KR20170082979A - 박리 장치 - Google Patents

박리 장치 Download PDF

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Publication number
KR20170082979A
KR20170082979A KR1020160182028A KR20160182028A KR20170082979A KR 20170082979 A KR20170082979 A KR 20170082979A KR 1020160182028 A KR1020160182028 A KR 1020160182028A KR 20160182028 A KR20160182028 A KR 20160182028A KR 20170082979 A KR20170082979 A KR 20170082979A
Authority
KR
South Korea
Prior art keywords
tape
peeling
wafer
protective
peeling tape
Prior art date
Application number
KR1020160182028A
Other languages
English (en)
Korean (ko)
Inventor
구니시게 스즈키
폴 빈센트 아텐디도
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20170082979A publication Critical patent/KR20170082979A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
KR1020160182028A 2016-01-07 2016-12-29 박리 장치 KR20170082979A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016002014A JP2017123409A (ja) 2016-01-07 2016-01-07 剥離装置
JPJP-P-2016-002014 2016-01-07

Publications (1)

Publication Number Publication Date
KR20170082979A true KR20170082979A (ko) 2017-07-17

Family

ID=59305780

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160182028A KR20170082979A (ko) 2016-01-07 2016-12-29 박리 장치

Country Status (2)

Country Link
JP (1) JP2017123409A (ja)
KR (1) KR20170082979A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6721473B2 (ja) * 2016-09-21 2020-07-15 株式会社ディスコ ウエーハの処理方法
JP6963483B2 (ja) * 2017-12-08 2021-11-10 株式会社ディスコ 剥離用テープカッター
KR102167270B1 (ko) * 2020-08-24 2020-10-19 (주)아이엠 Emi 이형 필름 제거 장치
JP2023059151A (ja) * 2021-10-14 2023-04-26 株式会社東京精密 ワーク加工装置
JP2023064613A (ja) 2021-10-26 2023-05-11 株式会社ディスコ 剥離治具、剥離治具を用いたシート剥離方法及びシート剥離装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136248A (ja) * 1991-11-15 1993-06-01 Hitachi Ltd 粘着テープの粘着力制御方法および装置
JP4740381B2 (ja) * 2010-03-12 2011-08-03 リンテック株式会社 シート剥離装置及び剥離方法
JP5558244B2 (ja) * 2010-07-22 2014-07-23 株式会社ディスコ テープ剥離装置
JP2012028541A (ja) * 2010-07-23 2012-02-09 Disco Abrasive Syst Ltd 粘着シート脱着用保持テーブル
JP5014483B2 (ja) * 2010-12-01 2012-08-29 株式会社東京精密 フィルム剥離方法およびフィルム剥離装置

Also Published As

Publication number Publication date
JP2017123409A (ja) 2017-07-13

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application