KR20180085071A - 웨이퍼를 가공하기 위한 장치 및 방법 - Google Patents

웨이퍼를 가공하기 위한 장치 및 방법 Download PDF

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Publication number
KR20180085071A
KR20180085071A KR1020187020824A KR20187020824A KR20180085071A KR 20180085071 A KR20180085071 A KR 20180085071A KR 1020187020824 A KR1020187020824 A KR 1020187020824A KR 20187020824 A KR20187020824 A KR 20187020824A KR 20180085071 A KR20180085071 A KR 20180085071A
Authority
KR
South Korea
Prior art keywords
processing wafers
wafers
processing
Prior art date
Application number
KR1020187020824A
Other languages
English (en)
Other versions
KR101993106B1 (ko
Inventor
파울 린드너
피터-올리버 행베이어
Original Assignee
에베 그룹 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에베 그룹 게엠베하 filed Critical 에베 그룹 게엠베하
Publication of KR20180085071A publication Critical patent/KR20180085071A/ko
Application granted granted Critical
Publication of KR101993106B1 publication Critical patent/KR101993106B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Semiconductors (AREA)
KR1020187020824A 2010-10-15 2011-10-05 웨이퍼를 가공하기 위한 장치 및 방법 KR101993106B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010048043.6 2010-10-15
DE102010048043A DE102010048043A1 (de) 2010-10-15 2010-10-15 Vorrichtung und Verfahren zur Prozessierung von Wafern
PCT/EP2011/067405 WO2012049058A1 (de) 2010-10-15 2011-10-05 Vorrichtung und verfahren zur prozessierung von wafern

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137010581A Division KR20130122628A (ko) 2010-10-15 2011-10-05 웨이퍼를 가공하기 위한 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20180085071A true KR20180085071A (ko) 2018-07-25
KR101993106B1 KR101993106B1 (ko) 2019-06-25

Family

ID=44741334

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020137010581A KR20130122628A (ko) 2010-10-15 2011-10-05 웨이퍼를 가공하기 위한 장치 및 방법
KR1020187020824A KR101993106B1 (ko) 2010-10-15 2011-10-05 웨이퍼를 가공하기 위한 장치 및 방법
KR1020137019497A KR20130114218A (ko) 2010-10-15 2011-10-05 웨이퍼를 가공하기 위한 장치 및 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020137010581A KR20130122628A (ko) 2010-10-15 2011-10-05 웨이퍼를 가공하기 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020137019497A KR20130114218A (ko) 2010-10-15 2011-10-05 웨이퍼를 가공하기 위한 장치 및 방법

Country Status (8)

Country Link
US (2) US9751698B2 (ko)
EP (2) EP2609619B1 (ko)
JP (2) JP2013542602A (ko)
KR (3) KR20130122628A (ko)
CN (3) CN103531438A (ko)
DE (1) DE102010048043A1 (ko)
SG (1) SG189240A1 (ko)
WO (1) WO2012049058A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5941589B1 (ja) * 2015-09-14 2016-06-29 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム及び記録媒体
CN108842143A (zh) * 2018-07-09 2018-11-20 上海新昇半导体科技有限公司 外延炉冷却系统及冷却方法
CN109378287A (zh) * 2018-11-15 2019-02-22 中芯长电半导体（江阴）有限公司 半导体封装装置
CN112501574B (zh) * 2020-10-27 2022-10-25 东兴华鸿光学科技有限公司 太阳镜片镀膜设备

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US7704348B2 (en) * 2002-03-19 2010-04-27 Fujitsu Limited Apparatus and method for fabricating bonded substrate
US20140037945A1 (en) * 2011-01-31 2014-02-06 Tadatomo Suga Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

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Publication number Priority date Publication date Assignee Title
US5455082A (en) * 1991-05-28 1995-10-03 Tokyo Electron Limited Reduced pressure processing system and reduced pressure processing method
KR20020042407A (ko) * 2000-11-30 2002-06-05 니시히라 쥰지 기판 중합 장치
US7704348B2 (en) * 2002-03-19 2010-04-27 Fujitsu Limited Apparatus and method for fabricating bonded substrate
US20140037945A1 (en) * 2011-01-31 2014-02-06 Tadatomo Suga Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

Also Published As

Publication number Publication date
KR20130122628A (ko) 2013-11-07
JP2013542602A (ja) 2013-11-21
EP2645410A1 (de) 2013-10-02
CN103168350B (zh) 2018-02-13
JP5635162B2 (ja) 2014-12-03
US20130240113A1 (en) 2013-09-19
CN103531438A (zh) 2014-01-22
WO2012049058A1 (de) 2012-04-19
KR20130114218A (ko) 2013-10-16
SG189240A1 (en) 2013-05-31
CN107978544A (zh) 2018-05-01
US9771223B2 (en) 2017-09-26
CN103168350A (zh) 2013-06-19
KR101993106B1 (ko) 2019-06-25
DE102010048043A1 (de) 2012-04-19
EP2609619A1 (de) 2013-07-03
JP2013225706A (ja) 2013-10-31
EP2645410B1 (de) 2021-03-03
EP2609619B1 (de) 2020-05-27
US9751698B2 (en) 2017-09-05
US20130309046A1 (en) 2013-11-21

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