KR20180133564A - 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법 - Google Patents

필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법 Download PDF

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Publication number
KR20180133564A
KR20180133564A KR1020187035605A KR20187035605A KR20180133564A KR 20180133564 A KR20180133564 A KR 20180133564A KR 1020187035605 A KR1020187035605 A KR 1020187035605A KR 20187035605 A KR20187035605 A KR 20187035605A KR 20180133564 A KR20180133564 A KR 20180133564A
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KR
South Korea
Prior art keywords
formula
film
represented
resin
polyamide
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Ceased
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KR1020187035605A
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English (en)
Korean (ko)
Inventor
고지 미야모토
노조미 마스이
쇼 가네사카
준이치 이케우치
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스미또모 가가꾸 가부시키가이샤
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Application filed by 스미또모 가가꾸 가부시키가이샤 filed Critical 스미또모 가가꾸 가부시키가이샤
Publication of KR20180133564A publication Critical patent/KR20180133564A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020187035605A 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법 Ceased KR20180133564A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-008828 2017-01-20
JP2017008828 2017-01-20
PCT/JP2018/000805 WO2018135432A1 (ja) 2017-01-20 2018-01-15 フィルム、樹脂組成物及びポリアミドイミド樹脂の製造方法

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KR1020187009234A Division KR101952823B1 (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법

Related Child Applications (1)

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KR1020207009594A Division KR20200038329A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법

Publications (1)

Publication Number Publication Date
KR20180133564A true KR20180133564A (ko) 2018-12-14

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KR1020187035605A Ceased KR20180133564A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법
KR1020207009594A Ceased KR20200038329A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법
KR1020187009234A Expired - Fee Related KR101952823B1 (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법

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KR1020187009234A Expired - Fee Related KR101952823B1 (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법

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JP (2) JP7118651B2 (enExample)
KR (3) KR20180133564A (enExample)
CN (1) CN110191909B (enExample)
TW (1) TW201831565A (enExample)
WO (1) WO2018135432A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7084710B2 (ja) * 2017-01-20 2022-06-15 住友化学株式会社 ポリアミドイミド樹脂および該ポリアミドイミド樹脂を含んでなる光学部材
WO2018147611A1 (ko) * 2017-02-08 2018-08-16 에스케이씨 주식회사 폴리아마이드-이미드 필름의 제조방법
KR102430056B1 (ko) * 2017-09-08 2022-08-05 삼성전자주식회사 폴리(아미드-이미드) 코폴리머, 폴리(아미드-이미드) 코폴리머 제조용 조성물, 폴리(아미드-이미드) 코폴리머를 포함하는 성형품 및 표시 장치
JP7145703B2 (ja) * 2017-09-08 2022-10-03 三星電子株式会社 ポリ（アミド－イミド）コポリマー、ポリ（アミド－イミド）コポリマー製造用組成物、ポリ（アミド－イミド）コポリマーを含む成形品および表示装置
CN112703220A (zh) * 2018-08-07 2021-04-23 齐默尔根公司 光学透明的聚酰亚胺
JP2020037675A (ja) * 2018-08-29 2020-03-12 住友化学株式会社 光学フィルム
WO2020137870A1 (ja) * 2018-12-26 2020-07-02 住友化学株式会社 ポリイミド系樹脂の製造方法
JP2020105497A (ja) * 2018-12-26 2020-07-09 住友化学株式会社 ポリイミド系樹脂及びその製造方法
JP2020105496A (ja) * 2018-12-26 2020-07-09 住友化学株式会社 ポリイミド系樹脂の製造方法
TW202031733A (zh) * 2018-12-28 2020-09-01 日商住友化學股份有限公司 聚醯胺醯亞胺系樹脂、聚醯胺醯亞胺系樹脂清漆、光學膜及可撓性顯示裝置
JP7365211B2 (ja) * 2019-12-02 2023-10-19 住友化学株式会社 光学フィルム
KR20210110642A (ko) * 2018-12-28 2021-09-08 스미또모 가가꾸 가부시키가이샤 광학 필름
CN111378129A (zh) * 2018-12-28 2020-07-07 住友化学株式会社 聚酰胺酰亚胺系树脂、聚酰胺酰亚胺系树脂清漆、光学膜及柔性显示装置
CN113227211A (zh) * 2018-12-28 2021-08-06 住友化学株式会社 聚酰胺系树脂、光学膜及柔性显示装置
CN111378130A (zh) * 2018-12-28 2020-07-07 住友化学株式会社 光学膜
WO2020138044A1 (ja) * 2018-12-28 2020-07-02 住友化学株式会社 ポリアミド系樹脂、光学フィルム及びフレキシブル表示装置
JP7382810B2 (ja) * 2018-12-28 2023-11-17 住友化学株式会社 光学フィルム
KR20210110647A (ko) * 2018-12-28 2021-09-08 스미또모 가가꾸 가부시키가이샤 광학 필름, 플렉시블 표시 장치 및 폴리아미드이미드계 수지
WO2020138046A1 (ja) * 2018-12-28 2020-07-02 住友化学株式会社 光学フィルム
CN111381295A (zh) * 2018-12-28 2020-07-07 住友化学株式会社 光学膜
JP2020122122A (ja) * 2019-01-31 2020-08-13 住友化学株式会社 ポリイミド系樹脂粉体及びポリイミド系樹脂粉体の製造方法
TWI730820B (zh) * 2019-06-28 2021-06-11 南韓商Ｓｋｃ股份有限公司 聚合物薄膜
JP7512805B2 (ja) * 2019-10-02 2024-07-09 大日本印刷株式会社 ポリアミドイミド樹脂、ポリアミドイミドワニス、ポリアミドイミドフィルム、積層体、ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
CN112646371A (zh) * 2019-10-11 2021-04-13 住友化学株式会社 光学膜及柔性显示装置
KR20220095209A (ko) * 2019-10-31 2022-07-06 스미또모 가가꾸 가부시키가이샤 광학 필름 및 플렉시블 표시 장치
CN112778522A (zh) * 2019-11-07 2021-05-11 住友化学株式会社 聚酰胺酰亚胺树脂、光学膜及柔性显示装置
CN115210681A (zh) * 2020-03-05 2022-10-18 住友化学株式会社 光学层叠体和显示装置
KR102286207B1 (ko) 2020-05-04 2021-08-06 에스케이이노베이션 주식회사 폴리이미드계 필름 및 이를 포함하는 플렉서블 디스플레이 패널
JPWO2022071443A1 (enExample) * 2020-09-30 2022-04-07
JP2022096909A (ja) * 2020-12-18 2022-06-30 住友化学株式会社 表示装置用前面板
TWI740758B (zh) * 2020-12-25 2021-09-21 律勝科技股份有限公司 聚醯胺醯亞胺共聚物及含其之薄膜
JP2023073709A (ja) * 2021-11-16 2023-05-26 株式会社カネカ 樹脂組成物およびフィルム
KR102845592B1 (ko) * 2022-11-14 2025-08-13 에스케이마이크로웍스솔루션즈 주식회사 폴리아마이드-이미드계 필름, 이의 제조방법, 및 이를 포함하는 커버 윈도우 및 디스플레이 장치
TW202523743A (zh) * 2023-10-03 2025-06-16 日商鐘化股份有限公司 聚醯胺醯亞胺、樹脂組合物、成形體及膜

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265371A (ja) * 2005-03-24 2006-10-05 Teijin Ltd ポリイミドフィルムの製造方法
JP4802934B2 (ja) * 2006-08-18 2011-10-26 新日本理化株式会社 脂環系ポリイミド共重合体及びその製造方法
JP5359029B2 (ja) * 2007-06-06 2013-12-04 Ｊｎｃ株式会社 酸二無水物、液晶配向膜および液晶表示素子
JP5240204B2 (ja) * 2007-11-12 2013-07-17 東洋紡株式会社 金属積層体
WO2009116500A1 (ja) 2008-03-19 2009-09-24 Jsr株式会社 ポリイミド系材料、ポリイミドフィルム及びそれらの製造方法
KR101459178B1 (ko) 2011-09-30 2014-11-07 코오롱인더스트리 주식회사 공중합 폴리아마이드-이미드 필름 및 공중합 폴리아마이드-이미드의 제조방법
KR20130071650A (ko) * 2011-12-21 2013-07-01 코오롱인더스트리 주식회사 투명 폴리아마이드―이미드 필름 및 그 제조방법
KR102058764B1 (ko) * 2012-03-30 2019-12-23 닛산 가가쿠 가부시키가이샤 폴리이미드계의 액정 배향 처리제, 액정 배향막, 및 액정 표시 소자
US9434816B2 (en) 2012-06-25 2016-09-06 Kolon Industries, Inc. Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer
JP6582988B2 (ja) 2013-10-23 2019-10-02 日産化学株式会社 液晶配向剤、液晶配向膜、及び液晶配向素子
JP5888472B2 (ja) 2014-02-21 2016-03-22 三菱化学株式会社 ポリイミド前駆体及び／又はポリイミドを含む組成物、並びにポリイミドフィルム
KR20160083738A (ko) * 2015-01-02 2016-07-12 삼성전자주식회사 표시 장치용 윈도우 및 이를 포함하는 표시 장치
JP6599620B2 (ja) * 2015-03-05 2019-10-30 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材
CN105237767A (zh) * 2015-07-25 2016-01-13 常州大学 一种液晶聚酰胺酰亚胺及其制备方法
KR101984171B1 (ko) * 2016-06-01 2019-05-30 주식회사 엘지화학 고강도 투명 폴리아미드이미드 및 이의 제조방법
CN106117556B (zh) * 2016-07-12 2020-08-14 苏州优瑞德新材料有限公司 可溶性的聚酰胺酰亚胺树脂，以及从该树脂得到的柔性覆金属板和柔性印制电路板

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Publication number Publication date
KR101952823B1 (ko) 2019-02-27
JP6675509B2 (ja) 2020-04-01
KR20180094840A (ko) 2018-08-24
JP2019104939A (ja) 2019-06-27
KR20200038329A (ko) 2020-04-10
TW201831565A (zh) 2018-09-01
CN110191909A (zh) 2019-08-30
JP7118651B2 (ja) 2022-08-16
WO2018135432A1 (ja) 2018-07-26
CN110191909B (zh) 2021-10-22
JP2018119141A (ja) 2018-08-02

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