KR20150080449A - 기질들을 정렬하기 위한 장치 및 방법 - Google Patents

기질들을 정렬하기 위한 장치 및 방법 Download PDF

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Publication number
KR20150080449A
KR20150080449A KR1020147030498A KR20147030498A KR20150080449A KR 20150080449 A KR20150080449 A KR 20150080449A KR 1020147030498 A KR1020147030498 A KR 1020147030498A KR 20147030498 A KR20147030498 A KR 20147030498A KR 20150080449 A KR20150080449 A KR 20150080449A
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KR
South Korea
Prior art keywords
substrate
holder
sensing
marking
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147030498A
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English (en)
Korean (ko)
Inventor
토마스 발겐라이트너
Original Assignee
에베 그룹 에. 탈너 게엠베하
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Publication of KR20150080449A publication Critical patent/KR20150080449A/ko
Ceased legal-status Critical Current

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    • H10P72/0428—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H10P72/50—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H10P72/53—
    • H10P95/00—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020147030498A 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법 Ceased KR20150080449A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/075831 WO2015082020A1 (de) 2013-12-06 2013-12-06 Vorrichtung und verfahren zum ausrichten von substraten

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167022033A Division KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Publications (1)

Publication Number Publication Date
KR20150080449A true KR20150080449A (ko) 2015-07-09

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147030498A Ceased KR20150080449A (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법
KR1020167022033A Active KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167022033A Active KR101741384B1 (ko) 2013-12-06 2013-12-06 기질들을 정렬하기 위한 장치 및 방법

Country Status (8)

Country Link
US (1) US9851645B2 (enExample)
EP (1) EP2893556B9 (enExample)
JP (1) JP6042564B2 (enExample)
KR (2) KR20150080449A (enExample)
CN (1) CN105247670B (enExample)
SG (1) SG11201406979VA (enExample)
TW (1) TWI637458B (enExample)
WO (1) WO2015082020A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
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KR102020236B1 (ko) * 2018-04-20 2019-09-10 세메스 주식회사 패널 합착 장치
KR20210148855A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 본딩된 웨이퍼들을 위한 포토리소그래피 정렬 공정
KR20220097217A (ko) * 2020-12-31 2022-07-07 주식회사 테스 기판접합장치 및 기판접합방법
KR20230000465U (ko) * 2021-08-26 2023-03-07 케이-제트 레이저 테크 인코포레이티드 정렬 기기

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Publication number Priority date Publication date Assignee Title
KR102020236B1 (ko) * 2018-04-20 2019-09-10 세메스 주식회사 패널 합착 장치
KR20210148855A (ko) * 2020-05-28 2021-12-08 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 본딩된 웨이퍼들을 위한 포토리소그래피 정렬 공정
KR20220097217A (ko) * 2020-12-31 2022-07-07 주식회사 테스 기판접합장치 및 기판접합방법
KR20230000465U (ko) * 2021-08-26 2023-03-07 케이-제트 레이저 테크 인코포레이티드 정렬 기기

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TWI637458B (zh) 2018-10-01
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TW201523782A (zh) 2015-06-16
EP2893556B9 (de) 2018-09-12
WO2015082020A1 (de) 2015-06-11
CN105247670A (zh) 2016-01-13
US9851645B2 (en) 2017-12-26
JP2016503589A (ja) 2016-02-04
EP2893556B1 (de) 2018-01-10
US20160240420A1 (en) 2016-08-18
EP2893556A1 (de) 2015-07-15
KR20160101202A (ko) 2016-08-24
JP6042564B2 (ja) 2016-12-14
CN105247670B (zh) 2018-06-12

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