KR20150080449A - 기질들을 정렬하기 위한 장치 및 방법 - Google Patents

기질들을 정렬하기 위한 장치 및 방법 Download PDF

Info

Publication number
KR20150080449A
KR20150080449A KR1020147030498A KR20147030498A KR20150080449A KR 20150080449 A KR20150080449 A KR 20150080449A KR 1020147030498 A KR1020147030498 A KR 1020147030498A KR 20147030498 A KR20147030498 A KR 20147030498A KR 20150080449 A KR20150080449 A KR 20150080449A
Authority
KR
South Korea
Prior art keywords
substrate
holder
sensing
marking
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147030498A
Other languages
English (en)
Korean (ko)
Inventor
토마스 발겐라이트너
Original Assignee
에베 그룹 에. 탈너 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에베 그룹 에. 탈너 게엠베하 filed Critical 에베 그룹 에. 탈너 게엠베하
Publication of KR20150080449A publication Critical patent/KR20150080449A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020147030498A 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법 Ceased KR20150080449A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/075831 WO2015082020A1 (de) 2013-12-06 2013-12-06 Vorrichtung und verfahren zum ausrichten von substraten

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167022033A Division KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Publications (1)

Publication Number Publication Date
KR20150080449A true KR20150080449A (ko) 2015-07-09

Family

ID=49753165

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147030498A Ceased KR20150080449A (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법
KR1020167022033A Active KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167022033A Active KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Country Status (8)

Country Link
US (1) US9851645B2 (enExample)
EP (1) EP2893556B9 (enExample)
JP (1) JP6042564B2 (enExample)
KR (2) KR20150080449A (enExample)
CN (1) CN105247670B (enExample)
SG (1) SG11201406979VA (enExample)
TW (1) TWI637458B (enExample)
WO (1) WO2015082020A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102020236B1 (ko) * 2018-04-20 2019-09-10 세메스 주식회사 패널 합착 장치
KR20210148855A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 본딩된 웨이퍼들을 위한 포토리소그래피 정렬 공정
KR20220097217A (ko) * 2020-12-31 2022-07-07 주식회사 테스 기판접합장치 및 기판접합방법
KR20230000465U (ko) * 2021-08-26 2023-03-07 케이-제트 레이저 테크 인코포레이티드 정렬 기기

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150155211A1 (en) 2013-12-03 2015-06-04 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
EP3312871B1 (de) 2014-02-03 2024-09-25 EV Group E. Thallner GmbH Aufnahmeeinrichtung zur aufnahme eines substratstapels
WO2015149846A1 (de) 2014-04-01 2015-10-08 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur oberflächenbehandlung von substraten
SG11201603148VA (en) 2014-12-18 2016-07-28 Ev Group E Thallner Gmbh Method for bonding substrates
DE102015108901A1 (de) 2015-06-05 2016-12-08 Ev Group E. Thallner Gmbh Verfahren zum Ausrichten von Substraten vor dem Bonden
SG11201806511XA (en) 2016-03-22 2018-08-30 Ev Group E Thallner Gmbh Device and method for bonding substrates
EP3497712B1 (de) 2016-08-12 2020-04-29 EV Group E. Thallner GmbH Verfahren und probenhalter zum gesteuerten bonden von substraten
SG11201901050SA (en) 2016-08-29 2019-03-28 Ev Group E Thallner Gmbh Method and device for aligning substrates
WO2018157937A1 (de) 2017-03-02 2018-09-07 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zum bonden von chips
DE102017105697B4 (de) 2017-03-16 2025-12-31 Ev Group E. Thallner Gmbh Verfahren und System zur Ausrichtung zweier gegenüberliegend angeordneter optischer Teilsysteme und Kamerachip
CN110383446B (zh) 2017-03-16 2024-07-16 Ev集团E·索尔纳有限责任公司 用于接合至少三个衬底的方法
KR102365283B1 (ko) * 2017-03-20 2022-02-18 에베 그룹 에. 탈너 게엠베하 두 기판의 정렬 방법
US10366967B2 (en) 2017-07-24 2019-07-30 Cerebras Systems Inc. Apparatus and method for multi-die interconnection
WO2019040273A1 (en) 2017-08-24 2019-02-28 Cerebras Systems Inc. APPARATUS AND METHOD FOR FIXING COMPONENTS OF AN INTEGRATED CIRCUIT
JP7123123B2 (ja) 2017-09-21 2022-08-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板を接合する装置および方法
TWI667728B (zh) * 2017-10-30 2019-08-01 財團法人工業技術研究院 晶片接合裝置、晶片接合的方法以及晶片封裝結構
US10541162B2 (en) * 2017-11-28 2020-01-21 Taiwan Semiconductor Manfacturing Co., Ltd. Systems and methods for wafer pod calibration
US10636688B2 (en) * 2018-06-22 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for alignment, process tool and method for wafer-level alignment
US10957595B2 (en) 2018-10-16 2021-03-23 Cerebras Systems Inc. Systems and methods for precision fabrication of an orifice within an integrated circuit
US10953539B2 (en) * 2018-12-27 2021-03-23 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and automatic teaching method
CN110246781B (zh) * 2019-05-29 2021-06-22 桂林立德智兴电子科技有限公司 一种半导体晶圆平坦化设备
JP7250641B2 (ja) 2019-08-06 2023-04-03 キオクシア株式会社 アライメント装置及び半導体装置の製造方法
EP4018472B1 (de) 2019-08-23 2025-08-13 EV Group E. Thallner GmbH Verfahren und vorrichtung zum ausrichten von substraten
US11145530B2 (en) * 2019-11-08 2021-10-12 Cerebras Systems Inc. System and method for alignment of an integrated circuit
WO2021115574A1 (de) 2019-12-10 2021-06-17 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur ausrichtung von substraten
JP7391733B2 (ja) * 2020-03-17 2023-12-05 キオクシア株式会社 半導体製造装置及び半導体装置の製造方法
CN111524449B (zh) * 2020-04-28 2022-03-29 昆山国显光电有限公司 贴合设备校正装置及方法、显示面板贴合设备及方法
EP4173028B1 (de) 2020-06-29 2024-04-10 EV Group E. Thallner GmbH Verfahren und vorrichtung zum bonden von substraten
JP7130720B2 (ja) * 2020-11-25 2022-09-05 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板を位置合わせする方法および装置
US11845179B2 (en) * 2020-12-22 2023-12-19 Kawasaki Jukogyo Kabushiki Kaisha Wafer jig, robot system, communication method, and robot teaching method
TWI792785B (zh) * 2020-12-31 2023-02-11 南韓商Ｔｅｓ股份有限公司 基板接合裝置及基板接合方法
KR102880566B1 (ko) * 2021-12-17 2025-11-04 에베 그룹 에. 탈너 게엠베하 기판 정렬 방법 및 장치
CN114373686B (zh) 2022-03-21 2022-06-14 北京芯士联半导体科技有限公司 基板的接合方法
JP7809596B2 (ja) * 2022-06-15 2026-02-02 キオクシア株式会社 接合装置、接合方法、及び半導体装置の製造方法
EP4581668A1 (de) 2022-09-02 2025-07-09 EV Group E. Thallner GmbH Vakuumsubstrathalter mit optimierter vakuumdichtung
KR102749845B1 (ko) * 2022-11-14 2025-01-07 주식회사 큐빅셀 스캐닝 홀로그래피 기반의 기판 정렬 장치 및 방법
CN122162531A (zh) 2023-09-18 2026-06-05 埃里克·索尔纳 衬底堆叠、改性的层系统、用于处理衬底堆叠的方法和用于这种方法的设备
CN117781863A (zh) * 2023-12-18 2024-03-29 海目星激光科技集团股份有限公司 电芯对齐度检测方法、电芯卷绕方法及电芯卷绕设备

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573791A (en) * 1979-04-03 1986-03-04 Optimetrix Corporation Step-and-repeat projection alignment and exposure system
US4597664A (en) * 1980-02-29 1986-07-01 Optimetrix Corporation Step-and-repeat projection alignment and exposure system with auxiliary optical unit
US4810941A (en) * 1986-04-17 1989-03-07 Canon Kabushiki Kaisha Control system for a servomotor
JP3061150B2 (ja) 1991-05-16 2000-07-10 三井・デュポンポリケミカル株式会社 水性分散体組成物及びそれより形成される被膜ならびにその製法
JP2577140B2 (ja) 1991-05-27 1997-01-29 日立テクノエンジニアリング株式会社 基板の位置合わせ装置
US5639323A (en) * 1995-02-17 1997-06-17 Aiwa Research And Development, Inc. Method for aligning miniature device components
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
AT405775B (de) 1998-01-13 1999-11-25 Thallner Erich Verfahren und vorrichtung zum ausgerichteten zusammenführen von scheibenförmigen halbleitersubstraten
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
CA2526368A1 (en) * 2003-05-20 2004-12-02 Fluidigm Corporation Method and system for microfluidic device and imaging thereof
JP4626160B2 (ja) 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
US7442476B2 (en) * 2004-12-27 2008-10-28 Asml Netherlands B.V. Method and system for 3D alignment in wafer scale integration
US7433038B2 (en) 2006-04-27 2008-10-07 Asml Netherlands B.V. Alignment of substrates for bonding
JP5339056B2 (ja) * 2006-07-14 2013-11-13 株式会社ニコン 露光装置及びデバイス製造方法
CN101523577A (zh) 2006-09-29 2009-09-02 东京毅力科创株式会社 硅氧化膜的形成方法，等离子体处理装置以及存储介质
US20080083818A1 (en) 2006-10-06 2008-04-10 Asml Netherlands B.V. Measuring the bonding of bonded substrates
KR101484348B1 (ko) 2007-08-10 2015-01-19 가부시키가이샤 니콘 기판접합장치 및 기판접합방법
TWI478272B (zh) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
US20090123874A1 (en) * 2007-11-14 2009-05-14 Tadashi Nagayama Exposure method, exposure apparatus, and method for manufacturing device
WO2010023935A1 (ja) * 2008-08-29 2010-03-04 株式会社ニコン 基板位置合わせ装置、基板位置合わせ方法および積層型半導体の製造方法
US8148646B2 (en) * 2008-09-29 2012-04-03 Formfactor, Inc. Process of positioning groups of contact structures
WO2010038454A1 (ja) 2008-10-01 2010-04-08 株式会社ニコン アラインメント装置およびアラインメント方法
DE102009018977A1 (de) * 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers
EP3731258A1 (de) 2009-09-22 2020-10-28 EV Group E. Thallner GmbH Vorrichtung zum ausrichten zweier substrate
JP5565792B2 (ja) * 2009-11-02 2014-08-06 ボンドテック株式会社 アライメント装置
JP5628549B2 (ja) * 2010-04-27 2014-11-19 芝浦メカトロニクス株式会社 基板貼合装置
JP5889581B2 (ja) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
EP2463892B1 (de) 2010-12-13 2013-04-03 EV Group E. Thallner GmbH Einrichtung, Vorrichtung und Verfahren zur Ermittlung von Ausrichtungsfehlern
JP5139604B1 (ja) * 2011-11-25 2013-02-06 信越エンジニアリング株式会社 基板搬送装置及び基板組み立てライン
CN103246170B (zh) * 2012-02-09 2015-07-08 中芯国际集成电路制造(上海)有限公司 曝光装置及曝光方法
JP6502846B2 (ja) * 2012-06-06 2019-04-17 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 位置合わせ誤差を求めるための装置と方法
US9772564B2 (en) * 2012-11-12 2017-09-26 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
JP6294686B2 (ja) * 2014-02-04 2018-03-14 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102020236B1 (ko) * 2018-04-20 2019-09-10 세메스 주식회사 패널 합착 장치
KR20210148855A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 본딩된 웨이퍼들을 위한 포토리소그래피 정렬 공정
KR20220097217A (ko) * 2020-12-31 2022-07-07 주식회사 테스 기판접합장치 및 기판접합방법
KR20230000465U (ko) * 2021-08-26 2023-03-07 케이-제트 레이저 테크 인코포레이티드 정렬 기기

Also Published As

Publication number Publication date
CN105247670A (zh) 2016-01-13
US20160240420A1 (en) 2016-08-18
EP2893556B1 (de) 2018-01-10
WO2015082020A1 (de) 2015-06-11
SG11201406979VA (en) 2015-07-30
US9851645B2 (en) 2017-12-26
TWI637458B (zh) 2018-10-01
EP2893556B9 (de) 2018-09-12
KR20160101202A (ko) 2016-08-24
KR101741384B1 (ko) 2017-05-29
JP2016503589A (ja) 2016-02-04
JP6042564B2 (ja) 2016-12-14
TW201523782A (zh) 2015-06-16
EP2893556A1 (de) 2015-07-15
CN105247670B (zh) 2018-06-12

Similar Documents

Publication Publication Date Title
KR101741384B1 (ko) 기질들을 정렬하기 위한 장치 및 방법
JP7379620B2 (ja) 高空間分解能を有するｘ線ビームの特性評価のための方法及びシステム
CN109791379B (zh) 测量系统及基板处理系统、及元件制造方法
JP6258479B2 (ja) 複数の基板を位置合わせする装置及び方法
KR102221965B1 (ko) 기질을 정렬하기 위한 방법 및 장치
KR102386007B1 (ko) 두 개의 기판을 정렬하기 위한 장치
TW528881B (en) Position measuring apparatus
CN104364892B (zh) 用于确定对准误差的装置和方法
US20130244350A1 (en) Substrate bonding apparatus and substrate bonding method
KR20200047741A (ko) 계측 빔 안정화를 위한 시스템들 및 방법들
TW201826047A (zh) 測量系統及基板處理系統、以及元件製造方法
JP2023517415A (ja) 複数の基板の位置合わせをする方法および装置
WO2008149372A2 (en) Apparatus and method for substrate handling
KR20170036108A (ko) 기판의 형상 변화 측정 방법
JP7831732B2 (ja) 検出手段を調整するための装置および方法
KR20080014794A (ko) 투명기판의 치수 변화를 측정하기 위한 방법 및 장치
JP2025500158A (ja) 基板を位置合わせするための方法および装置
HK40001178A (en) Measuring system, substrate processing system, and device manufacturing method

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0601 Decision of rejection after re-examination

St.27 status event code: N-2-6-B10-B17-rex-PX0601

X601 Decision of rejection after re-examination
T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
J201 Request for trial against refusal decision
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

J301 Trial decision

Free format text: TRIAL NUMBER: 2016101004720; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20160811

Effective date: 20170515

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20170515

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2014 7030498

Appeal request date: 20160811

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2016101004720

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000