KR20160141709A - 테일리스 금도금 기판의 스트리핑 방법 - Google Patents

테일리스 금도금 기판의 스트리핑 방법 Download PDF

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Publication number
KR20160141709A
KR20160141709A KR1020167024536A KR20167024536A KR20160141709A KR 20160141709 A KR20160141709 A KR 20160141709A KR 1020167024536 A KR1020167024536 A KR 1020167024536A KR 20167024536 A KR20167024536 A KR 20167024536A KR 20160141709 A KR20160141709 A KR 20160141709A
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KR
South Korea
Prior art keywords
circuit board
exposure
etching
resist
plating
Prior art date
Application number
KR1020167024536A
Other languages
English (en)
Korean (ko)
Inventor
티안후아 엑시아
류풍 루
지동 리
Original Assignee
광저우 패스트프린트 서킷 테크 컴퍼니 리미티드
이싱 실리콘 벨리 일레트로닉스 테크놀로지 컴퍼니 리미티드
센젠 패스트프린트 서킷 테크 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드, 이싱 실리콘 벨리 일레트로닉스 테크놀로지 컴퍼니 리미티드, 센젠 패스트프린트 서킷 테크 컴퍼니 리미티드 filed Critical 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드
Publication of KR20160141709A publication Critical patent/KR20160141709A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0508—Flood exposure

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020167024536A 2014-12-31 2015-11-12 테일리스 금도금 기판의 스트리핑 방법 KR20160141709A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201410857417.XA CN104582287B (zh) 2014-12-31 2014-12-31 一种无引线镀金板退膜方法
CN201410857417.X 2014-12-31
PCT/CN2015/094366 WO2016107295A1 (zh) 2014-12-31 2015-11-12 一种无引线镀金板退膜方法

Publications (1)

Publication Number Publication Date
KR20160141709A true KR20160141709A (ko) 2016-12-09

Family

ID=53097180

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167024536A KR20160141709A (ko) 2014-12-31 2015-11-12 테일리스 금도금 기판의 스트리핑 방법

Country Status (3)

Country Link
KR (1) KR20160141709A (zh)
CN (1) CN104582287B (zh)
WO (1) WO2016107295A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104582287B (zh) * 2014-12-31 2018-01-30 广州兴森快捷电路科技有限公司 一种无引线镀金板退膜方法
CN105228372A (zh) * 2015-09-25 2016-01-06 深圳崇达多层线路板有限公司 一种线路板局部金手指的制作方法
CN105916310A (zh) * 2016-06-17 2016-08-31 红板（江西）有限公司 一种全自动线路板显影蚀刻退膜连续生产设备
CN106793538A (zh) * 2016-11-25 2017-05-31 上海美维电子有限公司 在印刷线路板上用干膜法制造选择性镍钯金的方法
CN107222975B (zh) * 2017-05-26 2019-05-14 安徽四创电子股份有限公司 一种分次蚀刻电镀厚金微带板的图形制作方法
CN110324979A (zh) * 2018-03-29 2019-10-11 欣强电子（清远）有限公司 一种无导线镀金印制线路板的制作工艺
CN109743840B (zh) * 2018-12-28 2021-05-25 广州兴森快捷电路科技有限公司 无芯基板及其封装方法
CN113613385B (zh) * 2021-08-02 2022-08-12 金禄电子科技股份有限公司 多层线路板及其制备方法
CN113923882B (zh) * 2021-09-27 2023-07-04 盐城维信电子有限公司 一种针对多层板外层线路上二维码的去膜方法
CN115418643B (zh) * 2022-10-13 2023-10-31 深圳市板明科技股份有限公司 一种含有护锡添加剂的无机退膜液及其使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4974119B2 (ja) * 2008-03-03 2012-07-11 株式会社伸光製作所 回路基板の製造方法
JP2010180095A (ja) * 2009-02-05 2010-08-19 Dokin Denshi Kogyo Kofun Yugenkoshi 基板の金属化工程
CN103207527B (zh) * 2012-01-16 2016-08-10 昆山允升吉光电科技有限公司 一种掩模板的曝光处理方法
KR101317597B1 (ko) * 2012-03-30 2013-10-18 (주)인터플렉스 인쇄회로기판의 비아홀 및 외층회로형성방법
CN103731995B (zh) * 2013-12-24 2017-05-03 广州兴森快捷电路科技有限公司 无引线镀金封装基板及其制备方法
CN104135826B (zh) * 2014-07-14 2017-06-20 中国航天科技集团公司第九研究院第七七一研究所 一种在印制板电镀厚金的方法
CN104582287B (zh) * 2014-12-31 2018-01-30 广州兴森快捷电路科技有限公司 一种无引线镀金板退膜方法

Also Published As

Publication number Publication date
WO2016107295A1 (zh) 2016-07-07
CN104582287A (zh) 2015-04-29
CN104582287B (zh) 2018-01-30

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