KR20120044935A - 중합체 및 표면 개질된 육방정 질화붕소 입자의 복합물 - Google Patents
중합체 및 표면 개질된 육방정 질화붕소 입자의 복합물 Download PDFInfo
- Publication number
- KR20120044935A KR20120044935A KR1020117029687A KR20117029687A KR20120044935A KR 20120044935 A KR20120044935 A KR 20120044935A KR 1020117029687 A KR1020117029687 A KR 1020117029687A KR 20117029687 A KR20117029687 A KR 20117029687A KR 20120044935 A KR20120044935 A KR 20120044935A
- Authority
- KR
- South Korea
- Prior art keywords
- polymer
- smhbn
- boron nitride
- composite
- film
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/465,059 US8288466B2 (en) | 2009-05-13 | 2009-05-13 | Composite of a polymer and surface modified hexagonal boron nitride particles |
US12/465,059 | 2009-05-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20120044935A true KR20120044935A (ko) | 2012-05-08 |
Family
ID=43067764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117029687A KR20120044935A (ko) | 2009-05-13 | 2010-05-12 | 중합체 및 표면 개질된 육방정 질화붕소 입자의 복합물 |
Country Status (6)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160124516A (ko) | 2015-04-20 | 2016-10-28 | 주식회사 엘지화학 | 질화붕소 분산액 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8258346B2 (en) * | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
JP2012096432A (ja) | 2010-11-01 | 2012-05-24 | Sony Corp | バリアフィルム及びその製造方法 |
WO2013090168A1 (en) | 2011-12-16 | 2013-06-20 | Ticona Llc | Injection molding of polyarylene sulfide compositions |
JP6046741B2 (ja) | 2011-12-16 | 2016-12-21 | ティコナ・エルエルシー | ポリアリーレンスルフィド組成物用の成核系 |
US8796392B2 (en) | 2011-12-16 | 2014-08-05 | Ticona Llc | Low temperature injection molding of polyarylene sulfide compositions |
CN103998506B (zh) | 2011-12-16 | 2016-08-24 | 提克纳有限责任公司 | 用于聚苯硫醚的含硼成核剂 |
CN102786815B (zh) * | 2012-08-15 | 2014-04-02 | 中国科学院上海硅酸盐研究所 | 氮化硼粉体表面改性的方法、改性氮化硼及聚合物复合材料 |
US9464214B2 (en) | 2014-02-25 | 2016-10-11 | The Boeing Company | Thermally conductive flexible adhesive for aerospace applications |
TWI671364B (zh) | 2015-12-30 | 2019-09-11 | 美商聖高拜陶器塑膠公司 | 改質氮化物顆粒、寡聚物官能化氮化物顆粒及基於聚合物之複合材料 |
JP6721219B2 (ja) * | 2016-03-14 | 2020-07-08 | ナミックス株式会社 | 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法 |
US10246623B2 (en) * | 2016-09-21 | 2019-04-02 | NAiEEL Technology | Resin composition, article prepared by using the same, and method of preparing the same |
KR101850244B1 (ko) * | 2017-04-05 | 2018-06-07 | 한국과학기술원 | Bnnp를 포함하는 나노 복합 재료 및 그의 제조 방법 |
CN109135267B (zh) * | 2017-06-15 | 2021-04-27 | 中国科学院化学研究所 | 一种表面胺基化的氮化硼/尼龙复合材料及其制备方法和用途 |
CN110799455B (zh) * | 2017-07-14 | 2023-04-18 | 富士胶片株式会社 | 表面修饰无机氮化物、组合物、导热材料及带导热层的器件 |
MX2020005259A (es) * | 2018-01-26 | 2020-08-24 | Firmenich & Cie | Composicion colorante para cabello que comprende microcapsulas. |
WO2021010291A1 (ja) * | 2019-07-17 | 2021-01-21 | 富士フイルム株式会社 | 熱伝導材料形成用組成物、熱伝導材料、表面修飾無機物 |
Family Cites Families (36)
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DE2555515C2 (de) | 1975-12-10 | 1990-04-19 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung von einheitlichen 4-Aminobenzoldiazoniumsalzen |
US4670325A (en) * | 1983-04-29 | 1987-06-02 | Ibm Corporation | Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure |
DE69115171T2 (de) | 1990-08-27 | 1996-05-15 | Du Pont | Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung. |
JPH07215705A (ja) | 1994-02-07 | 1995-08-15 | Shin Etsu Chem Co Ltd | シリコーンゴム添加用窒化ほう素粉末およびシリコーンゴム製品 |
JP2732822B2 (ja) * | 1995-12-28 | 1998-03-30 | デュポン帝人アドバンスドペーパー株式会社 | 複合体シートおよびその製造方法 |
US5681883A (en) * | 1996-03-05 | 1997-10-28 | Advanced Ceramics Corporation | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
US6160042A (en) * | 1997-05-01 | 2000-12-12 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
JP3948642B2 (ja) * | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
EP1114843B1 (en) * | 1999-12-16 | 2006-03-29 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
US6162849A (en) | 1999-01-11 | 2000-12-19 | Ferro Corporation | Thermally conductive thermoplastic |
US6623791B2 (en) * | 1999-07-30 | 2003-09-23 | Ppg Industries Ohio, Inc. | Coating compositions having improved adhesion, coated substrates and methods related thereto |
US7976941B2 (en) * | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
US7445797B2 (en) * | 2005-03-14 | 2008-11-04 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and polymer-based compositions made therewith |
US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
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US6652822B2 (en) * | 2001-05-17 | 2003-11-25 | The Regents Of The University Of California | Spherical boron nitride particles and method for preparing them |
US7026436B2 (en) | 2002-11-26 | 2006-04-11 | E.I. Du Pont De Nemours And Company | Low temperature polyimide adhesive compositions and methods relating thereto |
US7470990B2 (en) * | 2004-03-31 | 2008-12-30 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
US20060127686A1 (en) * | 2004-12-15 | 2006-06-15 | Meloni Paul A | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device |
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US7524560B2 (en) * | 2005-08-19 | 2009-04-28 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
US20070205706A1 (en) * | 2006-03-01 | 2007-09-06 | General Electric Company | Optical Substrate Comprising Boron Nitride Particles |
US7658988B2 (en) * | 2006-04-03 | 2010-02-09 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from filled epoxy compositions |
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WO2009149445A1 (en) * | 2008-06-06 | 2009-12-10 | E. I. Du Pont De Nemours And Company | Polymers containing hexagonal boron nitride particles coated with turbostratic carbon and process for preparing same |
US20090305043A1 (en) * | 2008-06-06 | 2009-12-10 | E. I. Du Point De Nemours And Company | Boron nitride encapsulated in turbostratic carbon and process for making same |
US8277936B2 (en) * | 2008-12-22 | 2012-10-02 | E I Du Pont De Nemours And Company | Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers |
US8258346B2 (en) * | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
US8784980B2 (en) * | 2009-05-13 | 2014-07-22 | E I Du Pont De Nemours And Company | Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
US8440292B2 (en) * | 2009-05-13 | 2013-05-14 | E I Du Pont De Nemours And Company | Multi-layer article for flexible printed circuits |
-
2009
- 2009-05-13 US US12/465,059 patent/US8288466B2/en not_active Expired - Fee Related
-
2010
- 2010-05-12 JP JP2012510960A patent/JP5597699B2/ja not_active Expired - Fee Related
- 2010-05-12 CN CN201080021274.9A patent/CN102421841B/zh not_active Expired - Fee Related
- 2010-05-12 EP EP10775443.4A patent/EP2430091B1/en not_active Not-in-force
- 2010-05-12 WO PCT/US2010/034459 patent/WO2010132510A2/en active Application Filing
- 2010-05-12 KR KR1020117029687A patent/KR20120044935A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160124516A (ko) | 2015-04-20 | 2016-10-28 | 주식회사 엘지화학 | 질화붕소 분산액 |
Also Published As
Publication number | Publication date |
---|---|
US20100288968A1 (en) | 2010-11-18 |
US8288466B2 (en) | 2012-10-16 |
CN102421841A (zh) | 2012-04-18 |
JP2012526906A (ja) | 2012-11-01 |
JP5597699B2 (ja) | 2014-10-01 |
EP2430091B1 (en) | 2015-02-25 |
CN102421841B (zh) | 2014-04-09 |
EP2430091A2 (en) | 2012-03-21 |
WO2010132510A3 (en) | 2011-03-17 |
EP2430091A4 (en) | 2013-03-06 |
WO2010132510A2 (en) | 2010-11-18 |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |