KR20140083846A - 반도체발광소자용홀더, 반도체발광소자용모듈, 조명기구 및 반도체발광소자용홀더의 제조방법 - Google Patents

반도체발광소자용홀더, 반도체발광소자용모듈, 조명기구 및 반도체발광소자용홀더의 제조방법

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Publication number
KR20140083846A
KR20140083846A KR1020130028725A KR20130028725A KR20140083846A KR 20140083846 A KR20140083846 A KR 20140083846A KR 1020130028725 A KR1020130028725 A KR 1020130028725A KR 20130028725 A KR20130028725 A KR 20130028725A KR 20140083846 A KR20140083846 A KR 20140083846A
Authority
KR
South Korea
Prior art keywords
semiconductor light
conductive member
light emitting
led
conductive
Prior art date
Application number
KR1020130028725A
Other languages
English (en)
Korean (ko)
Inventor
케이코 쿠리모토
토오루 와가츠마
테츠야 하타
Original Assignee
교우세라 커넥터 프로덕츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교우세라 커넥터 프로덕츠 가부시키가이샤 filed Critical 교우세라 커넥터 프로덕츠 가부시키가이샤
Publication of KR20140083846A publication Critical patent/KR20140083846A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H01R13/05—Resilient pins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/05—Two-pole devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020130028725A 2012-12-26 2013-03-18 반도체발광소자용홀더, 반도체발광소자용모듈, 조명기구 및 반도체발광소자용홀더의 제조방법 KR20140083846A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012282392A JP2014127560A (ja) 2012-12-26 2012-12-26 半導体発光素子用ホルダ、半導体発光素子モジュール、照明器具、及び半導体発光素子用ホルダの製造方法
JPJP-P-2012-282392 2012-12-26

Publications (1)

Publication Number Publication Date
KR20140083846A true KR20140083846A (ko) 2014-07-04

Family

ID=50991542

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130028725A KR20140083846A (ko) 2012-12-26 2013-03-18 반도체발광소자용홀더, 반도체발광소자용모듈, 조명기구 및 반도체발광소자용홀더의 제조방법

Country Status (4)

Country Link
JP (1) JP2014127560A (zh)
KR (1) KR20140083846A (zh)
CN (1) CN103900052B (zh)
TW (1) TWI580888B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105264283B (zh) 2013-01-10 2018-06-12 莫列斯公司 Led组件
WO2016121197A1 (ja) * 2015-01-28 2016-08-04 京セラコネクタプロダクツ株式会社 配光板及び照明器具

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3964590B2 (ja) * 1999-12-27 2007-08-22 東芝電子エンジニアリング株式会社 光半導体パッケージ
JP3956965B2 (ja) * 2004-09-07 2007-08-08 日立エーアイシー株式会社 チップ部品型発光装置及びそのための配線基板
EP1825524A4 (en) * 2004-12-16 2010-06-16 Seoul Semiconductor Co Ltd CONNECTION GRID COMPRISING A THERMAL DISSIPATOR SUPPORT RING, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE HOUSING USING THE SAME, AND LIGHT-EMITTING DIODE HOUSING MADE THEREBY
KR100665117B1 (ko) * 2005-02-17 2007-01-09 삼성전기주식회사 Ｌｅｄ 하우징 및 그 제조 방법
KR100631903B1 (ko) * 2005-02-17 2006-10-11 삼성전기주식회사 고출력 ｌｅｄ 하우징 및 그 제조 방법
JP2006324438A (ja) * 2005-05-18 2006-11-30 Hitachi Cable Precision Co Ltd ヒートシンク付表面実装型ｌｅｄパッケージの製造方法
US7910946B2 (en) * 2005-12-12 2011-03-22 Nichia Corporation Light emitting apparatus and semiconductor apparatus, and method for manufacturing the same
WO2008038924A1 (en) * 2006-09-28 2008-04-03 Seoul Opto Device Co., Ltd. Ultraviolet light emitting diode package
JP4600455B2 (ja) * 2006-11-30 2010-12-15 東芝ライテック株式会社 照明装置
KR100947454B1 (ko) * 2006-12-19 2010-03-11 서울반도체 주식회사 다단 구조의 열전달 슬러그 및 이를 채용한 발광 다이오드패키지
JP4976167B2 (ja) * 2007-03-06 2012-07-18 豊田合成株式会社 発光装置
TWI397193B (zh) * 2007-11-05 2013-05-21 Univ Nat Chunghsing Light emitting diode chip element with heat dissipation substrate and method for making the same
JP2009200106A (ja) * 2008-02-19 2009-09-03 Sdi Corp 放熱部材を有するリードフレーム及びリードフレームに放熱部材を固定する方法
JP5196551B2 (ja) * 2008-06-09 2013-05-15 Ｎｅｃライティング株式会社 発光装置
JP5347515B2 (ja) * 2009-01-09 2013-11-20 東芝ライテック株式会社 照明装置
US7923739B2 (en) * 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8382337B2 (en) * 2009-09-18 2013-02-26 Luxingtek, Ltd. Lighting device, light spreading plate and method for manufacturing the same
JP2011253969A (ja) * 2010-06-03 2011-12-15 Panasonic Corp 光半導体装置およびその製造方法
KR20110136676A (ko) * 2010-06-14 2011-12-21 삼성엘이디 주식회사 양자점을 이용한 발광소자 패키지, 조광 장치 및 디스플레이 장치
JP2012089357A (ja) * 2010-10-20 2012-05-10 Sumitomo Light Metal Ind Ltd Ｌｅｄ照明基板用積層体及びそれを用いたｌｅｄ照明
JP2012195361A (ja) * 2011-03-15 2012-10-11 Sanken Electric Co Ltd 発光ダイオード及びその製造方法
JP5760655B2 (ja) * 2011-04-28 2015-08-12 三菱化学株式会社 半導体発光装置用樹脂パッケージ及び該樹脂パッケージを有してなる半導体発光装置並びにそれらの製造方法
US8690389B2 (en) * 2011-05-16 2014-04-08 Molex Incorporated Illumination module
CN102829360A (zh) * 2012-09-15 2012-12-19 安徽朝日照明有限公司 灯珠式大功率led光源

Also Published As

Publication number Publication date
JP2014127560A (ja) 2014-07-07
TW201425797A (zh) 2014-07-01
CN103900052B (zh) 2016-09-28
TWI580888B (zh) 2017-05-01
CN103900052A (zh) 2014-07-02

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