464 A KR20190069464 A KR 20190069464A KR 1020197013177 A KR1020197013177 A KR 1020197013177A KR 20197013177 A KR20197013177 A KR 20197013177A KR 20190069464 A KR20190069464 A KR 20190069464A
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South Korea
Prior art keywords
inorganic filler
resin composition
sealing
mass
average particle
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Ceased
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KR1020197013177A
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English (en)
Korean (ko)
Inventor
유마 다케우치
히사토 다카하시
요시히토 이나바
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히타치가세이가부시끼가이샤
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Priority to KR1020227038211A priority Critical patent/KR102725565B1/ko
Publication of KR20190069464A publication Critical patent/KR20190069464A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020197013177A 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 Ceased KR20190069464A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227038211A KR102725565B1 (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016202714 2016-10-14
JPJP-P-2016-202714 2016-10-14
PCT/JP2017/034810 WO2018070237A1 (ja) 2016-10-14 2017-09-26 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

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KR1020227038211A Division KR102725565B1 (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

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Publication Number Publication Date
KR20190069464A true KR20190069464A (ko) 2019-06-19

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KR1020197013177A Ceased KR20190069464A (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
KR1020227038211A Active KR102725565B1 (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

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Country Status (6)

Country Link
US (2) US11186742B2 (enExample)
JP (2) JP7231821B2 (enExample)
KR (2) KR20190069464A (enExample)
CN (2) CN120399400A (enExample)
TW (1) TWI753021B (enExample)
WO (1) WO2018070237A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018070237A1 (ja) 2016-10-14 2018-04-19 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
KR20240050451A (ko) * 2018-04-13 2024-04-18 가부시끼가이샤 레조낙 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
TWI811215B (zh) * 2018-04-13 2023-08-11 日商力森諾科股份有限公司 密封用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
JP7020343B2 (ja) * 2018-08-21 2022-02-16 昭和電工マテリアルズ株式会社 封止樹脂材料
CN114585684A (zh) * 2019-10-24 2022-06-03 松下知识产权经营株式会社 密封用树脂组合物及半导体装置
CN117736550A (zh) * 2022-09-15 2024-03-22 华为技术有限公司 树脂组合物及其制备方法和应用

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JP2010192525A (ja) 2009-02-16 2010-09-02 Namics Corp 半導体装置およびその製造方法
JP2011006618A (ja) 2009-06-26 2011-01-13 Namics Corp 封止用液状樹脂組成物、フリップチップ実装体およびその製造方法
JP2012107149A (ja) 2010-11-19 2012-06-07 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置

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JP4033257B2 (ja) 2002-04-08 2008-01-16 京セラケミカル株式会社 液状封止用樹脂組成物および半導体封止装置
JP4516779B2 (ja) * 2004-04-14 2010-08-04 株式会社アドマテックス 金属酸化物表面処理粒子、その製造方法および樹脂組成物の製造方法
JP4460968B2 (ja) * 2004-07-27 2010-05-12 株式会社アドマテックス 樹脂組成物の製造方法
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TWI673318B (zh) 2013-11-29 2019-10-01 日商納美仕股份有限公司 環氧樹脂組成物、半導體密封劑及半導體裝置
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WO2018070237A1 (ja) 2016-10-14 2018-04-19 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

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Publication number Priority date Publication date Assignee Title
JP2010192525A (ja) 2009-02-16 2010-09-02 Namics Corp 半導体装置およびその製造方法
JP2011006618A (ja) 2009-06-26 2011-01-13 Namics Corp 封止用液状樹脂組成物、フリップチップ実装体およびその製造方法
JP2012107149A (ja) 2010-11-19 2012-06-07 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置

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Publication number Publication date
JP7513074B2 (ja) 2024-07-09
CN120399400A (zh) 2025-08-01
US20210363380A1 (en) 2021-11-25
US11873414B2 (en) 2024-01-16
KR102725565B1 (ko) 2024-11-05
WO2018070237A1 (ja) 2018-04-19
CN109844020A (zh) 2019-06-04
WO2018070237A9 (ja) 2018-06-14
US11186742B2 (en) 2021-11-30
US20190233672A1 (en) 2019-08-01
JP2023016887A (ja) 2023-02-02
TW201817808A (zh) 2018-05-16
KR20220152583A (ko) 2022-11-16
JP7231821B2 (ja) 2023-03-02
TWI753021B (zh) 2022-01-21
JPWO2018070237A1 (ja) 2019-09-05

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