DE102009003312A1 - Bondvorrichtung, Ultraschall-Transducer und Bondverfahren - Google Patents

Bondvorrichtung, Ultraschall-Transducer und Bondverfahren Download PDF

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Publication number
DE102009003312A1
DE102009003312A1 DE102009003312A DE102009003312A DE102009003312A1 DE 102009003312 A1 DE102009003312 A1 DE 102009003312A1 DE 102009003312 A DE102009003312 A DE 102009003312A DE 102009003312 A DE102009003312 A DE 102009003312A DE 102009003312 A1 DE102009003312 A1 DE 102009003312A1
Authority
DE
Germany
Prior art keywords
bonding
vibration
tool
ultrasonic transducer
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102009003312A
Other languages
German (de)
English (en)
Inventor
Michael BRÖKELMANN
Hans-Jürgen Dr.-Ing. Hesse
Piotr Prof. Dr. Vasiljev
Jörg Prof. Dr.-Ing. Wallaschek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hesse GmbH
Original Assignee
Hesse and Knipps GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse and Knipps GmbH filed Critical Hesse and Knipps GmbH
Priority to DE102009003312A priority Critical patent/DE102009003312A1/de
Priority to CN200980140650.3A priority patent/CN102186620B/zh
Priority to KR1020117010160A priority patent/KR20110084899A/ko
Priority to JP2011531442A priority patent/JP5683470B2/ja
Priority to US13/123,745 priority patent/US8434659B2/en
Priority to MYPI2011001664A priority patent/MY158655A/en
Priority to EP09744989.6A priority patent/EP2344295B1/de
Priority to PCT/EP2009/063000 priority patent/WO2010043517A2/de
Priority to TW098134463A priority patent/TWI519017B/zh
Publication of DE102009003312A1 publication Critical patent/DE102009003312A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
DE102009003312A 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren Withdrawn DE102009003312A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102009003312A DE102009003312A1 (de) 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren
CN200980140650.3A CN102186620B (zh) 2008-10-14 2009-10-07 接合装置，超声波转换器和用于建立接合连接的方法
KR1020117010160A KR20110084899A (ko) 2008-10-14 2009-10-07 본딩 장치, 초음파 트랜스듀서, 그리고 본딩 방법
JP2011531442A JP5683470B2 (ja) 2008-10-14 2009-10-07 ボンディング装置、超音波トランスデューサおよびボンディング方法
US13/123,745 US8434659B2 (en) 2008-10-14 2009-10-07 Bonding device, ultrasonic transducer, and bonding method
MYPI2011001664A MY158655A (en) 2008-10-14 2009-10-07 Bonding device, ultrasonic transducer and bonding method
EP09744989.6A EP2344295B1 (de) 2008-10-14 2009-10-07 Bondvorrichtung, und bondverfahren zur herstellung von bondverbindungen
PCT/EP2009/063000 WO2010043517A2 (de) 2008-10-14 2009-10-07 Bondvorrichtung, ultraschall-transducer und bondverfahren
TW098134463A TWI519017B (zh) 2008-10-14 2009-10-12 A bonding device, an ultrasonic transducer, and a bonding method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008037450 2008-10-14
DE102008037450.4 2008-10-14
DE102009003312A DE102009003312A1 (de) 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren

Publications (1)

Publication Number Publication Date
DE102009003312A1 true DE102009003312A1 (de) 2010-04-15

Family

ID=41821369

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009003312A Withdrawn DE102009003312A1 (de) 2008-10-14 2009-01-06 Bondvorrichtung, Ultraschall-Transducer und Bondverfahren

Country Status (9)

Country Link
US (1) US8434659B2 (https=)
EP (1) EP2344295B1 (https=)
JP (1) JP5683470B2 (https=)
KR (1) KR20110084899A (https=)
CN (1) CN102186620B (https=)
DE (1) DE102009003312A1 (https=)
MY (1) MY158655A (https=)
TW (1) TWI519017B (https=)
WO (1) WO2010043517A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109630A1 (de) 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
US20220023967A1 (en) * 2019-04-09 2022-01-27 Lisa Draexlmaier Gmbh Device for determining a status of an ultrasonic welding process

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120109207A1 (en) * 2010-10-29 2012-05-03 Warsaw Orthopedic, Inc. Enhanced Interfacial Conformance for a Composite Rod for Spinal Implant Systems with Higher Modulus Core and Lower Modulus Polymeric Sleeve
US8640760B2 (en) * 2011-08-19 2014-02-04 Lg Chem, Ltd. Ultrasonic welding machine and method of aligning an ultrasonic welding horn relative to an anvil
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
JP6483079B2 (ja) * 2016-12-13 2019-03-13 本田技研工業株式会社 電気導体の接合方法
US10381321B2 (en) 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN108555429B (zh) * 2018-05-16 2023-06-20 华侨大学 金属箔大范围连续超声焊接装置
TWI741705B (zh) 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器
CN112427281B (zh) * 2020-09-18 2022-05-24 集美大学 一种复频超声振动加工装置
US11937979B2 (en) * 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
CN114388407B (zh) * 2021-12-24 2023-02-17 凌波微步半导体设备(常熟)有限公司 一种键合头装置及键合机

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549913A (en) 1967-10-31 1970-12-22 Matsushita Electric Industrial Co Ltd Piezo-electric transformer
US3602420A (en) * 1970-02-12 1971-08-31 Ibm Ultrasonic bonding device
JPH0777229B2 (ja) * 1988-10-28 1995-08-16 株式会社新川 超音波ワイヤボンディング装置
JPH0653291A (ja) * 1992-07-30 1994-02-25 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
DE19601599C1 (de) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
DE59701709C5 (de) 1996-02-12 2014-01-09 Smartrac Ip B.V. Verfahren und vorrichtung zur kontaktierung eines drahtleiters
CA2245775C (en) * 1996-02-12 2004-04-06 David Finn Method and device for bonding a wire conductor
JP2000040716A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd ボンディング装置
DE10114672A1 (de) * 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
JP2006255506A (ja) * 2005-03-15 2006-09-28 Fujitsu Ltd 発振器
KR100680307B1 (ko) * 2005-05-20 2007-02-07 삼성전기주식회사 압전 진동자 및 이를 구비한 초음파 모터
JP2007150188A (ja) * 2005-11-30 2007-06-14 Ngk Insulators Ltd 圧電デバイスの制御方法
JP5116250B2 (ja) * 2006-04-11 2013-01-09 キヤノン株式会社 積層圧電素子及びその製造方法、並びに振動波駆動装置
TW200801513A (en) * 2006-06-29 2008-01-01 Fermiscan Australia Pty Ltd Improved process
EP2133191A4 (en) * 2007-03-02 2013-05-15 Compania Espanola De Ultrasonidos Sa HEAD AND ULTRASONIC TRANSDUCER FOR ULTRASONIC WELDING OF PLASTIC MATERIALS
CH700015B1 (de) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultraschall Transducer.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109630A1 (de) 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
WO2016004919A3 (de) * 2014-07-09 2016-03-03 Hesse Gmbh Vorrichtung zur herstellung einer bondvorrichtung und transducer hierfür
US11007601B2 (en) 2014-07-09 2021-05-18 Hesse Gmbh Device for establishing a bonding connection and transducer therefor
US20220023967A1 (en) * 2019-04-09 2022-01-27 Lisa Draexlmaier Gmbh Device for determining a status of an ultrasonic welding process
US11969817B2 (en) * 2019-04-09 2024-04-30 Lisa Draexlmaier Gmbh Device for determining a status of an ultrasonic welding process

Also Published As

Publication number Publication date
JP5683470B2 (ja) 2015-03-11
WO2010043517A2 (de) 2010-04-22
US20110266329A1 (en) 2011-11-03
EP2344295A2 (de) 2011-07-20
MY158655A (en) 2016-10-31
WO2010043517A3 (de) 2010-07-29
TWI519017B (zh) 2016-01-21
US8434659B2 (en) 2013-05-07
JP2012505083A (ja) 2012-03-01
TW201025771A (en) 2010-07-01
CN102186620A (zh) 2011-09-14
CN102186620B (zh) 2014-03-05
EP2344295B1 (de) 2020-03-11
KR20110084899A (ko) 2011-07-26

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Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

Representative=s name: WIRO WICKORD, DE

Representative=s name: WIRO WICKORD, 33100 PADERBORN, DE

R082 Change of representative

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

R081 Change of applicant/patentee

Owner name: HESSE GMBH, DE

Free format text: FORMER OWNER: HESSE & KNIPPS GMBH, 33100 PADERBORN, DE

Effective date: 20130213

R082 Change of representative

Representative=s name: TARVENKORN & WICKORD PATENTANWAELTE PARTNERSCH, DE

Effective date: 20130213

Representative=s name: TARVENKORN & WICKORD PATENTANWAELTE PARTNERSCH, DE

Effective date: 20111209

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

Effective date: 20111209

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

Effective date: 20130213

R082 Change of representative

Representative=s name: TARVENKORN & WICKORD PATENTANWAELTE PARTNERSCH, DE

R005 Application deemed withdrawn due to failure to request examination