KR20100072030A - 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물 - Google Patents

에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물 Download PDF

Info

Publication number
KR20100072030A
KR20100072030A KR1020107008435A KR20107008435A KR20100072030A KR 20100072030 A KR20100072030 A KR 20100072030A KR 1020107008435 A KR1020107008435 A KR 1020107008435A KR 20107008435 A KR20107008435 A KR 20107008435A KR 20100072030 A KR20100072030 A KR 20100072030A
Authority
KR
South Korea
Prior art keywords
epoxy resin
microcapsule
curing agent
latent curing
type latent
Prior art date
Application number
KR1020107008435A
Other languages
English (en)
Korean (ko)
Inventor
시게아끼 후뉴우
유따까 오까다
요시이 모리시따
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Publication of KR20100072030A publication Critical patent/KR20100072030A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020107008435A 2007-09-20 2008-09-17 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물 KR20100072030A (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JPJP-P-2007-243852 2007-09-20
JP2007243852 2007-09-20
JPJP-P-2007-243851 2007-09-20
JP2007243851 2007-09-20
JP2008043346 2008-02-25
JPJP-P-2008-043346 2008-02-25
JPJP-P-2008-166246 2008-06-25
JP2008166246 2008-06-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020127000991A Division KR101243511B1 (ko) 2007-09-20 2008-09-17 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물

Publications (1)

Publication Number Publication Date
KR20100072030A true KR20100072030A (ko) 2010-06-29

Family

ID=40467907

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020107008435A KR20100072030A (ko) 2007-09-20 2008-09-17 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물
KR1020127000991A KR101243511B1 (ko) 2007-09-20 2008-09-17 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020127000991A KR101243511B1 (ko) 2007-09-20 2008-09-17 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물

Country Status (5)

Country Link
JP (1) JP5158088B2 (ja)
KR (2) KR20100072030A (ja)
CN (2) CN102936331A (ja)
TW (2) TW201008971A (ja)
WO (1) WO2009038097A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101870777B1 (ko) * 2017-03-28 2018-06-26 한국신발피혁연구원 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086701B1 (ko) * 2009-06-10 2011-11-25 한국과학기술연구원 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법
KR102270461B1 (ko) * 2016-03-10 2021-06-29 한국전자기술연구원 점접착제 조성물 및 그의 제조방법
KR102095115B1 (ko) * 2018-07-27 2020-03-30 한국전력공사 자가치유 실리콘 절연체 및 그 제조방법
CN111087576A (zh) * 2019-12-31 2020-05-01 芜湖天道绿色新材料有限公司 一种可降解微胶囊固化剂的制备及应用
CN111171285B (zh) * 2020-02-15 2022-04-26 常州大学 一种以聚氨酯为壳材的环氧树脂固化剂微胶囊及其制备方法
CN111518500B (zh) * 2020-04-22 2023-04-11 湖北回天新材料股份有限公司 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法
CN111389317B (zh) * 2020-04-28 2022-04-12 西北工业大学 基于巯基-异氰酸酯点击反应和油包油界面聚合的咪唑微胶囊的制备方法
CN116323837A (zh) * 2020-09-30 2023-06-23 旭化成株式会社 聚氨酯系固化剂及其应用
WO2023286499A1 (ja) * 2021-07-12 2023-01-19 旭化成株式会社 エポキシ樹脂組成物、フィルム、フィルムの製造方法、及び硬化物
CN114230767B (zh) * 2021-12-13 2024-03-19 江苏钛得新材料技术有限公司 胶粘剂用咪唑类衍生物微胶囊型潜伏固化剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3611439B2 (ja) * 1998-01-12 2005-01-19 株式会社日立製作所 マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物
JP4567377B2 (ja) * 2004-06-04 2010-10-20 旭化成イーマテリアルズ株式会社 潜在性硬化剤および組成物
EP1930359A1 (en) * 2005-09-29 2008-06-11 Asahi Kasei Chemicals Corporation High-stability microencapsulated hardener for epoxy resin and epoxy resin composition
JP4877716B2 (ja) * 2005-09-29 2012-02-15 旭化成イーマテリアルズ株式会社 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP4877717B2 (ja) * 2005-09-29 2012-02-15 旭化成イーマテリアルズ株式会社 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007204669A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
US7927514B2 (en) * 2006-02-03 2011-04-19 Asahi Kasei Chemicals Corporation Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good
JP4911981B2 (ja) * 2006-02-03 2012-04-04 旭化成イーマテリアルズ株式会社 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101870777B1 (ko) * 2017-03-28 2018-06-26 한국신발피혁연구원 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제

Also Published As

Publication number Publication date
KR101243511B1 (ko) 2013-03-20
CN102936331A (zh) 2013-02-20
CN101802050A (zh) 2010-08-11
KR20120024963A (ko) 2012-03-14
TW201244814A (en) 2012-11-16
JPWO2009038097A1 (ja) 2011-01-06
WO2009038097A1 (ja) 2009-03-26
TW201008971A (en) 2010-03-01
JP5158088B2 (ja) 2013-03-06

Similar Documents

Publication Publication Date Title
KR101243511B1 (ko) 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물
CN100357336C (zh) 胶囊型硬化剂及其组合物
JP4583373B2 (ja) エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
KR100961417B1 (ko) 고-안정성 마이크로캡슐화 에폭시 수지용 경화제 및 에폭시수지 조성물
JP5763527B2 (ja) イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
WO2007088889A1 (ja) マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品
JP2010053353A (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物、エポキシ樹脂硬化物、接着剤、接合用フィルム、導電性材料並びに異方導電性材料
KR20070104621A (ko) 에폭시 수지용 잠재성 경화제 및 에폭시 수지 조성물
KR100902204B1 (ko) 잠재성 경화제 및 조성물
JP5228644B2 (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物並びにエポキシ樹脂硬化物
JP2011208098A (ja) イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
JP5266936B2 (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤、一液性エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP6063304B2 (ja) エポキシ樹脂用マイクロカプセル型硬化剤
JP4567377B2 (ja) 潜在性硬化剤および組成物
JP5245790B2 (ja) 一液性エポキシ樹脂組成物
CN117580888A (zh) 环氧树脂组合物、薄膜、薄膜的制造方法和固化物
JP2019189834A (ja) エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、及び加工品

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
A107 Divisional application of patent
E601 Decision to refuse application
J201 Request for trial against refusal decision
J121 Written withdrawal of request for trial
WITB Written withdrawal of application
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20120615

Effective date: 20120723