KR20110063852A - 가압 유체를 이용하여 반도체 기판을 세정하기 위한 장치 및 방법 - Google Patents

가압 유체를 이용하여 반도체 기판을 세정하기 위한 장치 및 방법 Download PDF

Info

Publication number
KR20110063852A
KR20110063852A KR1020117009943A KR20117009943A KR20110063852A KR 20110063852 A KR20110063852 A KR 20110063852A KR 1020117009943 A KR1020117009943 A KR 1020117009943A KR 20117009943 A KR20117009943 A KR 20117009943A KR 20110063852 A KR20110063852 A KR 20110063852A
Authority
KR
South Korea
Prior art keywords
substrate
rollers
pressure wheel
cleaner
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117009943A
Other languages
English (en)
Korean (ko)
Inventor
후이 첸
알렌 엘. 디'암브라
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20110063852A publication Critical patent/KR20110063852A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020117009943A 2008-10-01 2009-09-11 가압 유체를 이용하여 반도체 기판을 세정하기 위한 장치 및 방법 Withdrawn KR20110063852A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/243,685 US8844546B2 (en) 2008-10-01 2008-10-01 Apparatus and method for cleaning semiconductor substrate using pressurized fluid
US12/243,685 2008-10-01

Publications (1)

Publication Number Publication Date
KR20110063852A true KR20110063852A (ko) 2011-06-14

Family

ID=42056078

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117009943A Withdrawn KR20110063852A (ko) 2008-10-01 2009-09-11 가압 유체를 이용하여 반도체 기판을 세정하기 위한 장치 및 방법

Country Status (4)

Country Link
US (1) US8844546B2 (https=)
JP (1) JP5504271B2 (https=)
KR (1) KR20110063852A (https=)
WO (1) WO2010039409A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102260571B1 (ko) * 2020-08-21 2021-06-07 (주)제이에스엠티 회전형 수직 습식에칭장치

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9646859B2 (en) * 2010-04-30 2017-05-09 Applied Materials, Inc. Disk-brush cleaner module with fluid jet
JP2015060852A (ja) * 2013-09-17 2015-03-30 株式会社東芝 半導体装置の製造方法及び製造装置
US9610615B2 (en) * 2015-03-31 2017-04-04 Taiwan Semiconductor Manufacturing Co., Ltd Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication
JP7297664B2 (ja) 2016-11-09 2023-06-26 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
JP7177069B2 (ja) 2017-01-27 2022-11-22 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド 基板をプロセスチャンバ内で回転及び並進するためのシステム及び方法
JP7357625B2 (ja) 2018-02-19 2023-10-06 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド 制御可能なビームサイズの処理噴霧を有する小型電子機器処理システム
CN112638557B (zh) * 2018-07-06 2023-02-03 谢尔贝克半导体技术有限公司 用于喷洒测量设备的系统和方法
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber
US11791173B2 (en) 2019-03-21 2023-10-17 Samsung Electronics Co., Ltd. Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
CN112820664A (zh) * 2019-11-18 2021-05-18 辛耘企业股份有限公司 基板冲洗装置
TWI710049B (zh) * 2019-11-18 2020-11-11 辛耘企業股份有限公司 基板沖洗裝置
EP4250341A1 (de) * 2022-03-24 2023-09-27 Siltronic AG Verfahren zum reinigen von halbleiterscheiben in einer reinigungsstrasse
CN116779508A (zh) * 2022-06-30 2023-09-19 杭州众硅电子科技有限公司 一种化学机械平坦化设备及晶圆传输方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2186600A (en) * 1938-10-29 1940-01-09 Walter S Behrens Sterilizer for dental hand pieces
JPS62173718A (ja) 1986-01-28 1987-07-30 Toshiba Corp 半導体ウエハの洗浄方法
JPH06310485A (ja) 1993-04-23 1994-11-04 Hitachi Ltd 無発塵ウエハクランプ方法
US6230753B1 (en) * 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
JPH10189528A (ja) 1996-12-27 1998-07-21 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JPH10289889A (ja) 1997-04-16 1998-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH1119609A (ja) * 1997-07-08 1999-01-26 Syst Seiko Kk 回転ディスクの表面処理方法および装置
EP1063186A1 (en) * 1997-12-03 2000-12-27 Nikon Corporation Substrate transferring device and method
US6119708A (en) 1998-11-11 2000-09-19 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6516816B1 (en) 1999-04-08 2003-02-11 Applied Materials, Inc. Spin-rinse-dryer
US6575177B1 (en) 1999-04-27 2003-06-10 Applied Materials Inc. Semiconductor substrate cleaning system
JP3990073B2 (ja) 1999-06-17 2007-10-10 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2001070896A (ja) 1999-07-06 2001-03-21 Ebara Corp 基板洗浄装置
US6558471B2 (en) * 2000-01-28 2003-05-06 Applied Materials, Inc. Scrubber operation
JP2002052370A (ja) * 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
JP2002151454A (ja) 2000-11-14 2002-05-24 Nec Kyushu Ltd 基板両面洗浄装置および基板両面洗浄方法
JP2002164318A (ja) 2000-11-27 2002-06-07 Ishii Hyoki Corp 基板スピン装置
US20020121289A1 (en) * 2001-03-05 2002-09-05 Applied Materials, Inc. Spray bar
JP3865602B2 (ja) 2001-06-18 2007-01-10 大日本スクリーン製造株式会社 基板洗浄装置
US20050048876A1 (en) 2003-09-02 2005-03-03 Applied Materials, Inc. Fabricating and cleaning chamber components having textured surfaces
JP2005142309A (ja) 2003-11-05 2005-06-02 Icf Kk 基板の洗浄方法、洗浄装置および洗浄システム
TWI251857B (en) 2004-03-09 2006-03-21 Tokyo Electron Ltd Two-fluid nozzle for cleaning substrate and substrate cleaning device
US20050211276A1 (en) * 2004-03-15 2005-09-29 Applied Materials, Inc. Lid for a semiconductor device processing apparatus and methods for using the same
US9799536B2 (en) 2005-02-07 2017-10-24 Planar Semiconductor, Inc. Apparatus and method for cleaning flat objects in a vertical orientation with pulsed liquid jet
US7685667B2 (en) * 2005-06-14 2010-03-30 Taiwan Semiconductor Manufacturing Co., Ltd. Post-CMP cleaning system
JP2007149892A (ja) 2005-11-25 2007-06-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008198667A (ja) 2007-02-08 2008-08-28 Nec Electronics Corp 半導体製造装置及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102260571B1 (ko) * 2020-08-21 2021-06-07 (주)제이에스엠티 회전형 수직 습식에칭장치

Also Published As

Publication number Publication date
JP5504271B2 (ja) 2014-05-28
JP2012504868A (ja) 2012-02-23
US20100078044A1 (en) 2010-04-01
US8844546B2 (en) 2014-09-30
WO2010039409A3 (en) 2010-05-20
WO2010039409A2 (en) 2010-04-08

Similar Documents

Publication Publication Date Title
KR20110063852A (ko) 가압 유체를 이용하여 반도체 기판을 세정하기 위한 장치 및 방법
KR101796651B1 (ko) 유체 제트를 구비한 디스크-브러시 세정장치 모듈
JP5535197B2 (ja) 高スループット化学機械研磨システム
TWI525686B (zh) 基板洗淨方法
KR101168361B1 (ko) 힘 제어식 브러쉬 박스 클리너
CN206541806U (zh) 基板处理系统
TW201318771A (zh) 用於化學機械拋光清潔裝置之刷盒模組
JP3459632B2 (ja) 基板洗浄装置
JP7644176B2 (ja) 非接触洗浄モジュール
CN217521959U (zh) 一种晶圆清洗装置和晶圆加工设备
CN115101448B (zh) 晶圆加工方法、装置和晶圆加工设备
KR20160122953A (ko) 웨이퍼 처리 장치
US7010826B2 (en) Substrate cleaning tool and substrate cleaning apparatus
JP3448844B2 (ja) 基板洗浄装置
JPH11354480A5 (https=)
CN206259319U (zh) 基板处理系统
JP2543007B2 (ja) ウエ−ハ枚葉洗浄装置
CN219380318U (zh) 一种化学机械抛光系统
JP2007036152A (ja) ウェーハ洗浄乾燥方法及びウェーハ洗浄乾燥装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000