KR20190045909A - 백사이드 바디 콘택트를 갖는 딥 트렌치 능동 디바이스 - Google Patents

백사이드 바디 콘택트를 갖는 딥 트렌치 능동 디바이스 Download PDF

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KR20190045909A
KR20190045909A KR1020197006280A KR20197006280A KR20190045909A KR 20190045909 A KR20190045909 A KR 20190045909A KR 1020197006280 A KR1020197006280 A KR 1020197006280A KR 20197006280 A KR20197006280 A KR 20197006280A KR 20190045909 A KR20190045909 A KR 20190045909A
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South Korea
Prior art keywords
backside
gate
layer
coupled
semiconductor
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Ceased
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KR1020197006280A
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English (en)
Korean (ko)
Inventor
시난 고테펠리
스티브 파넬리
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퀄컴 인코포레이티드
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Publication of KR20190045909A publication Critical patent/KR20190045909A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H10D86/215—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI comprising FinFETs
    • H01L27/1211—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H01L29/0649—
    • H01L29/66795—
    • H01L29/7851—
    • H01L29/78615—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/62—Fin field-effect transistors [FinFET]
    • H10D30/6211—Fin field-effect transistors [FinFET] having fin-shaped semiconductor bodies integral with the bulk semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6708—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
    • H10D30/6711—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect by using electrodes contacting the supplementary regions or layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
KR1020197006280A 2016-09-06 2017-08-03 백사이드 바디 콘택트를 갖는 딥 트렌치 능동 디바이스 Ceased KR20190045909A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/257,823 US9812580B1 (en) 2016-09-06 2016-09-06 Deep trench active device with backside body contact
US15/257,823 2016-09-06
PCT/US2017/045349 WO2018048529A1 (en) 2016-09-06 2017-08-03 Deep trench active device with backside body contact

Publications (1)

Publication Number Publication Date
KR20190045909A true KR20190045909A (ko) 2019-05-03

Family

ID=59684050

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197006280A Ceased KR20190045909A (ko) 2016-09-06 2017-08-03 백사이드 바디 콘택트를 갖는 딥 트렌치 능동 디바이스

Country Status (7)

Country Link
US (1) US9812580B1 (enExample)
EP (1) EP3510636A1 (enExample)
JP (1) JP2019530218A (enExample)
KR (1) KR20190045909A (enExample)
CN (1) CN109791948A (enExample)
BR (1) BR112019003900A2 (enExample)
WO (1) WO2018048529A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210148843A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 에어 갭을 갖는 반도체 디바이스 및 그 제조 방법

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CN110504240B (zh) * 2018-05-16 2021-08-13 联华电子股份有限公司 半导体元件及其制造方法
CN109524355B (zh) * 2018-10-30 2020-11-10 上海集成电路研发中心有限公司 一种半导体器件的结构和形成方法
CN109545785B (zh) * 2018-10-31 2023-01-31 上海集成电路研发中心有限公司 一种半导体器件结构和制备方法
CN109545802B (zh) * 2018-12-14 2021-01-12 上海微阱电子科技有限公司 一种绝缘体上半导体器件结构和形成方法
CN109616472B (zh) * 2018-12-14 2022-11-15 上海微阱电子科技有限公司 一种半导体器件结构和形成方法
CN109891585B (zh) * 2019-01-30 2020-03-27 长江存储科技有限责任公司 具有垂直扩散板的电容器结构
CN109923666B (zh) * 2019-01-30 2020-05-26 长江存储科技有限责任公司 具有垂直扩散板的电容器结构
KR102642279B1 (ko) * 2019-02-18 2024-02-28 양쯔 메모리 테크놀로지스 씨오., 엘티디. 새로운 커패시터 구조 및 이를 형성하는 방법
TWI741935B (zh) 2020-04-28 2021-10-01 台灣積體電路製造股份有限公司 半導體元件與其製作方法
DE102020122151A1 (de) * 2020-04-28 2021-10-28 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleitervorrichtung und verfahren
US11349004B2 (en) * 2020-04-28 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Backside vias in semiconductor device
US11355410B2 (en) * 2020-04-28 2022-06-07 Taiwan Semiconductor Manufacturing Co., Ltd. Thermal dissipation in semiconductor devices
US11251308B2 (en) 2020-04-28 2022-02-15 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method
CN120280431B (zh) * 2025-06-04 2025-09-30 长飞先进半导体(武汉)有限公司 半导体器件及制作方法、功率模块、功率转换电路和车辆

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JP2948018B2 (ja) * 1992-03-17 1999-09-13 三菱電機株式会社 半導体装置およびその製造方法
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JP2003309182A (ja) * 2002-04-17 2003-10-31 Hitachi Ltd 半導体装置の製造方法及び半導体装置
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Publication number Priority date Publication date Assignee Title
KR20210148843A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 에어 갭을 갖는 반도체 디바이스 및 그 제조 방법
US11830769B2 (en) 2020-05-28 2023-11-28 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with air gaps and method of fabrication thereof
US12463092B2 (en) 2020-05-28 2025-11-04 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with air gaps and method of fabrication thereof

Also Published As

Publication number Publication date
WO2018048529A1 (en) 2018-03-15
JP2019530218A (ja) 2019-10-17
US9812580B1 (en) 2017-11-07
BR112019003900A2 (pt) 2019-05-21
EP3510636A1 (en) 2019-07-17
CN109791948A (zh) 2019-05-21

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