KR20160011578A - 임프린트 방법, 임프린트 장치, 및 물품 제조 방법 - Google Patents
임프린트 방법, 임프린트 장치, 및 물품 제조 방법 Download PDFInfo
- Publication number
- KR20160011578A KR20160011578A KR1020150099558A KR20150099558A KR20160011578A KR 20160011578 A KR20160011578 A KR 20160011578A KR 1020150099558 A KR1020150099558 A KR 1020150099558A KR 20150099558 A KR20150099558 A KR 20150099558A KR 20160011578 A KR20160011578 A KR 20160011578A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- pattern
- imprint
- strength reduction
- bonding strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014148752A JP2016025230A (ja) | 2014-07-22 | 2014-07-22 | インプリント方法、インプリント装置、および物品の製造方法 |
| JPJP-P-2014-148752 | 2014-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160011578A true KR20160011578A (ko) | 2016-02-01 |
Family
ID=55165995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150099558A Withdrawn KR20160011578A (ko) | 2014-07-22 | 2015-07-14 | 임프린트 방법, 임프린트 장치, 및 물품 제조 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20160023380A1 (https=) |
| JP (1) | JP2016025230A (https=) |
| KR (1) | KR20160011578A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6541518B2 (ja) * | 2015-09-04 | 2019-07-10 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| JP6821414B2 (ja) * | 2016-12-13 | 2021-01-27 | キヤノン株式会社 | インプリント装置、及び物品の製造方法 |
| JP7023744B2 (ja) * | 2018-02-28 | 2022-02-22 | キヤノン株式会社 | インプリント方法及び製造方法 |
| JP7149870B2 (ja) * | 2019-02-08 | 2022-10-07 | キヤノン株式会社 | インプリント装置および物品製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004071831A (ja) * | 2002-08-06 | 2004-03-04 | Canon Inc | 微細加工装置およびこれを用いたデバイス |
| US7307118B2 (en) * | 2004-11-24 | 2007-12-11 | Molecular Imprints, Inc. | Composition to reduce adhesion between a conformable region and a mold |
| JP5632633B2 (ja) * | 2010-03-26 | 2014-11-26 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| JP5306404B2 (ja) * | 2011-03-25 | 2013-10-02 | 株式会社東芝 | パターン形成方法 |
| JP5653864B2 (ja) * | 2011-08-18 | 2015-01-14 | 富士フイルム株式会社 | ナノインプリント用のモールドの離型処理方法およびそれを用いた製造方法並びにモールド、ナノインプリント方法およびパターン化基板の製造方法 |
| JP6019953B2 (ja) * | 2012-09-04 | 2016-11-02 | 大日本印刷株式会社 | 凸状構造体の製造方法及び製造システム |
-
2014
- 2014-07-22 JP JP2014148752A patent/JP2016025230A/ja active Pending
-
2015
- 2015-07-14 KR KR1020150099558A patent/KR20160011578A/ko not_active Withdrawn
- 2015-07-20 US US14/803,163 patent/US20160023380A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016025230A (ja) | 2016-02-08 |
| US20160023380A1 (en) | 2016-01-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20150714 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20170113 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20150714 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20180205 Patent event code: PE09021S01D |
|
| PC1202 | Submission of document of withdrawal before decision of registration |
Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment) Patent event code: PC12021R01D Patent event date: 20180705 |
|
| WITB | Written withdrawal of application |