KR20140037763A - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR20140037763A
KR20140037763A KR1020130109733A KR20130109733A KR20140037763A KR 20140037763 A KR20140037763 A KR 20140037763A KR 1020130109733 A KR1020130109733 A KR 1020130109733A KR 20130109733 A KR20130109733 A KR 20130109733A KR 20140037763 A KR20140037763 A KR 20140037763A
Authority
KR
South Korea
Prior art keywords
top ring
polishing
connection sheet
ring
nozzle
Prior art date
Application number
KR1020130109733A
Other languages
English (en)
Korean (ko)
Inventor
마사오 우메모토
다다카즈 소네
히데오 아이자와
류이치 고스게
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20140037763A publication Critical patent/KR20140037763A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020130109733A 2012-09-19 2013-09-12 연마 장치 KR20140037763A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2012205394 2012-09-19
JPJP-P-2012-205394 2012-09-19
JPJP-P-2013-178935 2013-08-30
JP2013178935 2013-08-30
JP2013185884A JP2015062956A (ja) 2012-09-19 2013-09-09 研磨装置
JPJP-P-2013-185884 2013-09-09

Publications (1)

Publication Number Publication Date
KR20140037763A true KR20140037763A (ko) 2014-03-27

Family

ID=50274942

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130109733A KR20140037763A (ko) 2012-09-19 2013-09-12 연마 장치

Country Status (4)

Country Link
US (1) US20140080385A1 (ja)
JP (1) JP2015062956A (ja)
KR (1) KR20140037763A (ja)
TW (1) TW201417955A (ja)

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CN104117916A (zh) * 2014-07-21 2014-10-29 苏州塔可盛电子科技有限公司 一种防集屑式半自动往复抛光装置
JP6449194B2 (ja) * 2015-05-25 2019-01-09 株式会社荏原製作所 研磨装置、研磨ヘッド、およびリテーナリング
JP6517108B2 (ja) * 2015-08-05 2019-05-22 株式会社ディスコ Ｃｍｐ研磨装置
JP6705362B2 (ja) * 2016-10-25 2020-06-03 信越半導体株式会社 研磨ヘッドおよび研磨装置
JP6833591B2 (ja) * 2016-10-28 2021-02-24 株式会社荏原製作所 基板保持装置、弾性膜、研磨装置、および弾性膜の交換方法
US11179823B2 (en) * 2016-10-28 2021-11-23 Ebara Corporation Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
JP6941046B2 (ja) * 2017-12-20 2021-09-29 株式会社荏原製作所 研磨ヘッドおよび研磨装置
KR102454873B1 (ko) * 2018-02-01 2022-10-13 어플라이드 머티어리얼스, 인코포레이티드 도금 시스템의 세정 컴포넌트들 및 방법들
KR102486946B1 (ko) * 2018-04-20 2023-01-09 어플라이드 머티어리얼스, 인코포레이티드 도금 시스템에서의 세정 컴포넌트들 및 방법들
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
CN111300176B (zh) * 2020-03-05 2021-10-22 深圳市可高机电有限公司 一种马达外壳拉伸件表面精加工处理工艺
CN111906597B (zh) * 2020-08-05 2021-07-20 中国科学院西安光学精密机械研究所 一种大口径光学玻璃研磨抛光系统及方法

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JPH11347917A (ja) * 1998-06-09 1999-12-21 Ebara Corp ポリッシング装置
JPH11347925A (ja) * 1998-06-10 1999-12-21 Ebara Corp 基板受渡し装置
JP3701126B2 (ja) * 1998-09-01 2005-09-28 株式会社荏原製作所 基板の洗浄方法及び研磨装置
KR100304706B1 (ko) * 1999-06-16 2001-11-01 윤종용 화학기계적 연마장치 및 연마 헤드 내부의 오염 물질 세척방법
KR100355224B1 (ko) * 1999-06-22 2002-10-11 삼성전자 주식회사 연마 헤드의 리테이너 링과 이를 구비한 화학기계적 연마장치
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US7258599B2 (en) * 2005-09-15 2007-08-21 Fujitsu Limited Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device
JP4829631B2 (ja) * 2005-09-15 2011-12-07 富士通セミコンダクター株式会社 半導体装置の製造方法及び研磨装置
JP2008272902A (ja) * 2007-05-01 2008-11-13 Tokyo Seimitsu Co Ltd Ｃｍｐ装置における研磨ヘッド洗浄装置及び研磨ヘッド洗浄方法
JP5464820B2 (ja) * 2007-10-29 2014-04-09 株式会社荏原製作所 研磨装置
JP5199691B2 (ja) * 2008-02-13 2013-05-15 株式会社荏原製作所 研磨装置
JP2009212459A (ja) * 2008-03-06 2009-09-17 Sharp Corp Ｃｍｐ装置及びウェハーの洗浄方法

Also Published As

Publication number Publication date
JP2015062956A (ja) 2015-04-09
US20140080385A1 (en) 2014-03-20
TW201417955A (zh) 2014-05-16

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