KR20150048234A - 전기적으로 또는 기계적으로 여기된 커패시터로부터의 가청 및/또는 전기적 노이즈를 감소시키기 위한 방법 및 시스템 - Google Patents

전기적으로 또는 기계적으로 여기된 커패시터로부터의 가청 및/또는 전기적 노이즈를 감소시키기 위한 방법 및 시스템 Download PDF

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Publication number
KR20150048234A
KR20150048234A KR1020157008027A KR20157008027A KR20150048234A KR 20150048234 A KR20150048234 A KR 20150048234A KR 1020157008027 A KR1020157008027 A KR 1020157008027A KR 20157008027 A KR20157008027 A KR 20157008027A KR 20150048234 A KR20150048234 A KR 20150048234A
Authority
KR
South Korea
Prior art keywords
capacitor
capacitor structure
devices
array
capacitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020157008027A
Other languages
English (en)
Korean (ko)
Inventor
스티브 디. 슬레이글
제임스 디. 쇼
죠지 씨. 밈스
카일 이. 에릭슨
Original Assignee
알리손 트랜스미션, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알리손 트랜스미션, 인크. filed Critical 알리손 트랜스미션, 인크.
Publication of KR20150048234A publication Critical patent/KR20150048234A/ko
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/35Feed-through capacitors or anti-noise capacitors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H57/00General details of gearing
    • F16H57/0006Vibration-damping or noise reducing means specially adapted for gearings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10545Related components mounted on both sides of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045Protection against vibrations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Dc-Dc Converters (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Structure Of Transmissions (AREA)
  • Control Of Transmission Device (AREA)
KR1020157008027A 2012-08-30 2013-08-27 전기적으로 또는 기계적으로 여기된 커패시터로부터의 가청 및/또는 전기적 노이즈를 감소시키기 위한 방법 및 시스템 Ceased KR20150048234A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261694827P 2012-08-30 2012-08-30
US61/694,827 2012-08-30
PCT/US2013/056737 WO2014035929A1 (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207004141A Division KR102215960B1 (ko) 2012-08-30 2013-08-27 전기적으로 또는 기계적으로 여기된 커패시터로부터의 가청 및/또는 전기적 노이즈를 감소시키기 위한 방법 및 시스템

Publications (1)

Publication Number Publication Date
KR20150048234A true KR20150048234A (ko) 2015-05-06

Family

ID=50184217

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157008027A Ceased KR20150048234A (ko) 2012-08-30 2013-08-27 전기적으로 또는 기계적으로 여기된 커패시터로부터의 가청 및/또는 전기적 노이즈를 감소시키기 위한 방법 및 시스템
KR1020207004141A Active KR102215960B1 (ko) 2012-08-30 2013-08-27 전기적으로 또는 기계적으로 여기된 커패시터로부터의 가청 및/또는 전기적 노이즈를 감소시키기 위한 방법 및 시스템

Family Applications After (1)

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KR1020207004141A Active KR102215960B1 (ko) 2012-08-30 2013-08-27 전기적으로 또는 기계적으로 여기된 커패시터로부터의 가청 및/또는 전기적 노이즈를 감소시키기 위한 방법 및 시스템

Country Status (8)

Country Link
US (3) US20140060911A1 (https=)
EP (2) EP2891164A4 (https=)
KR (2) KR20150048234A (https=)
CN (2) CN110085425A (https=)
AU (1) AU2013309044A1 (https=)
CA (1) CA2879721C (https=)
IN (1) IN2015DN00730A (https=)
WO (1) WO2014035929A1 (https=)

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US12143147B2 (en) * 2021-04-29 2024-11-12 Samsung Electronics Co., Ltd. Electronic device for transmitting uplink signal and method for operating the same
DE102023134791A1 (de) * 2023-12-12 2025-06-12 Valeo Schalter Und Sensoren Gmbh Fahrzeugelektronikmodul mit Filterschaltung, welche gemäß einer Pi- oder T-Schaltung spezifisch verschaltete Bauteile aufweist, sowie Verfahren zum Betreiben eines Fahrzeugelektronikmoduls

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Also Published As

Publication number Publication date
IN2015DN00730A (https=) 2015-07-10
EP3528268A1 (en) 2019-08-21
KR20200018734A (ko) 2020-02-19
US20140060911A1 (en) 2014-03-06
AU2013309044A1 (en) 2015-02-05
US20150228410A1 (en) 2015-08-13
EP2891164A1 (en) 2015-07-08
US20180068799A1 (en) 2018-03-08
EP2891164A4 (en) 2016-07-20
KR102215960B1 (ko) 2021-02-15
CN104584158A (zh) 2015-04-29
CA2879721A1 (en) 2014-03-06
US10832870B2 (en) 2020-11-10
CN110085425A (zh) 2019-08-02
WO2014035929A1 (en) 2014-03-06
CA2879721C (en) 2021-06-22

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