KR20100037535A - 리프트 핀 - Google Patents

리프트 핀 Download PDF

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Publication number
KR20100037535A
KR20100037535A KR1020090080006A KR20090080006A KR20100037535A KR 20100037535 A KR20100037535 A KR 20100037535A KR 1020090080006 A KR1020090080006 A KR 1020090080006A KR 20090080006 A KR20090080006 A KR 20090080006A KR 20100037535 A KR20100037535 A KR 20100037535A
Authority
KR
South Korea
Prior art keywords
pin
lift pin
glass substrate
substrate
stage
Prior art date
Application number
KR1020090080006A
Other languages
English (en)
Korean (ko)
Inventor
마나부 가마타니
Original Assignee
도레 엔지니아린구 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레 엔지니아린구 가부시키가이샤 filed Critical 도레 엔지니아린구 가부시키가이샤
Publication of KR20100037535A publication Critical patent/KR20100037535A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020090080006A 2008-10-01 2009-08-27 리프트 핀 KR20100037535A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-256299 2008-10-01
JP2008256299A JP2010087342A (ja) 2008-10-01 2008-10-01 リフトピン

Publications (1)

Publication Number Publication Date
KR20100037535A true KR20100037535A (ko) 2010-04-09

Family

ID=42214714

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090080006A KR20100037535A (ko) 2008-10-01 2009-08-27 리프트 핀

Country Status (4)

Country Link
JP (1) JP2010087342A (ja)
KR (1) KR20100037535A (ja)
CN (1) CN101712023A (ja)
TW (1) TWI495033B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407268B (zh) * 2010-07-28 2013-09-01 Au Optronics Corp 工作台
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
KR102615853B1 (ko) * 2015-10-15 2023-12-21 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 시스템
CN109333016B (zh) * 2018-11-19 2021-04-02 Oppo（重庆）智能科技有限公司 壳体组件的加工方法、壳体组件及电子设备
DE102018009630A1 (de) * 2018-12-11 2020-06-18 Vat Holding Ag Stifthubvorrichtung mit Temperatursensor
WO2020189804A1 (ko) * 2019-03-15 2020-09-24 에스케이실트론 주식회사 완충 장치 및 이를 포함하는 에피텍셜 반응기
WO2020189803A1 (ko) * 2019-03-15 2020-09-24 에스케이실트론 주식회사 완충장치 및 이를 포함하는 에피텍셜 반응기
CN113145415B (zh) * 2021-04-26 2023-03-24 芜湖东信光电科技有限公司 超薄柔性玻璃的表面涂布方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JP3082624B2 (ja) * 1994-12-28 2000-08-28 住友金属工業株式会社 静電チャックの使用方法
JP3343012B2 (ja) * 1995-12-25 2002-11-11 大日本スクリーン製造株式会社 回転式基板処理装置
JP3881062B2 (ja) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 基板保持機構および基板処理装置
JP2000091374A (ja) * 1998-09-11 2000-03-31 Hitachi Via Mechanics Ltd はんだボールマウンタにおけるワークの支持装置
JP2000100915A (ja) * 1998-09-25 2000-04-07 Seiko Epson Corp 半導体製造装置
JP2005310989A (ja) * 2004-04-20 2005-11-04 Hitachi High-Tech Electronics Engineering Co Ltd 基板及びフォトマスクの受け渡し方法、並びに基板及びフォトマスクの受け渡し装置
JP2006310548A (ja) * 2005-04-28 2006-11-09 I-Pulse Co Ltd 電子部品吸着ノズル、部品移載装置、ｉｃハンドラーおよび表面実装機
JP4906375B2 (ja) * 2006-03-20 2012-03-28 東京応化工業株式会社 基板支持部材

Also Published As

Publication number Publication date
JP2010087342A (ja) 2010-04-15
CN101712023A (zh) 2010-05-26
TW201015662A (en) 2010-04-16
TWI495033B (zh) 2015-08-01

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