KR20100103389A - 회로 기판용 금속박 테이프 - Google Patents

회로 기판용 금속박 테이프 Download PDF

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Publication number
KR20100103389A
KR20100103389A KR1020100021256A KR20100021256A KR20100103389A KR 20100103389 A KR20100103389 A KR 20100103389A KR 1020100021256 A KR1020100021256 A KR 1020100021256A KR 20100021256 A KR20100021256 A KR 20100021256A KR 20100103389 A KR20100103389 A KR 20100103389A
Authority
KR
South Korea
Prior art keywords
metal foil
foil tape
adhesive
thickness
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020100021256A
Other languages
English (en)
Korean (ko)
Inventor
마코토 시모세
다쿠로 하야시
사토시 다카하시
Original Assignee
가와무라 산교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가와무라 산교 가부시키가이샤 filed Critical 가와무라 산교 가부시키가이샤
Publication of KR20100103389A publication Critical patent/KR20100103389A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020100021256A 2009-03-12 2010-03-10 회로 기판용 금속박 테이프 Ceased KR20100103389A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009059327A JP2010212584A (ja) 2009-03-12 2009-03-12 回路基板用金属箔テープ
JPJP-P-2009-059327 2009-03-12

Publications (1)

Publication Number Publication Date
KR20100103389A true KR20100103389A (ko) 2010-09-27

Family

ID=42972436

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100021256A Ceased KR20100103389A (ko) 2009-03-12 2010-03-10 회로 기판용 금속박 테이프

Country Status (3)

Country Link
JP (1) JP2010212584A (https=)
KR (1) KR20100103389A (https=)
TW (1) TW201044925A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119563A (ja) * 2010-12-02 2012-06-21 Mitsui Mining & Smelting Co Ltd 半導体装置用フレキシブル基板および半導体装置
JP2013038360A (ja) * 2011-08-11 2013-02-21 Toray Ind Inc 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、ｌｅｄ実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板

Also Published As

Publication number Publication date
JP2010212584A (ja) 2010-09-24
TW201044925A (en) 2010-12-16

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