KR20150063368A - 다가 카르복실산 수지 및 에폭시 수지 조성물 - Google Patents

다가 카르복실산 수지 및 에폭시 수지 조성물 Download PDF

Info

Publication number
KR20150063368A
KR20150063368A KR1020157005426A KR20157005426A KR20150063368A KR 20150063368 A KR20150063368 A KR 20150063368A KR 1020157005426 A KR1020157005426 A KR 1020157005426A KR 20157005426 A KR20157005426 A KR 20157005426A KR 20150063368 A KR20150063368 A KR 20150063368A
Authority
KR
South Korea
Prior art keywords
parts
acid
carboxylic acid
manufactured
compound
Prior art date
Application number
KR1020157005426A
Other languages
English (en)
Korean (ko)
Inventor
켄이치 쿠보키
나오후사 미야가와
나오스케 타니구치
치에 사사키
리츠코 시타라
Original Assignee
닛뽄 가야쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛뽄 가야쿠 가부시키가이샤 filed Critical 닛뽄 가야쿠 가부시키가이샤
Publication of KR20150063368A publication Critical patent/KR20150063368A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/68—Polyesters containing atoms other than carbon, hydrogen and oxygen
    • C08G63/695—Polyesters containing atoms other than carbon, hydrogen and oxygen containing silicon
    • C08G63/6954—Polyesters containing atoms other than carbon, hydrogen and oxygen containing silicon derived from polxycarboxylic acids and polyhydroxy compounds
    • C08G63/6956—Dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C08L2203/162—Applications used for films sealable films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
KR1020157005426A 2012-09-27 2013-09-26 다가 카르복실산 수지 및 에폭시 수지 조성물 KR20150063368A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012214119 2012-09-27
JP2012214118 2012-09-27
JPJP-P-2012-214118 2012-09-27
JPJP-P-2012-214119 2012-09-27
JPJP-P-2013-042972 2013-03-05
JP2013042972 2013-03-05
PCT/JP2013/076086 WO2014050978A1 (ja) 2012-09-27 2013-09-26 多価カルボン酸樹脂およびエポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
KR20150063368A true KR20150063368A (ko) 2015-06-09

Family

ID=50388373

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157005426A KR20150063368A (ko) 2012-09-27 2013-09-26 다가 카르복실산 수지 및 에폭시 수지 조성물

Country Status (5)

Country Link
JP (1) JP6058684B2 (ja)
KR (1) KR20150063368A (ja)
CN (1) CN104684960B (ja)
TW (1) TWI580707B (ja)
WO (1) WO2014050978A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6421127B2 (ja) * 2013-10-23 2018-11-07 株式会社ダイセル ラクトン重合体の製造方法
CN107250282A (zh) * 2015-02-05 2017-10-13 日本化药株式会社 含有多元醇化合物、酸酐化合物和热固化性树脂的热固化性树脂组合物及多元羧酸树脂、以及使用了其的热固化性树脂组合物、以及使用了前述热固化性树脂组合物中的任一种作为封装材料或者反射材料的光半导体装置
JP6494092B2 (ja) * 2015-02-06 2019-04-03 日本化薬株式会社 多価カルボン酸樹脂、それを用いた熱硬化性樹脂組成物、およびその熱硬化性樹脂組成物を反射材として使用した光半導体装置
JP6570176B2 (ja) * 2015-08-21 2019-09-04 日本化薬株式会社 多価カルボン酸およびそれを含有する多価カルボン酸組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに光半導体装置
CN112513146A (zh) * 2018-08-10 2021-03-16 东丽株式会社 聚硅氧烷-聚亚烷基二醇嵌段共聚物及其制造方法
WO2020175272A1 (ja) * 2019-02-26 2020-09-03 富士フイルム株式会社 内視鏡用接着剤及びその硬化物、並びに内視鏡及びその製造方法
CN115717008A (zh) * 2022-11-22 2023-02-28 江苏三木化工股份有限公司 一种防结晶的环氧树脂添加剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330670A (en) * 1981-05-26 1982-05-18 Eastman Kodak Company Copolyester adhesives
US5879857A (en) * 1997-02-21 1999-03-09 Lucent Technologies Inc. Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material
CN1199926A (zh) * 1997-05-21 1998-11-25 日本电气株式会社 一种半导体器件的制造方法
JP2004331744A (ja) * 2003-05-02 2004-11-25 Fuji Photo Film Co Ltd 硬化性組成物及びそれを用いた硬化処理物品
JP3993149B2 (ja) * 2003-08-21 2007-10-17 ジャパンエポキシレジン株式会社 発光素子封止材用エポキシ樹脂組成物
WO2008144514A2 (en) * 2007-05-17 2008-11-27 Massachusetts Institute Of Technology Polyol-based polymers
KR20120085256A (ko) * 2009-10-06 2012-07-31 닛뽄 가야쿠 가부시키가이샤 다가 카르복실산 조성물과 그 제조 방법, 및 그 다가 카르복실산 조성물을 함유하여 이루어지는 경화성 수지 조성물
CN102782014A (zh) * 2010-03-02 2012-11-14 日本化药株式会社 有机聚硅氧烷的制造方法、通过该制造方法得到的有机聚硅氧烷、含有该有机聚硅氧烷的组合物
CN102971355B (zh) * 2010-06-30 2015-07-08 日本化药株式会社 多元羧酸组合物、固化剂组合物以及含有该多元羧酸组合物或该固化剂组合物作为环氧树脂的固化剂的可固化树脂组合物

Also Published As

Publication number Publication date
JP6058684B2 (ja) 2017-01-11
TWI580707B (zh) 2017-05-01
JPWO2014050978A1 (ja) 2016-08-22
WO2014050978A1 (ja) 2014-04-03
CN104684960A (zh) 2015-06-03
TW201439142A (zh) 2014-10-16
CN104684960B (zh) 2017-05-10

Similar Documents

Publication Publication Date Title
KR101692450B1 (ko) 다가 카르복시산, 그 조성물, 경화성 수지 조성물, 경화물 및 다가 카르복시산의 제조방법
TWI512016B (zh) Polycarboxylic acid resin and its composition
JP6595329B2 (ja) 多価カルボン酸およびそれを含有する多価カルボン酸組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに光半導体装置
JP5878862B2 (ja) 硬化性樹脂組成物、及びその硬化物
TWI488890B (zh) A polycarboxylic acid composition and a method for producing the same, and a hardening resin composition comprising the polycarboxylic acid composition
JP5730852B2 (ja) オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
JP6058684B2 (ja) 多価カルボン酸樹脂およびエポキシ樹脂組成物
TWI504628B (zh) Hardened resin composition and hardened product thereof
KR101699773B1 (ko) 경화성 수지 조성물 및 그 경화물
SG172173A1 (en) Carboxylic acid compound and epoxy resin composition containing same
TWI564318B (zh) Epoxy resin composition
JP6143359B2 (ja) シリコーン変性エポキシ樹脂およびその組成物
JP5472924B2 (ja) 硬化性樹脂組成物およびその硬化物
JP6377445B2 (ja) エポキシ樹脂組成物およびその硬化物
JP6602170B2 (ja) 多価カルボン酸樹脂およびそれを含有する多価カルボン酸樹脂組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに半導体装置
JP6767816B2 (ja) 多価カルボン酸およびそれを含有する多価カルボン酸組成物、エポキシ樹脂組成物、それらの硬化物並びに光半導体装置
WO2014163122A1 (ja) 発光半導体被覆保護材用硬化性樹脂組成物

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right