CA2879721C - Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors - Google Patents

Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors Download PDF

Info

Publication number
CA2879721C
CA2879721C CA2879721A CA2879721A CA2879721C CA 2879721 C CA2879721 C CA 2879721C CA 2879721 A CA2879721 A CA 2879721A CA 2879721 A CA2879721 A CA 2879721A CA 2879721 C CA2879721 C CA 2879721C
Authority
CA
Canada
Prior art keywords
capacitor
transmission system
capacitors
capacitor structure
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2879721A
Other languages
English (en)
French (fr)
Other versions
CA2879721A1 (en
Inventor
Steve D. Slagle
James D. Shaw
George C. Mimms
Kyle E. Erickson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allison Transmission Inc
Original Assignee
Allison Transmission Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allison Transmission Inc filed Critical Allison Transmission Inc
Publication of CA2879721A1 publication Critical patent/CA2879721A1/en
Application granted granted Critical
Publication of CA2879721C publication Critical patent/CA2879721C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H57/00—General details of gearing
    • F16H57/0006—Vibration-damping or noise reducing means specially adapted for gearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Dc-Dc Converters (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Structure Of Transmissions (AREA)
  • Control Of Transmission Device (AREA)
CA2879721A 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors Active CA2879721C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261694827P 2012-08-30 2012-08-30
US61/694,827 2012-08-30
PCT/US2013/056737 WO2014035929A1 (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Publications (2)

Publication Number Publication Date
CA2879721A1 CA2879721A1 (en) 2014-03-06
CA2879721C true CA2879721C (en) 2021-06-22

Family

ID=50184217

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2879721A Active CA2879721C (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Country Status (8)

Country Link
US (3) US20140060911A1 (https=)
EP (2) EP2891164A4 (https=)
KR (2) KR20150048234A (https=)
CN (2) CN110085425A (https=)
AU (1) AU2013309044A1 (https=)
CA (1) CA2879721C (https=)
IN (1) IN2015DN00730A (https=)
WO (1) WO2014035929A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IN2015DN00730A (https=) 2012-08-30 2015-07-10 Allison Transm Inc
WO2017089119A1 (de) * 2015-11-23 2017-06-01 Behr-Hella Thermocontrol Gmbh Vorrichtung zur filterung der versorgungsspannung einer elektrischen baugruppe, insbesondere in einer fahrzeugkomponente
US12143147B2 (en) * 2021-04-29 2024-11-12 Samsung Electronics Co., Ltd. Electronic device for transmitting uplink signal and method for operating the same
DE102023134791A1 (de) * 2023-12-12 2025-06-12 Valeo Schalter Und Sensoren Gmbh Fahrzeugelektronikmodul mit Filterschaltung, welche gemäß einer Pi- oder T-Schaltung spezifisch verschaltete Bauteile aufweist, sowie Verfahren zum Betreiben eines Fahrzeugelektronikmoduls

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959786A (en) * 1988-04-29 1990-09-25 Chrysler Corporation Dual regulator for reducing system current during at least one mode of operation
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5261153A (en) * 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
DE69423667T2 (de) 1993-03-01 2000-11-23 Murata Mfg. Co., Ltd. Piezoelektrischer Vibrator und diesen verwendenden Beschleunigungssensor
US5838216A (en) * 1996-09-06 1998-11-17 Sunstrand Corporation Common-mode EMI filter
US6954346B2 (en) * 1997-04-08 2005-10-11 Xzy Attenuators, Llc Filter assembly
US5909350A (en) * 1997-04-08 1999-06-01 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6336365B1 (en) * 1999-08-24 2002-01-08 Personal Electronic Devices, Inc. Low-cost accelerometer
US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
JP3805146B2 (ja) * 1998-12-09 2006-08-02 太陽誘電株式会社 積層セラミックコンデンサの回路基板実装方法及び回路基板
JP2002217667A (ja) * 2001-01-22 2002-08-02 Sumitomo Metal Electronics Devices Inc 積層ｌｃフィルタ
US6618266B2 (en) * 2001-03-06 2003-09-09 Hewlett-Packard Development Company, L.P. Method for high-density, low-via-count, decoupling capacitor placement
US6661638B2 (en) * 2001-12-07 2003-12-09 Avaya Technology Corp. Capacitor employing both fringe and plate capacitance and method of manufacture thereof
US20030224546A1 (en) 2002-05-30 2003-12-04 Chen Wenjun W. Method and apparatus for reducing noise in electrical power supplied to a semiconductor
TW200427398A (en) 2002-10-23 2004-12-01 Spectrum Control Inc Low profile filter
DE10314234B3 (de) * 2003-03-29 2004-10-28 Aurator Treuhandgesellschaft Mbh Vier-Wellen-Leistungsverzweigungsgetriebe
US7443025B2 (en) * 2004-06-07 2008-10-28 Broadcom Corporation Thermally improved placement of power-dissipating components onto a circuit board
KR100674830B1 (ko) * 2004-11-04 2007-01-25 삼성전기주식회사 적층형 캐패시터 어레이
US7149072B2 (en) * 2004-11-04 2006-12-12 Samsung Electro-Mechanics Co., Ltd. Multilayered chip capacitor array
US9572258B2 (en) * 2004-12-30 2017-02-14 Intel Corporation Method of forming a substrate core with embedded capacitor and structures formed thereby
US7894965B2 (en) * 2006-11-29 2011-02-22 Chrysler Group Llc Swap shift control scheme for an automatic transmission
KR100920614B1 (ko) * 2007-02-05 2009-10-08 삼성전기주식회사 적층형 칩 커패시터
TW200838379A (en) * 2007-03-02 2008-09-16 Delta Electronics Inc Method of manufacturing stacked electronic device
JP5099433B2 (ja) * 2008-02-21 2012-12-19 アイシン・エィ・ダブリュ株式会社 駆動装置制御ユニット
JP5133813B2 (ja) * 2008-08-11 2013-01-30 レノボ・シンガポール・プライベート・リミテッド 積層セラミック・コンデンサの単位配置構造、全体配置構造およびプリント配線基板
TWI520165B (zh) * 2009-05-19 2016-02-01 Rubycon Corp Surface mount components, printed wiring board and electronic equipment
US8483919B2 (en) * 2010-11-12 2013-07-09 Allison Transmission, Inc. Double transition shift control in an automatic powershifting transmission
TW201347051A (zh) * 2012-01-27 2013-11-16 摩賽德科技股份有限公司 連接記憶體晶粒形成記憶體系統的方法與設備
US8648643B2 (en) * 2012-02-24 2014-02-11 Transphorm Inc. Semiconductor power modules and devices
JP5893484B2 (ja) * 2012-04-09 2016-03-23 キヤノン株式会社 プリント回路板及びプリント配線板
IN2015DN00730A (https=) 2012-08-30 2015-07-10 Allison Transm Inc
JP2014239207A (ja) * 2013-05-10 2014-12-18 株式会社村田製作所 コンデンサ素子の実装構造体およびコンデンサ素子の実装方法

Also Published As

Publication number Publication date
IN2015DN00730A (https=) 2015-07-10
EP3528268A1 (en) 2019-08-21
KR20200018734A (ko) 2020-02-19
US20140060911A1 (en) 2014-03-06
AU2013309044A1 (en) 2015-02-05
US20150228410A1 (en) 2015-08-13
EP2891164A1 (en) 2015-07-08
US20180068799A1 (en) 2018-03-08
EP2891164A4 (en) 2016-07-20
KR102215960B1 (ko) 2021-02-15
CN104584158A (zh) 2015-04-29
CA2879721A1 (en) 2014-03-06
US10832870B2 (en) 2020-11-10
CN110085425A (zh) 2019-08-02
WO2014035929A1 (en) 2014-03-06
KR20150048234A (ko) 2015-05-06

Similar Documents

Publication Publication Date Title
US10832870B2 (en) Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
KR101659363B1 (ko) 다이나모미터 시스템
CN104044592B (zh) 混合动力车辆控制器及控制混合动力电动车辆的方法
CN101493142B (zh) 通过电气传动控制的变速箱降噪
US20120083953A1 (en) Control device
RU2709700C2 (ru) Система активного шумоподавления и подавления вибрации
US9234562B2 (en) Damper device
JP2017511271A (ja) ハイブリッドモジュール及びハイブリッドモジュールを有するドライブトレーン
JP4137375B2 (ja) 画定された空間用の能動型ノイズ制御システム
KR102383554B1 (ko) 동력계 제어 장치
US7392714B2 (en) Torque monitoring system and method of monitoring engine torque
EP4007305B1 (en) Micro-electromechanical transducer with reduced size
WO2002008055A1 (en) System for active noise reduction
JPWO2015136626A1 (ja) ドライブトレインの試験システム
CN109835341A (zh) 用于控制机动车的至少一个轴的驱动系统的方法
KR20200034684A (ko) 자동 변속기
JP4146083B2 (ja) ヘリコプタギアボックスマウントのための能動型ノイズ制御システム
JP2009521367A (ja) 機械負荷の音響フィードバック
CN111038235B (zh) 气动调整的车辆动力传动系统安装件
JP5007876B2 (ja) 圧力トランスデューサーのパッケージを有する、変速機用のコントロールユニット
JP6137670B2 (ja) ダンパ装置
JP6137673B2 (ja) ダンパ装置
CN119247574B (zh) 一种具有面包板主动阻尼的光学平台
CN119247574A (zh) 一种具有面包板主动阻尼的光学平台
CN105864353A (zh) 一种基于压电堆的惯性式混合隔振器

Legal Events

Date Code Title Description
EEER Examination request

Effective date: 20180517