IN2015DN00730A - - Google Patents

Info

Publication number
IN2015DN00730A
IN2015DN00730A IN730DEN2015A IN2015DN00730A IN 2015DN00730 A IN2015DN00730 A IN 2015DN00730A IN 730DEN2015 A IN730DEN2015 A IN 730DEN2015A IN 2015DN00730 A IN2015DN00730 A IN 2015DN00730A
Authority
IN
India
Application number
Inventor
Steve D Slagle
James D Shaw
George C Mimms
Kyle E Erickson
Original Assignee
Allison Transm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201261694827P priority Critical
Priority to PCT/US2013/056737 priority patent/WO2014035929A1/en
Application filed by Allison Transm Inc filed Critical Allison Transm Inc
Publication of IN2015DN00730A publication Critical patent/IN2015DN00730A/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/35Feed-through capacitors or anti-noise capacitors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H57/00General details of gearing
    • F16H57/0006Vibration-damping or noise reducing means specially adapted for gearings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10545Related components mounted on both sides of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045Protection against vibrations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/611Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control the product being a printed circuit board [PCB]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
IN730DEN2015 2012-08-30 2015-01-29 IN2015DN00730A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US201261694827P true 2012-08-30 2012-08-30
PCT/US2013/056737 WO2014035929A1 (en) 2012-08-30 2013-08-27 Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors

Publications (1)

Publication Number Publication Date
IN2015DN00730A true IN2015DN00730A (en) 2015-07-10

Family

ID=50184217

Family Applications (1)

Application Number Title Priority Date Filing Date
IN730DEN2015 IN2015DN00730A (en) 2012-08-30 2015-01-29

Country Status (8)

Country Link
US (3) US20140060911A1 (en)
EP (2) EP2891164A4 (en)
KR (1) KR20150048234A (en)
CN (2) CN104584158A (en)
AU (1) AU2013309044A1 (en)
CA (1) CA2879721A1 (en)
IN (1) IN2015DN00730A (en)
WO (1) WO2014035929A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017089119A1 (en) * 2015-11-23 2017-06-01 Behr-Hella Thermocontrol Gmbh Apparatus for filtering the supply voltage for an electrical assembly, particularly in a vehicle component

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US4959786A (en) * 1988-04-29 1990-09-25 Chrysler Corporation Dual regulator for reducing system current during at least one mode of operation
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5261153A (en) * 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
EP0614087B1 (en) * 1993-03-01 2000-03-29 Murata Manufacturing Co., Ltd. Piezoelectric vibrator and acceleration sensor using the same
US5838216A (en) * 1996-09-06 1998-11-17 Sunstrand Corporation Common-mode EMI filter
US5909350A (en) * 1997-04-08 1999-06-01 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
JP3805146B2 (en) * 1998-12-09 2006-08-02 太陽誘電株式会社 Circuit board mounting method and circuit board for multilayer ceramic capacitor
US6336365B1 (en) * 1999-08-24 2002-01-08 Personal Electronic Devices, Inc. Low-cost accelerometer
JP2002217667A (en) * 2001-01-22 2002-08-02 Sumitomo Metal Electronics Devices Inc Laminated lc filter
US6618266B2 (en) * 2001-03-06 2003-09-09 Hewlett-Packard Development Company, L.P. Method for high-density, low-via-count, decoupling capacitor placement
US6661638B2 (en) * 2001-12-07 2003-12-09 Avaya Technology Corp. Capacitor employing both fringe and plate capacitance and method of manufacture thereof
US20030224546A1 (en) * 2002-05-30 2003-12-04 Chen Wenjun W. Method and apparatus for reducing noise in electrical power supplied to a semiconductor
US6822845B2 (en) * 2002-10-23 2004-11-23 Spectrum Control, Inc. Low profile filter
WO2005015719A2 (en) * 2003-07-21 2005-02-17 X2Y Attenuators, Llc Filter assembly
US7443025B2 (en) * 2004-06-07 2008-10-28 Broadcom Corporation Thermally improved placement of power-dissipating components onto a circuit board
KR100674830B1 (en) * 2004-11-04 2007-01-25 삼성전기주식회사 Multilayered chip capacitor array
US7149072B2 (en) * 2004-11-04 2006-12-12 Samsung Electro-Mechanics Co., Ltd. Multilayered chip capacitor array
US9572258B2 (en) * 2004-12-30 2017-02-14 Intel Corporation Method of forming a substrate core with embedded capacitor and structures formed thereby
US7894965B2 (en) * 2006-11-29 2011-02-22 Chrysler Group Llc Swap shift control scheme for an automatic transmission
JP5133813B2 (en) * 2008-08-11 2013-01-30 レノボ・シンガポール・プライベート・リミテッド Multilayer ceramic capacitor unit layout structure, overall layout structure and printed wiring board
SG10201402429XA (en) * 2009-05-19 2014-07-30 Rubycon Corp Surface mounting device and capacitor element
EP3444506A1 (en) * 2010-11-12 2019-02-20 Allison Transmission, Inc. Double transition shift control in an automatic powershifting transmission
US9159647B2 (en) * 2012-01-27 2015-10-13 Novachips Canada Inc. Method and apparatus for connecting memory dies to form a memory system
US8648643B2 (en) * 2012-02-24 2014-02-11 Transphorm Inc. Semiconductor power modules and devices
JP5893484B2 (en) * 2012-04-09 2016-03-23 キヤノン株式会社 Printed circuit board and printed wiring board
JP2014239207A (en) * 2013-05-10 2014-12-18 株式会社村田製作所 Mounting structure of capacitor element and mounting method of capacitor element

Also Published As

Publication number Publication date
CN104584158A (en) 2015-04-29
CA2879721A1 (en) 2014-03-06
WO2014035929A1 (en) 2014-03-06
US20150228410A1 (en) 2015-08-13
EP2891164A4 (en) 2016-07-20
KR20150048234A (en) 2015-05-06
EP3528268A1 (en) 2019-08-21
AU2013309044A1 (en) 2015-02-05
EP2891164A1 (en) 2015-07-08
US20180068799A1 (en) 2018-03-08
CN110085425A (en) 2019-08-02
US20140060911A1 (en) 2014-03-06

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