CN112638557B - 用于喷洒测量设备的系统和方法 - Google Patents
用于喷洒测量设备的系统和方法 Download PDFInfo
- Publication number
- CN112638557B CN112638557B CN201980056788.9A CN201980056788A CN112638557B CN 112638557 B CN112638557 B CN 112638557B CN 201980056788 A CN201980056788 A CN 201980056788A CN 112638557 B CN112638557 B CN 112638557B
- Authority
- CN
- China
- Prior art keywords
- spray
- channels
- rotor
- liquid
- measurement device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/035—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material to several spraying apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
- B05B12/006—Pressure or flow rate sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F3/00—Measuring the volume flow of fluids or fluent solid material wherein the fluid passes through the meter in successive and more or less isolated quantities, the meter being driven by the flow
- G01F3/36—Measuring the volume flow of fluids or fluent solid material wherein the fluid passes through the meter in successive and more or less isolated quantities, the meter being driven by the flow with stationary measuring chambers having constant volume during measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862694661P | 2018-07-06 | 2018-07-06 | |
US62/694,661 | 2018-07-06 | ||
PCT/US2019/040864 WO2020010357A1 (en) | 2018-07-06 | 2019-07-08 | Systems and methods for a spray measurement apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112638557A CN112638557A (zh) | 2021-04-09 |
CN112638557B true CN112638557B (zh) | 2023-02-03 |
Family
ID=69060353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980056788.9A Active CN112638557B (zh) | 2018-07-06 | 2019-07-08 | 用于喷洒测量设备的系统和方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10777434B2 (zh) |
EP (1) | EP3817870B1 (zh) |
JP (1) | JP7450844B2 (zh) |
KR (1) | KR102538284B1 (zh) |
CN (1) | CN112638557B (zh) |
SG (1) | SG11202100082XA (zh) |
WO (1) | WO2020010357A1 (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1753786A (zh) * | 2003-02-28 | 2006-03-29 | 精工爱普生株式会社 | 液滴喷出装置和液滴喷头的喷出异常判定方法 |
CN1762707A (zh) * | 2004-09-08 | 2006-04-26 | 精工爱普生株式会社 | 液滴喷出装置、电光学装置的制造方法、电光学装置及电子设备 |
CN101078881B (zh) * | 2006-05-23 | 2010-12-01 | K.C.科技股份有限公司 | 狭缝喷嘴的横向喷射均匀度测量装置及方法 |
CN204705491U (zh) * | 2015-06-02 | 2015-10-14 | 中国人民解放军72875部队 | 喷洒车故障检测装置 |
CN206678578U (zh) * | 2016-04-22 | 2017-11-28 | 精工爱普生株式会社 | 液体喷出装置 |
CN107771104A (zh) * | 2015-06-25 | 2018-03-06 | 贝兰克(有限公司) | 喷洒单元、包括这种单元的紧凑型喷洒模块以及包括多个这种模块的喷洒和控制系统 |
CN207198602U (zh) * | 2017-09-13 | 2018-04-06 | 张公权 | 航空农林喷洒远程实时监控及计量控制系统 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4197000A (en) * | 1978-05-23 | 1980-04-08 | Fsi Corporation | Positive developing method and apparatus |
US4816081A (en) * | 1987-02-17 | 1989-03-28 | Fsi Corporation | Apparatus and process for static drying of substrates |
US4900395A (en) * | 1989-04-07 | 1990-02-13 | Fsi International, Inc. | HF gas etching of wafers in an acid processor |
US5232328A (en) * | 1991-03-05 | 1993-08-03 | Semitool, Inc. | Robot loadable centrifugal semiconductor processor with extendible rotor |
US5378308A (en) * | 1992-11-09 | 1995-01-03 | Bmc Industries, Inc. | Etchant distribution apparatus |
US5728220A (en) * | 1996-03-08 | 1998-03-17 | Ultimation, Inc. | Tire soaper apparatus |
US6926017B2 (en) * | 1998-01-09 | 2005-08-09 | Entegris, Inc. | Wafer container washing apparatus |
US6125863A (en) | 1998-06-30 | 2000-10-03 | Semitool, Inc. | Offset rotor flat media processor |
US6432214B2 (en) * | 1998-07-10 | 2002-08-13 | Semitool, Inc. | Cleaning apparatus |
US6904920B2 (en) * | 1998-07-10 | 2005-06-14 | Semitool, Inc. | Method and apparatus for cleaning containers |
JP2001316861A (ja) | 2000-05-01 | 2001-11-16 | Tokyo Electron Ltd | 加熱装置およびそれを用いた液処理装置 |
TW477882B (en) * | 2000-07-03 | 2002-03-01 | Tokyo Electron Ltd | Processing apparatus with sealing mechanism |
US6418945B1 (en) * | 2000-07-07 | 2002-07-16 | Semitool, Inc. | Dual cassette centrifugal processor |
US6591162B1 (en) * | 2000-08-15 | 2003-07-08 | Asyst Technologies, Inc. | Smart load port with integrated carrier monitoring and fab-wide carrier management system |
US6725868B2 (en) * | 2000-11-14 | 2004-04-27 | Tokyo Electron Limited | Liquid processing apparatus |
EP1404463A4 (en) | 2001-07-12 | 2004-10-06 | Semitool Inc | METHOD AND DEVICE FOR CLEANING SEMICONDUCTOR WAFERS AND OTHER FLAT MEDIA |
WO2003008114A1 (en) | 2001-07-16 | 2003-01-30 | Semitool, Inc. | Systems and methods for processing workpieces |
JP3896265B2 (ja) * | 2001-09-11 | 2007-03-22 | オリンパス株式会社 | 位置出し治具及び位置出し治具を用いた吹き付け研磨装置 |
US7311004B2 (en) * | 2003-03-10 | 2007-12-25 | Capstan Ag Systems, Inc. | Flow control and operation monitoring system for individual spray nozzles |
US20050284375A1 (en) * | 2004-06-24 | 2005-12-29 | Kodjo Leeds | Method and apparatus for processing a workpiece |
US20060040111A1 (en) * | 2004-08-20 | 2006-02-23 | Dolechek Kert L | Process chamber and system for thinning a semiconductor workpiece |
US20060201541A1 (en) * | 2005-03-11 | 2006-09-14 | Semiconductor Energy Laboratory Co., Ltd. | Cleaning-drying apparatus and cleaning-drying method |
KR100696378B1 (ko) * | 2005-04-13 | 2007-03-19 | 삼성전자주식회사 | 반도체 기판을 세정하는 장치 및 방법 |
JP2007053297A (ja) | 2005-08-19 | 2007-03-01 | Oki Electric Ind Co Ltd | ポリマー除去装置および当該装置の内部の洗浄方法 |
KR100766443B1 (ko) * | 2006-05-23 | 2007-10-11 | 주식회사 케이씨텍 | 슬릿 노즐의 폭방향 토출 균일도 측정 장치 및 방법 |
US8844546B2 (en) * | 2008-10-01 | 2014-09-30 | Applied Materials, Inc. | Apparatus and method for cleaning semiconductor substrate using pressurized fluid |
KR101022014B1 (ko) * | 2010-05-18 | 2011-03-16 | (주) 디바이스이엔지 | 웨이퍼 보관용기 세정장치 |
AT515531B1 (de) * | 2014-09-19 | 2015-10-15 | Siconnex Customized Solutions Gmbh | Halterungssystem und Beschickungsverfahren für scheibenförmige Objekte |
-
2019
- 2019-07-08 WO PCT/US2019/040864 patent/WO2020010357A1/en unknown
- 2019-07-08 KR KR1020217003699A patent/KR102538284B1/ko active IP Right Grant
- 2019-07-08 SG SG11202100082XA patent/SG11202100082XA/en unknown
- 2019-07-08 JP JP2021521950A patent/JP7450844B2/ja active Active
- 2019-07-08 EP EP19831554.1A patent/EP3817870B1/en active Active
- 2019-07-08 US US16/505,450 patent/US10777434B2/en active Active
- 2019-07-08 CN CN201980056788.9A patent/CN112638557B/zh active Active
-
2020
- 2020-04-29 US US16/861,868 patent/US11664251B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1753786A (zh) * | 2003-02-28 | 2006-03-29 | 精工爱普生株式会社 | 液滴喷出装置和液滴喷头的喷出异常判定方法 |
CN1762707A (zh) * | 2004-09-08 | 2006-04-26 | 精工爱普生株式会社 | 液滴喷出装置、电光学装置的制造方法、电光学装置及电子设备 |
CN101078881B (zh) * | 2006-05-23 | 2010-12-01 | K.C.科技股份有限公司 | 狭缝喷嘴的横向喷射均匀度测量装置及方法 |
CN204705491U (zh) * | 2015-06-02 | 2015-10-14 | 中国人民解放军72875部队 | 喷洒车故障检测装置 |
CN107771104A (zh) * | 2015-06-25 | 2018-03-06 | 贝兰克(有限公司) | 喷洒单元、包括这种单元的紧凑型喷洒模块以及包括多个这种模块的喷洒和控制系统 |
CN206678578U (zh) * | 2016-04-22 | 2017-11-28 | 精工爱普生株式会社 | 液体喷出装置 |
CN207198602U (zh) * | 2017-09-13 | 2018-04-06 | 张公权 | 航空农林喷洒远程实时监控及计量控制系统 |
Also Published As
Publication number | Publication date |
---|---|
US11664251B2 (en) | 2023-05-30 |
SG11202100082XA (en) | 2021-02-25 |
EP3817870A4 (en) | 2022-04-13 |
KR20210050515A (ko) | 2021-05-07 |
US20200013650A1 (en) | 2020-01-09 |
JP2021529092A (ja) | 2021-10-28 |
US20200258763A1 (en) | 2020-08-13 |
WO2020010357A1 (en) | 2020-01-09 |
US10777434B2 (en) | 2020-09-15 |
KR102538284B1 (ko) | 2023-05-30 |
CN112638557A (zh) | 2021-04-09 |
JP7450844B2 (ja) | 2024-03-18 |
EP3817870B1 (en) | 2024-04-17 |
EP3817870A1 (en) | 2021-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110106280A1 (en) | Automated battery scanning, repair, and optimization | |
US6981422B1 (en) | Method and apparatus for differential pressure testing of catalytic reactor tubes | |
US20040049898A1 (en) | System and method for monitoring semiconductor production apparatus | |
EP2973488A1 (en) | Distributed sensor system with remote sensor nodes and centralized data processing | |
CN112638557B (zh) | 用于喷洒测量设备的系统和方法 | |
CN105960283A (zh) | 具有温度分析和/或验证单元的热循环仪以及用于分析或验证热循环仪的热性能且用于标定热循环仪的方法 | |
CN113324701B (zh) | 一种用于数据中心的机房漏水检测方法 | |
KR101504596B1 (ko) | 누설 테스트 장치 및 이를 이용한 누설 테스트 방법 | |
US8347742B2 (en) | Sampler | |
WO2003098768A2 (en) | Method and system for verification, calibration and simulation of a fuel cell test station | |
CN106123765B (zh) | 一种用于三相分离器的介质乳化层厚度测量仪 | |
KR101086054B1 (ko) | 계량기 검사대 | |
CN114778416B (zh) | 医疗器械用透气包装材料微生物屏障测试系统 | |
CN215314526U (zh) | 洁净容器设备的清洗验证装置 | |
CN114117831A (zh) | 智慧实验室的计量器具量值数据分析方法及装置 | |
KR100187440B1 (ko) | 멀티 프로브 파티클 측정 장치 | |
US20210270728A1 (en) | System, Apparatus and Method of Measuring Concentrations of Analytes | |
EP2621392B1 (en) | Test device | |
WO2019162795A1 (en) | Device for monitoring the quality of the compressed air and associated method | |
TW201341821A (zh) | 用於進行測試接觸器模組的自動維護的裝置 | |
CN117153712B (zh) | 半导体清洗设备腔室内部的综合监控系统及方法 | |
US20220236098A1 (en) | Fluid Meter Testing and Profiling System | |
DK180662B1 (en) | Ultrasonic consumption meter | |
KR20230053752A (ko) | 기판 처리 장치 및 이를 이용한 유량계 오류 검증 방법 | |
CN110532116A (zh) | 一种系统可靠性建模方法及装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Arizona Applicant after: Shelbeck Semiconductor Technology Co.,Ltd. Address before: Delaware Applicant before: OEM Group East Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220527 Address after: Arizona Applicant after: Oemg holdings LLC Address before: Arizona Applicant before: OEM Group LLC Effective date of registration: 20220527 Address after: Delaware Applicant after: OEM Group East Co.,Ltd. Address before: Arizona Applicant before: Oemg holdings LLC |
|
GR01 | Patent grant | ||
GR01 | Patent grant |