WO2018070237A9 - 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 - Google Patents
封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 Download PDFInfo
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- WO2018070237A9 WO2018070237A9 PCT/JP2017/034810 JP2017034810W WO2018070237A9 WO 2018070237 A9 WO2018070237 A9 WO 2018070237A9 JP 2017034810 W JP2017034810 W JP 2017034810W WO 2018070237 A9 WO2018070237 A9 WO 2018070237A9
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- WIPO (PCT)
- Prior art keywords
- inorganic filler
- resin composition
- sealing
- mass
- electronic component
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Definitions
- the present invention relates to a sealing resin composition, an electronic component device, and a method for manufacturing an electronic component device.
- FC-PKG flip chip package
- FC-CSP flip chip chip size package
- FC-PKG bleed is a phenomenon in which a liquid component in a semiconductor sealing material, which is a liquid resin composition, spreads and spreads on the surface of a solder resist applied on a substrate under a semiconductor chip.
- the connection circuit near the FC-PKG may be contaminated.
- the surface tension of the liquid resin composition may be reduced by adding a siloxane copolymer or a silicone compound.
- the decrease in the surface tension of the liquid resin composition may lead to deterioration of package injectability when the liquid resin composition is used as an underfill material. Therefore, there is a demand for a material that can suppress bleeding without depending on a siloxane copolymer or a silicone compound.
- the present invention has been made in view of the above circumstances, and an object thereof is to provide a sealing resin composition capable of suppressing bleeding, an electronic component device using the same, and a method for manufacturing the same.
- the (C) inorganic filler includes (C1) a first inorganic filler having an average particle diameter of 0.1 ⁇ m to 20 ⁇ m and (C2) a second inorganic filler having an average particle diameter of 10 nm to 80 nm, A sealing resin composition in which a value obtained by multiplying the specific surface area of the (C) inorganic filler by the ratio of the mass of the (C) inorganic filler to the solid mass is 4.0 mm 2 / g or more.
- ⁇ 2> The sealing resin composition according to ⁇ 1>, wherein the viscosity at 110 ° C. is 0.20 Pa ⁇ s or less.
- ⁇ 3> The ratio of the (C2) second inorganic filler having an average particle size of 10 nm to 80 nm in the (C) inorganic filler is 0.3% by mass or more.
- ⁇ 1> or ⁇ 2> The resin composition for sealing as described.
- the ratio of the (C1) first inorganic filler having an average particle diameter of 0.1 ⁇ m to 20 ⁇ m in the (C) inorganic filler is 70% by mass or more.
- ⁇ 1> to ⁇ 4> The sealing resin composition according to any one of the above.
- ⁇ 6> The sealing resin composition according to any one of ⁇ 1> to ⁇ 5>, wherein the viscosity at 25 ° C. is 0.1 Pa ⁇ s to 50.0 Pa ⁇ s.
- ⁇ 7> The sealing resin composition according to any one of ⁇ 1> to ⁇ 6>, wherein the first inorganic filler (C1) having an average particle diameter of 0.1 ⁇ m to 20 ⁇ m contains silica.
- the specific surface area of the second inorganic filler (C2) having an average particle diameter of 10 nm to 80 nm is 20 mm 2 / g to 500 mm 2 / g, according to any one of ⁇ 1> to ⁇ 10>
- the resin composition for sealing as described.
- ⁇ 12> The encapsulating resin composition according to any one of ⁇ 1> to ⁇ 11>, wherein the throttling index at 25 ° C. is 0.5 to 1.5.
- ⁇ 13> a substrate having a circuit layer; An electronic component disposed on the substrate and electrically connected to the circuit layer; A cured product of the sealing resin composition according to any one of ⁇ 1> to ⁇ 12> disposed in a gap between the substrate and the electronic component; An electronic component device comprising: ⁇ 14> A sealing substrate according to any one of ⁇ 1> to ⁇ 12>, wherein a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer
- the manufacturing method of the electronic component apparatus which has the process of sealing using a resin composition.
- a sealing resin composition capable of suppressing bleeding, an electronic component device using the same, and a method for producing the same.
- the present invention is not limited to the following embodiments.
- the components including element steps and the like are not essential unless otherwise specified.
- the term “process” includes a process that is independent of other processes and includes the process if the purpose of the process is achieved even if it cannot be clearly distinguished from the other processes. It is.
- numerical values indicated by using “to” include numerical values described before and after “to” as the minimum value and the maximum value, respectively.
- the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range. Good. Further, in the numerical ranges described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
- the content of each component in the composition is the sum of the plurality of substances present in the composition unless there is a specific indication when there are a plurality of substances corresponding to each component in the composition. It means the content rate of.
- the particle size of each component in the composition is a mixture of the plurality of types of particles present in the composition unless there is a specific indication when there are a plurality of types of particles corresponding to each component in the composition. Means the value of.
- the term “layer” refers to the case where the layer is formed only in a part of the region in addition to the case where the layer is formed over the entire region. Is also included.
- the sealing resin composition of the present disclosure includes (A) an epoxy resin, (B) a curing agent having at least one amino group in one molecule, and (C) an inorganic filler, and (C) the inorganic filler (C1) a first inorganic filler having an average particle diameter of 0.1 ⁇ m to 20 ⁇ m and (C2) a second inorganic filler having an average particle diameter of 10 nm to 80 nm, and (C) a specific surface area of the inorganic filler
- the value obtained by multiplying the ratio of the mass of the inorganic filler (C) to the mass of the solid content is 4.0 mm 2 / g or more.
- the epoxy resin (A) imparts curability and adhesiveness to the sealing resin composition, and imparts heat resistance and durability to the cured product of the sealing resin composition.
- the epoxy resin is preferably a liquid epoxy resin.
- a solid epoxy resin can be used in combination with a liquid epoxy resin as long as bleed suppression is achieved.
- a liquid epoxy resin means that it is a liquid epoxy resin at normal temperature (25 degreeC). Specifically, it means that the viscosity measured with an E-type viscometer is 1000 Pa ⁇ s or less at 25 ° C. Specifically, the viscosity is measured using an E-type viscometer EHD type (cone angle: 3 °, cone diameter: 28 mm), measuring temperature: 25 ° C., sample volume: 0.7 ml, and the number of rotations with reference to the following. The value after 1 minute from the start of measurement is taken as the measurement value after setting according to the assumed viscosity. (1) When the assumed viscosity is 100 Pa ⁇ s to 1000 Pa ⁇ s: 0.5 rotations / min. (2) When the assumed viscosity is less than 100 Pa ⁇ s: 5 rotations / min. An epoxy resin means a solid epoxy resin at room temperature (25 ° C.).
- epoxy resin is not particularly limited.
- epoxy resins naphthalene type epoxy resins; diglycidyl ether type epoxy resins such as bisphenol A, bisphenol F, bisphenol AD, bisphenol S, hydrogenated bisphenol A; phenols and aldehydes represented by orthocresol novolac type epoxy resins
- examples thereof include glycidylamine type epoxy resins obtained by the reaction.
- the epoxy equivalent of the epoxy resin is preferably 80 g / eq to 250 g / eq from the viewpoint of viscosity adjustment, more preferably 85 g / eq to 240 g / eq, and 90 g / eq to 230 g / eq. Is more preferable.
- the epoxy equivalent of the epoxy resin is measured by dissolving the weighed epoxy resin in a solvent such as methyl ethyl ketone, adding acetic acid and tetraethylammonium bromide acetic acid solution, and then performing potentiometric titration with a perchloric acid acetic acid standard solution. An indicator may be used for this titration.
- a commercially available product may be used as the epoxy resin.
- Specific examples of commercially available epoxy resins include amine type epoxy resin (product name: jER630) manufactured by Mitsubishi Chemical Corporation, bisphenol F type epoxy resin (product name: YDF-8170C) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and Nippon Steel & Sumikin Chemical Co., Ltd. Examples thereof include bisphenol A type epoxy resin (product name: YD-128) manufactured by DIC, naphthalene type epoxy resin (product name: HP-4032D) manufactured by DIC Corporation.
- the epoxy resin is not limited to these specific examples.
- Epoxy resins may be used alone or in combination of two or more.
- the content of the epoxy resin is not particularly limited.
- the proportion of the epoxy resin in the solid content of the sealing resin composition is preferably 5% by mass to 28% by mass, and preferably 7% by mass to 17% by mass. More preferably, the content is 10% by mass to 15% by mass.
- the curing agent having at least one amino group in one molecule of the component (B) may be any one that can be cured by polymerization together with an epoxy resin. If it is set as a composition, if the resin composition for sealing has fluidity
- Specific curing agents include amine-based curing agents and carboxylic acid dihydrazide curing agents. From the viewpoint of fluidity, pot life, etc., the specific curing agent is preferably an amine curing agent.
- amine-based curing agents examples include chain aliphatic amines, cycloaliphatic amines, aliphatic aromatic amines, aromatic amines, and the like, and aromatic amines are preferable from the viewpoint of heat resistance and electrical characteristics.
- Specific examples of the amine curing agent include m-phenylenediamine, 1,3-diaminotoluene, 1,4-diaminotoluene, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene.
- Aromatic amine curing agents having one aromatic ring such as 3,5-diethyl-2,6-diaminotoluene, 2,4-diaminoanisole; 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylsulfone 4,4′-methylenebis (2-ethylaniline), 3,3′-diethyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5,5′-tetramethyl-4,4′-diaminodiphenylmethane, Aromatic amine curing agents having two aromatic rings such as 3,3 ′, 5,5′-tetraethyl-4,4′-diaminodiphenylmethane; hydrolysis condensates of aromatic amine curing agents; Aromatic amine curing agent having a polyether structure such as tetramethylene oxide di-p-aminobenzoate, polytetramethylene oxide di
- Specific examples of commercial products of the specific curing agent include an amine curing agent (product name: Kayahard-AA) manufactured by Nippon Kayaku Co., Ltd., an amine curing agent (product name: jER Cure (registered trademark) 113 manufactured by Mitsubishi Chemical Corporation), and product name: jER Cure (registered trademark) W) and the like, but the specific curing agent is not limited to these specific examples.
- curing agent may be individual or may use 2 or more types together.
- the ratio of the number of equivalents of the epoxy resin and the number of equivalents of the specific curing agent contained in the sealing resin composition is not particularly limited.
- the ratio of the number of equivalents of epoxy resin to the number of equivalents of specific curing agent is in the range of 0.6 to 1.4 Is preferably set in the range of 0.7 to 1.3, more preferably in the range of 0.8 to 1.2.
- the sealing resin composition may contain other curing agents other than the specific curing agent as necessary.
- other curing agents include phenolic curing agents, acid anhydride curing agents, and imidazole curing agents.
- the inorganic filler of component (C) As the inorganic filler of component (C), (C1) a first inorganic filler having an average particle diameter of 0.1 ⁇ m to 20 ⁇ m and (C2) a second inorganic filler having an average particle diameter of 10 nm to 80 nm are used in combination. Is done.
- the inorganic filler include silica such as colloidal silica, hydrophobic silica and spherical silica, inorganic particles such as talc, and organic particles. From the viewpoint of fluidity when applying the sealing resin composition and the heat resistance of the cured product of the sealing resin composition, amorphous spherical silica is preferable.
- the content of the inorganic filler is not particularly limited.
- the proportion in the solid content of the sealing resin composition is preferably 40% by mass to 85% by mass, and 46% by mass to 78% by mass. %, More preferably 50% by mass to 70% by mass.
- the first inorganic filler of component (C1) imparts heat cycle resistance, moisture resistance, insulation, etc. to the cured product of the encapsulating resin composition, and stress during curing of the encapsulating resin composition Reduce.
- the average particle size of the first inorganic filler is 0.1 ⁇ m to 20 ⁇ m, preferably 0.2 ⁇ m to 10 ⁇ m, more preferably 0.2 ⁇ m to 8 ⁇ m, and 0.3 ⁇ m to 5 ⁇ m. More preferably.
- the specific surface area of the first inorganic filler is 1mm 2 / g ⁇ 30mm 2 / g from the viewpoint of fluidity, and more preferably 2mm 2 / g ⁇ 20mm 2 / g.
- the proportion of the first inorganic filler in the inorganic filler is preferably 70% by mass or more. Moreover, it is preferable that the ratio of the 1st inorganic filler to an inorganic filler is 99.7 mass% or less. The ratio of the first inorganic filler to the inorganic filler is more preferably 70% by mass to 99.7% by mass, and further preferably 75% by mass to 99.5% by mass.
- the BET method is mainly applied as a method for measuring the specific surface area of the inorganic filler.
- the BET method is a gas adsorption method in which inert gas molecules such as nitrogen (N 2 ), argon (Ar), and krypton (Kr) are adsorbed on solid particles, and the specific surface area of the solid particles is measured from the amount of adsorbed gas molecules. Is the law.
- the specific surface area can be measured using a specific surface area pore distribution measuring apparatus (for example, SA3100, manufactured by Beckman Coulter, Inc.).
- a commercially available product may be used as the first inorganic filler.
- Specific examples of commercially available products of the first inorganic filler include spherical silica manufactured by Admatechs Co., Ltd. (product name: SO-E2), spherical silica manufactured by Admatex Co., Ltd. (product name: SE2200), and the like.
- the inorganic filler is not limited to these specific examples.
- the average particle diameter of the first inorganic filler is measured by a dynamic light scattering nanotrack particle size analyzer. Note that the average particle size in the present disclosure is a particle size corresponding to 50% volume accumulation from the small diameter side.
- the first inorganic filler may be used alone or in combination of two or more.
- the first inorganic filler may have an organic group derived from the production raw material.
- the organic group that the first inorganic filler may have include alkyl groups such as a methyl group and an ethyl group.
- amorphous spherical silica amorphous spherical silica produced by a sol-gel method is preferable from the viewpoint of particle size controllability and purity.
- silica a composition containing silica obtained by the production method described in JP-A-2007-197655 may be used.
- the average particle diameter of the second inorganic filler is 10 nm to 80 nm, preferably 10 nm to 70 nm, and more preferably 10 nm to 60 nm. If the average particle diameter of the second inorganic filler is 10 nm or more, the viscosity of the encapsulating resin composition is unlikely to increase, and the fluidity tends not to deteriorate.
- the specific surface area of the second inorganic filler is a viewpoint from 20mm 2 / g ⁇ 500mm 2 / g of the fluidity, and more preferably from 50mm 2 / g ⁇ 300mm 2 / g.
- a commercially available product may be used as the second inorganic filler.
- Specific examples of commercially available products of the second inorganic filler include inorganic fillers manufactured by Admatechs Co., Ltd. (product names: YA010C, YA050C, etc.), inorganic fillers manufactured by Sakai Chemical Industry Co., Ltd. (product name: Sciqas 0.05 ⁇ m).
- the second inorganic filler is not limited to these specific examples.
- the second inorganic filler may be used alone or in combination of two or more.
- the proportion of the second inorganic filler in the inorganic filler is preferably 0.3% by mass or more. Moreover, it is preferable that the ratio of the 2nd inorganic filler to an inorganic filler is 30 mass% or less. The proportion of the second inorganic filler in the inorganic filler is more preferably 0.3% by mass to 30% by mass, and further preferably 0.5% by mass to 25% by mass. If the ratio of the 2nd inorganic filler to an inorganic filler is the said range, the resin composition for sealing which can express the reduction effect of a bleed and is excellent in fluidity
- the second inorganic filler a particle whose surface has been previously treated with an organic group can be used.
- the surface of the particles is pretreated with an organic group, which is preferable in terms of improving the adhesive strength to a semiconductor chip, an organic substrate and the like and improving the toughness of the cured product of the sealing resin composition.
- the inorganic filler includes both the first inorganic filler and the second inorganic filler is confirmed, for example, by obtaining a volume-based particle size distribution (frequency distribution) of the inorganic filler.
- a volume-based particle size distribution frequency distribution
- the inorganic filler is the first inorganic filler and the first inorganic filler. It can be said that both of the two inorganic fillers are included.
- the confirmation method is not limited to the above method.
- the method for obtaining the ratio of the first or second inorganic filler in the inorganic filler is not particularly limited, and for example, the volume-based particle size distribution (frequency distribution) of the inorganic filler is obtained, Both are cut into the valley between the peak corresponding to the first inorganic filler and the peak corresponding to the second inorganic filler, and the volume of the particles contained in each of the divided ranges is the total volume of the inorganic filler. It is calculated by dividing.
- the ratio of the first or second inorganic filler to the inorganic filler can be determined from the composition of the sealing resin composition. Note that the calculation method is not limited to the above method.
- the value obtained by multiplying the specific surface area of the inorganic filler by the ratio of the mass of the inorganic filler to the solid mass is 4 mm 2 / g or more, preferably 4 mm 2 / g to 30 mm 2 / g, 5 mm 2 / g to 26 mm 2 / g is more preferable, and 6 mm 2 / g to 24 mm 2 / g is still more preferable. If the value obtained by multiplying the specific surface area of the inorganic filler by the ratio of the mass of the inorganic filler to the solid mass is within the above range, a resin composition that can exhibit the effect of reducing bleeding and is excellent in fluidity can be obtained. .
- the “specific surface area of the inorganic filler” refers to a weighted average of the first inorganic filler and the second inorganic filler.
- the specific surface area of the inorganic filler is the first inorganic filler, the second inorganic filler The weighted average of inorganic fillers and other inorganic fillers.
- the “solid content mass” means the mass of the solid content contained in the encapsulating resin composition, and means the remaining components excluding volatile components such as organic solvents from the encapsulating resin composition.
- the sealing resin composition preferably contains a rubber additive as the component (D) from the viewpoint of relaxing the stress of the cured product of the sealing resin composition.
- the rubber additive include acrylic rubber, urethane rubber, silicone rubber, butadiene rubber and the like.
- the rubber additive one that is solid at room temperature (25 ° C.) can be used.
- the form is not particularly limited, and particles or pellets can be used.
- the average particle diameter is preferably 0.01 ⁇ m to 20 ⁇ m, more preferably 0.02 ⁇ m to 10 ⁇ m, and further preferably 0.03 ⁇ m to 5 ⁇ m.
- a liquid additive at normal temperature 25 ° C.
- the liquid rubber additive include polybutadiene, butadiene / acrylonitrile copolymer, polyisoprene, polypropylene oxide, and polydiorganosiloxane.
- the rubber additive is solid at normal temperature (25 ° C.), it is preferable to use it by heating and dissolving it in an epoxy resin or a specific curing agent.
- the rubber additive having a group that reacts with an epoxy group at the terminal may be solid or liquid at normal temperature (25 ° C.), and may be in any form.
- a commercially available product may be used as the rubber additive.
- Specific examples of commercially available rubber additives include CTBN1300, ATBN1300-16, CTBN1008-SP manufactured by Ube Industries, Ltd., silicone rubber powder (product name: AY42-119, etc.) manufactured by Toray Dow Corning, JSR Corporation Examples thereof include rubber powder (product name: XER81, etc.), but the rubber additive is not limited to these specific examples.
- the rubber additives may be used alone or in combination of two or more.
- the sealing resin composition may contain a coupling agent as component (E).
- a coupling agent is not particularly limited and can be appropriately selected from conventionally known ones.
- silane compounds such as amino silane, epoxy silane, mercapto silane, alkyl silane, ureido silane, vinyl silane having at least one selected from the group consisting of primary amino group, secondary amino group and tertiary amino group; titanate type Compound etc. are mentioned.
- an epoxysilane compound is preferable from the viewpoint of adhesion of the sealing resin composition.
- a commercially available product may be used as the coupling agent.
- a coupling agent may be used alone or in combination of two or more.
- a thixotropic agent for improving workability a pigment such as carbon black, a dye, an ion trapper, an antifoaming agent, You may contain other components, such as a leveling agent, antioxidant, a reactive diluent, and an organic solvent.
- the sealing resin composition is, for example, an epoxy resin, a specific curing agent, an inorganic filler, and other components used as needed, either collectively or separately, with heat treatment if necessary, stirring, melting, It can be obtained by mixing and dispersing.
- the specific curing agent is solid, when the specific curing agent is blended in a solid state, the viscosity increases and workability may decrease. Therefore, it is preferable to use the specific curing agent in a liquid state by heating in advance. .
- a device for mixing, stirring, dispersing and the like of these components is not particularly limited, and a lykai machine equipped with a stirring device, a heating device, etc., a three roll mill, a ball mill, a planetary mixer, a bead mill, etc. Can be mentioned.
- the above-mentioned components are mixed using these devices, kneaded, and defoamed as necessary to obtain a sealing resin composition.
- the viscosity of the sealing resin composition is not particularly limited. Among these, from the viewpoint of high fluidity, it is preferably 0.1 Pa ⁇ s to 50.0 Pa ⁇ s at 25 ° C., more preferably 0.1 Pa ⁇ s to 20.0 Pa ⁇ s, and more preferably 0.1 Pa ⁇ s. More preferably, it is s to 10.0 Pa ⁇ s.
- the viscosity of the sealing resin composition is measured at 25 ° C. using an E-type viscometer (cone angle 3 °, rotation speed 10 rotations / minute).
- the filling is performed when the sealing resin composition is filled in a narrow gap of several tens of ⁇ m to several hundreds of ⁇ m around 100 ° C. to 120 ° C.
- the viscosity at 110 ° C. is preferably 0.20 Pa ⁇ s or less, and more preferably 0.15 Pa ⁇ s or less.
- the viscosity of the sealing resin composition at 110 ° C. is measured with a rheometer AR2000 (TA Instruments, aluminum cone 40 mm, shear rate 32.5 / sec).
- the sealing resin composition has a vibration ratio which is a ratio of a viscosity at a rotation speed of 1.5 rotations / minute and a viscosity at a rotation speed of 10 rotations / minute measured at 25 ° C. using an E-type viscometer.
- the variable index [(viscosity at 1.5 revolutions / minute) / (viscosity at 10 revolutions / minute)] is preferably 0.5 to 1.5, more preferably 0.8 to 1.2. preferable.
- the fillet-forming property in the underfill material application is further improved when the change index is in the above range.
- the viscosity of the resin composition for sealing and the fluctuation index can be set to a desired range by appropriately selecting the composition of the epoxy resin, the content of the inorganic filler, and the like.
- the curing conditions of the sealing resin composition are not particularly limited, and it is preferable to heat at 80 ° C. to 165 ° C. for 1 minute to 150 minutes.
- An electronic component device includes a substrate having a circuit layer, an electronic component disposed on the substrate and electrically connected to the circuit layer, and a book disposed in a gap between the substrate and the electronic component. And a cured product of the disclosed resin composition for sealing.
- the electronic component device of the present disclosure can be obtained by sealing an electronic component with the sealing resin composition of the present disclosure. Since the electronic component is sealed with the sealing resin composition, the electronic component device of the present disclosure is excellent in temperature cycle resistance.
- Electronic component devices include lead frames, wired tape carriers, rigid wiring boards, flexible wiring boards, substrates with circuit layers such as glass and silicon wafers, active elements such as semiconductor chips, transistors, diodes, and thyristors, capacitors
- a semiconductor device in which a semiconductor element is flip-chip bonded to a wiring formed on a rigid wiring board, a flexible wiring board, or glass by bump connection is one of objects to which the present disclosure can be applied.
- Specific examples include electronic component devices such as flip chip BGA (Ball Grid Array), LGA (Land Grid Array), and COF (Chip On Film).
- the sealing resin composition of the present disclosure is suitable as an underfill material for flip chip having excellent reliability.
- the bump material connecting the wiring substrate and the semiconductor element is not a conventional lead-containing solder, but a Sn—Ag—Cu based material or the like. This is a flip-chip semiconductor component using lead-free solder.
- the sealing resin composition of the present disclosure can maintain good reliability even for a flip chip that is bump-bonded using lead-free solder that is physically brittle compared to conventional lead solder.
- reliability can be improved by applying the sealing resin composition of the present disclosure.
- the method of manufacturing an electronic component device includes a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer, the sealing resin composition according to the present disclosure. And using a sealing step.
- a sealing resin composition is applied to the gap between the electronic component and the substrate using a capillary phenomenon, and then a curing reaction of the sealing resin composition is performed.
- sealing resin composition of the present disclosure to the surface of at least one of the substrate having the circuit layer and the electronic component and connecting the electronic component to the substrate by thermocompression bonding.
- thermocompression bonding there is a first coating method in which the connection of the electronic component and the substrate and the curing reaction of the sealing resin composition are performed together.
- the method for applying the sealing resin composition include a casting method, a dispensing method, a printing method, and the like.
- sealing resin composition of the present disclosure it is possible to easily manufacture an electronic component device such as a flip chip mounting body in which bleeding is suppressed.
- Each component was blended so as to have the composition shown in Table 1 and Table 2, kneaded with a three roll and vacuum raikai machine, dispersed, and the results of Examples 1 to 9 and Comparative Examples 1 to 7 were obtained.
- a sealing resin composition was prepared.
- the blending unit is parts by mass, and “-” represents “no blending”. Further, the content (% by mass) of the inorganic filler in the sealing resin composition was calculated from the blending amount of each component.
- diaminotoluene type amine curing agent amine curing agent 1; manufactured by Mitsubishi Chemical Corporation, trade name “jER Cure W”
- diaminodiphenylmethane type amine curing agent amine curing agent 2; Nippon Kayaku Co., Ltd.
- an inorganic filler having an average particle size of 0.5 ⁇ m and a specific surface area of 4.5 m 2 / g, which is silica particles (inorganic filler 1: manufactured by Admatechs Co., Ltd., trade name “SE2200-SEJ”), average Inorganic filler having a particle size of 50 nm and a specific surface area of 66 m 2 / g (inorganic filler 2: manufactured by Admatechs, trade name “YA050C-SZ2), an inorganic filler having an average particle size of 10 nm and a specific surface area of 280 m 2 / g ( Inorganic filler 3: manufactured by Admatechs Co., Ltd., trade name “YA010C-SZ2”), with an average particle size of 0.3 ⁇ m and a specific surface area of 14 m 2 / g (inorganic filler 4: manufactured by Ad
- Viscosity and Fluctuation Index Viscosity (room temperature viscosity, Pa ⁇ s) of the resin composition for sealing at 25 ° C. is measured using an E-type viscometer (cone angle 3 °, rotation speed 10 rotations / minute). And measured. Further, the fluctuation index at 25 ° C. is the ratio of the viscosity at a rotation speed of 1.5 rotations / minute and the viscosity at a rotation speed of 10 rotations / minute [(viscosity at 1.5 rotations / minute) / (10 rotations / minute]. Viscosity in minutes)]. The viscosity (Pa ⁇ s) at 110 ° C. was measured using a rheometer AR2000 (aluminum cone 40 mm, shear rate 32.5 / sec).
- Tg glass transition temperature
- CTE coefficient of thermal expansion
- the thermal expansion coefficient in the temperature range below Tg was CTE1
- the thermal expansion coefficient in the temperature range above Tg was CTE2.
- Tg and CTE show thermal stability, Tg is preferably about 100 ° C. to 130 ° C., and CTE 1 and CTE 2 are preferably lower.
- the “content ratio of the second inorganic filler” means the ratio of the second inorganic filler to the inorganic filler.
- “specific surface area ⁇ ratio of inorganic filler” means “a value obtained by multiplying the specific surface area of the inorganic filler by the ratio of the mass of the inorganic filler to the solid mass”.
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Abstract
Description
<1> (A)エポキシ樹脂、(B)1分子中にアミノ基を少なくとも1つ有する硬化剤及び(C)無機充填材を含み、
前記(C)無機充填材が、(C1)平均粒径が0.1μm~20μmの第1の無機充填材及び(C2)平均粒径が10nm~80nmの第2の無機充填材を含み、
前記(C)無機充填材の比表面積に、固形分質量に占める前記(C)無機充填材の質量の割合を乗じた値が、4.0mm2/g以上である封止用樹脂組成物。
<2> 110℃での粘度が、0.20Pa・s以下である<1>に記載の封止用樹脂組成物。
<3> 前記(C)無機充填材に占める前記(C2)平均粒径が10nm~80nmの第2の無機充填材の割合が、0.3質量%以上である<1>又は<2>に記載の封止用樹脂組成物。
<4> 前記(C)無機充填材に占める前記(C2)平均粒径が10nm~80nmの第2の無機充填材の割合が、30質量%以下である<1>~<3>のいずれか1項に記載の封止用樹脂組成物。
<5> 前記(C)無機充填材に占める前記(C1)平均粒径が0.1μm~20μmの第1の無機充填材の割合が、70質量%以上である<1>~<4>のいずれか1項に記載の封止用樹脂組成物。
<6> 25℃における粘度が、0.1Pa・s~50.0Pa・sである<1>~<5>のいずれか1項に記載の封止用樹脂組成物。
<7> 前記(C1)平均粒径が0.1μm~20μmの第1の無機充填材が、シリカを含む<1>~<6>のいずれか1項に記載の封止用樹脂組成物。
<8> 前記(C2)平均粒径が10nm~80nmの第2の無機充填材が、シリカを含む<1>~<7>のいずれか1項に記載の封止用樹脂組成物。
<9> 前記(C)無機充填材の含有率が、40質量%~85質量%である<1>~<8>のいずれか1項に記載の封止用樹脂組成物。
<10> 前記(C1)平均粒径が0.1μm~20μmの第1の無機充填材の比表面積が、1mm2/g~30mm2/gである<1>~<9>のいずれか1項に記載の封止用樹脂組成物。
<11> 前記(C2)平均粒径が10nm~80nmの第2の無機充填材の比表面積が、20mm2/g~500mm2/gである<1>~<10>のいずれか1項に記載の封止用樹脂組成物。
<12> 25℃における揺変指数が、0.5~1.5である<1>~<11>のいずれか1項に記載の封止用樹脂組成物。
<13> 回路層を有する基板と、
前記基板上に配置され、前記回路層と電気的に接続された電子部品と、
前記基板と前記電子部品との間隙に配置された<1>~<12>のいずれか1項に記載の封止用樹脂組成物の硬化物と、
を備える電子部品装置。
<14> 回路層を有する基板と、前記基板上に配置され、前記回路層と電気的に接続された電子部品とを、<1>~<12>のいずれか1項に記載の封止用樹脂組成物を用いて封止する工程を有する電子部品装置の製造方法。
本明細書において「工程」との語には、他の工程から独立した工程に加え、他の工程と明確に区別できない場合であってもその工程の目的が達成されれば、当該工程も含まれる。
本明細書において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本明細書中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本明細書中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本明細書において組成物中の各成分の含有率は、組成物中に各成分に該当する物質が複数種存在する場合、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率を意味する。
本明細書において組成物中の各成分の粒径は、組成物中に各成分に該当する粒子が複数種存在する場合、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。
本明細書において「層」との語には、当該層が存在する領域を観察したときに、当該領域の全体に形成されている場合に加え、当該領域の一部にのみ形成されている場合も含まれる。
本開示の封止用樹脂組成物は、(A)エポキシ樹脂、(B)1分子中にアミノ基を少なくとも1つ有する硬化剤及び(C)無機充填材を含み、(C)無機充填材が、(C1)平均粒径が0.1μm~20μmの第1の無機充填材及び(C2)平均粒径が10nm~80nmの第2の無機充填材を含み、(C)無機充填材の比表面積に、固形分質量に占める(C)無機充填材の質量の割合を乗じた値が、4.0mm2/g以上とされたものである。
(A)成分のエポキシ樹脂は、封止用樹脂組成物に、硬化性及び接着性を付与し、封止用樹脂組成物の硬化物に、耐熱性及び耐久性を付与する。エポキシ樹脂は液状エポキシ樹脂であることが好ましい。本開示においては、ブリードの抑制が達成される範囲内であれば、液状エポキシ樹脂と共に固形エポキシ樹脂を併用することもできる。
(1)想定される粘度が100Pa・s~1000Pa・sの場合:回転数0.5回転/分
(2)想定される粘度が100Pa・s未満の場合:回転数5回転/分
また、固形エポキシ樹脂とは常温(25℃)において固体状のエポキシ樹脂であることを意味する。
エポキシ樹脂のエポキシ当量は、秤量したエポキシ樹脂をメチルエチルケトン等の溶媒に溶解させ、酢酸と臭化テトラエチルアンモニウム酢酸溶液を加えた後、過塩素酸酢酸標準液によって電位差滴定することにより測定される。この滴定には、指示薬を用いてもよい。
エポキシ樹脂の含有率は特に限定されるものではなく、例えば、封止用樹脂組成物の固形分に占める割合として、5質量%~28質量%であることが好ましく、7質量%~17質量%であることがより好ましく、10質量%~15質量%であることがさらに好ましい。
(B)成分の1分子中にアミノ基を少なくとも1つ有する硬化剤(以下、特定硬化剤と称することがある。)は、エポキシ樹脂とともに重合により硬化するものであればよく、封止用樹脂組成物としたときに、封止用樹脂組成物が室温(25℃)で流動性を有するならば、液体状のものでも固体状のものでも使用可能である。
特定硬化剤としては、アミン系硬化剤、カルボン酸ジヒドラジド硬化剤等が挙げられる。流動性、ポットライフ性等の観点から、特定硬化剤としては、アミン系硬化剤が好ましい。
アミン系硬化剤としては、具体的には、m-フェニレンジアミン、1,3-ジアミノトルエン、1,4-ジアミノトルエン、2,4-ジアミノトルエン、3,5-ジエチル-2,4-ジアミノトルエン、3,5-ジエチル-2,6-ジアミノトルエン、2,4-ジアミノアニソール等の芳香環が1個の芳香族アミン硬化剤;4,4’-ジアミノジフェニルメタン、4,4’-ジアミノジフェニルスルホン、4,4’-メチレンビス(2-エチルアニリン)、3,3’-ジエチル-4,4’-ジアミノジフェニルメタン、3,3’,5,5’-テトラメチル-4,4’-ジアミノジフェニルメタン、3,3’,5,5’-テトラエチル-4,4’-ジアミノジフェニルメタン等の芳香環が2個の芳香族アミン硬化剤;芳香族アミン硬化剤の加水分解縮合物;ポリテトラメチレンオキシドジ-p-アミノ安息香酸エステル、ポリテトラメチレンオキシドジパラアミノベンゾエート等のポリエーテル構造を有する芳香族アミン硬化剤;芳香族ジアミンとエピクロロヒドリンとの縮合物;芳香族ジアミンとスチレンとの反応生成物などが挙げられる。
(C)成分の無機充填材としては、(C1)平均粒径が0.1μm~20μmの第1の無機充填材及び(C2)平均粒径が10nm~80nmの第2の無機充填材が併用される。
無機充填材としては、コロイダルシリカ、疎水性シリカ、球状シリカ等のシリカ、タルクなどの無機粒子、有機粒子などが挙げられる。封止用樹脂組成物を塗布する際の流動性、封止用樹脂組成物の硬化物の耐熱性の観点から、非晶質の球状シリカであることが好ましい。
無機充填材の含有率は特に限定されるものではなく、例えば、封止用樹脂組成物の固形分に占める割合として、40質量%~85質量%であることが好ましく、46質量%~78質量%であることがより好ましく、50質量%~70質量%であることがさらに好ましい。
第1の無機充填材の比表面積としては流動性の観点から1mm2/g~30mm2/gであることが好ましく、2mm2/g~20mm2/gであることがより好ましい。
また、非晶質の球状シリカとしては、粒径制御性及び純度の面からゾル-ゲル法にて製造される非晶質の球状シリカも好ましい。なお、シリカとして、特開2007-197655号公報に記載の製造方法によって得られたシリカを含有する組成物を用いてもよい。
第2の無機充填材としては、市販品を用いてもよい。第2の無機充填材の市販品の具体例としては、株式会社アドマテックス製の無機充填材(品名:YA010C、YA050C等)、堺化学工業株式会社製の無機充填材(品名:Sciqas0.05μm)などが挙げられるが、第2の無機充填材は、これら具体例に限定されるものではない。第2の無機充填材は、単独でも2種以上を併用してもよい。
また、無機充填材に占める第1又は第2の無機充填材の割合を求める方法としては、特に限定されるものではなく、例えば、無機充填材の体積基準の粒度分布(頻度分布)を求め、第1の無機充填材に相当するピークと第2の無機充填材に相当するピークとの谷間で両者を切り分け、切り分けられた各範囲に含まれる粒子の体積を、無機充填材の総和の体積で除することにより求められる。封止用樹脂組成物の組成が明らかな場合には、封止用樹脂組成物の組成から無機充填材に占める第1又は第2の無機充填材の割合を求めることができる。なお、算出方法は、上記方法に限定されるものではない。
ここで、「無機充填材の比表面積」とは、第1の無機充填材及び第2の無機充填材の加重平均をいう。無機充填材として、第1の無機充填材及び第2の無機充填材以外のその他の無機充填材が併用される場合、無機充填材の比表面積とは、第1の無機充填材、第2の無機充填材及びその他の無機充填材の加重平均をいう。
また、「固形分質量」とは封止用樹脂組成物に含まれる固形分の質量をいい、封止用樹脂組成物から有機溶剤等の揮発性成分を除いた残りの成分を意味する。
封止用樹脂組成物は、封止用樹脂組成物の硬化物の応力を緩和する観点から、(D)成分のゴム添加物を含有することが好ましい。ゴム添加物としては、アクリルゴム、ウレタンゴム、シリコーンゴム、ブタジエンゴム等が挙げられる。ゴム添加物は、常温(25℃)において固体のものを使用することができる。形態は特に限定されず、粒子状又はペレット状のものを使用することができる。ゴム添加物が粒子状の場合は、例えば、平均粒径が、好ましくは0.01μm~20μmであり、より好ましくは0.02μm~10μmであり、さらに好ましくは0.03μm~5μmである。
ゴム添加物は、常温(25℃)で液状のものを使用することもできる。液状のゴム添加物としては、ポリブタジエン、ブタジエン・アクリロニトリルコポリマー、ポリイソプレン、ポリプロピレンオキシド、ポリジオルガノシロキサン等が挙げられる。
ゴム添加物が常温(25℃)で固体の場合は、加熱してエポキシ樹脂又は特定硬化剤に溶解させて使用することが好ましい。また、ゴム添加物は、末端にエポキシ基と反応する基を有するものを使用することができる。末端にエポキシ基と反応する基を有するゴム添加物は、常温(25℃)で固体であっても液状であってもいずれの形態であってもよい。
ゴム添加物としては、市販品を用いてもよい。ゴム添加物の市販品の具体例としては、宇部興産株式会社製CTBN1300、ATBN1300-16、CTBN1008-SP等、東レ・ダウコーニング株式会社製シリコーンゴムパウダー(品名:AY42-119等)、JSR株式会社製ゴムパウダー(品名:XER81等)などが挙げられるが、ゴム添加物は、これら具体例に限定されるものではない。また、ゴム添加物は、単独でも2種以上を併用してもよい。
封止用樹脂組成物は、(E)成分のカップリング剤を含有してもよい。封止用樹脂組成物がカップリング剤を含有すると、封止用樹脂組成物の密着性の観点から好ましい。
カップリング剤には特に制限はなく、従来公知のものから適宜選択して用いることができる。例えば、1級アミノ基、2級アミノ基及び3級アミノ基からなる群より選ばれる少なくとも1種を有するアミノシラン、エポキシシラン、メルカプトシラン、アルキルシラン、ウレイドシラン、ビニルシラン等のシラン系化合物;チタネート系化合物などが挙げられる。これらの中でも、封止用樹脂組成物の密着性の観点からエポキシシラン化合物が好ましい。
カップリング剤としては、市販品を用いてもよい。カップリング剤の市販品の具体例としては、信越化学工業株式会社製KBM-403、KBE-903、KBE-9103等が挙げられるが、カップリング剤は、これら具体例に限定されるものではない。カップリング剤は、単独でも2種以上を併用してもよい。
封止用樹脂組成物には、本開示の目的を損なわない範囲で、さらに必要に応じ、作業性向上のための揺変剤、カーボンブラック等の顔料、染料、イオントラッパ、消泡剤、レベリング剤、酸化防止剤、反応性希釈剤、有機溶剤などのその他の成分を含有してもよい。
本開示の電子部品装置は、回路層を有する基板と、前記基板上に配置され、前記回路層と電気的に接続された電子部品と、前記基板と前記電子部品との間隙に配置された本開示の封止用樹脂組成物の硬化物と、を備える。本開示の電子部品装置は、本開示の封止用樹脂組成物により電子部品を封止して得ることができる。電子部品が封止用樹脂組成物によって封止されることで、本開示の電子部品装置は、耐温度サイクル性に優れる。
特に、リジッド配線板、フレキシブル配線板又はガラス上に形成した配線に、半導体素子をバンプ接続によりフリップチップボンディングした半導体装置が、本開示を適応しうる対象の1つとして挙げられる。具体的な例としては、フリップチップBGA(Ball Grid Array)、LGA(Land Grid Array)、COF(Chip On Film)等の電子部品装置が挙げられる。
本開示の電子部品装置の製造方法は、回路層を有する基板と、前記基板上に配置され、前記回路層と電気的に接続された電子部品とを、本開示の封止用樹脂組成物を用いて封止する工程を有する。
本開示の封止用樹脂組成物を用いて回路層を有する基板と電子部品とを封止する工程に特に限定はない。例えば、電子部品と回路層を有する基板とを接続した後に、電子部品と基板とのギャップに毛細管現象を利用して封止用樹脂組成物を付与し、次いで封止用樹脂組成物の硬化反応を行う後入れ方式、並びに、先に回路層を有する基板及び電子部品の少なくとも一方の表面に本開示の封止用樹脂組成物を付与し、熱圧着して電子部品を基板に接続する際に、電子部品及び基板の接続と封止用樹脂組成物の硬化反応とを一括して行う先塗布方式が挙げられる。
封止用樹脂組成物の付与方法としては、注型方式、ディスペンス方式、印刷方式等が挙げられる。
(実施例1~9、比較例1~7)
エポキシ樹脂として、ビスフェノールF型エポキシ樹脂(エポキシ樹脂1;新日鉄住金化学株式会社製、商品名「YDF-8170C」、エポキシ当量:160g/eq)、及び3官能のエポキシ基を有するアミン型エポキシ樹脂(エポキシ樹脂2;三菱ケミカル株式会社製、商品名「jER630」、エポキシ当量:95g/eq)を用意した。
無機充填材として、シリカ粒子である平均粒径0.5μmで比表面積4.5m2/gの無機充填材(無機充填材1:株式会社アドマテックス製、商品名「SE2200-SEJ」)、平均粒径50nmで比表面積66m2/gの無機充填材(無機充填材2:株式会社アドマテックス製、商品名「YA050C-SZ2)、平均粒径10nmで比表面積280m2/gの無機充填材(無機充填材3:株式会社アドマテックス製、商品名「YA010C-SZ2」)、平均粒径0.3μmで比表面積14m2/gの無機充填材(無機充填材4:株式会社アドマテックス製、商品名「SE1050」)、平均粒径0.3μmで比表面積15m2/gの無機充填材(無機充填材5:株式会社アドマテックス製、商品名「SE1050-SET」)、平均粒径0.3μmで比表面積16m2/gの無機充填材(無機充填材6:株式会社アドマテックス製、商品名「SE1030-SET」)、平均粒径0.15μmで比表面積30m2/gの無機充填材(無機充填材7:株式会社日本触媒製、商品名「KE-S10」)、及び平均粒径0.15μmで比表面積30m2/gの無機充填材(無機充填材8:株式会社日本触媒製、商品名「KE-S10-HG」)を用意した。
封止用樹脂組成物の25℃における粘度(常温粘度、Pa・s)を、E型粘度計(コーン角度3°、回転数10回転/分)を用いて測定した。また、25℃における揺変指数は、回転数が1.5回転/分における粘度と回転数が10回転/分における粘度との比[(1.5回転/分における粘度)/(10回転/分における粘度)]とした。110℃における粘度(Pa・s)はレオメーターAR2000(アルミコーン40mm、せん断速度32.5/sec)を用いて測定した。
封止用樹脂組成物を165℃、2時間の条件で硬化して作製した試験片(φ4mm×20mm)を、熱機械分析装置(ティー・エイ・インスツルメント・ジャパン株式会社製、商品名TMAQ400)を用い、荷重15g、測定温度-50℃~220℃、昇温速度5℃/分の条件で測定した。
またTg以下の温度範囲における熱膨張係数をCTE1とし、Tg以上の温度範囲における熱膨張係数をCTE2とした。Tg及びCTEは熱的安定性を示し、Tgは100℃~130℃程度が好ましく、CTE1及びCTE2は低いほど好ましい。
ソルダーレジスト基板に、Ar2プラズマ処理(400W、2分間)を行い、このAr2プラズマ処理を行ったソルダーレジスト基板上に、シリンジに充填された封止用樹脂組成物を、20Gのニードルにて30mg吐出してポッティングし、150℃で120分間硬化させた。硬化後、光学顕微鏡を用いて、ブリードの長さを測定した。基板にはFR-4(日立化成株式会社製、MRC-E-679)上にソルダーレジスト(太陽インキ製造株式会社製 PSR-4000-AUS703)を形成したものを使用した。ブリード長さは、500μm以下であることが好ましく、400μm以下であることがより好ましく、350μm以下であることがさらに好ましい。
表1及び表2において、「比表面積×無機充填材の割合」は、「無機充填材の比表面積に、固形分質量に占める無機充填材の質量の割合を乗じた値」を意味する。
Claims (14)
- (A)エポキシ樹脂、(B)1分子中にアミノ基を少なくとも1つ有する硬化剤及び(C)無機充填材を含み、
前記(C)無機充填材が、(C1)平均粒径が0.1μm~20μmの第1の無機充填材及び(C2)平均粒径が10nm~80nmの第2の無機充填材を含み、
前記(C)無機充填材の比表面積に、固形分質量に占める前記(C)無機充填材の質量の割合を乗じた値が、4.0mm2/g以上である封止用樹脂組成物。 - 110℃での粘度が、0.20Pa・s以下である請求項1に記載の封止用樹脂組成物。
- 前記(C)無機充填材に占める前記(C2)平均粒径が10nm~80nmの第2の無機充填材の割合が、0.3質量%以上である請求項1又は請求項2に記載の封止用樹脂組成物。
- 前記(C)無機充填材に占める前記(C2)平均粒径が10nm~80nmの第2の無機充填材の割合が、30質量%以下である請求項1~請求項3のいずれか1項に記載の封止用樹脂組成物。
- 前記(C)無機充填材に占める前記(C1)平均粒径が0.1μm~20μmの第1の無機充填材の割合が、70質量%以上である請求項1~請求項4のいずれか1項に記載の封止用樹脂組成物。
- 25℃における粘度が、0.1Pa・s~50.0Pa・sである請求項1~請求項5のいずれか1項に記載の封止用樹脂組成物。
- 前記(C1)平均粒径が0.1μm~20μmの第1の無機充填材が、シリカを含む請求項1~請求項6のいずれか1項に記載の封止用樹脂組成物。
- 前記(C2)平均粒径が10nm~80nmの第2の無機充填材が、シリカを含む請求項1~請求項7のいずれか1項に記載の封止用樹脂組成物。
- 前記(C)無機充填材の含有率が、40質量%~85質量%である請求項1~請求項8のいずれか1項に記載の封止用樹脂組成物。
- 前記(C1)平均粒径が0.1μm~20μmの第1の無機充填材の比表面積が、1mm2/g~30mm2/gである請求項1~請求項9のいずれか1項に記載の封止用樹脂組成物。
- 前記(C2)平均粒径が10nm~80nmの第2の無機充填材の比表面積が、20mm2/g~500mm2/gである請求項1~請求項10のいずれか1項に記載の封止用樹脂組成物。
- 25℃における揺変指数が、0.5~1.5である請求項1~請求項11のいずれか1項に記載の封止用樹脂組成物。
- 回路層を有する基板と、
前記基板上に配置され、前記回路層と電気的に接続された電子部品と、
前記基板と前記電子部品との間隙に配置された請求項1~請求項12のいずれか1項に記載の封止用樹脂組成物の硬化物と、
を備える電子部品装置。 - 回路層を有する基板と、前記基板上に配置され、前記回路層と電気的に接続された電子部品とを、請求項1~請求項12のいずれか1項に記載の封止用樹脂組成物を用いて封止する工程を有する電子部品装置の製造方法。
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