JP2015164209A5 - - Google Patents

Description

Manufacturing method of holder for semiconductor light emitting device

  The present invention relates to a method for manufacturing a holder for a semiconductor light emitting element to which a semiconductor light emitting element (LED) can be attached.

As a conventional example of a lighting fixture using a semiconductor light emitting element (LED), there is one disclosed in Patent Document 1, for example.
This luminaire includes a heat sink made of metal or ceramic material, an LED unit mounted on one surface of the heat sink, and a housing made of an insulating material sandwiched between the LED unit and screwed to the heat sink. And a contact fixed to the housing. The LED unit is integrally provided with a substrate in contact with the heat sink and an LED (semiconductor light emitting element) mounted on the substrate, and the LED is exposed to the outside through an exposure window formed in the housing. The contact fixed to the housing is connected to a power source via a cable and is electrically connected to the LED.
Accordingly, when the power generated by the power source is supplied to the LED through the cable and the contact, the LED emits light.

JP 2012-164613 A

Part of the light generated by the LED diffuses to the surroundings while being reflected by the surface of the housing (the part located on the outer peripheral side of the LED).
However, since the visible light reflectance of the housing is generally low, the luminaire diffuses light to the surroundings while greatly reducing the light intensity (brightness) of the LED.
In addition, in order to manufacture a semiconductor light emitting element module and a lighting fixture equipped with the module, it is required to obtain a suitable method for manufacturing a holder for a semiconductor light emitting element.

  The objective of this invention is providing the manufacturing method of the suitable holder for semiconductor light-emitting devices.

  The method for manufacturing a holder for a semiconductor light emitting device according to the present invention includes a carrier, a wire connecting portion supported by the carrier via a cutting bridge and capable of connecting the semiconductor light emitting device, and a cable connecting portion for external connection. A step of preparing a conductive plate made of a metal material having a partial region of the conductive plate, a connection arm disposed so as to straddle the carrier and the partial region of the conductive plate, and the wire connection portion and the cable connection Forming a primary resin molding part having a recess capable of accommodating the semiconductor light emitting element, and cutting the cutting bridge in a state where the connection arm supports the carrier and the conductive plate partial region. Separating the carrier by cutting a connecting arm, a step of forming a secondary resin molded portion covering a part of the primary resin molded portion, and a step of cutting the connecting arm. It is characterized by comprising the steps of, a.

  The step of preparing the conductive plate may include a step of preparing a conductive plate in which the first conductive portion and the second conductive portion are integrally formed via the second cutting bridge.

  In the step of molding the primary resin molding portion, the primary resin molding portion is arranged between the end portion of the first conductive portion and the end portion of the second conductive portion facing the end portion of the first conductive portion. Can be shaped to fill.

  In the step of molding the primary resin molding part, the primary resin molding part can be molded so as to have a bridge exposing hole through which the second cutting bridge is exposed.

  After the step of forming the primary resin molding portion, the method may further include a step of cutting the second cutting bridge from the bridge exposing hole.

  In the step of forming the secondary resin molding portion after the step of cutting the second cutting bridge, the secondary resin molding portion is filled with the cut second cutting bridge and the bridge exposing hole. Can be molded as follows.

  In the step of preparing the conductive plate, the conductive plate is prepared so as to have a planned opening for receiving a base member, and in the step of molding the primary resin molded portion, the primary resin molded portion is formed by the planned receiving opening. After the step of molding so as to be exposed and molding the primary resin molding portion, the method may further include a step of arranging a part of the base member in the scheduled opening.

  In the step of molding the secondary resin molded part, the secondary resin molded part can be molded from the primary resin molded part to the base member.

  In the step of cutting the cutting bridge, the cutting bridge can be cut inside the outer periphery of the primary resin molded portion.

  In the step of molding the secondary resin molded portion, the secondary resin molded portion can be molded so as to cover the cut end surface on the conductive plate partial region side in the cut cutting bridge.

  In the step of molding the secondary resin molding portion, the secondary resin molding portion is a covering projection that projects a cut end surface on the conductive plate partial region side of the cut cutting bridge from an outer peripheral surface. It can be shaped to cover.

  In the step of separating the carrier, the connection arm can be cut along the end surface of the covering projection.

  In the step of preparing the conducting plate, the conducting plate is prepared to have an engaging hole for a translucent member that transmits light output from the semiconductor light emitting element, and molds the primary resin molding portion. In the step of performing, the primary resin molding portion can be molded so as to have an engagement hole exposing hole through which the engagement hole is exposed.

  In the step of molding the secondary resin molded portion, the secondary resin molded portion can be molded so as to avoid the engagement hole exposing hole.

  The holder for a semiconductor light emitting element has a housing portion, and in the step of molding the primary resin molding portion, the housing portion for housing the connector that can connect the primary resin molding portion from the outside serves as the cable connection portion. It can be shaped to be exposed.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the suitable holder for semiconductor light emitting elements is obtained.

It is the perspective view seen from the upper part of a part of conduction board of one embodiment of the present invention. It is the perspective view seen from the upper direction of the primary integrated object which formed the primary resin molding part integrally in the conduction | electrical_connection board. It is the perspective view seen from the downward direction of a primary integrated object. It is a top view of a primary integrated object. It is a top view of the primary integrated object which performed the primary cut. It is a perspective view of the separation state seen from the upper part of a primary integrated object and a heat sink. It is a perspective view of the separation state seen from the lower part of a primary integrated object and a heat sink. It is the perspective view seen from the upper part of the combined body of a primary integrated object and a heat sink. It is the perspective view seen from the lower part of the coupling body of a primary integrated object and a heat sink. It is the perspective view seen from the upper side of the secondary integrated object which formed the secondary resin molding part integrally in the combined body of a primary integrated object and a heat sink. It is the perspective view seen from the downward direction of a secondary integrated object. It is a top view of the secondary integrated object which formed the reflecting film with respect to the attachment surface. It is the perspective view seen from the holder for LED completed by performing a secondary cut, and LED. It is sectional drawing which follows the XIV-XIV arrow line of FIG. It is a top view of a LED module. It is the perspective view seen from the upper part of the coupling body of a LED module, a translucent cover member, and a chassis. It is the perspective view seen from the upper part of one edge part of the cable with a connector, and its vicinity part. It is the perspective view seen from the one end part of the cable with a connector, and its vicinity part from the downward direction. It is a top view of the lighting fixture which fixed the lower surface of the heat sink of one LED module with respect to the upper surface of a thermal radiation member, and connected the connector of the cable with a connector. It is a typical top view of the lighting fixture of FIG. 19 which abbreviate | omitted illustration of a translucent cover and a chassis. It is a top view similar to FIG. 20 of the lighting fixture of another aspect different from FIG.19 and FIG.20 comprised using one LED module. It is a top view similar to FIG. 20 of the lighting fixture of another aspect different from FIGS. 19-21 comprised using one LED module. It is a top view similar to FIG. 20 of the lighting fixture of another aspect different from FIGS. 19-22 comprised using one LED module. It is a top view similar to FIG. 20 of the lighting fixture comprised by connecting a some LED module in chain. It is a top view similar to FIG. 20 of the lighting fixture of another aspect different from FIG. 24 comprised by connecting the some LED module in chain. It is an expansion perspective view of the attachment surface, reflective film, and LED of a modification.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, front and rear, left and right, and up and down directions are based on the directions of arrows in the figure.
In this embodiment, the LED module 10 of the present invention is used as a light source of a lighting fixture 66 (see FIGS. 19 to 25).
The LED module 10 (semiconductor light-emitting element module) is integrated by attaching an LED 62, a wire bonding 64, and a sealant (and possibly a wire bonding 90 described later) to the LED holder 15 (semiconductor light-emitting element holder). Is. First, the detailed structure and manufacturing procedure of the LED holder 15 will be described.

  FIG. 1 shows a conductive plate 17 which is a base material of the LED holder 15. The conductive plate 17 is formed by stamping a metal flat plate having excellent conductivity, thermal conductivity, and rigidity, such as brass, beryllium copper, and Corson copper alloy. The entire shape of the conductive plate 17 is a long plate shape extending in the front-rear direction (FIG. 1 shows only a part of the conductive plate 17). The left and right side portions of the conductive plate 17 are constituted by carrier portions 18A and 18B extending in the front-rear direction, and a carrier connecting portion 19 provided with a plurality of portions of the carrier portion 18A and the carrier portion 18B at equal intervals in the front-rear direction is connected. ing. The carrier part 18A and the carrier part 18B are provided with conveying holes 18C at equal intervals. Two first conductive members 20 and two second conductive members 21 are formed in each of the portions surrounded by the carrier portions 18A and 18B and the two adjacent carrier connection portions 19. Further, the two first conductive members 20 are integrated with the carrier portions 18A and 18B and the carrier connecting portion 19 by two first cutting bridges 22, respectively, and the two second conductive members 21 are both one second. The carrier bridge 19 is integrated with the cutting bridge 23. Further, the adjacent first conductive member 20 and second conductive member 21 are connected to each other by one third cutting bridge 24. An arc-shaped wire connecting portion 20 </ b> A is formed on the inner peripheral edge of the first conductive member 20. A cable connection portion 20B linearly extending in a direction parallel to the carrier portions 18A and 18B is projected from a portion different from the wire connection portion 20A of the first conductive member 20, and a non-circular shape is provided at another portion. An engaging hole 20C having a shape is formed. On the other hand, an arc-like (the same shape as the wire connecting portion 20A) wire connecting portion 21A is formed on the inner peripheral edge of the second conductive member 21. Furthermore, a cable connection portion 21B extending linearly in a direction parallel to the cable connection portion 20B is projected from a portion different from the wire connection portion 21A of the second conductive member 21, and a non-circular shape is provided at another portion. An engaging hole 21C having a shape is formed.

The conduction plate 17 having such a structure is conveyed forward by engaging a sprocket of a conveyance device (not shown) with each conveyance hole 18C of the conduction plate 17 and rotating each sprocket. When the sheet is conveyed to a predetermined position, a primary mold (not shown) composed of a pair of molds positioned above and below the conductive plate 17 is closed, and the conductive plate 17 is accommodated in the primary mold. A large number of support pins (not shown) provided in the primary mold are fitted into positioning holes (not shown) formed in the conduction plate 17 when the conductive plate 17 is conveyed to the predetermined position, whereby the conduction plate 17 is primary. Fixed in the mold. Then, injection molding (primary molding or insert molding) using a resin material (for example, a liquid crystal polymer or the like) having high insulation and heat resistance is performed in the primary mold. Then, when the molds of the primary molding die are separated from the conductive plate 17 up and down after the resin material is cured, a plurality of integrated objects (hereinafter referred to as a plurality of primary resin molded portions 30 integrally formed on the surface of the conductive plate 17). , Referred to as a primary integrated object) appears (only one is shown in FIGS. 2 to 4).
As shown in the drawing, the primary resin molding portion 30 (base member) is integrated with the first conductive member 20, the second conductive member 21, the first cutting bridge 22, the second cutting bridge 23, and the third cutting bridge 24, and at the center. A main body portion 31 having a substantially rectangular shape in a plan view, and two connection arms 43 extending from two portions of the main body portion 31 and integrated with the front and rear carrier connection portions 19. Yes. The main body 31 includes a planar circular (tapered) annular inner wall 32 that forms the outer shape of the through hole, and the first conductive member 20 and the second adjacent to and adjacent to four locations of the inner peripheral edge of the annular inner wall 32. And four inner protrusions 33 filling the space between the ends of the conductive member 21. Further, two bridge exposure holes 35 for exposing the third cutting bridges 24 are formed on the upper surface of the main body 31. The engagement holes 20C and the engagement holes 21C are formed at four positions on the upper and lower surfaces of the main body 31. An engaging hole exposing hole 36 for exposing the hole is formed. Further, at two locations of the main body 31, the connector connecting protrusions 37 integrated with the cable connecting portion 20B and the cable connecting portion 21B while exposing the upper surfaces of the tip ends of the cable connecting portion 20B and the cable connecting portion 21B, and A connector connection groove 38 formed around the connector connection protrusion 37 and two engagement recesses 39 respectively formed on both side surfaces (right side surface and left side surface) of each connector connection groove 38 are formed. . Further, eight lower surface side protrusions 40A, 40B, 40C, and 40D projecting downward from the conductive plate 17 are provided on the lower surface of the primary resin molding portion 30. Further, the primary resin molding portion 30 includes two outer peripheral walls 41 having a substantially L-shaped cross section that protrude to a position below the lower surface side protrusions 40A, 40B, 40C, and 40D. One nail 42 is formed one by one (only one is shown in FIGS. 3 and 7).

  Next, each primary integrated body (conduction plate 17 and primary resin molding portion 30) is transported to a predetermined position in front using the transport device, and is conducted by a primary cutting device (not shown) disposed at the predetermined position. The first cutting bridge 22, the second cutting bridge 23, and the third cutting bridge 24 of the plate 17 are cut (primary cut is performed). Specifically, the first cutting bridge 22 and the second cutting bridge 23 are cut in a direction parallel to the outer peripheral surface of the main body portion 31 of each primary resin molding portion 30, and each of the primary resin molding portions 30 is utilized using the bridge exposure holes 35. A central portion of the third cutting bridge 24 is cut (see FIG. 5).

Next, the primary integrated object is transferred to a predetermined position in front by the conveying device.
A plurality of heat sinks 45 (base members) (heat transfer members) (the same number as the primary integrated objects) are arranged at the predetermined position, and when the primary integrated objects are conveyed to the predetermined position, they are directly below each primary integrated object. The heat sinks 45 are respectively located in (FIGS. 6 and 7).
The heat sink 45 is an integrally molded product made of a metal such as aluminum, and its thermal conductivity is higher than that of the primary resin molded portion 30 (and a secondary resin molded portion 54 described later). The outer shape of the heat sink 45 is substantially the same as that of the main body 31. The upper half portion of the heat sink 45 is configured by a receiving portion 46 having a slightly larger planar shape than the lower half portion, and locking recesses 47 are formed at two positions on the lower surface of the outer peripheral edge portion of the receiving portion 46. (Only one is shown in FIGS. 7 and 9). The lower surface of the heat sink 45 is constituted by a flat contact surface 48. At the center of the upper surface of the heat sink 45, a low-dimensional cylindrical LED support portion 49 protrudes. The upper surface of the LED support part 49 is comprised by the attachment surface 49a which consists of a horizontal plane. Further, two circular recesses 50 and two non-circular recesses 51 are provided on the upper surface of the heat sink 45.
When each primary integrated body (the conductive plate 17 and the primary resin molding portion 30) is positioned immediately above each heat sink 45, the above-mentioned transport device raises each heat sink 45 toward each primary integrated body (see FIGS. 8 and 9). . As a result, the accommodation portions 46 of the respective heat sinks 45 are accommodated in a space surrounded by the corresponding two outer peripheral walls 41 of the primary integrated body, and a part (two places) of the outer circumferential surface of the accommodation portion 46 has two outer circumferences. It faces the inner peripheral surface of the wall 41 while forming a minute clearance, and the upper surface of the accommodated portion 46 is in surface contact with the lower surfaces of the lower surface side projections 40A, 40B, 40C, and 40D. At this time, four protrusions (downward protrusions positioned around the four engagement hole exposing holes 36) formed on the lower surface of the primary integrated body (main body portion 31) are formed into two circular recesses 50 and two non-recesses. Each is fitted to the circular recess 51. Further, since the two engaging claws 42 engage with the two locking recesses 47 from below, the heat sink 45 is temporarily fixed to the main body 31 (the main body 31 and the heat sink 45 are integrated). Further, the LED support portion 49 is loosely fitted into the central circular hole of the main body portion 31. The outer peripheral surface of the LED support portion 49 is separated from the inner peripheral surface of the wire connecting portion 20A and the wire connecting portion 21A and the inner protrusions 33 toward the inner peripheral side, and an annular space S is formed between them. (See FIG. 8).

The integrated body of the primary integrated body (the conductive plate 17 and the primary resin molding portion 30) and the heat sink 45 is transported to a predetermined position further forward by the transport device.
Then, a secondary molding die (not shown) made up of a pair of molds located above and below the integrated object is closed, and the integrated object is stored in the secondary forming mold. At this time, a large number of supporting pins (not shown) provided in the secondary mold are fitted into the positioning holes, whereby the integrated object is fixed in the secondary mold. Then, a resin material (for example, a liquid crystal polymer) having high insulation and heat resistance is injection-molded (insert molding, secondary molding) in the secondary mold. Then, when the secondary molding die is separated up and down after the resin material is cured, the secondary resin molding portion 54 (base member) is formed on the surface of the integral body of the primary integrated body (the conductive plate 17 and the primary resin molding portion 30) and the heat sink 45. Appears as an integrated body (secondary integrated body) (see FIGS. 10 and 11). As shown in the figure, since the secondary resin molding portion 54 is molded across the primary resin molding portion 30 and the heat sink 45 (covering the engaging claw 42 and the locking recess 47), the secondary resin molding portion 54 is formed. The primary resin molding portion 30 and the heat sink 45 are completely fixed by curing. The secondary resin molding portion 54 has an annular wall 55 that is formed of a circular tapered surface covering the surface of the annular inner wall portion 32 and is continuous with the upper surface of each inner protrusion 33. An annular portion 56 constituting a part of the secondary resin molding portion 54 is formed between the inner peripheral surfaces of the wire connecting portion 20 </ b> A and the wire connecting portion 21 </ b> A and between the inner protrusions 33 and the outer peripheral surface of the LED support portion 49. The annular space S is filled (see FIG. 10), and the upper surface of the annular portion 56 is located on the same plane as the mounting surface 49a of the LED support portion 49 and the upper surfaces of the inner protrusions 33 (LED support portion). 49 is continuous with the mounting surface 49a and the upper surface of each inner protrusion 33). Further, the secondary resin molded portion 54 is formed by a gap formed between the lower surface of the primary resin molded portion 30 and the upper surface of the accommodated portion 46 (eight lower surface side protrusions 40A, 40B, 40C of the primary resin molded portion 30). The gap formed between 40D is filled. Further, the covering projections 57 formed (projected) at two locations on the outer peripheral surface of the secondary resin molding portion 54 are exposed end portions of the first cutting bridge 22 and the second cutting bridge 23 before the secondary molding. Is covered.

Next, each secondary integrated body (the conductive plate 17, the primary resin molding part 30, the heat sink 45, and the secondary resin molding part 54) is transported to a predetermined position in front using a transport device.
A pad printing machine (not shown) is disposed at the predetermined position. When the secondary integrated object is conveyed to the predetermined position, each secondary integrated object is positioned in the pad printing machine. The reflective film is continuously (integrally) applied to the upper surface of the four inner protrusions 33, the mounting surface 49a of the LED support portion 49, the surface of the annular wall 55, and the upper surface of the annular portion 56 from the pad printer. 58 is printed as a thin film having a thickness of 30 μm (see FIGS. 12 and 13). The reflective film 58 is obtained by mixing titanium oxide (TiO 2) or the like as a main component with a polyurethane resin as a main component, and has insulating properties as a whole. The reflective film 58 is white because it contains a colorant, and has a color (hue) different from that of the heat sink 45 made of aluminum, and the (light) visible light reflectance thereof is the primary resin molding portion 30, the heat sink 45, and It is higher than the secondary resin molded part 54 (specifically, the visible light reflectance is 90% or more, preferably 95% or more is used). Further, the reflective film 58 formed on the LED support portion 49 is formed in such a manner as to avoid a part of the mounting surface 49a. That is, as shown in the drawing, the mounting surface 49a is formed in such a manner as to avoid a large number (36 in total) of rectangular regions in plan view. Each rectangular area in plan view constitutes an LED fixing portion 59 (semiconductor light emitting element fixing portion), and the thickness of the reflecting film 58 is between the upper surface of the reflecting film 58 and the LED fixing portion 59 (mounting surface 49a). There is a difference in level.

  Next, the secondary integrated object is transferred to a predetermined position in front by the transport device, and each connection arm 43 is cut by the secondary cutting device (not shown) disposed at the predetermined position (secondary cut is performed). ). Specifically, each connection arm 43 is linearly cut along the end face of the corresponding covering projection 57, and the secondary integrated object is separated from the carrier connection part 19 (and the carrier parts 18A and 18B) (see FIG. 13). . As a result, a completed product of the plurality of LED holders 15 is obtained in which the connection portions (fracture surfaces; unnecessary metal portions) with the carrier portions 18A and 18B and the carrier connection portion 19 are not exposed.

Next, a procedure for manufacturing the LED module 10 from the LED holder 15 will be described.
A substantially rectangular parallelepiped LED 62 (semiconductor light emitting element) is fixed to each LED support portion 49 of the LED holder 15. As shown in the figure, the planar shape of each LED 62 is substantially the same as the LED fixing portion 59 (slightly smaller than the LED fixing portion 59). When fixing the LED 62 to the LED fixing portion 59, first, an adhesive (not shown) is applied to each LED fixing portion 59 (mounting surface 49 a), and then the LED transport device (not shown) is connected to each LED fixing portion 59. The LED 62 is placed on (see FIG. 15). As described above, a step corresponding to the thickness of the reflective film 58 is formed between the upper surface of the reflective film 58 and the LED fixing portion 59 (the LED fixing portion 59 becomes a recess surrounded by the reflective film 58. Therefore, the LED 62 can be easily and reliably attached (fitted) to each LED fixing portion 59. Further, since a step corresponding to the thickness of the reflective film 58 is formed between the upper surface of the reflective film 58 and the LED fixing portion 59, the adhesive applied to the LED fixing portion 59 (mounting surface 49 a) is applied to the LED fixing portion 59. It can suppress flowing to the circumference (the reflective film 58 side). The LED transport device has a sensor for identifying a hue difference, and the LED transport device recognizes a hue difference (boundary line) between the reflective film 58 and the LED fixing portion 59 (mounting surface 49a). The LED 62 is placed on the fixing portion 59. Therefore, the LED 62 can be reliably placed on the LED fixing portion 59.
Next, as shown in FIG. 15, the terminals formed exposed on the upper surfaces of the adjacent LEDs 62 fixed to each LED fixing portion 59 are connected by wire bonding 64 (thick line shown in FIG. 15), and the wire connecting portion The terminal of LED 62 located at a position facing 20A and the wire connecting portion 20A are connected by wire bonding 64, and the terminal of LED 62 located at a position facing the wire connecting portion 21A and the wire connecting portion 21A are connected by wire bonding 64. (Further, wire bonding 90 described later is applied if necessary).
Finally, the upper surface of the secondary resin molding portion 54 (circular hole formed between the upper edge portions of the annular wall 55) is made of a thermosetting resin material or an ultraviolet curable resin material having translucency and insulation. The LED module 10 is covered by covering the wire connecting part 20A, the wire connecting part 21A, the inner protrusion 33, the reflective film 58, the LED 62, and the wire bonding 64 (90) with a sealing agent (not shown). Is completed.

The LED module 10 having the above-described configuration can be used as a component of the lighting fixture 66 shown in FIGS.
The luminaire 66 includes a chassis 68 (heat radiating member) made of a metal plate. The LED module 10 is fixed to the chassis 68 with the contact surface 48 of the heat sink 45 in contact with the upper surface of the chassis 68.
Further, the lighting fixture 66 includes a translucent cover member 70 that can be attached to and detached from the LED module 10 and a cable 75 with a connector.
The translucent cover member 70 is a hollow member having an open lower surface made of a translucent material. The translucent cover member 70 has a substantially hemispherical diffusing lens 71, four projecting portions 72 projecting laterally from the lower portion of the diffusing lens 71, Four connection protrusions 73 that protrude from the lower surface of the portion 72 are integrally provided. The cross-sectional shape of the connection protrusion 73 is the same shape as the engagement hole 20C and the engagement hole 21C. The translucent cover member 70 is detachably attached to the LED module 10 by fitting the four connection projections 73 into the corresponding engagement holes 20C and 21C.

The cable 75 with a connector is obtained by integrating two cables 77 and a connector 80. The cable 77 having flexibility includes an electric wire 78 in which a large number of metal wires are bundled, and a covering tube 79 made of an insulating material that covers the surface of the electric wire 78. The wire 78 is exposed by removing the covering tube 79. The connector 80 includes an insulator 81 made of an insulating material, a first contact 85 and a second contact 87. Locking ridges 82 extending in the front-rear direction are formed on both sides of the insulator 81, which is a hollow member, and a retaining protrusion 83 is protrudingly provided at the front ends of the left and right locking ridges 82. Further, the lower surface of the tip (second half) of the insulator 81 is formed in a thin shape, and two long grooves 84 communicating with the internal space of the insulator 81 are formed on the lower surface. Both the first contact 85 and the second contact 87 are made of a conductive material (metal or the like), and are inserted into the inner space of the insulator 81 in a fixed state. Electric wires 78 at one end (rear end) of the two cables 77 are respectively crimped (connected) to one end (front end) of the first contact 85 and the second contact 87. The first contact The other end portion (rear end portion) of the second contact 87 and the second contact 87 is constituted by an elastically deformable first contact piece 86 and a second contact piece 88 that project downward from the insulator 81 through a corresponding long groove 84. .
As shown in FIG. 19, the cable 75 with a connector can be attached to and detached from the connector connecting protrusion 37 and the connector connecting groove 38 (the cable connecting portion 20B and the cable connecting portion 21B) of the LED module 10. That is, the connector 80 is inserted into the connector connection groove 38, and the left and right locking ridges 82 are fitted to the left and right sides of the connector connection groove 38. Then, since the left and right removal projections 83 engage with the left and right engagement recesses 39, the connection state between the connector connection projection 37 and the connector connection groove 38 and the connector 80 is maintained unless the connector 80 is intentionally pulled out. When the connector 80 is connected to the connector connecting projection 37 and the connector connecting groove 38, the first contact piece 86 of the first contact 85 and the second contact piece 88 of the second contact 87 are elastically deformed and the cable connecting portion 20B. The cable contacts 21B are in contact with each other.

The lighting fixture 66 (LED module 10) of this embodiment can be implemented in various ways.
19 to 23 show a lighting fixture 66 constituted by one LED module 10.
The front wire connecting portion 20A and the wire connecting portion 21A and the rear wire connecting portion 20A and the wire connecting portion 21A of the LED module 10 (LED holder 15) shown in FIGS. It is. Further, the connector 80 of the cable with connector 75 is connected to one of the connector connecting protrusions 37 and the connector connecting groove 38 of the LED module 10, and the two cables 77 of the cable with connector 75 are connected to the anode of the power source. Each is connected to the cathode.
When the switch (not shown) is switched from OFF to ON, the current generated by the power source is connected in parallel by the wire connection portion 20A, the wire connection portion 21A, the LED 62, the wire bonding 64, and the wire bonding 90 via the cable 77. Since it flows in the circuit, each LED 62 (in FIG. 20, all LEDs located on the left side of the central portion of the LED module 10 are collectively indicated as LED 62A, and all LEDs 62 located on the right side of the central portion are collectively indicated as LED 62B. Flashes). A part of the illumination light emitted from each LED 62 is directed directly toward the diffusion lens 71, and the remaining illumination light is reflected by the reflection film 58 toward the diffusion lens 71. The illumination light directed toward the diffusing lens 71 travels outside the translucent cover member 70 while being diffused by the diffusing lens 71. On the other hand, when the switch is switched from ON to OFF, the supply of current to the LEDs 62 is interrupted, and thus each LED 62 is turned off.

The wire connecting part 20A and the wire connecting part 21A on the right side of the LED module 10 (LED holder 15) constituting the lighting fixture 66 shown in FIG. Further, the connector 80 of the cable with connector 75 is connected to one of the connector connecting projections 37 and the connector connection groove 38 of the LED module 10, and the two cables 77 of the cable with connector 75 are connected to the anode of the power source. Each is connected to the cathode. Furthermore, the connection mode with respect to the wire connection part 20A and the wire connection part 21A via the wire bonding 64 of each LED 62 is changed from the above. That is, all the LEDs 62 positioned in front of the center portion of the LED module 10 (in FIG. 21, these LEDs 62 are collectively indicated as LED 62C) are connected to the front wire connecting portion 20A and the wire connecting portion 21A by wire bonding 64. Connect all the LEDs 62 located behind the center of the LED module 10 (in FIG. 21, these LEDs 62 are collectively indicated as LED 62D) by wire bonding 64 and wire connection to the rear wire connection 20A. It is connected to the part 21A. This luminaire 66 has a series circuit constituted by a wire connecting portion 20A, a wire connecting portion 21A, an LED 62, a wire bonding 64, and a wire bonding 90.
In addition, the lighting fixture 66 shown in FIG. 21 is the other connector connection protrusion instead of connecting between the wire connection part 20A on the right side of the LED module 10 (LED holder 15) and the wire connection part 21A by the wire bonding 90. It can also be configured by connecting a short-circuit connector 92 to the portion 37 and the connector connection groove 38. The short-circuit connector 92 includes an insulator corresponding to the insulator 81, and two contacts corresponding to the first contact 85 and the second contact 87, and the two contacts are short-circuited with each other inside the insulator. Yes.

The lighting fixture 66 shown in FIG. 22 connects the connectors 80 of the two cables 75 with connectors to the two connector connecting protrusions 37 and the connector connecting grooves 38 provided on the LED module 10 (LED holder 15). The end of each cable 75 with connector opposite to the connector 80 is connected to the anode and the cathode of the power supplies which are separate from each other.
The lighting fixture 66 shown in FIG. 23 has the same configuration as FIG. 22 except that the connection mode of the LED 62 to the wire connecting portion 20A and the wire connecting portion 21A via the wire bonding 64 is different from FIG. 22 (same as FIG. 21). It is.

24 and 25, a plurality of the lighting modules 66 (three LED modules 10 are shown in FIGS. 24 and 25, but two or four or more) may be connected in a chain. It is configured.
A lighting fixture 66 shown in FIG. 24 includes a plurality of LED modules 10 having the configuration shown in FIGS. 19 and 20, and the adjacent LED modules 10 are connected to each other with a connector-attached cable 75 ′ having connectors 80 at both ends. Connected by.
In the lighting fixture 66 shown in FIG. 25, one LED module 10 (the LED module 10 located at the rearmost position in FIG. 25) having the configuration shown in FIG. 21 and the wire bonding 90 are deleted from the LED module 10 shown in FIG. A plurality of LED modules 10 having the above-described configuration are provided, and adjacent LED modules 10 are connected to each other by a cable 75 ′ with a connector. When the lighting fixture 66 is configured in the form shown in FIG. 25, the wire bonding 90 between the wire connecting portion 20A on the right side of the LED module 10 (LED holder 15) located at one end and the wire connecting portion 21A is performed. Instead of the connection, the short-circuit connector 92 may be connected to the connector connection protrusion 37 and the connector connection groove 38 of the LED module 10.
When the lighting fixture 66 is configured in the form of FIG. 24 or FIG. 25, the chassis 68 may be fixed to each LED module 10 one by one, or one chassis (heat dissipating member, which is long in the front-rear direction). All LED modules 10 may be fixed with respect to (not shown).

  In the present embodiment described above, the resin portion having a low visible light reflectance in the circular pocket on the upper surface of the LED module 10 (LED holder 15) (the portion located on the inner peripheral side from the upper edge portion of the annular wall 55) ( Primary resin molding portion 30 with respect to the upper surface of the four inner protrusions 33, the surface of the annular wall 55, and the upper surface of the annular portion 56) and the attachment surface 49a (without exposing the resin portion and the attachment surface 49a), A reflective film 58 having a higher visible light reflectance than the LED support portion 49 and the secondary resin molding portion 54 is formed. Therefore, it is possible to reflect the light of the LED 62 attached to each LED fixing portion 59 (attachment surface 49a) without losing its intensity as much as possible.

  Further, the LED holder 15 is formed by separately molding the constituent elements (the conductive plate 17, the primary resin molding portion 30, the heat sink 45, and the secondary resin molding portion 54) constituting the LED holder 15, Since the primary resin molding part 30 and the secondary resin molding part 54 are manufactured by injection molding (insert molding) rather than being assembled together and fixed with screws or the like, the manufacturing is easy.

  Further, the upper surface of each inner protrusion 33, the mounting surface 49a of the LED support portion 49, and the upper surface of the annular portion 56 are located on the same plane (continuous), and the mounting surface 49a of the LED support portion 49. And the annular wall 55 are continuous via the upper surface of the annular portion 56 and the upper surface of each inner protrusion 33, the upper surface of the inner protrusion 33, the mounting surface 49a of the LED support portion 49, the surface of the annular wall 55, and The reflective film 58 can be easily and cleanly formed on the upper surface of the annular portion 56. Therefore, the reflection efficiency of the illumination light emitted from the LED 62 can be reliably increased by the reflection film 58.

Further, the heat generated by each LED 62 is transmitted to the heat sink 45 through the reflective film 58 made of a thin film and is radiated from the lower half (exposed portion) of the heat sink 45, and from the heat sink 45 (contact surface 48) to the chassis. Since heat is dissipated from the chassis 68 after being transmitted to 68, the heat of the LED 62 can be efficiently dissipated to the outside. Therefore, it is possible to prevent a decrease in the light emission efficiency of the LED 62 due to a high temperature. Moreover, since a large LED element with a large calorific value can be used as the LED 62, the amount of light can be increased.
Further, since the LED module 10 includes an annular wall 55 (a portion formed on the annular wall 55 of the reflective film 58) located in the immediate vicinity of the LED 62 (diffuse lens 71), the directivity and radiation of the illumination light generated by the LED 62 are provided. Angle control is possible. In addition, since the reflective film 58 and the LED fixing portion 59 can be formed in various modes with respect to the LED holder 15 (because there is a degree of freedom in the arrangement of the LEDs 62 on the mounting surface 49a), the degree of freedom in optical design. It is possible to obtain the LED module 10 having a large brightness (which can easily suppress the luminance unevenness of the LED 62, or can easily perform dimming (brightness adjustment) and toning (warm / cold color adjustment)).

As mentioned above, although this invention was demonstrated based on said each embodiment, this invention is not limited to the said embodiment, It can implement, giving various deformation | transformation.
For example, after the parts corresponding to the primary resin molding part 30 and the secondary resin molding part 54 are integrated with the first conductive member 20 and the second conductive member 21 in advance, the heat sink 45 is fixed to the integrated object. The LED holder 15 may be manufactured. Furthermore, in this case, the parts corresponding to the primary resin molding part 30 and the secondary resin molding part 54 may be integrated with the first conductive member 20 and the second conductive member 21 by injection molding (insert molding), or the primary resin The molded product may be assembled to the first conductive member 20 and the second conductive member 21 after the portions corresponding to the molded portion 30 and the secondary resin molded portion 54 are molded.
The heat sink 45 may be made of a material different from aluminum (however, a material having a higher thermal conductivity than the primary resin molded portion 30 and the secondary resin molded portion 54).
Further, a heat conductive sheet or a heat conductive adhesive may be interposed between the contact surface 48 of the heat sink 45 and the chassis 68.
Further, the formation of the reflective film 58 on the inner protrusion 33 or (and) the annular portion 56 may be omitted.
Furthermore, as shown in FIG. 26, after forming the reflective film 58, each LED fixing portion 59 (mounting surface 49 a) may be thinner than the reflective film 58 and have the same composition as the reflective film 58, If the visible light reflectance is higher than that of the primary resin molding part 30, the heat sink 45, and the secondary resin molding part 54, the reflective film 58 may have a different composition, and each LED fixing part 59 (reflection) The LED 62 may be fixed to the upper surface of the film 95.

10 LED module (semiconductor light-emitting element module)
15 LED holder (semiconductor light-emitting element holder)
17 Conductive plate 18A 18B Carrier portion 18C Transport hole 19 Carrier connection portion 20 First conductive member 20A Wire connection portion 20B Cable connection portion 20C Engagement hole 21 Second conductive member 21A Wire connection portion 21B Cable connection portion 21C Engagement hole 22 First cutting bridge 23 Second cutting bridge 24 Third cutting bridge 30 Primary resin molding part (base member) (resin molding part)
31 Main body 32 Annular inner wall 33 Inner protrusion 35 Bridge exposure hole 36 Engagement hole exposure hole 37 Connector connection protrusion 38 Connector connection groove 39 Engagement recess 40A 40B 40C 40D Lower surface side protrusion 41 Outer peripheral wall 42 Joint claw 43 Connection arm 45 Heat sink (base member) (heat transfer member)
46 Stored portion 47 Locking recess 48 Contact surface 49 LED support portion 49a Mounting surface 50 Circular recess 51 Non-circular recess 54 Secondary resin molded portion (base member) (resin molded portion)
55 Annular wall 56 Annular part 57 Covering projection 58 Reflective film 59 LED fixing part (semiconductor light emitting element fixing part)
62 62A 62B 62C 62D LED (semiconductor light emitting device)
64 Wire bonding 66 Lighting fixture 68 Chassis (heat dissipation member)
70 Translucent cover member 71 Diffuser lens 72 Projection 73 Connection projection 75 75 'Cable with connector 77 Cable 78 Electric wire 79 Covered tube 80 Connector 81 Insulator 82 Locking projection 83 Detent projection 84 Long groove 85 First contact 86 First Contact piece 87 Second contact 88 Second contact piece 90 Wire bonding 92 Short-circuit connector S Annular gap

Claims (15)

Conduction made of a metal material having a carrier and a conductive plate part region having a wire connection part that can be connected to the semiconductor light emitting element and a cable connection part for external connection supported by the carrier via a cutting bridge Preparing a plate;
A primary resin molding having a connection arm disposed so as to straddle the carrier and the conductive plate partial region, exposing the wire connection portion and the cable connection portion, and having a recess capable of accommodating the semiconductor light emitting element Forming the part;
Cutting the cutting bridge with the connection arm supporting the carrier and the conductive plate partial region;
Forming a secondary resin molding part covering a part of the primary resin molding part;
Separating the carrier by cutting the connection arm;
The manufacturing method of the holder for semiconductor light-emitting devices characterized by having. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 1,
In the step of preparing the conductive plate, the method includes a step of preparing a conductive plate in which the first conductive portion and the second conductive portion are integrally formed via a second cutting bridge.
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 2,
In the step of molding the primary resin molding portion, the primary resin molding portion is arranged between the end portion of the first conductive portion and the end portion of the second conductive portion facing the end portion of the first conductive portion. Molding to fill,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 2 or 3,
In the step of molding the primary resin molding part, the primary resin molding part is molded so as to have a bridge exposing hole through which the second cutting bridge is exposed,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 4,
After the step of molding the primary resin molding part, further comprising the step of cutting the second cutting bridge from the bridge exposure hole,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 5,
In the step of forming the secondary resin molding portion after the step of cutting the second cutting bridge, the secondary resin molding portion is filled with the cut second cutting bridge and the bridge exposing hole. To mold,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light-emitting devices of any one of Claim 1 to 6,
In the step of preparing the conductive plate, the conductive plate is prepared to have a planned opening for receiving a base member,
In the step of molding the primary resin molding part, the primary resin molding part is molded so that the scheduled opening is exposed,
After the step of molding the primary resin molding part, the method further comprises a step of arranging a part of the base member in the planned opening for receiving.
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 7,
In the step of molding the secondary resin molding part, the secondary resin molding part is molded from the primary resin molding part to the base member,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of any one of Claims 1-8,
In the step of cutting the cutting bridge, the cutting bridge is cut inside the outer periphery of the primary resin molding part,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of any one of Claims 1-9,
In the step of molding the secondary resin molded part, the secondary resin molded part is molded so as to cover the cut end face on the conductive plate partial region side of the cut bridge.
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of any one of Claims 1-10,
In the step of molding the secondary resin molding portion, the secondary resin molding portion is a covering projection that projects a cut end surface on the conductive plate partial region side of the cut cutting bridge from an outer peripheral surface. Molding to cover,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 11,
In the step of separating the carrier, the connection arm is cut along an end surface of the covering projection,
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of any one of Claims 1-12,
In the step of preparing the conductive plate, the conductive plate is prepared so as to have an engagement hole for a translucent member that transmits light output from the semiconductor light emitting element,
The step of molding the primary resin molding portion is to mold the primary resin molding portion so as to have an engagement hole exposing hole from which the engagement hole is exposed.
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of Claim 13,
In the step of molding the secondary resin molded part, the secondary resin molded part is molded so as to avoid the engagement hole exposing hole.
Manufacturing method of holder for semiconductor light emitting element. In the manufacturing method of the holder for semiconductor light emitting elements of any one of Claims 1-14,
The semiconductor light-emitting element holder has a housing portion,
In the step of molding the primary resin molding part, the primary resin molding part is molded so that the housing part that houses a connector connectable from the outside exposes the cable connection part,
Manufacturing method of holder for semiconductor light emitting element.