KR20110057136A - 실록산 화합물, 경화성 수지 조성물, 그 경화물 및 광반도체 소자 - Google Patents

실록산 화합물, 경화성 수지 조성물, 그 경화물 및 광반도체 소자 Download PDF

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Publication number
KR20110057136A
KR20110057136A KR1020117004174A KR20117004174A KR20110057136A KR 20110057136 A KR20110057136 A KR 20110057136A KR 1020117004174 A KR1020117004174 A KR 1020117004174A KR 20117004174 A KR20117004174 A KR 20117004174A KR 20110057136 A KR20110057136 A KR 20110057136A
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South Korea
Prior art keywords
group
reactive functional
formula
alkoxysilane
functional group
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KR1020117004174A
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English (en)
Korean (ko)
Inventor
나오푸사 미야가와
요시히로 카와타
마사타카 나카니시
치에 사사키
켄이치 쿠보키
시즈카 아오키
즈이칸 스즈키
마사토 야리타
히루 코야나기
Original Assignee
니폰 가야꾸 가부시끼가이샤
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Publication of KR20110057136A publication Critical patent/KR20110057136A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Silicon Polymers (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
KR1020117004174A 2008-09-03 2009-08-27 실록산 화합물, 경화성 수지 조성물, 그 경화물 및 광반도체 소자 KR20110057136A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-225472 2008-09-03
JP2008225472 2008-09-03

Publications (1)

Publication Number Publication Date
KR20110057136A true KR20110057136A (ko) 2011-05-31

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KR1020117004174A KR20110057136A (ko) 2008-09-03 2009-08-27 실록산 화합물, 경화성 수지 조성물, 그 경화물 및 광반도체 소자

Country Status (5)

Country Link
JP (2) JP5453276B2 (zh)
KR (1) KR20110057136A (zh)
CN (1) CN102143986B (zh)
TW (2) TWI519562B (zh)
WO (1) WO2010026714A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
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WO2012173460A3 (ko) * 2011-06-17 2013-03-28 주식회사 엘지화학 경화성 조성물
KR102252385B1 (ko) * 2019-12-09 2021-05-14 주식회사 티에스엘켐 Uv 접착제 조성물

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TW201113330A (en) * 2009-08-21 2011-04-16 Jsr Corp Photo-semiconductor package composition
JP5700618B2 (ja) * 2009-11-30 2015-04-15 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
KR20130018670A (ko) * 2010-03-02 2013-02-25 닛뽄 가야쿠 가부시키가이샤 오가노폴리실록산의 제조 방법, 상기 제조 방법에 의해 얻어지는 오가노폴리실록산, 상기 오가노폴리실록산을 함유하는 조성물
TWI538959B (zh) * 2010-03-02 2016-06-21 Nippon Kayaku Kk Hardened resin composition and hardened product thereof
JP5585529B2 (ja) * 2011-05-06 2014-09-10 信越化学工業株式会社 末端アルコキシ変性オルガノポリシロキサン及びその製造方法
JP5891617B2 (ja) * 2011-05-17 2016-03-23 三菱化学株式会社 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体デバイス
CN102299216A (zh) * 2011-08-15 2011-12-28 广东银雨芯片半导体有限公司 一种led的封装工艺
JP6031739B2 (ja) * 2011-09-08 2016-11-24 三菱化学株式会社 熱硬化性樹脂組成物、半導体デバイス用部材、及びそれを用いた半導体デバイス
JP6004581B2 (ja) * 2013-03-25 2016-10-12 日本化薬株式会社 エポキシ基含有シリコーン樹脂、エポキシ基含有シリコーン樹脂組成物、及びその硬化物
JP6239616B2 (ja) * 2013-06-26 2017-11-29 日本化薬株式会社 エポキシ基含有ポリオルガノシロキサンおよびそれを含有する硬化性樹脂組成物
JP6684273B2 (ja) 2014-06-19 2020-04-22 インクロン オサケユキチュアＩｎｋｒｏｎ Ｏｙ シロキサン粒子材料を用いたｌｅｄランプ
TWI570187B (zh) * 2015-12-17 2017-02-11 財團法人工業技術研究院 光學固態預聚物與模塑組成物
KR101871574B1 (ko) * 2016-05-12 2018-06-27 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
KR102146668B1 (ko) 2017-05-31 2020-08-21 코오롱인더스트리 주식회사 코팅용 수지 조성물 및 이의 경화물을 코팅층으로 포함하는 코팅필름
CN107353871B (zh) * 2017-08-21 2020-09-08 山东省科学院新材料研究所 一种耐高温粘接密封硅树脂及其制备方法
JP7218604B2 (ja) * 2018-02-26 2023-02-07 三菱ケミカル株式会社 エポキシ基含有ポリオルガノシロキサンを含む硬化性樹脂組成物及びその硬化物
WO2021039694A1 (ja) * 2019-08-27 2021-03-04 三菱ケミカル株式会社 エポキシ基含有ポリオルガノシロキサン、エポキシ基含有ポリオルガノシロキサンを含む硬化性樹脂組成物及びその硬化物
CN115003759B (zh) * 2020-01-15 2023-12-01 株式会社钟化 树脂组合物、其制造方法、以及多组分型固化性树脂组合物
CN111234233B (zh) * 2020-03-26 2022-05-27 兆舜科技(广东)有限公司 一种苯基硅树脂及其制备方法
CN111574715A (zh) * 2020-05-22 2020-08-25 中国乐凯集团有限公司 组合物及含有其的封装薄膜和制备方法以及电子器件
KR20220039206A (ko) * 2020-09-22 2022-03-29 ㈜ 엘프스 자가융착형 도전접속소재, 이를 포함하는 본딩모듈 및 이의 제조방법
TWI773424B (zh) * 2021-07-08 2022-08-01 碁達科技股份有限公司 熱介面組成物、熱介面材料及其製備方法

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JP3681582B2 (ja) * 1999-07-30 2005-08-10 信越化学工業株式会社 エポキシ基含有シリコーン樹脂
EP1736500A4 (en) * 2004-04-16 2010-03-24 Jsr Corp COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND PROCESS FOR PRODUCING A COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR
JP2006104249A (ja) * 2004-10-01 2006-04-20 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2006336010A (ja) * 2005-05-02 2006-12-14 Jsr Corp シロキサン系縮合物およびその製造方法、ポリシロキサン組成物
JP2007070560A (ja) * 2005-09-09 2007-03-22 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2007277320A (ja) * 2006-04-03 2007-10-25 Jsr Corp 光半導体用接着剤
WO2007135909A1 (ja) * 2006-05-18 2007-11-29 Nippon Kayaku Kabushiki Kaisha 熱硬化性樹脂組成物及びその硬化物
JP5158739B2 (ja) * 2006-06-13 2013-03-06 学校法人 関西大学 熱硬化性重合体組成物およびその硬化物
JPWO2008090971A1 (ja) * 2007-01-25 2010-05-20 Jsr株式会社 エポキシ基末端ポリジメチルシロキサンおよびその製造方法、ならびに硬化性ポリシロキサン組成物
WO2009072632A1 (ja) * 2007-12-07 2009-06-11 Jsr Corporation 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法
JP5246749B2 (ja) * 2008-03-04 2013-07-24 日本化薬株式会社 熱硬化性樹脂組成物及びその硬化物

Cited By (3)

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Publication number Priority date Publication date Assignee Title
WO2012173460A3 (ko) * 2011-06-17 2013-03-28 주식회사 엘지화학 경화성 조성물
US9123647B2 (en) 2011-06-17 2015-09-01 Lg Chem, Ltd. Curable composition
KR102252385B1 (ko) * 2019-12-09 2021-05-14 주식회사 티에스엘켐 Uv 접착제 조성물

Also Published As

Publication number Publication date
JP5684364B2 (ja) 2015-03-11
CN102143986A (zh) 2011-08-03
TW201020279A (en) 2010-06-01
TWI519562B (zh) 2016-02-01
JPWO2010026714A1 (ja) 2012-01-26
JP5453276B2 (ja) 2014-03-26
CN102143986B (zh) 2014-03-26
JP2014031522A (ja) 2014-02-20
TWI437030B (zh) 2014-05-11
TW201420628A (zh) 2014-06-01
WO2010026714A1 (ja) 2010-03-11

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