KR100768912B1 - Probe inspection apparatus - Google Patents

Abstract

A probe tester is provided to measure a photo current when testing electric characteristics of a circuit pattern over the entire range of a substrate of a liquid crystal display. A base plate is fixed to a support consisting of plural columns. A stage(116) is installed on the base plate to support a substrate(300) to be tested, and has plural backlight module(160) comprising a light emitting element irradiating light onto a rear surface of the substrate, a light emitting tube, a light surface with a diffusion sheet, and a support frame for supporting the light surface. A probe head(124) is electrically connected to circuit patterns formed on the substrate, and mechanically supports a probe pin(122).

Description

Probe inspection device {PROBE INSPECTION APPARATUS}

1 and 2 are various exemplary views of a conventional probe inspection device.

Figure 3 is a plan view of one embodiment of a probe inspection apparatus according to the present invention.

Figure 4 is a front view of one embodiment of a probe inspection apparatus according to the present invention.

5 is an exemplary view of a backlight module applied to the present invention.

Figure 6 is an exemplary view of another backlight module applied to the present invention.

Figure 7 is an exemplary view of another backlight module applied to the present invention.

8 is an exemplary view of another backlight module applied to the present invention.

9 is an exemplary view illustrating a circuit configuration of a feedback controller and a backlight module applied to the present invention.

10 is an exemplary view showing a state in which a plurality of probe inspection apparatus according to the present invention is used.

<Description of Symbols for Main Parts of Drawings>

100: probe inspection device 160: backlight module

300: substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe inspection apparatus for inspecting a flat panel display, and more particularly, to a probe inspection apparatus capable of measuring a change in electrical characteristics of a circuit pattern formed on a thin film transistor substrate of a liquid crystal display.

Recently, various flat panel displays (FPDs) that reduce weight and volume, which are disadvantages of cathode ray tubes, have emerged. Such flat panel displays include liquid crystal displays (LCDs). , Field emission displays, plasma display panels (PDPs), and electro-luminescence (Electro-Luminescence). Due to features such as light weight, thinness, and low power consumption, the application range of liquid crystal display devices is gradually increasing.

The manufacturing process of the liquid crystal display device includes a manufacturing process of a lower substrate, a manufacturing process of an upper substrate, and a bonding process of a lower substrate and an upper substrate. In this case, the upper substrate is composed of a mother substrate on which a plurality of color filter substrates (C / F substrate) are formed, and the lower substrate is also composed of a mother substrate on which a plurality of thin film transistor substrates (TFT substrates) are formed. .

In this case, each of the plurality of TFT substrates formed on the lower substrate is formed by crossing a plurality of horizontal lines and a plurality of vertical lines in a matrix form, and each pixel includes a transparent pixel electrode at each intersection of the vertical lines and the horizontal line. The pixel cells are formed, and the thin film transistors connected to the vertical line, the horizontal line, and the pixel electrode are formed in the pixel cells.

On the other hand, the lower substrate on which a plurality of TFT substrates are formed is bonded to the upper substrate after an inspection process, and is then cut into respective liquid crystal panels by a scribing process.

In particular, in the inspection process for the plurality of TFT substrates formed on the lower substrate during the manufacturing process of the liquid crystal display device, a circuit pattern (for example, a thin film transistor) formed on the plurality of TFT substrates using a probe inspection device (hereinafter, By simply supplying an electrical test signal to the circuit pattern, the state of the circuit pattern is measured to examine the process state of the previous process. In this case, the circuit pattern inspection by the probe inspection device may be performed on the TFT substrate cut from the mother substrate (lower substrate), but in general, a mother substrate (lower substrate) on which a plurality of TFT substrates are formed (hereinafter, referred to as a substrate). In this case, the TFT substrate or the mother substrate on which the thin film transistor is formed is collectively referred to as a substrate).

Such probe inspection apparatus requires a temperature and ambient conditions similar to actual operating conditions of a thin film transistor in order to obtain more accurate measured values when measuring electrical characteristics of the thin film transistor.

That is, the probe inspection device requires an environment that can be measured while maintaining constant conditions similar to the temperature conditions during operation of the liquid crystal display, such as light generated from the backlight of the liquid crystal display, heat generated during operation of the liquid crystal display. Of these, the effects on light and heat should be considered important.

First, the influence of light when measuring the characteristic change of the circuit pattern according to the application of the electrical signal to the substrate will be described.

In other words, when measuring the electrical characteristics of the circuit pattern formed on the substrate is measured in the dark box (DARK BOX) in order to avoid the influence of the photo current (PHOTO CURRENT), in order to obtain a more accurate operating characteristics conditions of mass-produced products Measurements are required under conditions similar to actual operating conditions. Here, the photocurrent refers to a current generated when the current flow of the circuit pattern is changed due to the photoelectric effect when the circuit pattern formed on the substrate is exposed to light, and the dark box indicates the effect of the photocurrent when testing the electrical characteristics of the circuit pattern. As a darkroom used for minimization, an electrical property test is performed on the measured object while the measured object enters the dark box. On the other hand, although the influence of light is important when measuring the electrical characteristics of the circuit pattern as described above, the conventional probe inspection device is accurate measurement due to the fluorescent lamp for photocurrent measurement, illumination for microscope observation, etc. The value could not be obtained, and only a rough characteristic change of the substrate could be measured. In addition, since the luminance and color temperature of a lighting device such as a fluorescent lamp are substantially different from the luminance and color temperature of a BACK LIGHT actually used in the liquid crystal display device, the electrical characteristic measurement information through the conventional probe inspection device is It could only be used as a reference. However, as liquid crystal displays are becoming larger and more sophisticated process control and measurement are required as the speed and image quality of the products are improved, photo current (PHOTO CURRENT), which has not been a major problem in the past, has a great effect on product quality. Therefore, there is a demand for an illumination device capable of performing the same function as a backlight in a probe device, which is an electrical property inspection device of a substrate.

Next, the effect of heat when measuring the characteristic change of the circuit pattern according to the application of the electrical signal is described as follows.

As described above, the electrical characteristics of the circuit pattern formed on the substrate may be measured under general temperature and ambient conditions, but the measurement may be performed under conditions similar to the actual operating conditions of the circuit pattern TR in order to obtain more accurate measurement values. It is preferable. For example, in order to measure more precise electrical characteristics of the circuit pattern of the substrate applied to the liquid crystal display device, the environment in which the substrate is actually mounted and used in the liquid crystal display device, that is, light emitted from a back light, and It is necessary to measure in a state where heat generated during the operation of the liquid crystal display is provided under the same conditions. Therefore, in the related art, a probe plate has a hot plate (HOT plate) to help measure while maintaining a constant temperature condition during operation of the liquid crystal display device. However, although the hot plate is developed for a semiconductor wafer rather than a substrate of the liquid crystal display device, the hot plate is still used for maintaining a temperature condition of the substrate for the liquid crystal display device. On the other hand, the technical difficulty that occurs when measuring the heating characteristics of the circuit pattern, the noise caused by the current applied for the heating of the circuit pattern is generated, it is difficult to control the heating temperature to keep the measurement temperature deviation very small. In other words, the thermal characteristic measurement of the circuit pattern slowly increases the voltage of the hot plate (typically from -10V to + 30V) and measures a very small amount of current flowing through the circuit pattern while heating the circuit pattern (10E-15A). By using the electrical heating method as described above, the heating characteristic change of the circuit pattern cannot be accurately measured due to the noise generated during heating. In addition, in order to accurately measure the heating characteristics of the circuit pattern, it is necessary to keep the measurement temperature deviation very small, but there is a problem that such a temperature deviation control is difficult with the inspection apparatus using the hot plate as described above. Furthermore, since the conventional hot plate is developed for a semiconductor, there is a problem that the hot plate is composed of an opaque metal plate which is not considered by light.

That is, as the process management and measurement of the liquid crystal display device becomes more sophisticated, the necessity of measuring the electrical characteristics of the substrate under the same conditions as the operating conditions of the actual liquid crystal display device, ie, heat and light, simultaneously occurs. However, with a conventional probe inspection device using a hot plate and a lighting device, only one measurement by heat or light is possible, and after measuring the characteristic change by heat and the characteristic change by light, respectively, By combining the two characteristic change data (DATA), there is a problem that the reliability and measurement convenience of the measurement data is inferior.

1 and 2 are various exemplary views of a conventional probe inspection apparatus.

That is, Figures 1 and 2 are for explaining the problems of the conventional probe inspection device as described above, Figure 1 shows a probe inspection device using a lighting device such as fluorescent lamp 11, Figure 2 is a general purpose The probe inspection apparatus using the backlight 21 is shown.

First, as shown in FIG. 1, an indirect measuring method using an illumination device such as a fluorescent lamp 11 cannot guarantee the repeatability and precision of the measurement, and in particular, due to the shadow of the device and the distance to the fluorescent lamp for each measurement position. The problem is that the measurement is not reliable. In addition, there is a problem in that a waiting time of several tens of minutes is required until the light is stabilized at the maximum brightness after the power is turned on.

In order to improve the above problems, a probe inspection apparatus as illustrated in FIG. 2 has been proposed. The probe inspection apparatus illustrated in FIG. 2 includes a general back light 21 mounted on a stage 16. A method of attaching was used. However, although the measured values of the probe inspection apparatus shown in FIG. 2 have the same level of reliability, the entire area of the substrate 12 cannot be measured, and only the installation area of the general back light 21 can be measured. There is a problem in that the CCFL characteristics of the general-purpose backlight 21, a problem that requires a stabilization time of several tens of minutes.

In addition, when multiple probe inspection devices are used, it is difficult to ensure uniformity of light quantity in the manufacturing process of the general-purpose backlight, and there are problems such as changes in the amount of light according to the service life and the fixed amount of light of a specific model. Due to the nature of the bright light amount required for the measurement is difficult to create and the problem of the light amount control is very limited possible.

Accordingly, an object of the present invention for solving the above problems, at least any one of the heat and light for the electrical characteristics of the substrate for a liquid crystal display device in which a plurality of transistors are formed at each intersection of the horizontal line and the vertical line. It is to provide a probe inspection device having a backlight module capable of applying one to a substrate.

In order to achieve the above object, the probe inspection apparatus according to the present invention, the base plate 110 is fixed on the support 150 formed of a plurality of pillars; A light emitter 162 and a light emitter 162 disposed on the base plate 110 to settle the substrate 300 to be inspected and to emit light to irradiate the back surface of the substrate 300. A light emitting tube 163 forming a path through which light passes, a light emitting surface 165 having a diffusion sheet 166 that uniformly diffuses the light from the light emitting tube 163 onto the back surface of the substrate, and the light emitting tube A stage 116 having a plurality of backlight modules 160 including a support frame 164 supporting the light emitting surface 165 on the 163; The probe pin 122 is mechanically supported while being in electrical contact with the circuit patterns formed on the substrate 300 and moved in the X or Y axis to mechanically support the probe pin 122 for measuring the characteristics of the circuit pattern. A probe head 124 is provided to contact the circuit patterns.

Other objects and features of the present invention in addition to the above object will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 is a plan view of one embodiment of a probe inspection apparatus according to the present invention, Figure 4 is a front view of an embodiment of a probe inspection apparatus according to the present invention.

The probe inspection apparatus 100 according to the present invention is for inspecting a substrate for a liquid crystal display device in which transistors are formed at intersections of horizontal lines and vertical lines. As illustrated in FIGS. 3 and 4, a plurality of probe inspection apparatuses 100 are provided. A support 150 formed of a pillar, a base plate 110 fixed on the support, a stage 116 installed on the base plate and a substrate 300 to be inspected, an electrode formed on the substrate, and A probe pin 122 for electrically contacting the pads to measure the characteristics of the transistor, and a probe head that mechanically supports the probe pin and is moved in the X or Y axis to allow the probe pin to contact each electrode. 124 and a plurality of linear motors 132 installed on the top of the base plate to transfer the probe head to the X-axis or Y-axis. At this time, although not shown in the drawings, the probe head 124 is attached with a microscope to find contact pads (tens of um) of the transistor formed on the substrate 300 or the pad and the probe pin 122 Used when contacting That is, the microscope may be composed of a high magnification microscope or the like that can be observed to contact each pad (Pad) and the pin (Pin) of a fine size in the right position (Contact).

The stage 116 is a table on which the fraudulent substrate 300 is placed to test the electrical characteristics of the substrate 300. In the stage 116, a plurality of backlight modules 160 are disposed. 160 may be configured to emit only light or may be configured to emit both light and temperature. This will be described in detail with reference to FIGS. 5 and 6.

An electrical test signal is applied to a control device (not shown) and a substrate 300 for driving or controlling the stage 116 and the linear motor 132 in the inner space of the support 150, and test results are also provided. A test device (not shown) for storage can be installed.

The base plate 110 is configured using a stone plate or a cast plate with high flattening accuracy, and the stage 116 is disposed on the base plate 110. In addition, the linear motor 132 is disposed on the pillars supported by the base plate 110, so that the probe head 124 connected to the linear motor 132 is placed on the stage 116. The substrate 300 may be moved along the X axis or the Y axis.

In the present invention having the configuration as described above, when the electrical characteristics of the substrate 300, the temperature and light conditions similar to the actual operating conditions of the circuit pattern formed on the substrate 300 should be made for more accurate inspection. To this end, the probe inspection apparatus according to the embodiment of the present invention is equipped with the backlight module 160 on the stage 116, and emits the temperature and light at the same time, the substrate 300 on which the circuit pattern is formed is a liquid crystal display It is intended to provide an environment in which the device is actually operating inside the device, thereby increasing the reliability of the measured electrical characteristics of the substrate.

FIG. 5 is a diagram illustrating a backlight module applied to the present invention, and shows a backlight module emitting only light. FIG. 6 is a diagram illustrating another backlight module applied to the present invention, and emits both light and heat. It shows a backlight module that can be. That is, FIGS. 5 and 6 show various front, top, bottom, and left side views of the backlight module 160 shown in FIG. 4.

The present invention has the greatest feature in providing a probe inspection device capable of emitting heat and light at the same time, but if it is necessary to provide only light to measure electrical characteristics, the backlight module 160 as shown in FIG. This may be used. That is, the backlight module 160 applied to the present invention may be manufactured in various models according to the size of the substrate and the luminance applied to the substrate, and in particular, only the optical characteristics of the substrate for the liquid crystal display may be considered. Not only can be manufactured in the form without a heating coil as shown in Figure 5, so as to be built in the form of a heating coil 169 as shown in Figure 6 to measure the thermal characteristics at the same time with the optical characteristics May be

First, the backlight module 160 illustrated in FIG. 5 is a backlight module that emits only light as described above, and includes a printed circuit board 161 on which a light emitter 162 is formed. A light emitting tube 163 forming a path through which the emitted light passes, a light emitting surface 165 having a diffusion sheet 166 attached thereon to allow the light emitted from the light emitting body to uniformly proceed toward the substrate, and the light emitting tube It comprises a support frame 164 for allowing the light emitting surface to be supported on. In this case, the light emitting surface 165 may be made of a transparent material such as synthetic resin or glass.

On the other hand, one side of the light emitting tube 163 may be further provided with an optical sensor 167 for detecting the amount or brightness of light reflected from the diffusion sheet 166 or the light emitting surface 165, the optical sensor The function of is described in detail in the following description with respect to FIG.

Next, the backlight module 160 shown in FIG. 6 is a backlight module capable of simultaneously emitting light and heat as described above. The basic configuration is the same as that of the backlight module 160 shown in FIG. The light emitting surface 165 further includes a heating coil 169 that may generate heat by power applied from the outside.

That is, the backlight module 160 shown in FIG. 6 forms a metal pattern (heating coil) 169 using a vacuum deposition technique on the light emitting surface 165 of the backlight module and supplies current to the heating coil 169. By applying, it is possible to simultaneously measure the optical characteristics and the thermal characteristics of the substrate for a liquid crystal display device.

At this time, since the electrical characteristic measurement of the liquid crystal display substrate is very sensitive to noise, as a current application and control method for the heating coil 169, a general PID (Proportional-plus-Integrate-plus-Derivative) ) Control or the use of alternating current is not possible, therefore, it is necessary to control the heating coil of analog type using linear power and analog continuous PID. Here, the linear power refers to a DC power supply with very low ripple and noise generation, and the analog continuous PID is a method for controlling in a manner to minimize temperature deviation. Refers to the method of controlling temperature by the amount of current.

Meanwhile, the light emitter 162 applied to the backlight module 160 requires the following characteristics.

That is, the light emitter 162 should have a high brightness and uniformity, color temperature and other optical properties should be similar to the backlight (back light) applied to the current liquid crystal display, and the amount of light should be free. In addition, the light emitter 162 should be able to stabilize the brightness within a short time and be able to continuously attain the specified brightness, and there should be no brightness change by life. Therefore, the light emitting unit 162 having the above characteristics is not limited in kind, but the present invention uses a light emitting diode (LED) as an example.

In addition, although not illustrated in FIG. 6, the backlight module illustrated in FIG. 6 may further include a heat sensor on the light emitting surface 165, and the function of the heat sensor may be described with reference to FIG. 9. It is explained in detail in the following.

FIG. 7 is a diagram illustrating another backlight module applied to the present invention, and shows a backlight module capable of emitting heat using a hot air fan, and FIG. 8 is a diagram illustrating another backlight module applied to the present invention. As a light emitting module, a backlight module using an ultraviolet light emitting diode (LED) is shown.

That is, FIGS. 7 and 8 show various front and plan views of the backlight module 160 illustrated in FIG. 4, and the backlight module illustrated in FIG. 5 has a basic configuration.

First, the backlight module illustrated in FIG. 7 is a backlight module capable of dissipating heat using the hot air blower 173, and the hot air blower 173 is disposed in the light emitting tube 163 of the backlight module shown in FIG. 5. It is connected. Therefore, the hot air emitted from the hot air blower 173 is introduced into the light emitting tube 163 through the heat tube 170 to heat the light emitting surface 165 of the upper end of the light emitting tube.

In addition, the backlight module illustrated in FIG. 7 may be used as a backlight module that is combined with the backlight module illustrated in FIG. 6 and simultaneously emits heat and light. That is, although FIG. 6 has a structure in which a heating coil 169 that can generate heat by an externally applied power is formed on the light emitting surface 165 to emit heat already, the hot air blower 173 may be added thereto. By additionally using an indirect heating method using a, it is possible to emit stronger heat.

However, since the heat emitted from the hot air blower 173 may affect the printed circuit board 162, the backlight module illustrated in FIG. 7 may be disposed in the light emitting tube 163 in contact with the printed circuit board 162. The lower surface may further include a high temperature blocking film 172, and a high temperature shielding glass may be used as the high temperature blocking film 172.

Meanwhile, a heat sensor 171 may be further provided on the light emitting surface 165 of the backlight module illustrated in FIG. 7, and the function of the heat sensor 171 will be described in detail with reference to FIG. 9. do.

Next, the backlight module illustrated in FIG. 8 is to emit at least one of infrared rays or ultraviolet rays in addition to the light emitted from the light emitter 162 formed on the printed circuit board 162. An ultraviolet light emitter 174 or an infrared light emitter 175 is further provided around the bottom wall of the light emitting tube 163.

The ultraviolet light emitter 174 and the infrared light emitter 175 may be an ultraviolet light emitting diode, an infrared light emitting diode, or the like. Since the brightness is higher, it may have a desired brightness with a small number as shown in the figure. Meanwhile, although the ultraviolet light emitter 174 and the infrared light emitter 175 are simultaneously formed in two stages in FIG. 8, only one light emitter may be selectively used depending on the characteristics of the substrate 300 to be inspected. The ultraviolet light emitter 174 and the infrared light emitter 175 may be electrically connected to the printed circuit board 161 on which the light emitter 162 is formed.

In addition, the backlight module illustrated in FIG. 8 may be used in combination with the backlight module illustrated in FIG. 6 or 7.

Meanwhile, a developer of a liquid crystal display device uses a red (R), green (G), and blue (B) light emitting diode instead of a monochromatic light emitting diode (LED) as a backlight of the liquid crystal display device to improve color reproduction and luminance. As the light emitting diode 162 of the backlight module is being studied, the present invention may use red, green, and blue light emitting diodes as shown in FIG. 8.

That is, the present invention provides red (R), green (G), and the like used as the backlight of the liquid crystal display in order to measure not only the amount of light of the backlight of the liquid crystal display but also the electrical effect of the transistor when the spectrum of light changes. By configuring the light emitting unit 162 using a blue light emitting diode (B), it is possible to more accurately measure the electrical characteristics of the liquid crystal display device while varying not only the amount of light but also the light spectrum.

In addition, the present invention may include an ultraviolet light emitting 174 or an infrared light emitting unit 175 as described above, thereby generating not only the spectrum of the visible light region but also the spectrum of the ultraviolet or infrared region. Its characteristics are that it can be carried out in a wider light range.

In addition, although not shown in FIG. 8, the backlight module illustrated in FIG. 8 may further include a heat sensor on the light emitting surface 165, and the function of the heat sensor may be described in the following description with reference to FIG. 9. It is explained in detail.

That is, the present invention relates to a probe inspection device having a backlight module 160 that can emit light or light and heat at the same time as described above, and the present invention provides uniform brightness of the backlight module 160. In order to control the brightness of the backlight module by comparing the brightness of the backlight module formed in the probe head 124 to measure the brightness of the light emitted from the backlight module and the brightness inside the backlight module. It may be configured to further include a feedback control unit 180 for controlling to a predetermined level. Accordingly, the optical sensor 167 or the thermal sensor 171 transmits the optical sensing information or the thermal sensing information to the feedback controller 180, and the feedback controller 180 uses the sensing information to transmit the backlight. The intensity of light or heat of module 160 is controlled. The feedback controller 180 will be described together with reference to FIG. 9.

9 is an exemplary view illustrating a circuit configuration of a feedback controller and a backlight module according to the present invention.

As shown in FIG. 9, the feedback controller 180 applied to the present invention stores an interface 181 for communicating with the luminance meter and the plurality of backlight modules and stores luminance information of the plurality of backlight modules. A storage unit 183, a power supply unit 184 for supplying power to each of the plurality of backlight modules to adjust the brightness of each of the plurality of backlight modules, and the brightness of the backlight module transmitted from the luminance meter through the interface. A controller 182 for controlling the driving of the power supply, an input unit 185 for receiving various types of information from a user, and information input through the input unit according to a comparison value between the information and the luminance information stored in the storage unit; And an output unit 186 for outputting information controlled through the controller.

That is, the probe inspection apparatus according to the present invention may further include a brightness correction luminance meter 123 attached to one side of the probe head 124, the luminance meter 123 is the backlight module 160 In order to detect the brightness of the light emitted from the information, the information detected through the luminance meter is applied to the feedback controller 180, the feedback controller 180 is the luminance information of the backlight module detected through the luminance meter and the The luminance information transmitted from the backlight module is analyzed to control the luminance of the backlight module.

In this case, the microscope 121 provided in the probe head 124 may be used to position the luminance meter 123 as a specific backlight module 160.

On the other hand, the feedback controller 180 may be installed and used in the interior space of the support 150, wherein the input unit 185 and the output unit 186 of the probe inspection apparatus to be confirmed by the user It may be formed by being exposed to the surface. In addition, the feedback controller 180 may be separately installed outside the probe inspection apparatus and used by a user.

Hereinafter, a process of controlling the brightness of each backlight module will be described with reference to the backlight feedback controller 180 illustrated in FIG. 7. In this case, the backlight module may not be provided with a heating coil as shown in FIG. 5, or may be provided with a heating coil 169 as shown in FIG. 6. That is, in the following, the heat supply process by the heating coil is performed separately, and the brightness correction function by the light emitter 162 will be described.

The probe inspection apparatus 100 corrects the luminance of each backlight module 160 before its use, and each backlight whose brightness is to be inspected by the probe head 124 to which the luminance meter 123 is attached. When the brightness information of the surface of the backlight module transmitted from the luminance meter and the brightness information transmitted from the optical sensor 167 in the backlight module are transmitted after moving to the center position of the module, the controller 182 of the feedback control unit may transmit the brightness information. Driving information of the power to be provided to the backlight module is stored in the storage unit 185 using the first and second luminance information. In this case, when setting information of power to be provided to each backlight module is input by the user through the input unit 185 to adjust the brightness of the backlight module, the setting information is combined with the brightness information and driving information. It can also be stored in the form of an information table. On the other hand, the various information stored by the above process can be used not only to correct the brightness of the backlight module during the subsequent electrical property check, but also to correct the brightness of each backlight module before the electrical property check on the substrate. It may be.

In this case, since the coordinates of the backlight modules 160 are determined on the stage 116, the controller 182 uses coordinate information of the probe head 124 to which the luminance meter 123 is connected. Each backlight module 160 may form and store the information table as described above.

On the other hand, when the electrical characteristic measurement of the circuit pattern of the substrate 300 is substantially performed, the controller 182 extracts the inspection object backlight module information corresponding to the movement coordinates of the probe head 124 and the The internal brightness information of the inspection backlight module is transmitted from the optical sensor 167 of the inspection backlight, and the external brightness information of the inspection backlight module is received from the luminance meter 123, and the external brightness information or the internal brightness information is received. By comparing and analyzing the luminance information with the information table, the voltage / current value necessary for maintaining uniform luminance of the backlight module to be inspected is extracted and then the power supply 184 is controlled according to the extracted value.

At this time, the power supply 184 supplies the power corresponding to the extracted value to the inspection target backlight module under the control of the controller 182, and thus, the backlight module 160 is electrically Uniform and ideal luminance is emitted during the characterization period. That is, the controller 182 analyzes luminance values measured inside and outside the light emitting tube 163, and immediately corrects the voltage / current through the power supply 184 when the light amount is higher or lower than the reference setting value. By outputting a value, the light emitter (LED) 162 maintains the amount of light within a certain deviation.

In the above description, only the brightness correction function by the light emitter 162 is described. However, the brightness correction or spectrum correction by the ultraviolet light emitter 174 and the infrared light emitter 175 may be applied in the same manner.

In addition, the present invention may implement a temperature correction function by the heating coil 169 or the hot air fan 173 similar to the luminance correction function by the light emitter 162 by using the heat sensor 171. That is, according to the present invention, if the thermal sensor 171 corresponding to the optical sensor 167 and the thermal sensor corresponding to the luminance meter 123 are provided, the temperature of the backlight module may be adjusted by the feedback controller 180. You can control it. However, the present invention may control the temperature of the backlight module using only the temperature information detected by the heat sensor 171 even without the heat sensor.

The present invention as described above is to allow the user to measure the change in electrical characteristics of the entire area of the substrate for the liquid crystal display device, the light uniformity, the amount of light, the amount of light required for measurement and heat for temperature rise By providing a backlight module that can provide heat and light to the substrate at the same time, and by correcting at least one of the brightness variation, spectrum variation or temperature variation of the backlight module, Measurement reliability can be achieved.

That is, the present invention is to solve the problem of the conventional probe inspection apparatus that generates inaccurate measurement values by using a fluorescent lamp, and by incorporating a controllable stable backlight module into the stage 116 of the probe inspection apparatus. In this case, the inspection data of the substrate can be obtained under conditions similar to those of the liquid crystal display device that is actually mass produced.

FIG. 10 is an exemplary view illustrating a state where a plurality of probe inspection apparatuses according to the present invention are used, and the luminance of backlight modules of the plurality of probe inspection apparatuses 100 is provided by using the feedback controller 180 as illustrated in FIG. 9. Shows the controlled state.

That is, as shown in FIG. 10, when the plurality of probe inspection apparatuses 100 are used in the process chamber, the feedback controllers 180 provided in each of the plurality of probe inspection apparatuses 100 are supported by the support 150. The user terminal 200 may be installed in a separate place and used by a user to simultaneously control the feedback control unit 180.

At this time, the luminance value or temperature outside the backlight module transmitted from the luminance meter 123 or the thermal sensor connected to each probe inspection apparatus 100 is transmitted to the user terminal through the probe inspection apparatus or the user terminal. Directly transmitted to (200), the user terminal 200 is the respective probe inspection apparatus 100 so that the luminance value or temperature of all the backlight module transmitted from each probe inspection apparatus 100 can be maintained the same. It controls the feedback control unit 180 provided in the.

To this end, the user terminal 200 stores information about each probe inspection apparatus 100 and information about the feedback controller 180 and the backlight module included in each probe inspection apparatus. Control information related to the backlight module is stored.

That is, the user terminal 200 is to expand the function of the feedback control unit 180, so that all the backlight modules of all the probe inspection apparatuses maintain the same brightness or temperature, and thus the electrical characteristics of the substrate according to the probe inspection apparatus. This is to prevent the measured value from changing.

On the other hand, the CCFL and the light emitting diode (LED) used as a backlight of the liquid crystal display device operates as a flashing light having a specific frequency and waveform, and the frequency and waveform are different for each model of the liquid crystal display device, so the probe inspection device is also It is necessary to follow the frequency and flashing waveforms.

Therefore, the present invention can add a power modulation function to the controller 182 of the feedback controller 180 so that the power supply 184 can actually implement the frequency and waveform used to drive the backlight of the liquid crystal display.

That is, the controller 182 applied to the present invention receives the frequency and waveform information actually used to drive the liquid crystal display through the input unit 185 and stores the analyzed information in the storage unit 183. The power supply 184 may be controlled according to the frequency and waveform information stored in the storage 183 when the electrical characteristic test is performed on the liquid crystal display substrate. .

Accordingly, the present invention has a feature that even when the electrical characteristics test for the substrate is performed, more accurate electrical characteristic values for the substrate can be obtained by using the frequency and waveform of the power supply actually supplied to the liquid crystal display.

As described above, the probe inspection apparatus according to the present invention enables photocurrent measurement during the electrical pattern test of the circuit pattern, that is, the transistor, over the entire area of the liquid crystal display substrate, as well as optical There is an excellent effect that can simultaneously measure the electrical properties due to overheating.

In addition, the present invention has an excellent effect that can provide a reliable measurement value by continuously correcting the change in brightness of the light when measuring the electrical characteristics.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (10)

A base plate 110 fixed on a support 150 formed of a plurality of pillars; A light emitter 162 and a light emitter 162 disposed on the base plate 110 to settle the substrate 300 to be inspected and to emit light to irradiate the back surface of the substrate 300. A light emitting tube 163 forming a path through which light passes, a light emitting surface 165 having a diffusion sheet 166 that uniformly diffuses the light from the light emitting tube 163 onto the back surface of the substrate, and the light emitting tube A stage 116 having a plurality of backlight modules 160 including a support frame 164 supporting the light emitting surface 165 on the 163; And The probe pin 122 is mechanically supported while being in electrical contact with the circuit patterns formed on the substrate 300 and moved in the X or Y axis to mechanically support the probe pin 122 for measuring the characteristics of the circuit pattern. And a probe head (124) for contacting the circuit patterns. The method of claim 1, A luminance meter (123) formed in the probe head (124) for measuring luminance of light supplied from the backlight module (160); And And a feedback control unit 180 for controlling the luminance of the backlight module 160 to a constant level by comparing the luminance information transmitted from the luminance meter 123 and the backlight module 160. Inspection device. The method of claim 1, A heat sensor 171 formed on the backlight module 160 to sense a temperature of the backlight module 160; And And a feedback control unit 180 for controlling the heating temperature of the backlight module 160 to a predetermined level by comparing the information transmitted from the thermal sensor 171 with preset temperature information of the substrate. Probe inspection device. The method of claim 2, The feedback control unit 180, An interface (181) for communicating with the luminance meter (123) and the plurality of backlight modules (160); A storage unit 183 for storing driving information for the plurality of backlight modules 160; A power supply unit 184 for supplying power to each of the plurality of backlight modules 160 to adjust brightness of each of the plurality of backlight modules 160; And The luminance of the backlight module 160 using the luminance information supplied from the luminance meter 123 and the backlight module 160 through the interface 181 and the driving information supplied from the storage unit 183. Probe inspection apparatus comprising a controller (182) for controlling the drive of the power supply (184) to maintain a constant. The method of claim 2, The feedback control unit 180, The probe inspection apparatus, which is connected to the user terminal 200 together with the feedback controllers of the other probe inspection apparatuses, controls the brightness of the backlight module 160 under the control of the user terminal 200. . The method of claim 2, The feedback control unit 180, And receiving and modulating and storing frequency and waveform information used for driving the backlight of the liquid crystal display, and controlling luminance of the backlight module according to the frequency and waveform information. The method according to any one of claims 1 to 6, On the light emitting surface 165 of the backlight module 160, Probe inspection device, characterized in that the heating coil (169) is formed that can dissipate heat by the applied power source. The method according to any one of claims 1 to 6, In the light emitting tube 163 of the backlight module 160, Probe inspection device, characterized in that the heat pipe 170 for receiving a high temperature heat from the outside is formed. The method according to any one of claims 1 to 6, On the side surface of the light emitting tube 163 of the backlight module 160, At least one of an ultraviolet light emitter for emitting ultraviolet rays or an infrared light emitter for emitting infrared rays. The method according to any one of claims 1 to 6, The light emitter 162 of the backlight module, Probe inspection device comprising a red light emitting diode, a green light emitting diode and a blue light emitting diode.

Images