KR20110084899A - 본딩 장치, 초음파 트랜스듀서, 그리고 본딩 방법 - Google Patents

본딩 장치, 초음파 트랜스듀서, 그리고 본딩 방법 Download PDF

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Publication number
KR20110084899A
KR20110084899A KR1020117010160A KR20117010160A KR20110084899A KR 20110084899 A KR20110084899 A KR 20110084899A KR 1020117010160 A KR1020117010160 A KR 1020117010160A KR 20117010160 A KR20117010160 A KR 20117010160A KR 20110084899 A KR20110084899 A KR 20110084899A
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KR
South Korea
Prior art keywords
bonding
tool
piezo element
vibration
ultrasonic transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117010160A
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English (en)
Korean (ko)
Inventor
한스-죠르겐 헤세
죠르그 발라쉐크
마이클 브뢰켈만
피오트르 바실레프
Original Assignee
헤서 운트 크니프스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 헤서 운트 크니프스 게엠베하 filed Critical 헤서 운트 크니프스 게엠베하
Publication of KR20110084899A publication Critical patent/KR20110084899A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
KR1020117010160A 2008-10-14 2009-10-07 본딩 장치, 초음파 트랜스듀서, 그리고 본딩 방법 Withdrawn KR20110084899A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102008037450 2008-10-14
DE102008037450.4 2008-10-14
DE102009003312.2 2009-01-06
DE102009003312A DE102009003312A1 (de) 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren

Publications (1)

Publication Number Publication Date
KR20110084899A true KR20110084899A (ko) 2011-07-26

Family

ID=41821369

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117010160A Withdrawn KR20110084899A (ko) 2008-10-14 2009-10-07 본딩 장치, 초음파 트랜스듀서, 그리고 본딩 방법

Country Status (9)

Country Link
US (1) US8434659B2 (https=)
EP (1) EP2344295B1 (https=)
JP (1) JP5683470B2 (https=)
KR (1) KR20110084899A (https=)
CN (1) CN102186620B (https=)
DE (1) DE102009003312A1 (https=)
MY (1) MY158655A (https=)
TW (1) TWI519017B (https=)
WO (1) WO2010043517A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130020549A (ko) * 2011-08-19 2013-02-27 주식회사 엘지화학 초음파 용접 장치 및 앤빌에 대해 초음파 용접 혼을 정렬하는 방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120109207A1 (en) * 2010-10-29 2012-05-03 Warsaw Orthopedic, Inc. Enhanced Interfacial Conformance for a Composite Rod for Spinal Implant Systems with Higher Modulus Core and Lower Modulus Polymeric Sleeve
DE102014109630A1 (de) 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
JP6483079B2 (ja) * 2016-12-13 2019-03-13 本田技研工業株式会社 電気導体の接合方法
US10381321B2 (en) 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN108555429B (zh) * 2018-05-16 2023-06-20 华侨大学 金属箔大范围连续超声焊接装置
DE102019109262B4 (de) * 2019-04-09 2025-11-20 Lisa Dräxlmaier GmbH VORRICHTUNG UND VERFAHREN ZUM BESTIMMEN EINES ZUSTANDS EINES ULTRASCHALLSCHWEIßPROZESSES
TWI741705B (zh) 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器
CN112427281B (zh) * 2020-09-18 2022-05-24 集美大学 一种复频超声振动加工装置
US11937979B2 (en) * 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
CN114388407B (zh) * 2021-12-24 2023-02-17 凌波微步半导体设备(常熟)有限公司 一种键合头装置及键合机

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US3549913A (en) 1967-10-31 1970-12-22 Matsushita Electric Industrial Co Ltd Piezo-electric transformer
US3602420A (en) * 1970-02-12 1971-08-31 Ibm Ultrasonic bonding device
JPH0777229B2 (ja) * 1988-10-28 1995-08-16 株式会社新川 超音波ワイヤボンディング装置
JPH0653291A (ja) * 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
DE19601599C1 (de) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
DE59701709C5 (de) 1996-02-12 2014-01-09 Smartrac Ip B.V. Verfahren und vorrichtung zur kontaktierung eines drahtleiters
CA2245775C (en) * 1996-02-12 2004-04-06 David Finn Method and device for bonding a wire conductor
JP2000040716A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd ボンディング装置
DE10114672A1 (de) * 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
JP2006255506A (ja) * 2005-03-15 2006-09-28 Fujitsu Ltd 発振器
KR100680307B1 (ko) * 2005-05-20 2007-02-07 삼성전기주식회사 압전 진동자 및 이를 구비한 초음파 모터
JP2007150188A (ja) * 2005-11-30 2007-06-14 Ngk Insulators Ltd 圧電デバイスの制御方法
JP5116250B2 (ja) * 2006-04-11 2013-01-09 キヤノン株式会社 積層圧電素子及びその製造方法、並びに振動波駆動装置
TW200801513A (en) * 2006-06-29 2008-01-01 Fermiscan Australia Pty Ltd Improved process
EP2133191A4 (en) * 2007-03-02 2013-05-15 Compania Espanola De Ultrasonidos Sa HEAD AND ULTRASONIC TRANSDUCER FOR ULTRASONIC WELDING OF PLASTIC MATERIALS
CH700015B1 (de) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultraschall Transducer.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130020549A (ko) * 2011-08-19 2013-02-27 주식회사 엘지화학 초음파 용접 장치 및 앤빌에 대해 초음파 용접 혼을 정렬하는 방법

Also Published As

Publication number Publication date
JP5683470B2 (ja) 2015-03-11
WO2010043517A2 (de) 2010-04-22
US20110266329A1 (en) 2011-11-03
EP2344295A2 (de) 2011-07-20
MY158655A (en) 2016-10-31
WO2010043517A3 (de) 2010-07-29
TWI519017B (zh) 2016-01-21
US8434659B2 (en) 2013-05-07
JP2012505083A (ja) 2012-03-01
DE102009003312A1 (de) 2010-04-15
TW201025771A (en) 2010-07-01
CN102186620A (zh) 2011-09-14
CN102186620B (zh) 2014-03-05
EP2344295B1 (de) 2020-03-11

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PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

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St.27 status event code: A-2-2-P10-P22-nap-X000