KR20120133555A - Light emitting device array - Google Patents

Abstract

PURPOSE: A light emitting element array is provided to increase luminous efficiency by overlapping light generated in a light emitting device package with the light generated in a neighboring light emitting device package. CONSTITUTION: A light emitting element array(100) comprises a substrate and first and second light emitting device packages(110,111). The first and second light emitting device packages are arranged to be adjacent to the substrate. The first light emitting device package forms an inclination angle of 20° to 70° with the second light emitting device package and. The first light emitting device package is adjacent to one side edge of the substrate.

Description

Light emitting device array

Embodiments relate to an array of light emitting devices.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

Embodiments are directed to a light emitting device array that can increase light emission efficiency and reduce the number of light emitting device packages.

The light emitting device array according to the embodiment may include a substrate and first and second light emitting device packages disposed adjacent to the substrate, and the first light emitting device package may be in a range of 45 ° to 70 ° with the second light emitting device package. The angle of inclination can be achieved.

In the light emitting device array according to the embodiment, the light emitting device package disposed to be adjacent to one edge of the substrate is inclined, so that a dark portion at the edge portion of the substrate is not generated.

In addition, the light emitting device array according to the embodiment, the light generated from the light emitting device package disposed adjacent to the edge and disposed obliquely overlaps the light generated from the adjacent light emitting device package, the entire light emitting device package disposed on the substrate It is possible to reduce the number, there is an advantage that can increase the luminous efficiency.

1 is an exploded perspective view briefly showing a light emitting device module including a light emitting device array according to the embodiment.
FIG. 2 is a perspective view illustrating the first light emitting device package shown in FIG. 1.
3 is an enlarged view illustrating a first embodiment of the 'P' block illustrated in FIG. 1.
FIG. 4 is an enlarged view illustrating a second embodiment of the 'P' block shown in FIG. 1.
5 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
6 is a cross-sectional view showing a cross section along AA of the lighting apparatus shown in FIG. 5.
7 is an exploded perspective view of a display device including the light emitting device package according to the first embodiment.
8 is an exploded perspective view of a display device including the light emitting device package according to the second embodiment.

In the description of the present embodiment, when one device is described as being formed "on or under" of another device, the device may be (up) or down (down) ( on or under includes both the two devices are in direct contact with each other (directly) or one or more other devices are formed indirectly between the two devices (indirectly). In addition, when expressed as “on” or “under”, it may include the meaning of the downward direction as well as the upward direction based on one device.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Thus, the size of each component does not fully reflect its actual size.

In addition, the angle and direction mentioned in the process of describing the structure of the light emitting device module in the present specification are based on those described in the drawings. In the description of the structure constituting the light emitting device module in the specification, if the reference point and the positional relationship with respect to the angle is not clearly mentioned, refer to the related drawings.

1 is an exploded perspective view briefly showing a light emitting device module including a light emitting device array according to the embodiment.

Referring to FIG. 1, the light emitting device module 200 may include a power control module 210, a light emitting device array 100, and a connector 130.

Here, the power control module 210 generates a power consumed by the light emitting device package 110 mounted on the light emitting device array 100 to control the operation of the power supply 212 and the power supply 212 ( 214 and a connector connector 216 to which one side of the connector 130 is connected may be included.

In this case, the power supply 212 operates under the control of the control unit 214 and generates the power consumed by the light emitting device array 100.

The controller 214 may control the operation of the power supply 212 according to a command input from the outside.

In this case, the externally input command may be a command output from a remote control for directing an operation of a device including the light emitting device module 200 and an input device (not shown) directly connected to the light emitting device module 200. There is no limitation to this.

In addition, the connector connecting portion 216 is connected to one side of the connector 130, it can supply the power supplied from the power supply 212 to the connector 130.

The light emitting device array 100 may include a connector 120 on the substrate 120 and the substrate 120 on which the first to sixth light emitting device packages 110 to 116 and the first to sixth light emitting device packages 110 to 116 are disposed. The other side of the 130 may include a connector terminal 122 is connected.

In this case, the connector terminal 122 may be electrically connected to the connector connector 216 through the connector 130.

The substrate 120 may be a printed circuit board, a flexible printed circuit board, or a metal substrate, and in the case of the printed circuit board, a single-sided PCB and a double-sided PCB A printed circuit board (PCB) or a plurality of layers may be used, and the embodiment is described as a single-sided printed circuit board (PCB), but is not limited thereto.

The first to sixth light emitting device packages 110 to 116 may be divided into a plurality of groups (not shown), and may be connected in series and in parallel, without being limited thereto.

Although the first to sixth light emitting device packages 110 to 116 illustrated in FIG. 1 are shown as seven, the total number is not limited.

At least one of the first to sixth light emitting device packages 110 to 116 may emit light of different colors, and may emit light of the same color, without being limited thereto.

For example, when the first to sixth light emitting device packages 110 to 116 emit white light, the first to sixth light emitting device packages 110 to 116 may emit light of red light and the blue light. It can be implemented by using a light emitting device package for emitting light. Accordingly, the light emitting device packages that emit red light and blue light may be alternately mounted, and may be formed of red light, blue light, and green light.

In addition, the first to sixth light emitting device packages 110 to 116 may be formed in the same configuration, and a plurality of light emitting devices (not shown) may be disposed on at least one, but is not limited thereto.

Hereinafter, the first to sixth light emitting device packages 110 to 116 will be described as having the same configuration.

FIG. 2 is a perspective view illustrating the first light emitting device package shown in FIG. 1.

The first light emitting device package 110 shown in FIG. 2 may have the same configuration as the second to seventh light emitting device packages 111 to 116, and at least one of the color of the phosphor and the light emitted from the light emitting device may be different. Can be.

The light emitting device package 110 may include a light emitting device 11 and a body 12 on which the light emitting device 11 is disposed.

The body 12 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photosensitive glass (PSG), polyamide 9T (PA9T), neogeotactic polystyrene (SPS), metal, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), ceramic, and may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board).

The body 12 may be formed by an injection molding, an etching process, or the like, without being limited thereto.

The upper surface shape of the body 12 may have various shapes such as triangles, squares, polygons, and circles depending on the use and design of the light emitting device 11, but is not limited thereto.

In addition, the body 12 forms a cavity (s) in which the light emitting element 11 is disposed, and the cross-sectional shape of the cavity (s) may be formed in a cup shape, a concave container shape, or the like, and forms a cavity (s). The inner surface of the body 12 may be formed to be inclined downward.

In addition, the planar shape of the cavity s may form various shapes such as a circle, a rectangle, a polygon, and an oval, but is not limited thereto.

In this case, the first and second lead frames 13 and 14 may be disposed on the lower surface of the body 12, and the first and second lead frames 13 and 14 may be formed of a metal material, for example, titanium (Ti). , Copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al ), Indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) may include one or more materials or alloys. Can be.

In addition, the first and second lead frames 13 and 14 may be formed to have a single layer or a multilayer structure, but the present invention is not limited thereto.

The inner surface of the body 12 is formed to be inclined with a predetermined inclination angle with respect to any one of the first and second lead frames 13 and 14, and the reflection angle of the light emitted from the light emitting element 11 varies according to the inclination angle. In this way, it is possible to adjust the directivity angle of the light emitted to the outside. As the directivity of light decreases, the concentration of light emitted from the light emitting device 11 to the outside increases, while the directivity of light increases to the outside of the light emitted from the light emitting device 11.

The inner surface of the body 12 may have a plurality of inclination angles, but is not limited thereto.

The first and second lead frames 13 and 14 are electrically connected to the light emitting element 11, and are connected to the positive and negative poles of an external power source (not shown), respectively, to emit the light emitting element 11. ) Can be powered.

The light emitting device 11 is mounted on the first lead frame 13, and the light emitting device 11 is die-bonded with the first lead frame 13 and is formed by the second lead frame 14 and the wire (not shown). The wire may be bonded to receive power from the first and second lead frames 13 and 14.

Here, the light emitting element 11 may be wire bonded or die bonded to each of the first and second lead frames 13 and 14, but is not limited thereto.

In addition, a cathode mark (not shown) may be formed on the body 12. The cathode mark distinguishes the polarity of the light emitting element 11, that is, the polarity of the first and second lead frames 13 and 14, and thus prevents confusion when the first and second lead frames 13 and 14 are electrically connected to each other. It can be used to

The light emitting element 11 may be a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode emitting red, green, blue, or white light, or an ultraviolet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. There may be a plurality of light emitting devices 11 mounted on the frame 13, at least one light emitting device 11 may be mounted on the first and second lead frames 13 and 14, and the light emitting devices 11 may be mounted on the first and second lead frames 13 and 14. There is no limitation on the number of mounting positions and mounting positions.

In the embodiment, the light emitting element 11 is described as using a blue light emitting element that emits blue light.

In addition, the body 11 may include a resin material 17 filled in the cavity (s). That is, the resin 17 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

In addition, the resin material 17 may be formed in a film form, and may include at least one of a phosphor and a light diffusing material, and a translucent material that does not include the phosphor and the light diffusing material may be used. Do not.

In an embodiment, the resin material 17 may include the first and second phosphors 15 and 16, and may be mixed with a silicon material (not shown), or may be formed in a dual structure, without being limited thereto. .

That is, when the light emitting device package 110 emits white light, the first and second phosphors 15 and 16 may be red phosphors and green phosphors by the light emitting device 11 emitting blue light.

In the embodiment, the first and second phosphors 15 and 16 have been described as including, but may include a single color phosphor, wherein the single color phosphor may be a yellow phosphor, but is not limited thereto.

If the light emitting device package 110 emits red or green light, the light emitting device package 110 may use a mixture of a blue phosphor and a green phosphor or a blue phosphor and a red phosphor to emit white light. have.

3 is an enlarged view illustrating a first embodiment of the 'P' block illustrated in FIG. 1.

Referring to FIG. 3, the light emitting device array 100 may include a first light emitting device package 110, a second light emitting device package 111, a third light emitting device package 112, and first to third light emitting device packages 110. 112 may include a substrate 120 disposed thereon.

Here, the first to third light emitting device packages 110 to 112 may be formed in the same package size (a), it will be described as having the same configuration.

In this case, the first light emitting device package 110 may be disposed adjacent to one edge of the substrate 120. In addition, the first light emitting device package 110 may be bent at the edge of the substrate 120, and the first light emitting device package 110 may be inclined to correspond to the bend.

That is, the first light emitting device package 110 may have a predetermined inclination angle θ with the second light emitting device package 111 disposed adjacent to the substrate 110.

Here, the inclination angle θ may be 20 ° to 70 °. When the inclination angle θ is greater than 70 °, a steering angle (not shown) of light emitted from the light emitting surface of the first light emitting device package 110 is directed to the side surfaces and the light emitting surface of the second and third light emitting device packages 111 and 112. Thus, a dark portion may be generated at the edge of the substrate 120. When the angle is lower than 20 °, a steering angle (not shown) of light emitted from the light emitting surface of the first light emitting device package 110 is determined by the second and third light emitting device packages (not shown). Since the steering angles (not shown) of the 111 and 112 are not significantly changed, the total number of light emitting device packages disposed on the substrate 120 may not be reduced.

In this case, the first separation distance b1 between the first and second light emitting device packages 110 and 111 is the same as the second separation distance b2 between the second and third light emitting device packages 111 and 112, or It may be longer than the second separation distance b2.

That is, the first separation distance b1 may be varied by the inclination angle θ, and the first separation distance b1 may be in inverse relationship with the inclination angle θ.

For example, the first separation distance b1 may be the same as the second separation distance b2 when the inclination angle θ is 20 °, and the first separation distance b2 is the first separation distance b2 when the inclination angle θ is 70 °. 2 It can be farther than the separation distance (b2).

As such, the second and third light emitting device packages 111 and 112 are spaced apart by the second separation distance b2, and the fifth, sixth and seventh light emitting device packages 114, 115, and 116 are adjacent to each other as shown in FIG. 1. The separation distance between) may be the same as the second separation distance b2.

When the light emitting device array 100 shown in the first embodiment has the same package size, the first separation distance b1 between the first and second light emitting device packages 110 and 111 is defined as the first and second light emitting device packages ( It can vary by the inclination angle θ between (110, 111).

FIG. 4 is an enlarged view illustrating a second embodiment of the 'P' block shown in FIG. 1.

4 is the same as the reference numerals in FIG. 3, and overlapping descriptions will be briefly described or omitted.

Referring to FIG. 4, the light emitting device array 100 includes a first light emitting device package 110, a second light emitting device package 111, a third light emitting device package 112, and first to third light emitting device packages 110. 112 may include a substrate 120 disposed thereon.

The first light emitting device package 110 may have a different package size from the second and third light emitting device packages 111 and 112.

That is, the first light emitting device package 110 may be formed in a first package size a1, and the second and third light emitting device packages 111 and 112 may have a second package size smaller than the first package size a1. It may be formed as (a2).

The first light emitting device package 110 may have a predetermined inclination angle θ with the second light emitting device package 111 disposed adjacent to the substrate 110.

Here, the inclination angle θ may be 20 ° to 70 °. When the inclination angle θ is greater than 70 °, a steering angle (not shown) of light emitted from the light emitting surface of the first light emitting device package 110 is directed to the side surfaces and the light emitting surface of the second and third light emitting device packages 111 and 112. Thus, a dark portion may be generated at the edge of the substrate 120. When the angle is lower than 20 °, a steering angle (not shown) of light emitted from the light emitting surface of the first light emitting device package 110 is determined by the second and third light emitting device packages (not shown). Since the steering angles (not shown) of the 111 and 112 are not significantly changed, the total number of light emitting device packages disposed on the substrate 120 may not be reduced.

The first separation distance b1 between the first and second light emitting device packages 110 and 111 may be longer than the second separation distance b2 between the second and third light emitting device packages 111 and 112.

That is, the first separation distance b1 may be varied by the inclination angle θ and the first and second package sizes a1 and a2, and the first separation distance b1 may be in inverse relationship with the inclination angle θ. It may be possible to have a proportional relationship with at least one of the first and second package sizes a1 and a2.

However, the distance difference between the first and second separation distances b1 and b2 may be formed as the maximum distance when the inclination angle θ is 20 °, and may be formed as the minimum distance when the inclination angle θ is 70 °.

The second and third light emitting device packages 111 and 112 are spaced apart by the second separation distance b2, and the fifth, sixth and seventh light emitting device packages 114, 115, and 116 are adjacent to each other as shown in FIG. 1. The separation distance therebetween may be equal to the second separation distance b2.

The light emitting device array 100 according to the second embodiment is adjacent to the first light emitting device package 110 having the first package size a1 and the second light emitting device package 111 having the second package size a2. The first separation distance b1 may vary according to the first package size a1 and the inclination angle θ.

5 is a perspective view illustrating a lighting apparatus including a light emitting device package according to an embodiment, and FIG. 6 is a cross-sectional view illustrating an A-A cross section of the lighting apparatus illustrated in FIG. 5.

Hereinafter, in order to describe the shape of the lighting apparatus 300 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 300, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 6 is a cross-sectional view of the lighting apparatus 300 of FIG. 5 cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. FIG.

5 and 6, the lighting device 300 may include a body 310, a cover 330 fastened to the body 310, and a closing cap 350 positioned at both ends of the body 310. have.

The lower surface of the body 310 is fastened to the light emitting device module 340, the body 310 is conductive so that the heat generated in the light emitting device package 344 can be discharged to the outside through the upper surface of the body 310 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device module 340 may include a light emitting device array (not shown) including a light emitting device package 344 and a printed circuit board 342.

The light emitting device package 344 may be mounted on the PCB 342 in a multi-colored, multi-row array to form an array. The light emitting device package 344 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. The PCB 342 may be a metal core PCB (MCPCB) or a PCB made of FR4.

The cover 330 may be formed in a circular shape to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the light emitting device module 340 from the outside and the like. In addition, the cover 330 may include diffusing particles to prevent glare of the light generated from the light emitting device package 344, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 330 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 330.

On the other hand, since the light generated from the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 344. The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 350 is located at both ends of the body 310 may be used for sealing the power supply (not shown). In addition, the closing cap 350 is formed with a power pin 352, the lighting device 300 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

7 is an exploded perspective view of a display device including the light emitting device package according to the first embodiment.

7 illustrates an edge-light method, the display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

The liquid crystal display panel 410 may display an image using light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 412 may implement a color of an image displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to the printed circuit board 418 on which a plurality of circuit components are mounted through the driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 may convert the light provided from the light emitting device module 420, the light emitting device module 420 into a surface light source, and provide the light guide plate 430 to the liquid crystal display panel 410. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 430 and the plurality of films 450, 464, 466 to uniform the luminance distribution of the light provided from the 430 and improve the vertical incidence ( 447).

The light emitting device module 420 may include a PCB substrate 422 such that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 may be mounted to form an array.

Here, the PCB substrate 422 may be applied to the substrate 120 shown in FIG.

On the other hand, the backlight unit 470 is a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410, and a prism film 450 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 464 for protecting the prism film 450.

8 is an exploded perspective view of a display device including the light emitting device package according to the second embodiment.

However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8 is a direct view, the display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 7, a detailed description thereof will be omitted.

The backlight unit 570 includes a plurality of light emitting device modules 523, a reflective sheet 524, a lower chassis 530 in which the light emitting device modules 523 and the reflective sheet 524 are accommodated, and an upper portion of the light emitting device module 523. It may include a diffusion plate 540 and a plurality of optical film 560 disposed in the.

The light emitting device module 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

The reflective sheet 524 reflects the light generated from the light emitting device package 522 in the direction in which the liquid crystal display panel 510 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 523 is incident on the diffusion plate 540, the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the lighting device 300 and the liquid crystal display device (400, 500) may be included in the lighting system, in addition to the light emitting device package, and the purpose of the lighting may also be included in the lighting system.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (10)

Board; And
And first and second light emitting device packages disposed adjacent to each other on the substrate.
The first light emitting device package,
A light emitting device array having an inclination angle of 20 ° to 70 ° with the second light emitting device package. The method of claim 1, wherein the first light emitting device package,
And a light emitting element array adjacent to one edge of the substrate. The method of claim 1, wherein the first light emitting device package,
The second light emitting device package and the same package size,
Or a light emitting device array larger than a package size of the second light emitting device package. The method of claim 1,
And a third light emitting device package disposed on the substrate and adjacent to the second light emitting device package.
The first separation distance between the first and second light emitting device package,
Is equal to a second separation distance between the second and third light emitting device packages,
Or a light emitting device array longer than a second separation distance between the second and third light emitting device packages. The method of claim 4, wherein the first spacing,
And a light emitting device array variable according to at least one package size among the first and second light emitting device packages. The method of claim 4, wherein the second spacing,
The light emitting device array variable according to the size of the inclination angle. The method of claim 4, wherein the third light emitting device package,
Same as any one of the first and second light emitting device packages,
Or a light emitting device array smaller than any one of the first and second light emitting device packages. The method of claim 1, wherein at least one of the first and second light emitting device packages,
A light emitting device array comprising at least two light emitting devices. The method of claim 1, wherein the substrate,
Light emitting device array which is a printed circuit board, flexible printed circuit board or metal substrate. 10. An illumination system comprising the array of light emitting elements of any one of claims 1-9.

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