CN107464867B - 一种led用大尺寸氮化镓半导体片的制备方法 - Google Patents
一种led用大尺寸氮化镓半导体片的制备方法 Download PDFInfo
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- CN107464867B CN107464867B CN201710572699.2A CN201710572699A CN107464867B CN 107464867 B CN107464867 B CN 107464867B CN 201710572699 A CN201710572699 A CN 201710572699A CN 107464867 B CN107464867 B CN 107464867B
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- gallium nitride
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- nitride semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
性能指标 | 基片尺寸 | 氮化镓半导体无缺陷尺寸 | 缓冲层厚度 | 可重复性 |
实施例一 | 10*10cm<sup>2</sup> | 8*8cm<sup>2</sup> | 300-400nm易剥离 | 玻璃基片可以重复使用 |
实施例二 | 10*10cm<sup>2</sup> | 9*8cm<sup>2</sup> | 100-200nm易剥离 | 玻璃基片可以重复使用 |
实施例三 | 10*10cm<sup>2</sup> | 9.5*8cm<sup>2</sup> | 50-80nm易剥离 | 玻璃基片可以重复使用 |
实施例四 | 10*10cm<sup>2</sup> | 10*8cm<sup>2</sup> | 20-50nm易剥离 | 玻璃基片可以重复使用 |
实施例五 | 10*10cm<sup>2</sup> | 9*8cm<sup>2</sup> | 20-50nm易剥离 | 玻璃基片可以重复使用 |
Claims (8)
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CN201710572699.2A CN107464867B (zh) | 2017-07-14 | 2017-07-14 | 一种led用大尺寸氮化镓半导体片的制备方法 |
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CN201710572699.2A CN107464867B (zh) | 2017-07-14 | 2017-07-14 | 一种led用大尺寸氮化镓半导体片的制备方法 |
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CN107464867A CN107464867A (zh) | 2017-12-12 |
CN107464867B true CN107464867B (zh) | 2019-06-14 |
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Family Cites Families (2)
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JP5831958B2 (ja) * | 2011-06-17 | 2015-12-16 | エルジー・ケム・リミテッド | 硬化性組成物 |
CN104152890B (zh) * | 2014-07-30 | 2018-05-11 | 电子科技大学 | 在柔性金属部件上制备抗热冲击的耐高温绝缘涂层的方法 |
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Effective date of registration: 20190513 Address after: 200 000 1/12 Building, 2755 Sanlu Highway, Minhang District, Shanghai Applicant after: Shanghai Shengli Optoelectronics Technology Co.,Ltd. Address before: 610091 Donghai Road, Jiao long industrial port, Qingyang District, Chengdu, Sichuan 4 Applicant before: Chengdu Xinkeli Chemical Sci-Tech Co., Ltd. |
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Effective date of registration: 20200325 Address after: No.28 Haiyan Road, Binhai Park, Qidong, Nantong, Jiangsu Patentee after: QIDONG SHENGLI OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 200000 Shanghai Minhang District three Lu Road 2755 12 Building 1 buildings. Patentee before: Shanghai Shengli Optoelectronics Technology Co.,Ltd. |