CN105392825A - 用于发光二极管的封装材料 - Google Patents

用于发光二极管的封装材料 Download PDF

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Publication number
CN105392825A
CN105392825A CN201480040899.8A CN201480040899A CN105392825A CN 105392825 A CN105392825 A CN 105392825A CN 201480040899 A CN201480040899 A CN 201480040899A CN 105392825 A CN105392825 A CN 105392825A
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CN
China
Prior art keywords
organopolysilazane
purposes
alkyl
led
aryl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480040899.8A
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English (en)
Chinese (zh)
Inventor
R·格罗腾穆勒
R·卡伦纳楠丹
F·基塔
H·伦兹
D·瓦格纳
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AZ Electronic Materials Luxembourg SARL
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AZ Electronic Materials Luxembourg SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AZ Electronic Materials Luxembourg SARL filed Critical AZ Electronic Materials Luxembourg SARL
Publication of CN105392825A publication Critical patent/CN105392825A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/247—Heating methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/62—Nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/16—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
CN201480040899.8A 2013-07-19 2014-07-16 用于发光二极管的封装材料 Pending CN105392825A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP13177289.9 2013-07-19
EP13177289 2013-07-19
EP14157208.1 2014-02-28
EP14157208 2014-02-28
PCT/EP2014/065248 WO2015007778A1 (en) 2013-07-19 2014-07-16 Encapsulation material for light emitting diodes

Publications (1)

Publication Number Publication Date
CN105392825A true CN105392825A (zh) 2016-03-09

Family

ID=51205398

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480040899.8A Pending CN105392825A (zh) 2013-07-19 2014-07-16 用于发光二极管的封装材料

Country Status (8)

Country Link
US (1) US9991182B2 (https=)
EP (1) EP3022249A1 (https=)
JP (1) JP2016529354A (https=)
KR (1) KR20160035581A (https=)
CN (1) CN105392825A (https=)
SG (2) SG10201800517XA (https=)
TW (1) TW201510001A (https=)
WO (1) WO2015007778A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
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CN110799622A (zh) * 2017-06-30 2020-02-14 默克专利股份有限公司 波长转换组件
CN111263981A (zh) * 2017-10-31 2020-06-09 陶氏环球技术有限责任公司 用于光伏封装膜的聚烯烃组成物
CN112420892A (zh) * 2020-10-28 2021-02-26 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行粘结的紫外led灯珠及其制备方法
CN112420893A (zh) * 2020-10-28 2021-02-26 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法

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TWI737610B (zh) * 2015-05-20 2021-09-01 美商納諾光子公司 用於改進發光二極體之效率的程序
US10833231B2 (en) 2016-04-18 2020-11-10 Osram Oled Gmbh Method for producing an optoelectronic component, and optoelectronic component
CN109476873B (zh) 2016-07-18 2021-08-24 Az电子材料（卢森堡）有限公司 用于led封装材料的制剂
KR102191894B1 (ko) 2016-07-18 2020-12-17 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. Led 밀봉 물질용 제형
KR101947113B1 (ko) * 2016-08-15 2019-02-12 주식회사 에스제이하이테크 투명 엘이디 디스플레이 패널 및 이를 이용한 디지털 사이니지 시스템
US20200017763A1 (en) 2016-12-20 2020-01-16 Merck Patent Gmbh Optical medium and an optical device
WO2019025392A1 (en) 2017-08-03 2019-02-07 Merck Patent Gmbh QUANTUM PERFORMANCE RECOVERY
JP7119332B2 (ja) * 2017-10-18 2022-08-17 信越化学工業株式会社 ポリシラザン化合物を用いた撥水処理剤および撥水処理方法
US11724963B2 (en) 2019-05-01 2023-08-15 Corning Incorporated Pharmaceutical packages with coatings comprising polysilazane

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KR20130128420A (ko) * 2010-11-18 2013-11-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리실라잔 결합층을 포함하는 발광 다이오드 성분
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110799622A (zh) * 2017-06-30 2020-02-14 默克专利股份有限公司 波长转换组件
CN110799622B (zh) * 2017-06-30 2024-01-02 默克专利股份有限公司 波长转换组件
CN111263981A (zh) * 2017-10-31 2020-06-09 陶氏环球技术有限责任公司 用于光伏封装膜的聚烯烃组成物
CN112420892A (zh) * 2020-10-28 2021-02-26 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行粘结的紫外led灯珠及其制备方法
CN112420893A (zh) * 2020-10-28 2021-02-26 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法
CN112420893B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法

Also Published As

Publication number Publication date
US20160172552A1 (en) 2016-06-16
JP2016529354A (ja) 2016-09-23
KR20160035581A (ko) 2016-03-31
WO2015007778A1 (en) 2015-01-22
EP3022249A1 (en) 2016-05-25
TW201510001A (zh) 2015-03-16
SG10201800517XA (en) 2018-02-27
US9991182B2 (en) 2018-06-05
SG11201600363XA (en) 2016-02-26

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C06 Publication
PB01 Publication
CB03 Change of inventor or designer information

Inventor after: R Grosso Muller

Inventor after: Carona Nan Dan R

Inventor after: Bei Wenxiong

Inventor after: H. Renz

Inventor after: Wagner Daniel

Inventor before: R Grosso Muller

Inventor before: Carona Nan Dan R

Inventor before: F,

Inventor before: H. Renz

Inventor before: Wagner Daniel

COR Change of bibliographic data
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned
AD01 Patent right deemed abandoned

Effective date of abandoning: 20190416