IN2015DN00730A - - Google Patents

Info

Publication number
IN2015DN00730A
IN2015DN00730A IN730DEN2015A IN2015DN00730A IN 2015DN00730 A IN2015DN00730 A IN 2015DN00730A IN 730DEN2015 A IN730DEN2015 A IN 730DEN2015A IN 2015DN00730 A IN2015DN00730 A IN 2015DN00730A
Authority
IN
India
Prior art keywords
capacitor
devices
structures
supporting structure
arrays
Prior art date
Application number
Other languages
English (en)
Inventor
Steve D Slagle
James D Shaw
George C Mimms
Kyle E Erickson
Original Assignee
Allison Transm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allison Transm Inc filed Critical Allison Transm Inc
Publication of IN2015DN00730A publication Critical patent/IN2015DN00730A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H57/00—General details of gearing
    • F16H57/0006—Vibration-damping or noise reducing means specially adapted for gearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Dc-Dc Converters (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Structure Of Transmissions (AREA)
  • Control Of Transmission Device (AREA)
IN730DEN2015 2012-08-30 2013-08-27 IN2015DN00730A (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261694827P 2012-08-30 2012-08-30
PCT/US2013/056737 WO2014035929A1 (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Publications (1)

Publication Number Publication Date
IN2015DN00730A true IN2015DN00730A (https=) 2015-07-10

Family

ID=50184217

Family Applications (1)

Application Number Title Priority Date Filing Date
IN730DEN2015 IN2015DN00730A (https=) 2012-08-30 2013-08-27

Country Status (8)

Country Link
US (3) US20140060911A1 (https=)
EP (2) EP2891164A4 (https=)
KR (2) KR20150048234A (https=)
CN (2) CN110085425A (https=)
AU (1) AU2013309044A1 (https=)
CA (1) CA2879721C (https=)
IN (1) IN2015DN00730A (https=)
WO (1) WO2014035929A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IN2015DN00730A (https=) 2012-08-30 2015-07-10 Allison Transm Inc
WO2017089119A1 (de) * 2015-11-23 2017-06-01 Behr-Hella Thermocontrol Gmbh Vorrichtung zur filterung der versorgungsspannung einer elektrischen baugruppe, insbesondere in einer fahrzeugkomponente
US12143147B2 (en) * 2021-04-29 2024-11-12 Samsung Electronics Co., Ltd. Electronic device for transmitting uplink signal and method for operating the same
DE102023134791A1 (de) * 2023-12-12 2025-06-12 Valeo Schalter Und Sensoren Gmbh Fahrzeugelektronikmodul mit Filterschaltung, welche gemäß einer Pi- oder T-Schaltung spezifisch verschaltete Bauteile aufweist, sowie Verfahren zum Betreiben eines Fahrzeugelektronikmoduls

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US5261153A (en) * 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
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US5838216A (en) * 1996-09-06 1998-11-17 Sunstrand Corporation Common-mode EMI filter
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US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
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JP2002217667A (ja) * 2001-01-22 2002-08-02 Sumitomo Metal Electronics Devices Inc 積層ｌｃフィルタ
US6618266B2 (en) * 2001-03-06 2003-09-09 Hewlett-Packard Development Company, L.P. Method for high-density, low-via-count, decoupling capacitor placement
US6661638B2 (en) * 2001-12-07 2003-12-09 Avaya Technology Corp. Capacitor employing both fringe and plate capacitance and method of manufacture thereof
US20030224546A1 (en) 2002-05-30 2003-12-04 Chen Wenjun W. Method and apparatus for reducing noise in electrical power supplied to a semiconductor
TW200427398A (en) 2002-10-23 2004-12-01 Spectrum Control Inc Low profile filter
DE10314234B3 (de) * 2003-03-29 2004-10-28 Aurator Treuhandgesellschaft Mbh Vier-Wellen-Leistungsverzweigungsgetriebe
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JP2014239207A (ja) * 2013-05-10 2014-12-18 株式会社村田製作所 コンデンサ素子の実装構造体およびコンデンサ素子の実装方法

Also Published As

Publication number Publication date
EP3528268A1 (en) 2019-08-21
KR20200018734A (ko) 2020-02-19
US20140060911A1 (en) 2014-03-06
AU2013309044A1 (en) 2015-02-05
US20150228410A1 (en) 2015-08-13
EP2891164A1 (en) 2015-07-08
US20180068799A1 (en) 2018-03-08
EP2891164A4 (en) 2016-07-20
KR102215960B1 (ko) 2021-02-15
CN104584158A (zh) 2015-04-29
CA2879721A1 (en) 2014-03-06
US10832870B2 (en) 2020-11-10
CN110085425A (zh) 2019-08-02
WO2014035929A1 (en) 2014-03-06
CA2879721C (en) 2021-06-22
KR20150048234A (ko) 2015-05-06

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