KR20160092003A - 형광체, 그의 제조 방법, 및 상기 형광체를 사용한 발광 장치 - Google Patents

형광체, 그의 제조 방법, 및 상기 형광체를 사용한 발광 장치 Download PDF

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KR20160092003A
KR20160092003A KR1020167017423A KR20167017423A KR20160092003A KR 20160092003 A KR20160092003 A KR 20160092003A KR 1020167017423 A KR1020167017423 A KR 1020167017423A KR 20167017423 A KR20167017423 A KR 20167017423A KR 20160092003 A KR20160092003 A KR 20160092003A
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South Korea
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phosphor
light emitting
light
emitting device
less
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English (en)
Korean (ko)
Inventor
료스케 히라마츠
준 다무라
구니오 이시다
게이코 알베사르
마사히로 가토
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가부시끼가이샤 도시바
도시바 마테리알 가부시키가이샤
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Publication of KR20160092003A publication Critical patent/KR20160092003A/ko
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/61—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/57—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing manganese or rhenium
    • C—CHEMISTRY; METALLURGY
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/59—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/61—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H01L33/502—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
KR1020167017423A 2013-12-09 2014-12-09 형광체, 그의 제조 방법, 및 상기 형광체를 사용한 발광 장치 Ceased KR20160092003A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013254437A JP6342146B2 (ja) 2013-12-09 2013-12-09 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
JPJP-P-2013-254437 2013-12-09
PCT/JP2014/082516 WO2015087861A1 (ja) 2013-12-09 2014-12-09 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置

Related Child Applications (1)

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KR1020177036905A Division KR101940439B1 (ko) 2013-12-09 2014-12-09 형광체 및 그의 제조 방법, 및 상기 형광체를 포함하는 발광 장치

Publications (1)

Publication Number Publication Date
KR20160092003A true KR20160092003A (ko) 2016-08-03

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KR1020167017423A Ceased KR20160092003A (ko) 2013-12-09 2014-12-09 형광체, 그의 제조 방법, 및 상기 형광체를 사용한 발광 장치
KR1020177036905A Active KR101940439B1 (ko) 2013-12-09 2014-12-09 형광체 및 그의 제조 방법, 및 상기 형광체를 포함하는 발광 장치

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Country Status (6)

Country Link
US (1) US10519368B2 (https=)
JP (1) JP6342146B2 (https=)
KR (2) KR20160092003A (https=)
CN (2) CN112500855A (https=)
TW (1) TWI529978B (https=)
WO (1) WO2015087861A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101809793B1 (ko) * 2014-09-30 2017-12-15 니치아 카가쿠 고교 가부시키가이샤 불화물 형광체 및 그 제조 방법 및 발광 장치
JP2016088950A (ja) * 2014-10-30 2016-05-23 信越化学工業株式会社 赤色蛍光体
CN105181671B (zh) * 2015-09-21 2018-06-26 中国科学院长春光学精密机械与物理研究所 测试氮化物荧光粉老化程度的方法
CN105331360A (zh) * 2015-10-30 2016-02-17 烟台希尔德新材料有限公司 Led红色荧光粉及其组合物的产业化制备方法以及产品和应用
JP2018002813A (ja) 2016-06-29 2018-01-11 株式会社東芝 蛍光体および発光装置
US9929321B2 (en) 2016-08-04 2018-03-27 Kabushiki Kaisha Toshiba Phosphor, producing method thereof and light-emitting device employing the phosphor
JP6812231B2 (ja) * 2016-12-20 2021-01-13 デンカ株式会社 フッ化物蛍光体の製造方法
JP2019044017A (ja) * 2017-08-30 2019-03-22 デンカ株式会社 フッ化物蛍光体及び発光装置
JP2019044018A (ja) * 2017-08-30 2019-03-22 デンカ株式会社 フッ化物蛍光体及び発光装置
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2009528429A (ja) 2006-02-28 2009-08-06 ルミネイション リミテッド ライアビリティ カンパニー 発光ダイオード応用における使用のための赤色線放出蛍光体

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Publication number Priority date Publication date Assignee Title
US8491816B2 (en) * 2008-02-07 2013-07-23 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
WO2009119486A1 (ja) * 2008-03-25 2009-10-01 国立大学法人群馬大学 蛍光体及びその製造方法並びに該蛍光体を用いた白色発光ダイオード
JP5682104B2 (ja) * 2008-09-05 2015-03-11 三菱化学株式会社 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP5105132B1 (ja) 2011-06-02 2012-12-19 三菱化学株式会社 半導体発光装置、半導体発光システムおよび照明器具
JP5418548B2 (ja) * 2011-07-06 2014-02-19 日亜化学工業株式会社 フッ化物蛍光体及びそのフッ化物蛍光体を用いた発光装置
CN103429702B (zh) * 2011-12-16 2016-10-26 皇家飞利浦有限公司 用于led应用的锰活化的六氟硅酸盐
JP5840540B2 (ja) 2012-03-15 2016-01-06 株式会社東芝 白色照明装置
JP2014177511A (ja) 2013-03-13 2014-09-25 Toshiba Corp 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
JP2014177586A (ja) * 2013-03-15 2014-09-25 Toshiba Corp 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
CN103540314B (zh) * 2013-10-10 2015-01-14 上海师范大学 一种低温合成的氟硅酸盐纳米棒红色荧光粉及其制备方法

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JP2009528429A (ja) 2006-02-28 2009-08-06 ルミネイション リミテッド ライアビリティ カンパニー 発光ダイオード応用における使用のための赤色線放出蛍光体

Non-Patent Citations (1)

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Title
J. Electrochem. Soc. 158(6), J179-183 (2011)

Also Published As

Publication number Publication date
KR101940439B1 (ko) 2019-01-18
WO2015087861A1 (ja) 2015-06-18
JP2015113362A (ja) 2015-06-22
US10519368B2 (en) 2019-12-31
JP6342146B2 (ja) 2018-06-13
KR20180002893A (ko) 2018-01-08
CN112500855A (zh) 2021-03-16
TWI529978B (zh) 2016-04-11
TW201530830A (zh) 2015-08-01
CN105793388A (zh) 2016-07-20
US20160340577A1 (en) 2016-11-24

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