KR20110096059A - Ｕｖ 경화성 무기-유기 하이브리드 레진 및 그 제조 방법 - Google Patents

Ｕｖ 경화성 무기-유기 하이브리드 레진 및 그 제조 방법 Download PDF

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Publication number
KR20110096059A
KR20110096059A KR1020117015210A KR20117015210A KR20110096059A KR 20110096059 A KR20110096059 A KR 20110096059A KR 1020117015210 A KR1020117015210 A KR 1020117015210A KR 20117015210 A KR20117015210 A KR 20117015210A KR 20110096059 A KR20110096059 A KR 20110096059A
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KR
South Korea
Prior art keywords
monomer
mixture
less
organic hybrid
hybrid resin
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KR1020117015210A
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English (en)
Korean (ko)
Inventor
라즈 그비쉬
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소레크 뉴클리어 리서치 센터
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Publication of KR20110096059A publication Critical patent/KR20110096059A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020117015210A 2008-12-03 2009-12-03 Ｕｖ 경화성 무기-유기 하이브리드 레진 및 그 제조 방법 KR20110096059A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11945908P 2008-12-03 2008-12-03
US61/119,459 2008-12-03

Publications (1)

Publication Number Publication Date
KR20110096059A true KR20110096059A (ko) 2011-08-26

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ID=41625220

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117015210A KR20110096059A (ko) 2008-12-03 2009-12-03 Ｕｖ 경화성 무기-유기 하이브리드 레진 및 그 제조 방법

Country Status (7)

Country Link
US (1) US8969219B2 (ja)
EP (1) EP2370502A1 (ja)
JP (1) JP2012510554A (ja)
KR (1) KR20110096059A (ja)
CN (1) CN102264802A (ja)
CA (1) CA2745075A1 (ja)
WO (1) WO2010064240A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR102223131B1 (ko) 2020-05-18 2021-03-05 주식회사 마이크로원 여과집진기의 여과효율 향상을 위한 재봉부 무용제 심실링 적용 필터 및 이의 제조 공법

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TWI452068B (zh) * 2008-03-26 2014-09-11 Lintec Corp A silane compound polymer, and a light element sealing body
DE102009019370A1 (de) * 2009-04-29 2011-01-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Verkapseln von flüssigen oder pastösen Substanzen in einem vernetzten Verkapselungsmaterial
KR101611999B1 (ko) * 2010-02-04 2016-04-14 삼성디스플레이 주식회사 접착제, 접착제를 갖는 표시 장치, 표시 장치의 제조 방법 및 본딩 장치
US8858025B2 (en) * 2012-03-07 2014-10-14 Lg Innotek Co., Ltd. Lighting device
US9627595B2 (en) * 2012-06-27 2017-04-18 Lg Innotek Co., Ltd. Lighting device
EP2935493B1 (en) * 2012-12-21 2016-09-21 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US20140178698A1 (en) * 2012-12-21 2014-06-26 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US9963786B2 (en) 2013-03-15 2018-05-08 Henkel Ag & Co. Kgaa Inorganic composite coatings comprising novel functionalized acrylics
US9957440B2 (en) 2013-09-27 2018-05-01 Halliburton Energy Services, Inc. Expandable particulates and methods of use and preparation
US20180251645A1 (en) * 2015-08-19 2018-09-06 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd 3d polymerizable ceramic inks
PT3246175T (pt) * 2016-05-20 2018-10-22 Flooring Technologies Ltd Processo para a produção de uma placa de derivados de madeira resistente à abrasão e linha de produção para a mesma
ES2803757T3 (es) 2017-11-06 2021-01-29 Flooring Technologies Ltd Procedimiento para fabricar un tablero de material derivado de la madera resistente a la abrasión y línea de producción para ello
CN109991813B (zh) * 2017-12-29 2022-06-21 财团法人工业技术研究院 感光型复合材料及使用其形成复合薄膜的方法
CN111868142B (zh) * 2018-12-28 2022-08-16 浙江三时纪新材科技有限公司 一种球形硅树脂粉体或其接团体的制备方法以及由此得到的球形硅树脂粉体或其接团体
PT3686028T (pt) 2019-01-22 2021-05-05 Flooring Technologies Ltd Processo para o fabrico de um painel de derivados de madeira resistente à abrasão
DE102020112268A1 (de) * 2020-05-06 2021-11-11 EXXERGY GmbH Verbesserung der Glasfestigkeit und Bruchzähigkeit durch eine nicht spröde, abriebfeste Beschichtung
CN112831002A (zh) * 2021-02-05 2021-05-25 珠海格力电器股份有限公司 光敏树脂及其合成方法
CN113125310B (zh) * 2021-04-19 2022-08-16 安徽农业大学 一种监测塑料包装中光起始剂-907渗透行为的方法
WO2023170438A1 (en) * 2022-03-10 2023-09-14 Totalenergies One Tech Photoactivable hybrid organic-inorganic sol-gel resin for 3d printing

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102223131B1 (ko) 2020-05-18 2021-03-05 주식회사 마이크로원 여과집진기의 여과효율 향상을 위한 재봉부 무용제 심실링 적용 필터 및 이의 제조 공법

Also Published As

Publication number Publication date
US20110244695A1 (en) 2011-10-06
EP2370502A1 (en) 2011-10-05
JP2012510554A (ja) 2012-05-10
CN102264802A (zh) 2011-11-30
CA2745075A1 (en) 2010-06-10
WO2010064240A1 (en) 2010-06-10
US8969219B2 (en) 2015-03-03

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