JP2015164209A5 - - Google Patents
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- Publication number
- JP2015164209A5 JP2015164209A5 JP2015083904A JP2015083904A JP2015164209A5 JP 2015164209 A5 JP2015164209 A5 JP 2015164209A5 JP 2015083904 A JP2015083904 A JP 2015083904A JP 2015083904 A JP2015083904 A JP 2015083904A JP 2015164209 A5 JP2015164209 A5 JP 2015164209A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- holder
- light emitting
- manufacturing
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 112
- 239000011347 resin Substances 0.000 claims description 112
- 238000000465 moulding Methods 0.000 claims description 109
- 239000004065 semiconductor Substances 0.000 claims description 55
- 238000004519 manufacturing process Methods 0.000 claims description 39
- 239000000969 carrier Substances 0.000 claims description 31
- 230000002093 peripheral Effects 0.000 claims description 19
- 239000007769 metal material Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 30
- 230000000875 corresponding Effects 0.000 description 11
- 239000012212 insulator Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005286 illumination Methods 0.000 description 5
- 210000000078 Claw Anatomy 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000001808 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007649 pad printing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 230000037250 Clearance Effects 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N Dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 210000000282 Nails Anatomy 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium(0) Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000035512 clearance Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000001131 transforming Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015083904A JP5894310B2 (ja) | 2015-04-16 | 2015-04-16 | 半導体発光素子用ホルダの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015083904A JP5894310B2 (ja) | 2015-04-16 | 2015-04-16 | 半導体発光素子用ホルダの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012282392A Division JP2014127560A (ja) | 2012-12-26 | 2012-12-26 | 半導体発光素子用ホルダ、半導体発光素子モジュール、照明器具、及び半導体発光素子用ホルダの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015164209A JP2015164209A (ja) | 2015-09-10 |
| JP2015164209A5 true JP2015164209A5 (zh) | 2015-10-29 |
| JP5894310B2 JP5894310B2 (ja) | 2016-03-23 |
Family
ID=54187006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015083904A Expired - Fee Related JP5894310B2 (ja) | 2015-04-16 | 2015-04-16 | 半導体発光素子用ホルダの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5894310B2 (zh) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100616684B1 (ko) * | 2005-06-03 | 2006-08-28 | 삼성전기주식회사 | 고출력 ｌｅｄ 패키지 및 그 제조방법 |
| JP2011146187A (ja) * | 2010-01-13 | 2011-07-28 | Tsutomu Seisakusho:Kk | 発光ダイオード蛍光灯用連続基板の製造方法 |
| JP2012049367A (ja) * | 2010-08-27 | 2012-03-08 | Kyocera Elco Corp | 半導体発光素子取付用モジュール、半導体発光素子モジュール、半導体発光素子照明器具、及び、半導体発光素子取付用モジュールの製造方法 |
| JP2013093418A (ja) * | 2011-10-25 | 2013-05-16 | Japan Aviation Electronics Industry Ltd | 半導体装置用パッケージの集合体、半導体装置の集合体、半導体装置の製造方法 |
-
2015
- 2015-04-16 JP JP2015083904A patent/JP5894310B2/ja not_active Expired - Fee Related
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