WO2012173460A3 - 경화성 조성물 - Google Patents

경화성 조성물 Download PDF

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Publication number
WO2012173460A3
WO2012173460A3 PCT/KR2012/004820 KR2012004820W WO2012173460A3 WO 2012173460 A3 WO2012173460 A3 WO 2012173460A3 KR 2012004820 W KR2012004820 W KR 2012004820W WO 2012173460 A3 WO2012173460 A3 WO 2012173460A3
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WO
WIPO (PCT)
Prior art keywords
curable composition
composition
led
present application
resistance
Prior art date
Application number
PCT/KR2012/004820
Other languages
English (en)
French (fr)
Other versions
WO2012173460A2 (ko
Inventor
김민균
고민진
문명선
정재호
최범규
강대호
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2014515769A priority Critical patent/JP5831958B2/ja
Priority to EP12800817.4A priority patent/EP2722366B1/en
Priority to CN201280029919.2A priority patent/CN103608408B/zh
Publication of WO2012173460A2 publication Critical patent/WO2012173460A2/ko
Publication of WO2012173460A3 publication Critical patent/WO2012173460A3/ko
Priority to US14/109,179 priority patent/US9123647B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

본 출원은, 경화성 조성물, 발광 다이오드, 액정표시장치 및 조명 기구에 관한 것이다. 본 출원에서는, 가공성 및 작업성이 뛰어나고, 경화 후에 내크렉성, 경도, 내열성, 내열충격성, 투명성 및 접착성이 우수한 경화성 조성물을 제공할 수 있다. 상기 조성물은, 적용된 후에 백탁을 나타내지 않고, 표면에서의 끈적임도 없다. 상기 조성물은, 예를 들면, LED, CCD 또는 포토커플러 등과 같은 광반도체 소자의 접착 소재 또는 봉지 소재로 유용하게 사용될 수 있다.
PCT/KR2012/004820 2011-06-17 2012-06-18 경화성 조성물 WO2012173460A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014515769A JP5831958B2 (ja) 2011-06-17 2012-06-18 硬化性組成物
EP12800817.4A EP2722366B1 (en) 2011-06-17 2012-06-18 Curable composition
CN201280029919.2A CN103608408B (zh) 2011-06-17 2012-06-18 可固化组合物
US14/109,179 US9123647B2 (en) 2011-06-17 2013-12-17 Curable composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110059102 2011-06-17
KR10-2011-0059102 2011-06-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/109,179 Continuation US9123647B2 (en) 2011-06-17 2013-12-17 Curable composition

Publications (2)

Publication Number Publication Date
WO2012173460A2 WO2012173460A2 (ko) 2012-12-20
WO2012173460A3 true WO2012173460A3 (ko) 2013-03-28

Family

ID=47357645

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004820 WO2012173460A2 (ko) 2011-06-17 2012-06-18 경화성 조성물

Country Status (6)

Country Link
US (1) US9123647B2 (ko)
EP (1) EP2722366B1 (ko)
JP (2) JP5831958B2 (ko)
KR (1) KR101518104B1 (ko)
CN (1) CN103608408B (ko)
WO (1) WO2012173460A2 (ko)

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JP2014169415A (ja) * 2013-03-05 2014-09-18 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
TWI468415B (zh) * 2013-06-13 2015-01-11 Daxin Materials Corp 矽氧烷二酸酐、聚合物、液晶配向劑、液晶配向膜及液晶顯示元件
KR20150066969A (ko) * 2013-12-09 2015-06-17 제일모직주식회사 봉지재 조성물, 봉지재, 및 전자 소자
CN107464867B (zh) * 2017-07-14 2019-06-14 上海盛丽光电科技有限公司 一种led用大尺寸氮化镓半导体片的制备方法
JP7296539B2 (ja) * 2019-11-18 2023-06-23 Ａｇｃ株式会社 支持ガラス基板及び積層体
CN111100463A (zh) * 2019-12-26 2020-05-05 广东盈骅新材料科技有限公司 环氧改性硅树脂组合物及其应用
CN114058287A (zh) * 2020-08-04 2022-02-18 三星Sdi株式会社 粘附膜、包括其的光学构件和包括其的光学显示器

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Also Published As

Publication number Publication date
CN103608408B (zh) 2016-04-13
JP2014518292A (ja) 2014-07-28
EP2722366B1 (en) 2023-01-04
KR20120139614A (ko) 2012-12-27
EP2722366A4 (en) 2015-01-21
WO2012173460A2 (ko) 2012-12-20
JP2015193850A (ja) 2015-11-05
US9123647B2 (en) 2015-09-01
US20140175333A1 (en) 2014-06-26
KR101518104B1 (ko) 2015-05-06
CN103608408A (zh) 2014-02-26
JP5831958B2 (ja) 2015-12-16
EP2722366A2 (en) 2014-04-23
JP6066140B2 (ja) 2017-01-25

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