JP2010212584A - 回路基板用金属箔テープ - Google Patents

回路基板用金属箔テープ Download PDF

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Publication number
JP2010212584A
JP2010212584A JP2009059327A JP2009059327A JP2010212584A JP 2010212584 A JP2010212584 A JP 2010212584A JP 2009059327 A JP2009059327 A JP 2009059327A JP 2009059327 A JP2009059327 A JP 2009059327A JP 2010212584 A JP2010212584 A JP 2010212584A
Authority
JP
Japan
Prior art keywords
metal foil
foil tape
meth
circuit boards
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009059327A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010212584A5 (https=
Inventor
Makoto Shimose
真 下瀬
Takuro Hayashi
拓郎 林
Satoshi Takahashi
聡 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawamura Sangyo Co Ltd
Original Assignee
Kawamura Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Sangyo Co Ltd filed Critical Kawamura Sangyo Co Ltd
Priority to JP2009059327A priority Critical patent/JP2010212584A/ja
Priority to TW099103974A priority patent/TW201044925A/zh
Priority to KR1020100021256A priority patent/KR20100103389A/ko
Publication of JP2010212584A publication Critical patent/JP2010212584A/ja
Publication of JP2010212584A5 publication Critical patent/JP2010212584A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2009059327A 2009-03-12 2009-03-12 回路基板用金属箔テープ Pending JP2010212584A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009059327A JP2010212584A (ja) 2009-03-12 2009-03-12 回路基板用金属箔テープ
TW099103974A TW201044925A (en) 2009-03-12 2010-02-09 Metal foil tape for circuit substrate
KR1020100021256A KR20100103389A (ko) 2009-03-12 2010-03-10 회로 기판용 금속박 테이프

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009059327A JP2010212584A (ja) 2009-03-12 2009-03-12 回路基板用金属箔テープ

Publications (2)

Publication Number Publication Date
JP2010212584A true JP2010212584A (ja) 2010-09-24
JP2010212584A5 JP2010212584A5 (https=) 2012-01-12

Family

ID=42972436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009059327A Pending JP2010212584A (ja) 2009-03-12 2009-03-12 回路基板用金属箔テープ

Country Status (3)

Country Link
JP (1) JP2010212584A (https=)
KR (1) KR20100103389A (https=)
TW (1) TW201044925A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119563A (ja) * 2010-12-02 2012-06-21 Mitsui Mining & Smelting Co Ltd 半導体装置用フレキシブル基板および半導体装置
JP2013038360A (ja) * 2011-08-11 2013-02-21 Toray Ind Inc 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、ｌｅｄ実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119563A (ja) * 2010-12-02 2012-06-21 Mitsui Mining & Smelting Co Ltd 半導体装置用フレキシブル基板および半導体装置
JP2013038360A (ja) * 2011-08-11 2013-02-21 Toray Ind Inc 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、ｌｅｄ実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板

Also Published As

Publication number Publication date
KR20100103389A (ko) 2010-09-27
TW201044925A (en) 2010-12-16

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Effective date: 20111117