CN110085425A - 用于减少来自经电激励或机械激励的电容器的可闻及/或电噪声的方法及系统 - Google Patents
用于减少来自经电激励或机械激励的电容器的可闻及/或电噪声的方法及系统 Download PDFInfo
- Publication number
- CN110085425A CN110085425A CN201910264427.5A CN201910264427A CN110085425A CN 110085425 A CN110085425 A CN 110085425A CN 201910264427 A CN201910264427 A CN 201910264427A CN 110085425 A CN110085425 A CN 110085425A
- Authority
- CN
- China
- Prior art keywords
- capacitor
- device structure
- transmission system
- support construction
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H57/00—General details of gearing
- F16H57/0006—Vibration-damping or noise reducing means specially adapted for gearings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Dc-Dc Converters (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
- Structure Of Transmissions (AREA)
- Control Of Transmission Device (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261694827P | 2012-08-30 | 2012-08-30 | |
| US61/694,827 | 2012-08-30 | ||
| CN201380044536.7A CN104584158A (zh) | 2012-08-30 | 2013-08-27 | 用于减少来自经电激励或磁激励的电容器的可闻及/或电噪声的方法及系统 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380044536.7A Division CN104584158A (zh) | 2012-08-30 | 2013-08-27 | 用于减少来自经电激励或磁激励的电容器的可闻及/或电噪声的方法及系统 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110085425A true CN110085425A (zh) | 2019-08-02 |
Family
ID=50184217
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910264427.5A Pending CN110085425A (zh) | 2012-08-30 | 2013-08-27 | 用于减少来自经电激励或机械激励的电容器的可闻及/或电噪声的方法及系统 |
| CN201380044536.7A Pending CN104584158A (zh) | 2012-08-30 | 2013-08-27 | 用于减少来自经电激励或磁激励的电容器的可闻及/或电噪声的方法及系统 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380044536.7A Pending CN104584158A (zh) | 2012-08-30 | 2013-08-27 | 用于减少来自经电激励或磁激励的电容器的可闻及/或电噪声的方法及系统 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US20140060911A1 (https=) |
| EP (2) | EP2891164A4 (https=) |
| KR (2) | KR20150048234A (https=) |
| CN (2) | CN110085425A (https=) |
| AU (1) | AU2013309044A1 (https=) |
| CA (1) | CA2879721C (https=) |
| IN (1) | IN2015DN00730A (https=) |
| WO (1) | WO2014035929A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IN2015DN00730A (https=) | 2012-08-30 | 2015-07-10 | Allison Transm Inc | |
| WO2017089119A1 (de) * | 2015-11-23 | 2017-06-01 | Behr-Hella Thermocontrol Gmbh | Vorrichtung zur filterung der versorgungsspannung einer elektrischen baugruppe, insbesondere in einer fahrzeugkomponente |
| US12143147B2 (en) * | 2021-04-29 | 2024-11-12 | Samsung Electronics Co., Ltd. | Electronic device for transmitting uplink signal and method for operating the same |
| DE102023134791A1 (de) * | 2023-12-12 | 2025-06-12 | Valeo Schalter Und Sensoren Gmbh | Fahrzeugelektronikmodul mit Filterschaltung, welche gemäß einer Pi- oder T-Schaltung spezifisch verschaltete Bauteile aufweist, sowie Verfahren zum Betreiben eines Fahrzeugelektronikmoduls |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1256502A (zh) * | 1998-12-09 | 2000-06-14 | 太阳诱电株式会社 | 叠层陶瓷电容的电路基板安装方法及电路基板 |
| CN1768212A (zh) * | 2003-03-29 | 2006-05-03 | 动力技术(英国)有限公司 | 四支路差速传动系统 |
| CN101241800A (zh) * | 2007-02-05 | 2008-08-13 | 三星电机株式会社 | 多层片式电容器 |
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| US4959786A (en) * | 1988-04-29 | 1990-09-25 | Chrysler Corporation | Dual regulator for reducing system current during at least one mode of operation |
| US5155655A (en) * | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| US5261153A (en) * | 1992-04-06 | 1993-11-16 | Zycon Corporation | In situ method for forming a capacitive PCB |
| DE69423667T2 (de) | 1993-03-01 | 2000-11-23 | Murata Mfg. Co., Ltd. | Piezoelektrischer Vibrator und diesen verwendenden Beschleunigungssensor |
| US5838216A (en) * | 1996-09-06 | 1998-11-17 | Sunstrand Corporation | Common-mode EMI filter |
| US6954346B2 (en) * | 1997-04-08 | 2005-10-11 | Xzy Attenuators, Llc | Filter assembly |
| US5909350A (en) * | 1997-04-08 | 1999-06-01 | X2Y Attenuators, L.L.C. | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| US6336365B1 (en) * | 1999-08-24 | 2002-01-08 | Personal Electronic Devices, Inc. | Low-cost accelerometer |
| US6011683A (en) * | 1997-12-29 | 2000-01-04 | Texas Instruments Incorporated | Thin multilayer ceramic capacitors |
| JP2002217667A (ja) * | 2001-01-22 | 2002-08-02 | Sumitomo Metal Electronics Devices Inc | 積層lcフィルタ |
| US6618266B2 (en) * | 2001-03-06 | 2003-09-09 | Hewlett-Packard Development Company, L.P. | Method for high-density, low-via-count, decoupling capacitor placement |
| US6661638B2 (en) * | 2001-12-07 | 2003-12-09 | Avaya Technology Corp. | Capacitor employing both fringe and plate capacitance and method of manufacture thereof |
| US20030224546A1 (en) | 2002-05-30 | 2003-12-04 | Chen Wenjun W. | Method and apparatus for reducing noise in electrical power supplied to a semiconductor |
| TW200427398A (en) | 2002-10-23 | 2004-12-01 | Spectrum Control Inc | Low profile filter |
| US7443025B2 (en) * | 2004-06-07 | 2008-10-28 | Broadcom Corporation | Thermally improved placement of power-dissipating components onto a circuit board |
| KR100674830B1 (ko) * | 2004-11-04 | 2007-01-25 | 삼성전기주식회사 | 적층형 캐패시터 어레이 |
| US7149072B2 (en) * | 2004-11-04 | 2006-12-12 | Samsung Electro-Mechanics Co., Ltd. | Multilayered chip capacitor array |
| US9572258B2 (en) * | 2004-12-30 | 2017-02-14 | Intel Corporation | Method of forming a substrate core with embedded capacitor and structures formed thereby |
| US7894965B2 (en) * | 2006-11-29 | 2011-02-22 | Chrysler Group Llc | Swap shift control scheme for an automatic transmission |
| TW200838379A (en) * | 2007-03-02 | 2008-09-16 | Delta Electronics Inc | Method of manufacturing stacked electronic device |
| JP5099433B2 (ja) * | 2008-02-21 | 2012-12-19 | アイシン・エィ・ダブリュ株式会社 | 駆動装置制御ユニット |
| JP5133813B2 (ja) * | 2008-08-11 | 2013-01-30 | レノボ・シンガポール・プライベート・リミテッド | 積層セラミック・コンデンサの単位配置構造、全体配置構造およびプリント配線基板 |
| TWI520165B (zh) * | 2009-05-19 | 2016-02-01 | Rubycon Corp | Surface mount components, printed wiring board and electronic equipment |
| US8483919B2 (en) * | 2010-11-12 | 2013-07-09 | Allison Transmission, Inc. | Double transition shift control in an automatic powershifting transmission |
| TW201347051A (zh) * | 2012-01-27 | 2013-11-16 | 摩賽德科技股份有限公司 | 連接記憶體晶粒形成記憶體系統的方法與設備 |
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| JP5893484B2 (ja) * | 2012-04-09 | 2016-03-23 | キヤノン株式会社 | プリント回路板及びプリント配線板 |
| IN2015DN00730A (https=) | 2012-08-30 | 2015-07-10 | Allison Transm Inc | |
| JP2014239207A (ja) * | 2013-05-10 | 2014-12-18 | 株式会社村田製作所 | コンデンサ素子の実装構造体およびコンデンサ素子の実装方法 |
-
2013
- 2013-08-27 IN IN730DEN2015 patent/IN2015DN00730A/en unknown
- 2013-08-27 AU AU2013309044A patent/AU2013309044A1/en not_active Abandoned
- 2013-08-27 WO PCT/US2013/056737 patent/WO2014035929A1/en not_active Ceased
- 2013-08-27 KR KR1020157008027A patent/KR20150048234A/ko not_active Ceased
- 2013-08-27 CA CA2879721A patent/CA2879721C/en active Active
- 2013-08-27 EP EP13834095.5A patent/EP2891164A4/en not_active Withdrawn
- 2013-08-27 KR KR1020207004141A patent/KR102215960B1/ko active Active
- 2013-08-27 CN CN201910264427.5A patent/CN110085425A/zh active Pending
- 2013-08-27 CN CN201380044536.7A patent/CN104584158A/zh active Pending
- 2013-08-27 US US14/010,772 patent/US20140060911A1/en not_active Abandoned
- 2013-08-27 EP EP19163294.2A patent/EP3528268A1/en not_active Withdrawn
-
2015
- 2015-04-23 US US14/694,437 patent/US20150228410A1/en not_active Abandoned
-
2017
- 2017-11-13 US US15/810,782 patent/US10832870B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1256502A (zh) * | 1998-12-09 | 2000-06-14 | 太阳诱电株式会社 | 叠层陶瓷电容的电路基板安装方法及电路基板 |
| CN1768212A (zh) * | 2003-03-29 | 2006-05-03 | 动力技术(英国)有限公司 | 四支路差速传动系统 |
| CN101241800A (zh) * | 2007-02-05 | 2008-08-13 | 三星电机株式会社 | 多层片式电容器 |
Non-Patent Citations (1)
| Title |
|---|
| 中国汽车工程学会组编: "《世界汽车技术发展跟踪研究》", 30 November 2006 * |
Also Published As
| Publication number | Publication date |
|---|---|
| IN2015DN00730A (https=) | 2015-07-10 |
| EP3528268A1 (en) | 2019-08-21 |
| KR20200018734A (ko) | 2020-02-19 |
| US20140060911A1 (en) | 2014-03-06 |
| AU2013309044A1 (en) | 2015-02-05 |
| US20150228410A1 (en) | 2015-08-13 |
| EP2891164A1 (en) | 2015-07-08 |
| US20180068799A1 (en) | 2018-03-08 |
| EP2891164A4 (en) | 2016-07-20 |
| KR102215960B1 (ko) | 2021-02-15 |
| CN104584158A (zh) | 2015-04-29 |
| CA2879721A1 (en) | 2014-03-06 |
| US10832870B2 (en) | 2020-11-10 |
| WO2014035929A1 (en) | 2014-03-06 |
| CA2879721C (en) | 2021-06-22 |
| KR20150048234A (ko) | 2015-05-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190802 |
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| RJ01 | Rejection of invention patent application after publication |