KR20110079030A - Apparatus for testing array - Google Patents

Abstract

PURPOSE: An array test device is provided to prepare frame which is arranged to be moved into the direction of which the substrate is transferred to, and to equip the tray in which probe head, corresponding to the number of electrode of substrate and the arrangement location, is installed on the frame, and to make the electricity signal sanctioned to the electrode of the substrate. CONSTITUTION: The substrate transportation unit transfers the test part testing defect presence and absence about substrate and the substrate to the test part. The frame(70) is installed to be moved into the direction of which the substrate is transferred. The tray(80) is installed to be attached and detached on the frame, and comprises the tray in which probehead(90) having the probe pin-contacting with the electrode of substrate. The probe module comprises the frame and the tray.

Description

Array Test Device {APPARATUS FOR TESTING ARRAY}

The present invention relates to an array test apparatus.

In general, a flat panel display (FPD) is an image display device that is thinner and lighter than a television or a monitor employing a CRT. As flat panel displays, liquid crystal displays (LCDs), plasma display panels (PDPs), field emission displays (FEDs) and organic light emitting diodes (OLEDs) are developed. It is used.

Among them, the liquid crystal display is a display device in which a desired image is displayed by individually supplying data signals according to image information to liquid crystal cells arranged in a matrix to adjust light transmittance of the liquid crystal cells. Liquid crystal displays are widely used due to their thin, light, low power consumption and low operating voltage. The manufacturing method of the liquid crystal panel generally employed in such a liquid crystal display will be described.

First, a color filter and a common electrode are formed on an upper substrate, and a thin film transistor (TFT) and a pixel electrode are formed on a lower substrate corresponding to the upper substrate.

Subsequently, after the alignment films are applied to the substrates, the alignment films are rubbed to provide a pre-tilt angle and an orientation direction to the liquid crystal molecules in the liquid crystal layer to be formed therebetween.

Then, paste is applied to at least one substrate in a predetermined pattern to form a paste pattern so as to maintain a gap between the substrates and to prevent the liquid crystal from leaking to the outside and to seal the gaps between the substrates. Through the process of forming a liquid crystal layer in the liquid crystal panel is manufactured.

During this process, a process of testing for defects such as disconnection of gate lines and data lines and poor color of pixel cells included in the thin film transistor TFT and the lower substrate (hereinafter, referred to as a substrate) on which the pixel electrode is formed. Will be performed.

In order to test the substrate, an array test apparatus having a test module having a modulator and a probe module having a plurality of probe pins is used. Such an array test apparatus may be performed by placing a plurality of probe pins to correspond to electrodes disposed on a substrate, pressing the probe pins to contact the electrodes, and then applying a predetermined electric signal to the electrodes.

In recent years, in order to ensure mass productivity of a liquid crystal panel, a large area board | substrate is processed and the liquid crystal panel is manufactured. On the other hand, in order to apply an electrical signal to each electrode disposed on a large-area substrate through the probe pin, the size of the probe module must also be large to correspond to the large-area substrate. Therefore, an optimal design is required in the configuration and driving method of the probe module so that the probe module can be efficiently operated in response to a large area substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and an object of the present invention is to provide an array test apparatus having a probe module configured to efficiently cope with a large-area substrate.

An array test apparatus according to the present invention for achieving the above object, the test unit for testing whether the defect on the substrate, the substrate transfer unit for transferring the substrate to the test unit, and the electrode disposed on the substrate In the array test apparatus including a probe module for applying a signal, the probe module, the frame is installed so as to be movable in the direction in which the substrate is transferred, and detachably mounted to the frame, the electrode of the substrate It may be configured to include a tray having a probe head having a probe pin in contact with the.

Here, the probe module may be provided with a head lifting unit for elevating the probe pin, the frame elevating unit for elevating the frame so as to lower the probe pin to contact the probe pin with the electrode of the substrate. It may be provided, the tray lifting unit for lifting the tray may be provided.

Meanwhile, the frame may include a pair of first frame members extending in a direction perpendicular to the direction in which the substrate is transferred, and a pair of second frame members extending in the direction in which the substrate is transferred. It can be made in a configuration.

The tray may include a pair of first tray members extending in a direction perpendicular to a direction in which the substrate is transported, and a pair of second tray members extending in a direction in which the substrate is transported integrally. It can be made in a configuration.

In addition, the buffer member is preferably provided at a portion where the frame and the tray are connected to each other.

The array test apparatus according to the present invention provides a frame in which a frame is disposed to be movable in a direction in which a substrate is transferred, and a tray on which a probe head corresponding to the number and arrangement positions of electrodes of a substrate is installed is mounted on the frame. The electrical signal can be applied to the electrode of the. Therefore, when testing a substrate having a different number of electrodes and a different arrangement position of the substrate, only the tray needs to be replaced without having to replace the entire probe module, thereby effectively coping with various kinds of substrates.

In addition, the array test apparatus according to the present invention, since the probe module is divided into two components, that is, the frame and the tray in which the probe head is installed, to eliminate the complexity in the process of designing and configuring the probe module It can be effective.

In addition, the array test apparatus according to the present invention, the process of installing the probe module can be separated into two processes of installing the frame on the base, the tray on the frame, one probe head is integrally configured Compared to installing a large probe module on a base at a time, there is an effect that can eliminate the problems caused by the weight or size of the probe module in the process of installing a large probe module.

Hereinafter, a preferred embodiment of an array test apparatus according to the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, the array test apparatus according to the first exemplary embodiment of the present invention includes a base 10, a test unit 20 for testing a substrate S, and a substrate S. 20 may be configured to include a loading unit 30 for loading into the loading unit and an unloading unit 40 for unloading the substrate S from the test unit 20.

The loading unit 30 supports the substrate S to be tested, and transfers the substrate S to the test unit 20, and the unloading unit 40 has completed the test of the substrate ( Supporting S) and also serves to transfer from the test unit 20.

In the loading unit 30 and the unloading unit 40, a plurality of support plates 50 on which the substrate S is mounted and spaced at predetermined intervals, and a substrate transfer unit for transferring the substrate S ( 60) may be provided.

The support plate 50 may have an air hole 51 through which air for supporting the substrate S is injected, and the air hole 51 may be connected to a positive pressure source for supplying air.

As shown in FIG. 2, the substrate transfer unit 60 includes a guide rail 61 extending in a direction parallel to the direction in which the substrate S is transferred (Y-axis direction), and a movement of the guide rail 61. The support member 62 which is installed as possible, the adsorption plate 63 installed on the support member 62, and the lower side of the substrate S is adsorbed, and the adsorption plate 63 are moved up and down (Z-axis direction). It may be configured to include a suction plate elevating device (64).

By this structure, when the board | substrate S is carried in the upper part of the support plate 50, the adsorption plate 63 will raise and adsorb | suck and support the lower surface of the board | substrate S. In this state, the support member 62 moves along the guide rail 61 to transfer the substrate S to the test unit 20. As the guide rail 61, a linear transport mechanism such as a linear motor may be applied. Meanwhile, an adsorption hole through which air passes may be formed in the adsorption plate 63, and a negative pressure source for sucking air may be connected to the adsorption hole.

The test unit 20 serves to test whether the substrate S has an electrical defect. The test unit 20 may test whether the test plate 21 on which the substrate S loaded by the loading unit 30 is disposed and the electrical defects of the substrate S disposed on the test plate 21 are tested. The test module 22, the probe module 23 for applying an electrical signal to the electrode S1 of the substrate S disposed on the test plate 21, the test module 22 and the probe module 23. It may be configured to include a control unit (not shown) for controlling the.

The test module 22 may be installed to be movable in the X-axis direction on the support 223 extending in the direction (X-axis direction) perpendicular to the direction in which the substrate S is transferred from the upper side of the test plate 21. have. The test module 22 may be provided in plural along the extending direction (X-axis direction) of the support 223. The test module 22 is disposed above the substrate S disposed on the test plate 21 to detect whether the substrate S is defective. The test module 22 may include a modulator 221 adjacent to the substrate S disposed on the test plate 21, and an imaging device 222 for imaging the modulator 221. .

The test unit 20 may be divided into two types, a reflection method and a transmission method. In the case of the reflection method, the light source is disposed together with the test module 22, and a reflective layer is provided on the modulator 221 of the test module 22, whereby the light emitted from the light source is incident on the modulator 221. After the reflection from the reflective layer of the modulator 221, by measuring the light amount of the reflected light, it is detected whether the substrate (S) is defective. In the case of the transmission method, a light source is provided below the test plate 21, and thus, by measuring the amount of light emitted from the light source and passing through the modulator 221, the defect of the substrate S is detected. . Both the reflection method and the transmission method may be applied to the test unit 20 of the array test apparatus according to the present invention.

The modulator 221 of the test module 22 changes the amount of light reflected (in the case of reflection) or the amount of light transmitted (in the case of transmission) according to the magnitude of the electric field generated between the substrate S. An electro-optical material layer is provided. The allergen layer is made of a material whose specific property is changed by an electric field generated when electricity is applied to the substrate S and the modulator 221 to change the amount of light incident on the allergen layer. The all-optical material layer may be made of a polymer dispersed liquid crystal (PDLC) that is made of a material having a characteristic of being arranged in a predetermined direction according to the size of an electric field and polarizes light incident thereto.

As shown in FIG. 3, the probe module 23 includes a frame 70 and a frame 70 which are installed to be movable in a direction (Y-axis direction) in which the substrate S is transferred on the base 10. It may be configured to include a tray 80 that is detachably installed in, and a probe head 90 provided in the tray 80 and having a plurality of probe pins 91.

The frame 70 is preferably formed in a rectangular lattice so as to increase its rigidity. That is, the frame 70 includes a pair of first frame members 71 extending in a direction perpendicular to the direction in which the substrate S is transferred (X-axis direction) and the direction in which the substrate S is transferred (Y). A pair of second frame members 72 extending in the axial direction may be formed integrally coupled to each other. By such a configuration, even if the size of the frame 70 is increased in correspondence with the large-area substrate S, the distance between the pair of first frame members 71 and the pair of second frame members 72 are increased. The interval of can be kept constant.

The frame 70 is installed to be movable in the Y-axis direction on the base 10. To this end, a frame moving guide 73 extending in the Y-axis direction may be installed on the base 10, and a frame moving device 74 connected to the frame moving guide 73 may be installed on the frame 70. . The frame 70 may be moved in the Y-axis direction by the interaction between the frame moving guide 73 and the frame moving device 74. Various straight line transfer mechanisms such as a linear motor or a ball screw may be applied as the frame move guide 73 and the frame mover 74 for transferring the frame 70.

The tray 80 is preferably formed in a rectangular lattice so as to increase its rigidity. That is, the tray 80 includes a pair of first tray members 81 extending in a direction perpendicular to the direction in which the substrate S is transferred (X-axis direction) and the direction in which the substrate S is transferred ( The pair of second tray members 82 extending in the Y-axis direction may be integrally coupled to each other. By such a configuration, the tray 80 may maintain a constant distance between the pair of first tray members 81 and a distance between the pair of second tray members 82.

The tray 80 may descend from the upper side of the frame 70 to be detachably mounted on the upper portion of the frame 70. To this end, an insertion groove 721 having a predetermined depth and extending in the Y-axis direction may be formed in the second frame member 72 of the frame 70, and the second frame member 82 of the tray 80 may be formed. An insertion protrusion 821 protruding in a shape corresponding to the insertion groove 721 of the second frame member 72 and extending in the Y-axis direction may be formed. Accordingly, the tray 80 is lowered from the upper side of the frame 70 so that the insertion protrusion 821 of the second tray member 82 is inserted into the insertion groove 721 of the second frame member 72. 80 may be connected on frame 70.

Meanwhile, in the first embodiment of the present invention, as described above, the second frame member 72 of the frame 70 and the second tray member 82 of the tray 80 are connected to each other. The present invention is not limited thereto, and the first frame member 71 of the frame 70 and the first tray member of the tray 80 may correspond to a position where the electrode S1 is disposed on the substrate S. 81 may be connected to each other, and the first frame member 71 of the frame 70 and the first tray member 81 of the tray 80 are connected to each other to form a second structure of the frame 70. A configuration in which the frame member 72 and the second tray member 82 of the tray 80 are connected to each other may be applied.

As shown in FIG. 4, the probe head 90 may be installed to be elevated on the tray 80. In the first embodiment of the present invention, a configuration in which the probe head 90 is installed in the first tray member 81 of the tray 80 is provided. However, the present invention is not limited thereto, and the electrode on the substrate S is provided. The configuration in which the probe head 90 is installed on the second tray member 82 of the tray 80 may be applied to correspond to the position at which the S is disposed, and the probe head 90 may be formed on the tray 80. A configuration in which both the first tray member 81 and the second tray member 82 are installed may be applied.

The probe head 90 includes a probe pin member 92 provided with a plurality of probe pins 91, a head lifting unit 93 for elevating the probe pin member 92 in the vertical direction (Z-axis direction), It may be configured to include a head moving unit 94 for moving the probe pin member 92 in the direction (X-axis direction) extending the first tray member 81.

The head lifting unit 93 may be applied to various configurations capable of raising or lowering the probe pin member 92 such as a cylinder operated by a fluid pressure or an electrically operated linear motor. The head lifting unit 93 is a probe pin member so that the probe pin 91 can press and contact the electrode S1 of the substrate S while the substrate S is disposed on the test plate 21. (92) serves to descend.

The probe head 90 may be moved in the X-axis direction by the operation of the head moving unit 94. The head moving unit 94 may be a linear transfer mechanism such as a linear motor or a ball screw.

On the other hand, as shown in Figure 9, it is preferable that the buffer member 78 is provided at a portion where the frame 70 and the tray 80 are connected to each other. The buffer member 78 may be an elastic member or a spring made of a material having elasticity. For example, in the case where the second frame member 72 of the frame 70 and the second tray member 82 of the tray 80 are connected to each other, the shock absorbing member 78 is the second frame member 72. It may be inserted into the insertion groove 721 of the). By providing the buffer member 78, vibration generated when the tray 80 is seated on the frame 70, when the frame 70 moves or when the probe head 90 moves up and down is provided. Absorbed by the buffer member 78 can be eliminated.

5 to 10, the operation of the array test apparatus according to the first embodiment of the present invention constructed as described above will be described.

First, in order to install the probe module 23 in the array test apparatus, a pair of frame movement guides 73 extending in the Y-axis direction on the base 10 are installed, and the frame on the frame movement guide 73 is installed. Install (10). Then, the mounting of the probe module 23 is completed by mounting the tray 80 having the probe head 90 on the frame 10.

Meanwhile, as shown in FIGS. 5 and 7, the substrate S may include a panel region P which is cut after being applied to the substrate S and applied to an actual product. . The electrode S1 to which an electric signal is applied is formed around the panel region P. FIG. According to the size and position of the panel region P and the range of the region occupied by the panel region P in the substrate S, the number and arrangement positions of the electrodes S1 arranged on the substrate S vary. .

Accordingly, as shown in FIGS. 6 and 7, trays in which the probe head 90 is installed at various positions in various numbers so as to correspond to the number and arrangement positions of the electrodes S1 disposed on the substrate S ( 80 may be provided in plurality.

That is, as shown in FIG. 5, three panel regions P exist in the longitudinal direction (Y-axis direction) inside the substrate S, and in the X-axis direction around one panel region P. FIG. In the case where two electrodes S1 having an interval of X1 and an interval of Y1 in the Y-axis direction are arranged, as shown in FIG. 6, the interval in the X-axis direction is X1 and the interval in the Y-axis direction. The tray 80 having two probe heads 90 which are Y1 is seated in the frame 70.

In addition, as shown in FIG. 7, two panel regions P exist in the horizontal direction (X-axis direction) and two panel regions P in the longitudinal direction (Y-axis direction). Is present, and two electrodes S1 are arranged around the one panel region P with the interval in the X-axis direction X2 and the interval in the Y-axis direction Y2, as shown in FIG. Similarly, a tray 80 having two pairs of probe heads 90 having an interval of X2 in the X-axis direction and Y2 of an interval in the Y-axis direction is seated on the frame 70.

Accordingly, a plurality of trays 80 having different numbers and arrangement positions of the probe heads 90 may be provided, and the trays 80 may be replaced according to the number and arrangement positions of the electrodes S1 of the substrate S. It can correspond to various kinds of substrates (S) carried into the array test apparatus through mounting on the).

On the other hand, after mounting the tray 80 corresponding to the board | substrate S carried into an array test apparatus to the frame 70, the board | substrate S is carried in from the exterior to the loading part 30 part. Then, in the state where air is injected into the air hole 51 of the support plate 50 and the substrate S is supported, the suction plate 63 of the substrate transfer unit 60 adsorbs the lower surface of the substrate S. When the substrate S is moved in the Y-axis direction while being supported, the substrate S is moved to the test unit 20. In addition, when the frame 70 moves along the frame moving guide 73 along the frame moving guide 73 in the conveying direction (Y-axis direction) by driving the frame moving device 74, the frame 70 moves by the frame 70. The tray 80 mounted on the frame 70 and the probe head 90 provided on the tray 80 move in the Y-axis direction. Accordingly, as shown in FIG. 9, the probe pin 91 of the probe head 90 is vertical (Z-axis direction) and horizontal direction with the electrode S1 of the substrate S above the substrate S. Sorted to match. In this case, the probe head 90 may be moved in the X-axis direction by the driving of the head moving unit 94. Accordingly, the probe pin 91 may be moved to a position corresponding to the electrode S1 of the substrate S. Can be moved.

As such, when the substrate S is transferred to the test unit 20 and the probe pin 91 is aligned with the electrode S1 of the substrate S, the test unit 20 may determine whether the substrate S is defective. The testing operation is performed.

When the jet of air is blocked from the air hole 51 of the support plate 50 to test whether the substrate S is defective, the substrate S is supported in contact with the upper surface of the support plate 50. . At this time, as shown in FIG. 10, the probe pin member 92 of the probe head 90 is lowered by the driving of the head lifting unit 93, so that the probe pin 91 is formed on the substrate ( The electrode S1 of S is pressed and an electrical signal is applied to the electrode S1 of the substrate S. Then, the test module 22 is lowered so that electricity is applied to the modulator 221 while the modulator 221 is adjacent to the upper side of the substrate S.

At this time, an electric field is generated between the substrate S and the modulator 221, and the characteristics of the all-optical material constituting the all-optical material layer are changed by the electric field. Accordingly, in the case of the reflection method, the amount of light that is incident from the light source to the modulator 221 and then reflected by the reflection layer of the modulator 221 is changed. In the case of the transmission method, the light emitted from the light source and passed through the modulator 221 is changed. The amount of light is changed. Therefore, the amount of light may be analyzed from the image of the modulator 221 captured by the imaging device 222 to detect the magnitude of the electric field generated between the substrate S and the modulator 221. If there is no defect in the substrate S, a normal electric field within a preset range is formed between the substrate S and the modulator 221. If the substrate S is defective, the substrate S and the modulator 221 are formed. An electric field is not formed between them, or a small electric field is formed in comparison with the normal case. Therefore, it is possible to measure whether the substrate S is defective by using the detected magnitude of the electric field.

On the other hand, the test unit 20 measures whether there is a defect in each panel region P of the substrate S, for this purpose, the substrate S is sequentially transferred toward the test unit 20. At this time, when the probe pin member 92 of the probe head 90 is raised by the driving of the head lifting unit 93, and the jet of air is started again from the air hole 51 of the support plate 50, the substrate ( S) is supported from the upper surface of the support plate 50. At this time, when the adsorption plate 63 is moved in the Y-axis direction while adsorbing the lower surface of the substrate S to support the substrate S, the panel to be tested among the panel areas P of the substrate S is moved. The area P is moved to the test unit 2. When the injection of air from the air hole 51 of the support plate 50 is blocked, the substrate S is supported in contact with the upper surface of the support plate 50. Then, the frame 70 is moved in the Y-axis direction along the frame moving guide 73 by the drive of the frame moving device 74, and thus the tray 80 and the tray 80 seated on the frame 70 The mounted probe head 90 may move to a position coincident with the electrode S1 of the panel region P under test. Then, while the probe pin member 92 of the probe head 90 is lowered by the driving of the head lifting unit 93, the probe pin 91 presses the electrode S1 of the substrate S, and the substrate S An electrical signal is applied to the electrode S1 of ().

The process as described above is performed sequentially and repeatedly, and accordingly, a test for each panel region P on the substrate S may be performed.

The array test apparatus according to the first embodiment of the present invention as described above has a frame 70 which is arranged to be movable in the direction (Y-axis direction) in which the substrate S is transferred, and the substrate S An electric signal may be applied to the electrode S1 of the substrate S by mounting the tray 80 on which the probe head 90 corresponding to the number and arrangement positions of the electrodes S1 is mounted on the frame 70. You can do that. Therefore, when testing the substrate S having a different number and placement positions of the electrodes S1 of the substrate S, only the tray 80 may be replaced without having to replace the entire probe module 23. There is an effect that the substrate S can be efficiently coped.

In addition, in the array test apparatus according to the first embodiment of the present invention, the probe module 23 is separated into a tray 80 in which two components, that is, the frame 10 and the probe head 90 are installed. Since the configuration is made, there is an effect that can remove the complexity in the process of designing and configuring the probe module (23).

In addition, the array test apparatus according to the first embodiment of the present invention, the process of installing the probe module 23, the frame 70 is installed on the base 10, the tray 80 is the frame 70 Since it can be separated into two processes to be installed on the one, the large probe module in the process of installing a large probe module in the process of installing a large probe module, as compared to installing one large probe module integrally formed on the base 10 at a time, There is an effect that can eliminate the problems caused by the weight or size of the probe module.

In addition, in the array test apparatus according to the first embodiment of the present invention, since the frame 70 and / or the tray 80 may be formed in a rectangular grid, the frame 70 and / or the tray 80 may be used. Can be prevented from being deformed, and accordingly, the position of the probe head 90 is changed due to the deformation of the frame 70 and / or the tray 80, and the electrical signal is transmitted to the electrode S1 on the substrate S. There is an effect that can prevent the phenomenon is not applied properly.

The effect of the array test apparatus according to the first embodiment of the present invention as described above is more advantageous when the probe module 23 is enlarged in order to perform the test on the large-area substrate (S).

Hereinafter, an array test apparatus according to a second exemplary embodiment of the present invention will be described with reference to FIGS. 11 and 12. The same parts as those described in the first embodiment of the present invention will be denoted by the same reference numerals and detailed description thereof will be omitted.

As shown in FIG. 11, the array test apparatus according to the second exemplary embodiment of the present invention may be provided with a frame elevating unit 110 installed below the frame 70 and elevating the frame 70.

The frame lifting unit 110 connects the driving device 111 installed on the upper side of the frame moving device 74, the driving device 111 and the frame 70, and controls the driving force of the driving device 111 to the frame 70. It may be configured to include a power transmission member 112 for transmitting to.

As the driving device 110, for example, a configuration may be adopted in which the driving device 111 is a cylinder that operates by pneumatic or hydraulic pressure and the power transmission member 112 is a rod that is connected to the cylinder. However, the present invention is not limited to this configuration, and various configurations for elevating the frame 70 may be employed, such as a linear motor operating by electromagnetic interaction of the mover and the stator as the driving device 110. This can be applied.

With this configuration, when the tray 80 seated on the frame 70 and the probe head 90 provided on the tray 80 move in the Y-axis direction by the movement in the Y-axis direction of the frame 70, FIG. As shown in FIG. 11, the probe pins 91 of the probe head 90 are aligned in the vertical direction (Z-axis direction) and the horizontal direction with the electrodes S1 of the substrate S on the upper side of the substrate S. As shown in FIG. do. At this time, the frame 70 is lowered downward by the driving of the frame lifting unit 110. therefore. As shown in FIG. 12, the probe head 90 installed in the tray 80 connected to the frame 70 is lowered downward, whereby the probe pin 91 has an electrode S1 on the substrate S. As shown in FIG. While pressing the electric signal may be applied to the electrode (S1) of the substrate (S).

In the array test apparatus according to the second embodiment of the present invention as described above, the probe pins 91 provided on the probe head 90 are raised and lowered in the vertical direction (Z-axis direction) of the frame 70 by the substrate. The electrode S1 may be spaced apart from the electrode S1 of (S) or contacted with the electrode S1 of the substrate S. Therefore, since the probe head 90 does not need to separately include a head lifting unit 93 for raising or lowering the probe pin 91, the head lifting unit 93 is installed in the probe head 90. The complexity can be eliminated, and the weight of the tray 80 can be reduced to easily perform the task of replacing the tray 80.

Hereinafter, an array test apparatus according to a third exemplary embodiment of the present invention will be described with reference to FIGS. 13 and 14. The same parts as those described in the above-described first and second embodiments of the present invention will be denoted by the same reference numerals and detailed description thereof will be omitted.

As shown in FIG. 14, the array test apparatus according to the third exemplary embodiment of the present invention may be provided with a tray elevating unit 120 installed at one side of the tray 80 to elevate the tray 80.

The tray lifting unit 120 connects the driving device 121 installed on the frame 70, the driving device 121, and the tray 70, and transfers the driving force of the driving device 121 to the tray 80. It may be configured to include a transmission member (122). The driving device 120 is installed inside the insertion groove 721 of the second frame member 72 and is connected to the insertion protrusion 821 of the second tray member 82, thereby elevating the insertion protrusion 821. By raising or lowering the tray 80 may be configured to be raised or lowered.

As the driving device 120, for example, a configuration may be adopted in which the driving device 121 is a cylinder operated by pneumatic or hydraulic pressure and the power transmission member 122 is a rod connected to the cylinder. However, the present invention is not limited to such a configuration, and various configurations for elevating the tray 80, such as a linear motor operating by electromagnetic interaction of the mover and the stator as the driving apparatus 120 may be employed. This can be applied.

With this configuration, when the tray 80 seated on the frame 70 and the probe head 90 provided on the tray 80 move in the Y-axis direction by the movement in the Y-axis direction of the frame 70, FIG. As shown in FIG. 13, the probe pins 91 of the probe head 90 are aligned with the electrodes S1 of the substrate S in the vertical direction (Z-axis direction) and the horizontal direction on the upper side of the substrate S. do. At this time, the tray 80 is lowered by the drive of the tray lifting unit 120. Accordingly. As shown in FIG. 14, the probe head 90 installed in the tray 80 descends downward, and the probe pin 91 presses the electrode S1 on the substrate S while the electrode of the substrate S is pressed. An electrical signal may be applied to S1.

In the array test apparatus according to the third exemplary embodiment of the present invention, the probe pins 91 provided on the probe head 90 are formed by raising and lowering the tray 80 in the vertical direction (Z-axis direction). The electrode S1 of (S) may be spaced apart or the electrode S1 of the substrate S may be pressed. Therefore, since the probe head 90 does not need to separately include a head lifting unit 93 for raising or lowering the probe pin 91, the head lifting unit 93 is installed in the probe head 90. The complexity can be eliminated, and the weight of the tray 80 can be reduced to easily perform the task of replacing the tray 80.

In addition, the array test apparatus according to the third embodiment of the present invention has a relatively heavy weight compared to the frame 70 without raising or lowering the frame 70 having a relatively large weight as in the second embodiment of the present invention. Since the small tray 80 is configured to raise or lower, there is an effect that can reduce the power required to raise or lower the probe pin 91 of the probe head 90.

The technical idea described in each embodiment of the present invention may be implemented independently, or may be implemented in combination with each other.

1 is a perspective view showing an array test apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view illustrating a substrate transfer unit of the array test apparatus of FIG. 1.

3 is an exploded perspective view illustrating a probe module of the array test apparatus of FIG. 1.

4 is an exploded perspective view illustrating the probe head of the probe module of the array test apparatus of FIG. 1.

5 is a plan view illustrating an example of a substrate tested by the array test apparatus of FIG. 1.

6 is a plan view illustrating a probe module corresponding to the substrate of FIG. 5.

7 is a plan view illustrating another example of a substrate tested by the array test apparatus of FIG. 1.

8 is a plan view illustrating a probe module corresponding to the substrate of FIG. 7.

9 and 10 are operational state diagrams of the array test apparatus of FIG. 1.

11 is a partial cross-sectional view of an array test apparatus according to a second exemplary embodiment of the present invention.

12 is an operational state diagram of the array test apparatus of FIG. 11.

13 is a partial cross-sectional view of an array test apparatus according to a third exemplary embodiment of the present invention.

FIG. 14 is an operational state diagram of the array test apparatus of FIG. 13.

*** Explanation of symbols for main parts of drawing ***

22: test module 23: probe module

50: support plate 70: frame

80: tray 90: probe head

Claims (7)

An array test apparatus including a test unit for testing a defect of a substrate, a substrate transfer unit for transferring the substrate to the test unit, and a probe module for applying an electrical signal to an electrode disposed on the substrate, The probe module, A frame installed to be movable in the direction in which the substrate is transferred; And And a tray provided detachably on the frame and having a probe head having a probe pin in contact with an electrode of the substrate. The method of claim 1, The probe module, the array test device, characterized in that the head lifting unit for lifting the probe pin is provided. The method of claim 1, The probe module, the array test apparatus, characterized in that the frame lifting unit for lifting the frame is provided. The method of claim 1, The probe module, array test apparatus characterized in that the tray lifting unit for lifting the tray is provided. The method according to any one of claims 1 to 4, The frame, And a pair of first frame members extending in a direction perpendicular to the direction in which the substrate is transported, and a pair of second frame members extending in a direction in which the substrate is transported integrally coupled to each other. Array test device. The method according to any one of claims 1 to 4, The tray may be configured such that a pair of first tray members extending in a direction perpendicular to a direction in which the substrate is transferred and a pair of second tray members extending in a direction in which the substrate is transferred are integrally coupled to each other. Array test apparatus, characterized in that made. The method according to any one of claims 1 to 4, And a buffer member is provided at a portion where the frame and the tray are connected to each other.

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