US20140060911A1 - Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors - Google Patents

Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors Download PDF

Info

Publication number
US20140060911A1
US20140060911A1 US14/010,772 US201314010772A US2014060911A1 US 20140060911 A1 US20140060911 A1 US 20140060911A1 US 201314010772 A US201314010772 A US 201314010772A US 2014060911 A1 US2014060911 A1 US 2014060911A1
Authority
US
United States
Prior art keywords
capacitor
devices
capacitors
array
capacitor structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/010,772
Other languages
English (en)
Inventor
Steve D. Slagle
James D. Shaw
George C. Mimms
Kyle E. Erickson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allison Transmission Inc
Original Assignee
Allison Transmission Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allison Transmission Inc filed Critical Allison Transmission Inc
Priority to US14/010,772 priority Critical patent/US20140060911A1/en
Assigned to ALLISON TRANSMISSION, INC. reassignment ALLISON TRANSMISSION, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHAW, JAMES D., ERICKSON, KYLE E., MIMMS, GEORGE C., SLAGLE, STEVEN D.
Publication of US20140060911A1 publication Critical patent/US20140060911A1/en
Priority to US14/694,437 priority patent/US20150228410A1/en
Priority to US15/810,782 priority patent/US10832870B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/35Feed-through capacitors or anti-noise capacitors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H57/00General details of gearing
    • F16H57/0006Vibration-damping or noise reducing means specially adapted for gearings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10545Related components mounted on both sides of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045Protection against vibrations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the present invention relates to circuit boards and in particular to the arrangement of capacitors on circuit boards.
  • FIG. 2 is similar to FIG. 1 except that it also includes a substantially similar, opposing capacitor 210 mounted on the bottom face 104 of the circuit board 100 directly opposite the capacitor 110 which is mounted on the top face 102 of the circuit board 100 .
  • the piezoelectric acceleration forces F 1 and F 2 produced by the substantially similar capacitors 110 , 210 oppose each other's ability to vibrate the circuit board 100 .
  • piezoelectric acceleration forces F 1 can cause the excited capacitor 110 to vibrate at frequencies within the audible range.
  • piezoelectric acceleration forces F 1 from the excited capacitor 110 can be transmitted into the circuit board 100 causing its larger surface area to vibrate and generate acoustic waves 120 as shown in FIG. 1 .
  • the opposing capacitor 210 produces piezoelectric acceleration forces F 2 causing the excited opposing capacitor 210 to vibrate at substantially the same frequencies in the opposite direction.
  • the piezoelectric acceleration forces F 2 from the opposing capacitor 210 tend to cancel the acceleration forces F 1 from the capacitor 110 reducing or eliminating vibrations in the circuit board 100 that generate undesirable acoustic waves. By reducing or eliminating the circuit board vibration, significant noise reduction can be realized.
  • a stack with an even number of two or more substantially similar discrete capacitors, or sets of capacitor layers can be constructed such that the stack is supported by a circuit board or other structure in the middle of the stack such that the stack of capacitors or capacitor layers is substantially symmetrical about the support structure, and the terminals are designed to provide substantially the same electrical stimulation to both sides of the stack.
  • FIG. 2 shows an exemplary stack of two substantially similar capacitors 110 , 210 which can be illustrative of more complex capacitor structures in which each of the capacitors 110 , 210 represents stacks of capacitors or sets of capacitor layers that are substantially symmetrical about the circuit board 100 .
  • the substantially similar stacks or sets of capacitors or capacitor layers 110 , 210 that are symmetrical about the circuit board 100 can receive substantially the same electrical signals.
  • the opposing vibrations of the substantially symmetrical halves of the capacitor stacks and/or layers can substantially cancel each other out thus prevent communication of the capacitor vibrations to the circuit board or other supporting structure in the middle of the two stack halves.
  • the opposing vibrations of the substantially identical or symmetrical halves of the capacitor stacks and/or layers can also substantially cancel undesirable electrical noise due to the capacitor vibrations to reduce the effects on signals of interest.
  • This symmetrical or balanced configuration of substantially similar capacitor structures can be used to substantially reduce unwanted audible and/or electrical noise and vibrations from the excited capacitors.
  • the capacitor structures can be discrete capacitors, stacks or sets of capacitors, capacitor layers, or other structures formed using capacitors.
  • a capacitor array of two or more discrete capacitors, stacks or sets of capacitors, capacitor layers, or other structures formed using capacitors can be constructed such that the capacitor array is supported by a circuit board or other structure, and a substantially similar capacitor array can be arranged on the opposite side of the supporting structure such that for each capacitor device of the array there is a substantially similar capacitor device on the opposite side of the supporting structure.
  • the terminals of the capacitor arrays can be designed to provide substantially the same electrical stimulation to the capacitor arrays on both sides of the supporting structure.
  • each of the capacitors 110 , 210 represents an array of capacitor devices where for each capacitor device of the capacitor array 110 , the capacitor array 210 includes a substantially similar capacitor device mounted on the opposite side of the circuit board 100 .
  • the substantially similar capacitor arrays 110 , 210 can receive substantially the same electrical signals.
  • the opposing vibrations of the substantially identical capacitor arrays 110 , 210 can substantially cancel each other out and thus prevent communication of the capacitor vibrations to the circuit board 100 or other supporting structure.
  • Undesirable noise voltages caused by vibration of the substantially identical capacitor arrays 110 , 210 can also substantially oppose one another canceling the undesirable electrical noise effects on signals of interest.
  • This balanced configuration of substantially similar capacitor arrays 110 , 210 can be used to substantially reduce unwanted audible and/or electrical noise and vibrations from the excited capacitors.
  • the capacitor arrays can be discrete capacitors, stacks or sets of capacitors, capacitor layers, or other structures formed using capacitors.
  • FIG. 3 illustrates an exemplary embodiment of a transmission system 10 in which substantially similar capacitors could be located on opposite sides of circuit boards or supporting structures to cancel vibrations of the supporting structures and reduce or eliminate unwanted vibration and audible or electrical noise.
  • the system 10 includes an internal combustion engine 12 that is configured to rotatably drive an output shaft 14 that is coupled to an input or pump shaft 16 of a conventional torque converter 20 .
  • the input or pump shaft 16 is attached to an impeller or pump 18 that is rotatably driven by the output shaft 14 of the engine 12 .
  • the torque converter 20 further includes a turbine 22 that is attached to a turbine shaft 24 , and the turbine shaft 24 is coupled to, or integral with, a rotatable input shaft 26 of a transmission 28 .
  • the transmission 28 is conventional and includes, for example, a planetary gear system 30 having a number of automatically selected gears.
  • An output shaft 32 of the transmission is coupled to or integral with, and rotatably drives, a propeller shaft 34 that is coupled to a differential 36 .
  • the differential 36 is coupled to, and rotatably drives, an axle 38 having wheels 40 A and 40 B mounted thereto at each end.
  • the output shaft 32 of the transmission 28 drives the wheels 40 A and 40 B in a conventional manner via the propeller shaft 34 , differential 36 and axle 38 .
  • a conventional lockup clutch 42 is connected between the pump 18 and the turbine 22 of the torque converter 20 .
  • the operation of the torque converter 20 is conventional in that the torque converter 20 is operable in a so-called “torque converter” mode during certain operating conditions such as vehicle launch, low speed and certain gear shifting conditions.
  • the lockup clutch 42 is disengaged and the pump 18 rotates at the rotational speed of the engine output shaft 14 while the turbine 22 is rotatably actuated by the pump 18 through a fluid (not shown) interposed between the pump 18 and the turbine 22 .
  • torque multiplication occurs through the fluid coupling such that the turbine shaft 24 is exposed to more drive torque than is being supplied by the engine 12 , as is known in the art.
  • the torque converter 20 is alternatively operable in a so-called “lockup” mode during other operating conditions, such as when certain gears of the planetary gear system 30 of the transmission 28 are engaged.
  • the lockup clutch 42 is engaged and the pump 18 is thereby secured directly to the turbine 22 so that the engine output shaft 14 is directly coupled to the input shaft 26 of the transmission 28 , as is also known in the art.
  • the transmission 28 further includes an electro-hydraulic system 44 that is fluidly coupled to the planetary gear system 30 via a number, J, of fluid paths 46 1 - 46 J where J may be any positive integer.
  • the electro-hydraulic system 44 is responsive to control signals to selectively cause fluid to flow through one or more of the fluid paths 46 1 - 46 J to thereby control operation, i.e., engagement and disengagement, of a plurality of corresponding friction devices in the planetary gear system 30 .
  • the plurality of friction devices may include, but are not limited to, one or more conventional brake devices, one or more torque transmitting devices, and the like.
  • the operation, i.e., engagement and disengagement, of the plurality of friction devices is controlled by selectively controlling the friction applied by each of the plurality of friction devices, such as by controlling fluid pressure to each of the friction devices.
  • the plurality of friction devices include a plurality of brake and torque transmitting devices in the form of conventional clutches that may each be controllably engaged and disengaged via fluid pressure supplied by the electro-hydraulic system 44 .
  • changing or shifting between the various gears of the transmission 28 is accomplished in a conventional manner by selectively controlling the plurality of friction devices via control of fluid pressure within the number of fluid paths 46 1 - 46 J .
  • the system 10 further includes a transmission control circuit 50 that includes a memory unit 55 .
  • the transmission control circuit 50 is illustratively microprocessor-based, and the memory unit 55 generally includes instructions stored therein that are executable by the transmission control circuit 50 to control operation of the torque converter 20 and operation of the transmission 28 , i.e., shifting between the various gears of the planetary gear system 30 . It will be understood, however, that this disclosure contemplates other embodiments in which the transmission control circuit 50 is not microprocessor-based, but is configured to control operation of the torque converter 20 and/or transmission 28 based on one or more sets of hardwired instructions and/or software instructions stored in the memory unit 55 .
  • the torque converter 20 and the transmission 28 include a number of sensors configured to produce sensor signals that are indicative of one or more operating states of the torque converter 20 and transmission 28 respectively.
  • the torque converter 20 illustratively includes a conventional speed sensor 60 that is positioned and configured to produce a speed signal corresponding to the rotational speed of the pump shaft 16 , which is the same rotational speed of the output shaft 14 of the engine 12 .
  • the speed sensor 60 is electrically connected to a pump speed input, PS, of the transmission control circuit 50 via a signal path 62 , and the transmission control circuit 50 is operable to process the speed signal produced by the speed sensor 60 in a conventional manner to determine the rotational speed of the pump shaft 16 /engine output shaft 14 .
  • the speed sensor 64 is electrically connected to a transmission input shaft speed input, TIS, of the transmission control circuit 50 via a signal path 66 , and the transmission control circuit 50 is operable to process the speed signal produced by the speed sensor 64 in a conventional manner to determine the rotational speed of the turbine shaft 24 /transmission input shaft 26 .
  • the system 10 further includes an engine control circuit 80 having an input/output port (I/O) that is electrically coupled to the engine 12 via a number K of signal paths 82 , wherein K may be any positive integer.
  • the engine control circuit 80 may be conventional, and is operable to control and manage the overall operation of the engine 12 .
  • the engine control circuit 80 further includes a communication port COM which is electrically connected to a similar communication port COM of the transmission control circuit 50 via a number L of signal paths 84 , wherein L may be any positive integer.
  • the one or more signal paths 84 are typically referred to collectively as a data link.
  • the engine control circuit 80 and the transmission control circuit 50 are operable to share information via the one or more signal paths 84 in a conventional manner.
  • the engine control circuit 80 and transmission control circuit 50 are operable to share information via the one or more signal paths 84 in the form of one or more messages in accordance with a Society of Automotive Engineers (SAE) J-1939 communications protocol, although this disclosure contemplates other embodiments in which the engine control circuit 80 and the transmission control circuit 50 are operable to share information via the one or more signal paths 84 in accordance with one or more other conventional communication protocols.
  • SAE Society of Automotive Engineers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Dc-Dc Converters (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Structure Of Transmissions (AREA)
  • Control Of Transmission Device (AREA)
US14/010,772 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors Abandoned US20140060911A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/010,772 US20140060911A1 (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
US14/694,437 US20150228410A1 (en) 2012-08-30 2015-04-23 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
US15/810,782 US10832870B2 (en) 2012-08-30 2017-11-13 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261694827P 2012-08-30 2012-08-30
US14/010,772 US20140060911A1 (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/694,437 Division US20150228410A1 (en) 2012-08-30 2015-04-23 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Publications (1)

Publication Number Publication Date
US20140060911A1 true US20140060911A1 (en) 2014-03-06

Family

ID=50184217

Family Applications (3)

Application Number Title Priority Date Filing Date
US14/010,772 Abandoned US20140060911A1 (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
US14/694,437 Abandoned US20150228410A1 (en) 2012-08-30 2015-04-23 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
US15/810,782 Active US10832870B2 (en) 2012-08-30 2017-11-13 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Family Applications After (2)

Application Number Title Priority Date Filing Date
US14/694,437 Abandoned US20150228410A1 (en) 2012-08-30 2015-04-23 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
US15/810,782 Active US10832870B2 (en) 2012-08-30 2017-11-13 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Country Status (8)

Country Link
US (3) US20140060911A1 (https=)
EP (2) EP2891164A4 (https=)
KR (2) KR20150048234A (https=)
CN (2) CN110085425A (https=)
AU (1) AU2013309044A1 (https=)
CA (1) CA2879721C (https=)
IN (1) IN2015DN00730A (https=)
WO (1) WO2014035929A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10832870B2 (en) 2012-08-30 2020-11-10 Allison Transmission, Inc. Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
US20220352619A1 (en) * 2021-04-29 2022-11-03 Samsung Electronics Co., Ltd. Electronic device for transmitting uplink signal and method for operating the same
DE102023134791A1 (de) * 2023-12-12 2025-06-12 Valeo Schalter Und Sensoren Gmbh Fahrzeugelektronikmodul mit Filterschaltung, welche gemäß einer Pi- oder T-Schaltung spezifisch verschaltete Bauteile aufweist, sowie Verfahren zum Betreiben eines Fahrzeugelektronikmoduls

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017089119A1 (de) * 2015-11-23 2017-06-01 Behr-Hella Thermocontrol Gmbh Vorrichtung zur filterung der versorgungsspannung einer elektrischen baugruppe, insbesondere in einer fahrzeugkomponente

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261153A (en) * 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
US5824903A (en) * 1993-03-01 1998-10-20 Murata Manufacturing Co., Ltd. Piezoelectric vibrator and acceleration sensor using the same
US5838216A (en) * 1996-09-06 1998-11-17 Sunstrand Corporation Common-mode EMI filter
US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
US6336365B1 (en) * 1999-08-24 2002-01-08 Personal Electronic Devices, Inc. Low-cost accelerometer
US20020172023A1 (en) * 2001-03-06 2002-11-21 Blakely Robert J. Method for high-density, low-via-count, decoupling capacitor placement
US20030107869A1 (en) * 2001-12-07 2003-06-12 Avaya Technology Corporation Capacitor employing both fringe and plate capacitance and method of manufacture thereof
US20030224546A1 (en) * 2002-05-30 2003-12-04 Chen Wenjun W. Method and apparatus for reducing noise in electrical power supplied to a semiconductor
US6822845B2 (en) * 2002-10-23 2004-11-23 Spectrum Control, Inc. Low profile filter
US6954346B2 (en) * 1997-04-08 2005-10-11 Xzy Attenuators, Llc Filter assembly
US20050270749A1 (en) * 2004-06-07 2005-12-08 Broadcom Corporation Thermally improved placement of power-dissipating components onto a circuit board
US20060143887A1 (en) * 2004-12-30 2006-07-06 Sriram Srinivasan Forming a substrate core with embedded capacitor and structures formed thereby
US20120125674A1 (en) * 2009-05-19 2012-05-24 Takuya Miyahara Device for surface mounting and capacitor element
US20130193582A1 (en) * 2012-01-27 2013-08-01 Mosaid Technologies Incorporated Method and apparatus for connecting memory dies to form a memory system
US20130222045A1 (en) * 2012-02-24 2013-08-29 Transphorm Inc. Semiconductor power modules and devices
US20130265726A1 (en) * 2012-04-09 2013-10-10 Canon Kabushiki Kaisha Printed circuit board
US20140332261A1 (en) * 2013-05-10 2014-11-13 Murata Manufacturing Co., Ltd. Capacitor element mounting structure and capacitor element mounting method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959786A (en) * 1988-04-29 1990-09-25 Chrysler Corporation Dual regulator for reducing system current during at least one mode of operation
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5909350A (en) * 1997-04-08 1999-06-01 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
JP3805146B2 (ja) * 1998-12-09 2006-08-02 太陽誘電株式会社 積層セラミックコンデンサの回路基板実装方法及び回路基板
JP2002217667A (ja) * 2001-01-22 2002-08-02 Sumitomo Metal Electronics Devices Inc 積層lcフィルタ
DE10314234B3 (de) * 2003-03-29 2004-10-28 Aurator Treuhandgesellschaft Mbh Vier-Wellen-Leistungsverzweigungsgetriebe
KR100674830B1 (ko) * 2004-11-04 2007-01-25 삼성전기주식회사 적층형 캐패시터 어레이
US7149072B2 (en) * 2004-11-04 2006-12-12 Samsung Electro-Mechanics Co., Ltd. Multilayered chip capacitor array
US7894965B2 (en) * 2006-11-29 2011-02-22 Chrysler Group Llc Swap shift control scheme for an automatic transmission
KR100920614B1 (ko) * 2007-02-05 2009-10-08 삼성전기주식회사 적층형 칩 커패시터
TW200838379A (en) * 2007-03-02 2008-09-16 Delta Electronics Inc Method of manufacturing stacked electronic device
JP5099433B2 (ja) * 2008-02-21 2012-12-19 アイシン・エィ・ダブリュ株式会社 駆動装置制御ユニット
JP5133813B2 (ja) * 2008-08-11 2013-01-30 レノボ・シンガポール・プライベート・リミテッド 積層セラミック・コンデンサの単位配置構造、全体配置構造およびプリント配線基板
US8483919B2 (en) * 2010-11-12 2013-07-09 Allison Transmission, Inc. Double transition shift control in an automatic powershifting transmission
IN2015DN00730A (https=) 2012-08-30 2015-07-10 Allison Transm Inc

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261153A (en) * 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
US5824903A (en) * 1993-03-01 1998-10-20 Murata Manufacturing Co., Ltd. Piezoelectric vibrator and acceleration sensor using the same
US5838216A (en) * 1996-09-06 1998-11-17 Sunstrand Corporation Common-mode EMI filter
US6954346B2 (en) * 1997-04-08 2005-10-11 Xzy Attenuators, Llc Filter assembly
US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
US6336365B1 (en) * 1999-08-24 2002-01-08 Personal Electronic Devices, Inc. Low-cost accelerometer
US20020172023A1 (en) * 2001-03-06 2002-11-21 Blakely Robert J. Method for high-density, low-via-count, decoupling capacitor placement
US20030107869A1 (en) * 2001-12-07 2003-06-12 Avaya Technology Corporation Capacitor employing both fringe and plate capacitance and method of manufacture thereof
US20030224546A1 (en) * 2002-05-30 2003-12-04 Chen Wenjun W. Method and apparatus for reducing noise in electrical power supplied to a semiconductor
US6822845B2 (en) * 2002-10-23 2004-11-23 Spectrum Control, Inc. Low profile filter
US20050270749A1 (en) * 2004-06-07 2005-12-08 Broadcom Corporation Thermally improved placement of power-dissipating components onto a circuit board
US20060143887A1 (en) * 2004-12-30 2006-07-06 Sriram Srinivasan Forming a substrate core with embedded capacitor and structures formed thereby
US20120125674A1 (en) * 2009-05-19 2012-05-24 Takuya Miyahara Device for surface mounting and capacitor element
US20130193582A1 (en) * 2012-01-27 2013-08-01 Mosaid Technologies Incorporated Method and apparatus for connecting memory dies to form a memory system
US20130222045A1 (en) * 2012-02-24 2013-08-29 Transphorm Inc. Semiconductor power modules and devices
US20130265726A1 (en) * 2012-04-09 2013-10-10 Canon Kabushiki Kaisha Printed circuit board
US20140332261A1 (en) * 2013-05-10 2014-11-13 Murata Manufacturing Co., Ltd. Capacitor element mounting structure and capacitor element mounting method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10832870B2 (en) 2012-08-30 2020-11-10 Allison Transmission, Inc. Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
US20220352619A1 (en) * 2021-04-29 2022-11-03 Samsung Electronics Co., Ltd. Electronic device for transmitting uplink signal and method for operating the same
US12143147B2 (en) * 2021-04-29 2024-11-12 Samsung Electronics Co., Ltd. Electronic device for transmitting uplink signal and method for operating the same
DE102023134791A1 (de) * 2023-12-12 2025-06-12 Valeo Schalter Und Sensoren Gmbh Fahrzeugelektronikmodul mit Filterschaltung, welche gemäß einer Pi- oder T-Schaltung spezifisch verschaltete Bauteile aufweist, sowie Verfahren zum Betreiben eines Fahrzeugelektronikmoduls

Also Published As

Publication number Publication date
IN2015DN00730A (https=) 2015-07-10
EP3528268A1 (en) 2019-08-21
KR20200018734A (ko) 2020-02-19
AU2013309044A1 (en) 2015-02-05
US20150228410A1 (en) 2015-08-13
EP2891164A1 (en) 2015-07-08
US20180068799A1 (en) 2018-03-08
EP2891164A4 (en) 2016-07-20
KR102215960B1 (ko) 2021-02-15
CN104584158A (zh) 2015-04-29
CA2879721A1 (en) 2014-03-06
US10832870B2 (en) 2020-11-10
CN110085425A (zh) 2019-08-02
WO2014035929A1 (en) 2014-03-06
CA2879721C (en) 2021-06-22
KR20150048234A (ko) 2015-05-06

Similar Documents

Publication Publication Date Title
US10832870B2 (en) Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
CN104044592B (zh) 混合动力车辆控制器及控制混合动力电动车辆的方法
KR101659363B1 (ko) 다이나모미터 시스템
RU2709700C2 (ru) Система активного шумоподавления и подавления вибрации
US9234562B2 (en) Damper device
US20180269376A1 (en) Perforated piezoelectric hydrophone, array comprising a plurality of hydrophones and method for making said hydrophone
KR102383554B1 (ko) 동력계 제어 장치
JP5265370B2 (ja) 電気機械波デバイス
JPWO2015136626A1 (ja) ドライブトレインの試験システム
US8384270B2 (en) Pressure-balanced electromechanical converter
WO2002008055A1 (en) System for active noise reduction
JP4146083B2 (ja) ヘリコプタギアボックスマウントのための能動型ノイズ制御システム
EP3936873B1 (fr) Accéléromètre industriel triaxial
WO2021097341A1 (en) Differential hydraulic buffer
RU2540828C2 (ru) Система с двойным шестеренчатым приводом
JP6137670B2 (ja) ダンパ装置
CN103963699B (zh) 以虚拟方式增加内燃机中的汽缸数目
CN119247574B (zh) 一种具有面包板主动阻尼的光学平台
JP6137673B2 (ja) ダンパ装置
Benzel et al. Active control of gear pair vibration with an electronically commutated motor as actuator
JP2006342864A (ja) 振動抑制装置
JP2010002033A (ja) 振動低減装置及び振動低減方法
CN119247574A (zh) 一种具有面包板主动阻尼的光学平台
CN105864353A (zh) 一种基于压电堆的惯性式混合隔振器
JP2005299745A (ja) 防振支持装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: ALLISON TRANSMISSION, INC., INDIANA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SLAGLE, STEVEN D.;SHAW, JAMES D.;MIMMS, GEORGE C.;AND OTHERS;SIGNING DATES FROM 20130822 TO 20130823;REEL/FRAME:031090/0261

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION