KR20160035581A - 발광다이오드를 위한 봉지재 - Google Patents

발광다이오드를 위한 봉지재 Download PDF

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Publication number
KR20160035581A
KR20160035581A KR1020167001454A KR20167001454A KR20160035581A KR 20160035581 A KR20160035581 A KR 20160035581A KR 1020167001454 A KR1020167001454 A KR 1020167001454A KR 20167001454 A KR20167001454 A KR 20167001454A KR 20160035581 A KR20160035581 A KR 20160035581A
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South Korea
Prior art keywords
organopolysilazane
alkyl
led
aryl
cycloalkyl
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KR1020167001454A
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English (en)
Korean (ko)
Inventor
랄프 그로텐뮬러
로살인 카룬아난단
푸미오 키타
헬멋 렌즈
디에터 와그너
Original Assignee
에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘.
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Publication of KR20160035581A publication Critical patent/KR20160035581A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H01L33/56—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/247—Heating methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • H01L21/02—
    • H01L21/312—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/62—Nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/16—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • H01L2924/12041—
    • H01L2933/005—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
KR1020167001454A 2013-07-19 2014-07-16 발광다이오드를 위한 봉지재 Withdrawn KR20160035581A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP13177289.9 2013-07-19
EP13177289 2013-07-19
EP14157208.1 2014-02-28
EP14157208 2014-02-28
PCT/EP2014/065248 WO2015007778A1 (en) 2013-07-19 2014-07-16 Encapsulation material for light emitting diodes

Publications (1)

Publication Number Publication Date
KR20160035581A true KR20160035581A (ko) 2016-03-31

Family

ID=51205398

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167001454A Withdrawn KR20160035581A (ko) 2013-07-19 2014-07-16 발광다이오드를 위한 봉지재

Country Status (8)

Country Link
US (1) US9991182B2 (https=)
EP (1) EP3022249A1 (https=)
JP (1) JP2016529354A (https=)
KR (1) KR20160035581A (https=)
CN (1) CN105392825A (https=)
SG (2) SG10201800517XA (https=)
TW (1) TW201510001A (https=)
WO (1) WO2015007778A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20180019044A (ko) * 2016-08-15 2018-02-23 주식회사 에스제이하이테크 투명 엘이디 디스플레이 패널 및 이를 이용한 디지털 사이니지 시스템

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TWI737610B (zh) * 2015-05-20 2021-09-01 美商納諾光子公司 用於改進發光二極體之效率的程序
US10833231B2 (en) 2016-04-18 2020-11-10 Osram Oled Gmbh Method for producing an optoelectronic component, and optoelectronic component
CN109476873B (zh) 2016-07-18 2021-08-24 Az电子材料（卢森堡）有限公司 用于led封装材料的制剂
KR102191894B1 (ko) 2016-07-18 2020-12-17 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. Led 밀봉 물질용 제형
US20200017763A1 (en) 2016-12-20 2020-01-16 Merck Patent Gmbh Optical medium and an optical device
WO2019002328A1 (en) * 2017-06-30 2019-01-03 Merck Patent Gmbh WAVE LENGTH CONVERTING COMPONENT
WO2019025392A1 (en) 2017-08-03 2019-02-07 Merck Patent Gmbh QUANTUM PERFORMANCE RECOVERY
JP7119332B2 (ja) * 2017-10-18 2022-08-17 信越化学工業株式会社 ポリシラザン化合物を用いた撥水処理剤および撥水処理方法
CN111263981B (zh) * 2017-10-31 2024-06-25 陶氏环球技术有限责任公司 用于光伏封装膜的聚烯烃组成物
US11724963B2 (en) 2019-05-01 2023-08-15 Corning Incorporated Pharmaceutical packages with coatings comprising polysilazane
CN112420892B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行粘结的紫外led灯珠及其制备方法
CN112420893B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法

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JPH01153730A (ja) 1987-12-11 1989-06-15 Shin Etsu Chem Co Ltd 有機シラザン重合体の製造方法
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KR101238738B1 (ko) 2010-12-27 2013-03-06 한국세라믹기술원 자기 발광 소자용 봉지재 및 봉지재 제조 방법, 그 봉지재를 이용한 자기 발광 소자 및 그의 제조 방법
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180019044A (ko) * 2016-08-15 2018-02-23 주식회사 에스제이하이테크 투명 엘이디 디스플레이 패널 및 이를 이용한 디지털 사이니지 시스템

Also Published As

Publication number Publication date
US20160172552A1 (en) 2016-06-16
JP2016529354A (ja) 2016-09-23
WO2015007778A1 (en) 2015-01-22
EP3022249A1 (en) 2016-05-25
TW201510001A (zh) 2015-03-16
SG10201800517XA (en) 2018-02-27
CN105392825A (zh) 2016-03-09
US9991182B2 (en) 2018-06-05
SG11201600363XA (en) 2016-02-26

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