KR20130133184A - 전사 장치 및 수지 패턴 제조 방법 - Google Patents

전사 장치 및 수지 패턴 제조 방법 Download PDF

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Publication number
KR20130133184A
KR20130133184A KR1020137012067A KR20137012067A KR20130133184A KR 20130133184 A KR20130133184 A KR 20130133184A KR 1020137012067 A KR1020137012067 A KR 1020137012067A KR 20137012067 A KR20137012067 A KR 20137012067A KR 20130133184 A KR20130133184 A KR 20130133184A
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KR
South Korea
Prior art keywords
transfer
transfer member
flexibility
resin
flexible
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KR1020137012067A
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English (en)
Korean (ko)
Inventor
히로시 사카모토
사토시 시라토리
유리코 가이다
Original Assignee
아사히 가라스 가부시키가이샤
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Publication of KR20130133184A publication Critical patent/KR20130133184A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/006—Degassing moulding material or draining off gas during moulding

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  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020137012067A 2010-11-22 2011-11-21 전사 장치 및 수지 패턴 제조 방법 KR20130133184A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010260387 2010-11-22
JPJP-P-2010-260387 2010-11-22
PCT/JP2011/076833 WO2012070546A1 (ja) 2010-11-22 2011-11-21 転写装置及び樹脂パターン製造方法

Publications (1)

Publication Number Publication Date
KR20130133184A true KR20130133184A (ko) 2013-12-06

Family

ID=46145888

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137012067A KR20130133184A (ko) 2010-11-22 2011-11-21 전사 장치 및 수지 패턴 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2012070546A1 (ja)
KR (1) KR20130133184A (ja)
CN (1) CN103210474A (ja)
TW (1) TW201228845A (ja)
WO (1) WO2012070546A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101877772B1 (ko) * 2016-12-30 2018-07-13 주식회사 에스에프에이 패턴 복제장치
KR20180099508A (ko) * 2017-02-28 2018-09-05 도시바 기카이 가부시키가이샤 패턴 임프린팅을 위한 장치 및 방법
KR20190046669A (ko) * 2017-10-25 2019-05-07 도시바 기카이 가부시키가이샤 전사 장치 및 전사 방법
KR20190046671A (ko) * 2017-10-25 2019-05-07 도시바 기카이 가부시키가이샤 전사 장치
US11801629B2 (en) 2017-10-25 2023-10-31 Shibaura Machine Co., Ltd. Transfer apparatus

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014010517A1 (ja) * 2012-07-10 2016-06-23 旭硝子株式会社 インプリント方法、及びインプリント装置
JP5944800B2 (ja) * 2012-09-11 2016-07-05 東芝機械株式会社 転写装置
CN102929100B (zh) * 2012-11-22 2014-11-19 南昌欧菲光纳米科技有限公司 一种可对准卷对卷uv成型的装置及方法
CN105143976B (zh) * 2013-03-15 2019-12-17 佳能纳米技术公司 使用具有金属或氧化物涂层的可再次利用的聚合物模板的纳米压印
JP6190138B2 (ja) * 2013-04-02 2017-08-30 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6104691B2 (ja) * 2013-04-26 2017-03-29 株式会社日立産機システム ナノインプリント方法及びそのための装置
JP6073180B2 (ja) * 2013-04-26 2017-02-01 株式会社日立産機システム ナノインプリント方法及びそのための装置
JP6032492B2 (ja) * 2013-05-24 2016-11-30 パナソニックＩｐマネジメント株式会社 微細パターン形成方法、及び微細パターン形成装置
WO2015072572A1 (ja) * 2013-11-18 2015-05-21 Ｓｃｉｖａｘ株式会社 離型装置及び離型方法
KR102502784B1 (ko) * 2015-05-13 2023-02-22 도판 인사츠 가부시키가이샤 요철 패턴 형성체의 제조 방법, 그 제조 장치, 및 시일
CN110320765B (zh) * 2018-03-29 2023-05-16 株式会社Orc制作所 曝光装置
JP7040981B2 (ja) * 2018-03-29 2022-03-23 株式会社オーク製作所 露光装置
JP7245973B2 (ja) * 2019-02-04 2023-03-27 パナソニックＩｐマネジメント株式会社 パターンの形成方法および装置
JP6694101B1 (ja) * 2019-08-09 2020-05-13 Ａｉメカテック株式会社 微細構造転写装置及び微細構造転写方法
JP7475646B2 (ja) 2020-04-24 2024-04-30 Ａｉメカテック株式会社 微細構造転写装置及び微細構造転写方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293010A (ja) * 1987-05-26 1988-11-30 Bridgestone Corp モ−ルドからの加硫ゴム製品の取出方法
JP2001058352A (ja) * 1999-06-14 2001-03-06 Dainippon Printing Co Ltd 密着転写方法および装置ならびに転写型
JP4317375B2 (ja) * 2003-03-20 2009-08-19 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
JP2004333616A (ja) * 2003-05-01 2004-11-25 Fuji Photo Film Co Ltd 感光性樹脂転写装置および方法
JP2008290330A (ja) * 2007-05-24 2008-12-04 Oji Paper Co Ltd ナノインプリントシートの製造装置および製造方法
JP2008310917A (ja) * 2007-06-18 2008-12-25 Ricoh Co Ltd 複数層光ディスク及び記録再生方法
WO2009148138A1 (ja) * 2008-06-05 2009-12-10 旭硝子株式会社 ナノインプリント用モールド、その製造方法および表面に微細凹凸構造を有する樹脂成形体ならびにワイヤグリッド型偏光子の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101877772B1 (ko) * 2016-12-30 2018-07-13 주식회사 에스에프에이 패턴 복제장치
KR20180099508A (ko) * 2017-02-28 2018-09-05 도시바 기카이 가부시키가이샤 패턴 임프린팅을 위한 장치 및 방법
KR20190046669A (ko) * 2017-10-25 2019-05-07 도시바 기카이 가부시키가이샤 전사 장치 및 전사 방법
KR20190046671A (ko) * 2017-10-25 2019-05-07 도시바 기카이 가부시키가이샤 전사 장치
US10596752B2 (en) 2017-10-25 2020-03-24 Toshiba Kikai Kabushiki Kaisha Transfer apparatus
US11801629B2 (en) 2017-10-25 2023-10-31 Shibaura Machine Co., Ltd. Transfer apparatus

Also Published As

Publication number Publication date
JPWO2012070546A1 (ja) 2014-05-19
TW201228845A (en) 2012-07-16
CN103210474A (zh) 2013-07-17
WO2012070546A1 (ja) 2012-05-31

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