KR20150108315A - 반도체 발광 소자 - Google Patents
반도체 발광 소자 Download PDFInfo
- Publication number
- KR20150108315A KR20150108315A KR1020150031582A KR20150031582A KR20150108315A KR 20150108315 A KR20150108315 A KR 20150108315A KR 1020150031582 A KR1020150031582 A KR 1020150031582A KR 20150031582 A KR20150031582 A KR 20150031582A KR 20150108315 A KR20150108315 A KR 20150108315A
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- layer
- semiconductor layer
- region
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H01L33/36—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H01L33/22—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2014-054157 | 2014-03-17 | ||
| JP2014054157A JP6302303B2 (ja) | 2014-03-17 | 2014-03-17 | 半導体発光素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150108315A true KR20150108315A (ko) | 2015-09-25 |
Family
ID=52577783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150031582A Ceased KR20150108315A (ko) | 2014-03-17 | 2015-03-06 | 반도체 발광 소자 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20150263223A1 (enExample) |
| EP (1) | EP2922102A1 (enExample) |
| JP (1) | JP6302303B2 (enExample) |
| KR (1) | KR20150108315A (enExample) |
| CN (1) | CN104934511A (enExample) |
| TW (1) | TW201547055A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180009436A (ko) * | 2016-07-18 | 2018-01-29 | 삼성전자주식회사 | 반도체 발광소자 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017533574A (ja) | 2014-09-18 | 2017-11-09 | インテル・コーポレーション | シリコンcmos互換性半導体装置における欠陥伝播制御のための傾斜側壁カット面を有するウルツ鉱ヘテロエピタキシャル構造物 |
| JP6376575B2 (ja) | 2014-09-25 | 2018-08-22 | インテル・コーポレーション | 自立シリコンメサ上のiii−nエピタキシャル素子構造 |
| US10573647B2 (en) | 2014-11-18 | 2020-02-25 | Intel Corporation | CMOS circuits using n-channel and p-channel gallium nitride transistors |
| CN106922200B (zh) | 2014-12-18 | 2021-11-09 | 英特尔公司 | N沟道氮化镓晶体管 |
| EP3298628A4 (en) | 2015-05-19 | 2019-05-22 | INTEL Corporation | SEMICONDUCTOR COMPONENTS WITH INCREASED DOTED CRYSTALLINE STRUCTURES |
| WO2016209283A1 (en) | 2015-06-26 | 2016-12-29 | Intel Corporation | Heteroepitaxial structures with high temperature stable substrate interface material |
| WO2017111869A1 (en) | 2015-12-24 | 2017-06-29 | Intel Corporation | Transition metal dichalcogenides (tmdcs) over iii-nitride heteroepitaxial layers |
| CN105702821B (zh) * | 2016-03-29 | 2018-01-30 | 苏州晶湛半导体有限公司 | 半导体发光器件及其制造方法 |
| TWI720053B (zh) * | 2016-11-09 | 2021-03-01 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| WO2019066953A1 (en) | 2017-09-29 | 2019-04-04 | Intel Corporation | REDUCED CONTACT RESISTANCE GROUP III (N-N) NITRIDE DEVICES AND METHODS OF MAKING SAME |
| US12125888B2 (en) | 2017-09-29 | 2024-10-22 | Intel Corporation | Group III-nitride (III-N) devices with reduced contact resistance and their methods of fabrication |
| US11195973B1 (en) * | 2019-05-17 | 2021-12-07 | Facebook Technologies, Llc | III-nitride micro-LEDs on semi-polar oriented GaN |
| US11175447B1 (en) | 2019-08-13 | 2021-11-16 | Facebook Technologies, Llc | Waveguide in-coupling using polarized light emitting diodes |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004071657A (ja) * | 2002-08-01 | 2004-03-04 | Nec Corp | Iii族窒化物半導体素子、iii族窒化物半導体基板およびiii族窒化物半導体素子の製造方法 |
| US9279193B2 (en) * | 2002-12-27 | 2016-03-08 | Momentive Performance Materials Inc. | Method of making a gallium nitride crystalline composition having a low dislocation density |
| JP4925580B2 (ja) * | 2004-12-28 | 2012-04-25 | 三菱化学株式会社 | 窒化物半導体発光素子およびその製造方法 |
| CN100477425C (zh) * | 2005-05-19 | 2009-04-08 | 松下电器产业株式会社 | 氮化物半导体装置及其制造方法 |
| JP4605193B2 (ja) * | 2007-07-27 | 2011-01-05 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子 |
| JP2009081374A (ja) * | 2007-09-27 | 2009-04-16 | Rohm Co Ltd | 半導体発光素子 |
| KR101761385B1 (ko) * | 2010-07-12 | 2017-08-04 | 엘지이노텍 주식회사 | 발광 소자 |
| JP5333382B2 (ja) * | 2010-08-27 | 2013-11-06 | 豊田合成株式会社 | 発光素子 |
| TWI532214B (zh) * | 2010-10-12 | 2016-05-01 | Lg伊諾特股份有限公司 | 發光元件及其封裝 |
| WO2012090252A1 (ja) * | 2010-12-28 | 2012-07-05 | Dowaエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| TWI435477B (zh) * | 2010-12-29 | 2014-04-21 | Lextar Electronics Corp | 高亮度發光二極體 |
| JP5050109B2 (ja) * | 2011-03-14 | 2012-10-17 | 株式会社東芝 | 半導体発光素子 |
| KR101827975B1 (ko) * | 2011-10-10 | 2018-03-29 | 엘지이노텍 주식회사 | 발광소자 |
| JP5983125B2 (ja) * | 2012-07-18 | 2016-08-31 | 日亜化学工業株式会社 | 半導体発光素子の製造方法 |
| JP6052962B2 (ja) * | 2012-08-03 | 2016-12-27 | スタンレー電気株式会社 | 半導体発光装置 |
| JP6287317B2 (ja) * | 2013-02-28 | 2018-03-07 | 日亜化学工業株式会社 | 半導体発光素子 |
-
2014
- 2014-03-17 JP JP2014054157A patent/JP6302303B2/ja active Active
-
2015
- 2015-02-26 US US14/632,131 patent/US20150263223A1/en not_active Abandoned
- 2015-02-26 TW TW104106325A patent/TW201547055A/zh unknown
- 2015-02-27 EP EP15156997.7A patent/EP2922102A1/en not_active Withdrawn
- 2015-03-06 KR KR1020150031582A patent/KR20150108315A/ko not_active Ceased
- 2015-03-12 CN CN201510107845.5A patent/CN104934511A/zh active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180009436A (ko) * | 2016-07-18 | 2018-01-29 | 삼성전자주식회사 | 반도체 발광소자 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015177135A (ja) | 2015-10-05 |
| US20150263223A1 (en) | 2015-09-17 |
| EP2922102A1 (en) | 2015-09-23 |
| CN104934511A (zh) | 2015-09-23 |
| JP6302303B2 (ja) | 2018-03-28 |
| TW201547055A (zh) | 2015-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |