KR20110122681A - 보호막 형성용 원료액, 보호막, 보호막을 구비한 배선 기판 - Google Patents

보호막 형성용 원료액, 보호막, 보호막을 구비한 배선 기판 Download PDF

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KR20110122681A
KR20110122681A KR1020117019255A KR20117019255A KR20110122681A KR 20110122681 A KR20110122681 A KR 20110122681A KR 1020117019255 A KR1020117019255 A KR 1020117019255A KR 20117019255 A KR20117019255 A KR 20117019255A KR 20110122681 A KR20110122681 A KR 20110122681A
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dianhydride
protective film
film
raw material
compound
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KR1020117019255A
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Korean (ko)
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히로끼 카나야
토모야스 스나가
마미꼬 노무라
주니찌 이시이
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소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
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Publication of KR20110122681A publication Critical patent/KR20110122681A/ko

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KR1020117019255A 2009-02-21 2010-02-22 보호막 형성용 원료액, 보호막, 보호막을 구비한 배선 기판 KR20110122681A (ko)

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JP (1) JP5362811B2 (zh)
KR (1) KR20110122681A (zh)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130033314A (ko) * 2011-09-26 2013-04-03 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 el 표시 장치, 및 액정 표시 장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5603908B2 (ja) * 2011-09-26 2014-10-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置
JP5981555B2 (ja) * 2012-09-03 2016-08-31 富士フイルム株式会社 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置および液晶表示装置
KR20150038238A (ko) * 2012-09-03 2015-04-08 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 el 표시 장치 및 액정 표시 장치
WO2017057741A1 (ja) * 2015-09-30 2017-04-06 日産化学工業株式会社 樹脂薄膜形成用組成物
CN107216471A (zh) * 2017-08-02 2017-09-29 桂林电器科学研究院有限公司 一种多层黑色亚光聚酰亚胺薄膜的制备方法
CN107286358A (zh) * 2017-08-02 2017-10-24 桂林电器科学研究院有限公司 一种黑色亚光聚酰亚胺薄膜的制备方法及产品
CN111910165A (zh) * 2020-07-20 2020-11-10 上海空间电源研究所 一种pecvd过程中裸露金属保护液及保护方法
CN116368122A (zh) * 2020-10-21 2023-06-30 株式会社艾迪科 组合物、固化物、固化物的制造方法及添加剂

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3682860A (en) * 1969-03-03 1972-08-08 Toray Industries Thermally stable polymers and method of their production
GB1309501A (en) * 1970-02-03 1973-03-14 Toray Industries Polyamideimide compositions
US4395527A (en) * 1978-05-17 1983-07-26 M & T Chemicals Inc. Siloxane-containing polymers
KR0159287B1 (ko) * 1991-01-24 1999-01-15 윤종용 실록산 변성 폴리이미드 수지의 제조방법
JP2754445B2 (ja) * 1993-03-22 1998-05-20 株式会社巴川製紙所 シロキサン変性ポリアミドイミド樹脂およびその製造方法
JP3471427B2 (ja) * 1993-07-13 2003-12-02 株式会社メニコン 眼用レンズ材料
JP2003335858A (ja) * 2002-03-11 2003-11-28 Sumitomo Bakelite Co Ltd ポリイミド樹脂
US7745516B2 (en) * 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy
JP2008261921A (ja) * 2007-04-10 2008-10-30 Kaneka Corp 新規な感光性樹脂組成物、それから得られる硬化膜、絶縁膜及び絶縁膜付きプリント配線板
US8193295B2 (en) * 2007-08-22 2012-06-05 Sony Chemical & Information Device Corporation Amide group-containing siloxane amine compound
JP5439765B2 (ja) * 2007-08-22 2014-03-12 デクセリアルズ株式会社 新規なポリイミド樹脂及び感光性ポリイミド樹脂組成物

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KR20130033314A (ko) * 2011-09-26 2013-04-03 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 el 표시 장치, 및 액정 표시 장치

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